Exposure machine for producing copper-clad ceramic substrate
By introducing a telescopic mechanism into the exposure machine, automatically positioning and fixing the substrate, the problems of substrate positioning complexity and operation difficulty in the prior art are solved, and the exposure efficiency and degree of automation are improved.
Patent Information
- Application Number
- CN202421100289.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-05-20
AI Technical Summary
In the production process of copper clad ceramic substrates, the automatic positioning and placement of the target substrates are complicated and require a lot of manual intervention, resulting in low exposure efficiency.
An exposure machine including a workbench and a telescopic mechanism is designed. By driving the coordinated movement of the screw and the positioning block, the automatic telescopic and the base plate are realized, thereby reducing manual operation steps.
Automatic positioning and fixing of substrates of any size is realized, the operation process is simplified, and the exposure efficiency and automation are improved.
Smart Images

Figure CN222299946U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of exposure machines, and in particular to an exposure machine for producing copper-clad ceramic substrates. Background Art
[0002] Under the control of a computer, the exposure machine uses a focused electron beam to expose organic polymers (usually called electronic resists or photoresists). After being irradiated by the electron beam, the physical and chemical properties of the photoresist change, forming well-soluble or non-well-soluble areas in a certain solvent, thereby forming fine patterns on the resist. Among them, the exposure amount is determined by the aperture value and shutter speed, the energy controller can control the energy that is finally irradiated to the silicon wafer, the beam shape is set, the shutter prevents the beam from irradiating the silicon wafer when exposure is not required, and the energy detector detects whether the final incident energy of the beam meets the exposure requirements, and feeds back to the energy controller for adjustment.
[0003] The exposure machine is one of the key processes in the production process of copper-clad ceramic substrates. It transfers the film image to the copper-clad ceramic substrate. First, a layer of photosensitive material (such as liquid photosensitive glue, photosensitive resist dry film, etc.) is coated on the substrate, and then the photosensitive material coated on the substrate is irradiated with light to change its solubility. The resin in the unexposed part is not polymerized and is dissolved under the action of the developer, while the resin in the photosensitive part remains on the substrate to form an image.
[0004] It can be seen that the exposure process of the copper-clad substrate is controlled by a computer and has a high degree of automation, but the operator still needs to make preparations in the early stage. Among them, how to place the target substrate into the exposure position and position it is a key operating step. Utility Model Content
[0005] The utility model provides an exposure machine for producing copper-clad ceramic substrates, which can automatically bring a target substrate into an exposure position and fix it, thereby reducing the operation steps and difficulty of the staff and improving the exposure efficiency.
[0006] To this end, the present application provides an exposure machine for producing copper-clad ceramic substrates, and the technical solution adopted is as follows:
[0007] The exposure machine includes a workbench for placing a target substrate and a telescopic mechanism, the telescopic mechanism includes a supporting block fixed under the workbench, the supporting block is penetrated by a horizontally arranged driving screw and matched with the driving screw thread, one end of the driving screw is rotatably connected to a fixed block, two positioning blocks are symmetrically distributed on both sides of the supporting block, and each positioning block is penetrated by a guide rod with one end fixed to the fixed block, the guide rod and the driving screw are located on the same horizontal plane and fixed at a certain angle, a positioning plate is fixed above the positioning block, and the positioning plate is located above the workbench and close to its table top.
[0008] A connecting rod is also fixedly provided on the supporting block, which is perpendicular to the driving screw and has two ends respectively inserted into the two positioning blocks and slidably connected to the positioning blocks; the driving screw is driven to rotate by a driving device, so that the supporting block matching its thread moves back and forth above it, and drives the two positioning blocks to continuously approach or move away from each other.
[0009] A further technical solution is that the exposure machine also includes a control system and an exposure cabin, the workbench and the telescopic mechanism are located inside the exposure cabin, and an exposure component is also fixed inside the exposure cabin.
[0010] A further technical solution is that a groove is provided between the positioning block and the positioning plate, and the side of the workbench is inserted into the groove and can move inside the groove.
[0011] A further technical solution is that the connecting end of the driving screw and the fixing block passes through the fixing block to be connected to the driving device, and a reinforcing sleeve is sleeved on the passing portion, and the reinforcing sleeve is fixed on the fixing block.
[0012] A further technical solution is that a blocking block is fixed to the other end of the driving screw rod and the guide rod that is not fixed to the fixing block.
[0013] A further technical solution is that the drive device is communicatively connected to a control output of a control system.
[0014] The working principle and beneficial effects of this application are:
[0015] Through the telescopic mechanism, the workbench is automatically extended and retracted to receive the target substrate in the hands of the staff, and in this process, the two positioning plates are synchronously loosened or clamped to release or fix the target substrate, thereby realizing the positioning function of target substrates of any size, reducing the operating steps and difficulty of the staff, and improving the exposure efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0017] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;
[0018] Figure 2 This is a schematic diagram of the overall structure of the telescopic mechanism described in this application;
[0019] Figure 3 This is a schematic diagram of the overall top view of the telescopic mechanism described in this application;
[0020] Figure 4 This is a schematic diagram of the overall bottom view of the telescopic mechanism described in this application;
[0021] Figure 5 It is a schematic diagram of the overall front structure of the telescopic mechanism described in this application. DETAILED DESCRIPTION
[0022] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] like Figure 1-Figure 5 As shown, an exposure machine for producing copper-clad ceramic substrates, the exposure machine includes a workbench 100 for placing a target substrate and a telescopic mechanism, the telescopic mechanism includes a supporting block 11 fixed below the workbench 100, the supporting block 11 is penetrated by a horizontally arranged driving screw 12 and is threadably matched with the driving screw 12, one end of the driving screw 12 is rotatably connected to a fixed block 13, two positioning blocks 14 are symmetrically distributed on both sides of the supporting block 11, and each positioning block 14 is penetrated by a guide rod 15 with one end fixed to the fixed block 13, the guide rod 15 and the driving screw 12 are located on the same horizontal plane and are fixed at a certain angle, a positioning plate 16 is fixed above the positioning block 14, and the positioning plate 16 is located above the workbench 100 and close to its table top.
[0024] A connecting rod 17 is also fixedly provided on the supporting block 11, and the connecting rod 17 is perpendicular to the driving screw 12 and its two ends are respectively inserted into the two positioning blocks 14 and are slidably connected to the positioning blocks 14; the driving screw 12 is driven to rotate by a driving device, so that the supporting block 11 matched with its thread moves back and forth above it, and drives the two positioning blocks 14 to continuously approach or move away from each other.
[0025] During the operation of the exposure machine, when the target substrate needs to be placed on the workbench 100, the control system controls the driving device to drive the driving screw 12 to rotate, so that the supporting block 11 matched therewith moves toward the outside of the exposure machine, so that the workbench 100 and the connecting rod 17 fixed with the supporting block 11 move outward synchronously with it; since two positioning blocks 14 are also penetrated on the connecting rod 17, the two positioning blocks 14 move outward with the connecting rod 17, and there is a certain inclination angle between the guide rod 15 and the driving bolt, so due to the action of the guide rod 15, the two positioning blocks 14 will gradually move away while moving outward, thereby driving the two positioning plates 16 above them to move away, and making room for the position above the workbench 100.
[0026] After the workbench 100 moves to the designated position outside the exposure machine, the staff places the target substrate between the two positioning plates 16 on the workbench 100. Since the width of the positioning plates 16 is close to that of the workbench 100, there is no need to consider the possibility that the positioning plates 16 will not be able to work when placing the substrate. Just be careful not to place the substrate on the edge of the workbench 100. After the target substrate is placed, the drive device drives the drive screw 12 to rotate in the opposite direction, and at the same time the workbench 100 is retracted, and the two positioning plates 16 gradually approach each other. When the two positioning plates 16 are close to clamping the two sides of the target substrate to fix it, the drive device stops running and the workbench 100 stops moving. Then the exposure machine automatically scans and positions the target substrate on the workbench 100 to perform the exposure operation, and sends the target substrate out again after the exposure is completed.
[0027] During the whole process, the staff only needs to place the target substrate on the workbench 100, and after the target substrate is sent out after the exposure operation, take down the exposed target substrate and place it in the designated position. Therefore, the telescopic mechanism is used to automatically extend and retract the workbench 100 to receive the target substrate in the hands of the staff. In the process, the two positioning plates 16 are synchronously released or clamped to release or fix the target substrate, thereby realizing the positioning function of target substrates of any size, reducing the operating steps and difficulty of the staff, and improving the exposure efficiency.
[0028] like Figure 1 As shown, the exposure machine also includes a control system and an exposure cabin 10. The workbench 100 and the telescopic mechanism are located inside the exposure cabin 10. An exposure component is also fixed inside the exposure cabin 10. The entire exposure process is controlled by the control system. The target substrate being exposed is in the exposure cabin 10, which is convenient for maintaining the stability of parameters during the exposure process.
[0029] like Figure 5 As shown, when the positioning block 14 and the supporting block 11 are at the same horizontal position, the working efficiency of the driving device is the highest, and the workbench 100 is above the two. In order not to interfere with the area of the workbench 100, a groove 140 is provided between the positioning block 14 and the positioning plate 16. The side of the workbench 100 is inserted into the groove 140 and can move inside it, thereby ensuring that the positioning plate 16 moves with the positioning block 14 to perform work without affecting the area of the workbench 100.
[0030] Since the driving screw 12 drives the movement of the entire telescopic mechanism, and the connecting end of the driving screw 12 and the fixing block 13 passes through the fixing block 13 and is connected to the driving device, considering the strength of the driving screw 12, such as Figure 2 As shown, a reinforcing sleeve 121 is sleeved on the protruding portion thereof, and the reinforcing sleeve 121 is fixed on the fixing block 13 , thereby alleviating the stress on the driving screw 12 when rotating, improving the working strength, and reducing the loss of the driving screw 12 .
[0031] like Figure 3 As shown, in order to prevent the supporting block 11 and the positioning block 14 from falling out, a blocking block 18 is fixed to the other end of the driving screw 12 and the guide rod 15 that is not fixed to the fixing block 13. The blocking block 18 can also limit the moving position of the workbench 100.
[0032] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An exposure machine for producing copper-clad ceramic substrates, comprising a workbench (100) for placing a target substrate, characterized in that: The exposure machine further comprises a telescopic mechanism, the telescopic mechanism comprising a supporting block (11) fixed below the workbench (100), the supporting block (11) being penetrated by a horizontally arranged driving screw (12) and being threadably matched with the driving screw (12), one end of the driving screw (12) being rotatably connected to a fixing block (13), two positioning blocks (14) being symmetrically distributed on both sides of the supporting block (11), and each positioning block (14) being penetrated by a guide rod (15) having one end fixed to the fixing block (13), the guide rod (15) and the driving screw (12) being located on the same horizontal plane and fixed at a certain angle, a positioning plate (16) being fixed above the positioning block (14), the positioning plate (16) being located above the workbench (100) and close to its table top; A connecting rod (17) is fixedly provided on the supporting block (11), the connecting rod (17) is perpendicular to the driving screw rod (12), and the two ends of the connecting rod (17) are respectively inserted into the two positioning blocks (14) and are slidably connected to the positioning blocks (14); The driving screw (12) is driven to rotate by a driving device, causing the supporting block (11) matched with its thread to move back and forth above it, and driving the two positioning blocks (14) to continuously move closer to or farther away from each other.
2. The exposure machine for producing copper-clad ceramic substrates according to claim 1, characterized in that: The exposure machine further comprises a control system and an exposure cabin (10); the workbench (100) and the telescopic mechanism are located inside the exposure cabin (10); and an exposure component is also fixed inside the exposure cabin (10).
3. The exposure machine for producing copper-clad ceramic substrates according to claim 1, characterized in that: A groove (140) is provided between the positioning block (14) and the positioning plate (16); the side edge of the workbench (100) is inserted into the groove (140) and is capable of moving inside the groove (140).
4. The exposure machine for producing copper-clad ceramic substrates according to claim 1, characterized in that: The connecting end of the driving screw rod (12) and the fixing block (13) passes through the fixing block (13) to be connected to the driving device, and a reinforcing sleeve (121) is sleeved on the protruding portion thereof, and the reinforcing sleeve (121) is fixed on the fixing block (13).
5. The exposure machine for producing copper-clad ceramic substrate according to claim 1, characterized in that: A blocking block (18) is fixed to the other end of the driving screw rod (12) and the guide rod (15) that is not fixed to the fixing block (13).
6. The exposure machine for producing copper-clad ceramic substrates according to claim 2, characterized in that: The drive device is communicatively connected to a control output of the control system.
