Cleaning fluid output device
By designing a nozzle with periodic motion and a cleaning liquid output device with precise control, the problem of uneven distribution of cleaning liquid is solved, the cleaning effect of wafers is improved, and overload protection is provided through belt transmission to ensure stable operation of the device.
Patent Information
- Application Number
- CN202420613482.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-03-27
AI Technical Summary
In the prior art, the cleaning liquid is unevenly distributed on the wafer surface, resulting in poor cleaning effect and product defects.
A cleaning liquid output device is designed, including a fixed arm, an output arm and a nozzle. The nozzle is fixed at the bottom of the output arm and moves periodically with the rotation of the output arm. Combined with the servo motor and gear transmission structure, it ensures that the cleaning liquid is evenly distributed.
Through the periodic movement and precise control of the nozzle, the uniform distribution of the cleaning liquid is achieved, the cleaning effect of the wafer is improved, and overload protection is provided through the belt transmission structure to ensure the stable operation of the device.
Smart Images

Figure CN222300626U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer cleaning, in particular to a cleaning liquid output device. Background Art
[0002] CMP (Chemical Mechanical Planarization) is a process that uses chemical etching and mechanical force to planarize silicon wafers or other substrate materials during processing and perform post-cleaning. Therefore, the post-polishing CMP cleaning process is a key technology for the successful application of CMP in semiconductor processes.
[0003] In the prior art, the cleaning liquid output structure outputs the cleaning liquid to a fixed position on the wafer surface and distributes the cleaning liquid to various places on the wafer surface by rotating the wafer. However, the cleaning liquid cannot be evenly distributed on the wafer surface when the wafer rotates, and it cannot be guaranteed that the cleaning liquid effectively enters between the brush and the wafer, which leads to uneven distribution of the cleaning liquid, insufficient product cleaning, and product defects. Utility Model Content
[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of uneven cleaning liquid in the prior art, thereby providing a cleaning liquid output device.
[0005] The utility model provides a cleaning liquid output device, comprising:
[0006] Fixed arm;
[0007] An output arm, rotatably connected to the fixed arm;
[0008] There is at least one nozzle; the nozzle is fixed at the bottom of the output arm; the nozzle performs periodic motion as the output arm rotates.
[0009] As a preferred solution, the nozzle has one.
[0010] As a preferred solution, it includes:
[0011] A control component is connected to the output arm; the control component is suitable for controlling the rotation of the output arm.
[0012] As a preferred solution, the control assembly includes a driving structure and a transmission structure; the driving structure is connected to the output arm; and the transmission structure is arranged between the driving structure and the output arm.
[0013] As a preferred solution, the driving structure includes a motor.
[0014] As a preferred embodiment, the transmission structure includes a first gear and a second gear; the first gear is fixedly connected to the output arm; the first gear rotates synchronously with the output arm; the second gear is fixedly connected to the driving structure; the second gear is connected to the first gear; and the second gear drives the first gear to rotate.
[0015] As a preferred solution, the first gear is connected to the second gear via a belt.
[0016] As a preferred solution, the output diameter of the nozzle is 1.5mm-5mm.
[0017] As a preferred solution, the rotation speed of the output arm is 10rpm-100rpm.
[0018] As a preferred solution, the motor is a servo motor.
[0019] The technical solution of the utility model has the following advantages:
[0020] 1. The cleaning liquid output device provided by the utility model comprises: a fixed arm, an output arm and a nozzle, wherein the output arm is rotatably connected to the fixed arm; there is at least one nozzle; the nozzle is fixed at the bottom of the output arm; the nozzle performs periodic motion with the rotation of the output arm. The device drives the nozzle to perform periodic motion by the rotation of the output arm and the fixed arm. During the wafer cleaning process, the nozzle in the scheme is in motion, and not only outputs the cleaning liquid to a fixed position on the wafer surface, but the moving nozzle can output the cleaning liquid more evenly to the wafer surface, thereby increasing the wafer cleaning effect.
[0021] 2. The cleaning liquid output device provided by the utility model has a first gear and a second gear connected by a belt. The belt drive has the advantage of smooth operation, and the belt has good elasticity, can buffer and absorb vibration during operation, and the belt also has an overload protection function. If an overload is encountered during operation, the belt will slip, thereby playing a safety protection role.
[0022] 3. The cleaning liquid output device provided by the utility model has a servo motor as its motor, which has the advantages of high precision and stable operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1 This is a schematic diagram of the overall structure of the cleaning liquid output device provided by the utility model.
[0025] Figure 2 This is a schematic diagram of the structure of other forms of output arms of the cleaning liquid output device provided by the utility model.
[0026] Description of reference numerals:
[0027] 1. Fixed arm; 2. Output arm; 3. Nozzle; 4. Control component; 41. Driving structure; 42. Transmission structure; 421. First gear; 422. Second gear; 423. Belt. DETAILED DESCRIPTION
[0028] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0029] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.
[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0031] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0032] like Figure 1As shown, this embodiment provides a cleaning liquid output device, including: a fixed arm 1, an output arm 2 and a nozzle 3, wherein the output arm 2 is rotatably connected to the fixed arm 1; the nozzle 3 has at least one nozzle; the nozzle 3 is fixed at the bottom of the output arm 2; and the nozzle 3 performs periodic motion with the rotation of the output arm 2. This device drives the nozzle 3 to perform periodic motion by the rotation of the output arm 2 and the fixed arm 1. During the wafer cleaning process, the nozzle 3 in this solution is in motion, and not only outputs the cleaning liquid to a fixed position on the wafer surface, but the moving nozzle 3 can output the cleaning liquid more evenly to the wafer surface, thereby increasing the wafer cleaning effect.
[0033] It should be noted that in this embodiment, the output arm 2 is L-shaped, the vertical arm of the output arm 2 is connected to the fixed arm 1, and the horizontal arm is used to connect the nozzle 3. The installation position of the nozzle 3 will affect the output range of the nozzle 3 when it rotates. In order to make the output range of the nozzle 3 as large as possible, the nozzle 3 in this embodiment has one nozzle 3, and the nozzle 3 is installed at the end of the horizontal arm away from the vertical arm. In order to further increase the output of the cleaning liquid of the nozzle 3, multiple nozzles 3 can be set on the horizontal arm.
[0034] like Figure 2 As shown, as an alternative embodiment, the output arm 2 is in a T-shape, the vertical arm of the output arm 2 is connected to the fixed arm 1, and the horizontal arm is used to connect the nozzle 3, and there are three nozzles 3 evenly distributed on the horizontal arm.
[0035] It should be noted that in order to make the nozzle 3 suitable for wafers of more sizes, the length of the horizontal arm can be appropriately increased or decreased. Specifically, the length of the horizontal arm ranges from 10 mm to 150 mm.
[0036] Furthermore, the output diameter of the nozzle 3 is 1.5 mm to 5 mm. In order to increase the flow rate of the cleaning liquid, the output diameter of the nozzle 3 can be appropriately increased.
[0037] Furthermore, a control component 4 is included. The control component 4 is connected to the output arm 2 and is suitable for controlling the rotation of the output arm 2.
[0038] It should be noted that the control component 4 controls the rotation speed of the output arm 2 to be 10rpm-100rpm. The specific rotation speed of the output arm 2 is adjusted according to the rotation speed of the wafer. When the speed of the wafer increases, the rotation speed of the output arm 2 also increases accordingly. When the speed of the wafer slows down, the rotation speed of the output arm 2 also decreases accordingly. This ensures that the output arm 2 can correspond to the uniformity of the cleaning liquid on the wafer surface at different rotation speeds.
[0039] Furthermore, the control assembly 4 includes a driving structure 41 and a transmission structure 42, wherein the driving structure 41 is connected to the output arm 2, and the transmission structure 42 is arranged between the driving structure 41 and the output arm 2; wherein the transmission structure 42 plays a transmission role.
[0040] It should be noted that the drive structure 41 includes a motor, the output end of the motor is connected to the drive structure 41, and the motor generates a driving torque, thereby serving as a power source. Specifically, the motor is a servo motor, which has the advantages of high precision and stable operation.
[0041] like Figure 1 As shown, further, the transmission structure 42 includes a first gear 421 and a second gear 422, the first gear 421 is fixedly connected to the output arm 2, and the first gear 421 rotates synchronously with the output arm 2. In this embodiment, the first gear 421 is sleeved on the outside of the output arm 2, and the first gear 421 is fixedly connected to the output arm 2. Specifically, the first gear 421 is connected to the output arm 2 by bonding, or by welding. The second gear 422 is fixedly connected to the output end of the motor, specifically, the second gear 422 is connected to the motor by bonding, or by welding.
[0042] like Figure 1 As shown, the second gear 422 is connected to the first gear 421, and the second gear 422 drives the first gear 421 to rotate. In this embodiment, the second gear 422 is connected to the first gear 421 through a belt 423, and the second gear 422 and the first gear 421 are synchronously rotated by the belt 423. The belt 423 transmission has the advantage of smooth operation, and the belt 423 has good elasticity, which can buffer and absorb vibration during operation. The belt 423 also has an overload protection function. If an overload is encountered during operation, the belt 423 will slip, thereby playing a role of safety protection. As an alternative embodiment, the second gear 422 and the first gear 421 are connected by meshing.
[0043] In this embodiment, the wafer cleaning process is as follows: the wafer enters the cleaning unit with the grinding head, the nozzle 3 rotates with the output arm 2, and the cleaning liquid pre-flows for 5s-8s. Then the wafer is pressed down to the grinding pad with the grinding head and the main grinding begins. The grinding time is 46-51 seconds (originally 59-67 seconds), the cleaning liquid flow rate is 240-260ml / min; the nozzle 3 speed is 50rpm. After the wafer is polished, it is lifted up, and the high-pressure water spray starts to clean the grinding pad. The wafer is cleaned and enters the next unit.
[0044] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. A cleaning liquid output device, characterized in that: include: Fixed arm (1); An output arm (2) is rotatably connected to the fixed arm (1); There is at least one nozzle (3); the nozzle (3) is fixed at the bottom of the output arm (2); the nozzle (3) performs periodic movement as the output arm (2) rotates.
2. The cleaning liquid output device according to claim 1, characterized in that: The spray head (3) has one.
3. The cleaning liquid output device according to claim 1, characterized in that: include: A control component (4) is connected to the output arm (2); the control component (4) is suitable for controlling the rotation of the output arm (2).
4. The cleaning liquid output device according to claim 3, characterized in that: The control component (4) comprises a driving structure (41) and a transmission structure (42); the driving structure (41) is connected to the output arm (2); and the transmission structure (42) is arranged between the driving structure (41) and the output arm (2).
5. The cleaning liquid output device according to claim 4, characterized in that: The driving structure (41) comprises a motor.
6. The cleaning liquid output device according to claim 5, characterized in that: The transmission structure (42) comprises a first gear (421) and a second gear (422); the first gear (421) is fixedly connected to the output arm (2); the first gear (421) and the output arm (2) rotate synchronously; the second gear (422) is fixedly connected to the driving structure (41); the second gear (422) is connected to the first gear (421); and the second gear (422) drives the first gear (421) to rotate.
7. The cleaning liquid output device according to claim 6, characterized in that: The first gear (421) and the second gear (422) are connected via a belt (423).
8. The cleaning liquid output device according to claim 1, characterized in that: The output diameter of the nozzle (3) is 1.5 mm-5 mm.
9. The cleaning liquid output device according to claim 1, characterized in that: The rotation speed of the output arm (2) is 10 rpm-100 rpm.
10. The cleaning liquid output device according to claim 5, characterized in that: The motor is a servo motor.
