Blanking device of silicon wafer etching machine

Abstract

The utility model discloses a blanking device of a silicon wafer etching machine, which relates to the field of silicon wafer processing equipment and comprises two supporting legs, the top surfaces of the two supporting legs are fixedly connected with supporting plates, the top surfaces of the two supporting plates are jointly and fixedly connected with an etching machine body, a conveying belt is jointly arranged between the two supporting plates, and the conveying belt is arranged between the two supporting plates. And supporting columns are fixedly connected to the top surfaces of the two supporting plates. According to the utility model, etched silicon wafers are sent out through the conveyor belt, then the transmission assembly drives the adsorption assembly to move, then the etched silicon wafers are adsorbed, and then the etched silicon wafers are sent to the storage assembly to be stored. Therefore, the problem that the use of the silicon wafers and the etching yield of the silicon wafers are affected due to the fact that the silicon wafers are damaged when the silicon wafers are grabbed by a mechanical arm is solved, and the blanking efficiency can be improved through the cooperation of the transmission assembly and the adsorption assembly.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer processing equipment, in particular to a material unloading device of a silicon wafer etching machine. Background Art

[0002] The etching process is a process of removing the thin film layer that is not masked by the resist, so as to obtain a pattern on the thin film that is exactly the same as the pattern on the resist film. In the integrated circuit manufacturing process, after mask registration, exposure and development, the required pattern is copied on the resist film, or an electron beam is used to directly draw a pattern on the resist film, and then this pattern is accurately transferred to the silicon oxide under the resist to produce the required thin layer pattern. After the silicon wafer is etched, it needs to be cut.

[0003] After searching, the applicant found that a Chinese patent disclosed "an automatic loading and unloading mechanism for a laser etching machine", and its publication number is "CN217913494U". This patent mainly controls the height position of the top product through a loading device, providing a basis for loading products. The top product of the loading device is transported to the workbench for processing by a loading and handling robot. At the same time, the unloading and handling robot transports the processed products on the workbench to the unloading device for collection. The driving assembly drives the loading and handling robot and the unloading and handling robot to work synchronously, thereby improving the efficiency of loading and unloading.

[0004] The above-mentioned device can complete the loading and unloading of the processed products through a series of structures, and improve the efficiency of loading and unloading. However, when the above-mentioned device unloads the processed products, it is easy for the robot to touch the silicon wafer and cause damage to the silicon wafer by clamping it through a robot, thereby affecting the use of the silicon wafer and affecting the yield rate of silicon wafer etching. Utility Model Content

[0005] The utility model aims to provide a material unloading device for a silicon wafer etching machine, so as to solve the problem in the background technology that the robot arm is prone to damage the silicon wafer when the device is used, thereby affecting the use of the silicon wafer and the silicon wafer etching yield.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a feeding device of a silicon wafer etcher, comprising two supporting legs, the top surfaces of the two supporting legs are fixedly connected to a supporting plate, the top surfaces of the two supporting plates are commonly fixedly connected to an etcher body, a conveyor belt is commonly provided between the two supporting plates, the top surfaces of the two supporting plates are fixedly connected to supporting columns, one side of the surface of one of the supporting plates is fixedly connected to a first motor, opposite sides of the two supporting plates are provided with a storage assembly for storing silicon wafers that have been etched, the top surfaces of the two supporting columns are commonly provided with a transmission assembly that can be translated, and the transmission assembly is provided with an adsorption assembly that can move up and down to adsorb the silicon wafers that have been etched.

[0007] Preferably, the storage assembly includes a fixed plate, one side of the surface of the fixed plate is fixedly connected to one side of the support plate, limiting columns are fixedly connected at the four corners of the top surface of the fixed plate, the inner walls of the four limiting columns are slidably connected to a storage basket, handles are fixedly connected on both sides of the surface of the storage basket, and a buffer pad is fixedly connected to the inner wall of the storage basket.

[0008] Preferably, the storage assembly further comprises a reinforcing rib, one side of the reinforcing rib is fixedly connected to one side of the supporting leg, and the top surface of the reinforcing rib is fixedly connected to the bottom surface of the fixing plate.

[0009] Preferably, the transmission assembly includes a transmission box and a second motor fixed to one side of the transmission box surface, the bottom surface of the transmission box is fixedly connected to the top surfaces of the two support columns, one side of the inner wall of the transmission box is rotatably connected with a transmission screw, the rod wall of the transmission screw is threadedly connected to two transmission blocks, one end of the transmission screw penetrates one side of the inner wall of the transmission box and extends to one side of the transmission box surface and is fixedly connected to the output end of the second motor.

[0010] Preferably, the transmission assembly also includes a sliding groove opened on one side of the transmission box surface and a limiting groove opened on one side of the inner wall of the transmission box, the sliding groove is communicated with the interior of the transmission box, the inner wall of the sliding groove is slidably connected to the surfaces of the two transmission blocks, the inner wall of the limiting groove is slidably connected to two limiting blocks, and one side of the two limiting blocks is fixedly connected to one side of the two transmission blocks respectively.

[0011] Preferably, the adsorption assembly includes two connecting plates, one side of the two connecting plates is fixedly connected to one side of the corresponding transmission block, the bottom surfaces of the two connecting plates are commonly fixedly connected to a mounting plate, the two sides of the bottom surface of the mounting plate are respectively fixedly connected to the first electric telescopic rod and the second electric telescopic rod, and the bottom ends of the first electric telescopic rod and the second electric telescopic rod are both fixedly connected to electric suction cups.

[0012] Preferably, the distance between the two electric suction cups is equal to the distance from the center of the conveyor belt to the center of one of the storage baskets.

[0013] Preferably, the top surfaces of the two support plates are fixedly connected with stoppers.

[0014] The technical effects and advantages of the utility model are as follows: the utility model sends out the etched silicon wafers through a conveyor belt, and then the transmission component drives the adsorption component to move, and then adsorbs the etched silicon wafers, and then sends the etched silicon wafers to the storage component for storage, thereby avoiding the problem of affecting the use of silicon wafers and the etching yield of silicon wafers due to damage to the silicon wafers when the robot arm grabs the silicon wafers, and the cooperation of the transmission component and the adsorption component can improve the efficiency of material unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0016] Figure 2 It is a front view structural schematic diagram of the utility model.

[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the adsorption component of the utility model.

[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the storage basket of the utility model.

[0019] Figure 5 It is a schematic diagram of the cross-sectional structure of the transmission box of the utility model from above.

[0020] In the figure: 1. support leg; 2. transmission assembly; 3. adsorption assembly; 4. storage assembly; 5. support plate; 6. block; 7. conveyor belt; 8. first motor; 9. etcher body; 10. support column; 201. transmission box; 202. second motor; 203. sliding groove; 204. transmission screw; 205. transmission block; 206. limiting block; 207. limiting groove; 301. connecting plate; 302. mounting plate; 303. first electric telescopic rod; 304. second electric telescopic rod; 305. electric suction cup; 401. storage basket; 402. buffer pad; 403. handle; 404. limiting column; 405. fixing plate; 406. reinforcing rib. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] The utility model provides Figure 1-5 The unloading device of a silicon wafer etching machine shown in the figure comprises two support legs 1, the top surfaces of the two support legs 1 are fixedly connected with support plates 5, the top surfaces of the two support plates 5 are commonly fixedly connected with an etching machine body 9, a conveyor belt 7 is commonly provided between the two support plates 5, the top surfaces of the two support plates 5 are fixedly connected with support columns 10, one side of the surface of one support plate 5 is fixedly connected with a first motor 8, the opposite sides of the two support plates 5 are each provided with a storage assembly 4 for storing the etched silicon wafers, and the top surfaces of the two support columns 10 are commonly provided with a transmission capable of translation. Component 2, the transmission component 2 is provided with an adsorption component 3 which can move up and down to adsorb the etched silicon wafer, the etched silicon wafer is sent out through the conveyor belt 7, and then the transmission component 2 drives the adsorption component 3 to move, and then adsorbs the etched silicon wafer, and then sends the etched silicon wafer to the storage component 4 for storage, thereby avoiding the problem of affecting the use of the silicon wafer and the etching yield of the silicon wafer due to damage to the silicon wafer when the robot grabs the silicon wafer, and the cooperation of the transmission component 2 and the adsorption component 3 can improve the efficiency of material unloading.

[0023] like Figure 1 , Figure 2 and Figure 4 As shown, the storage component 4 includes a fixed plate 405, one side of the surface of the fixed plate 405 is fixedly connected to one side of the support plate 5, the four corners of the top surface of the fixed plate 405 are fixedly connected to the limiting columns 404, the inner walls of the four limiting columns 404 are slidably connected with a storage basket 401, the storage basket 401 can store the etched silicon wafers, both sides of the surface of the storage basket 401 are fixedly connected with handles 403, the handles 403 can facilitate the transportation of the stored silicon wafers, the inner wall of the storage basket 401 is fixedly connected with a buffer pad 402, the buffer pad 402 can prevent the silicon wafers from being scratched against the storage basket 401, the storage component 4 also includes a reinforcing rib 406, the reinforcing rib 406 can make the fixed plate 405 more secure, one side of the reinforcing rib 406 is fixedly connected to one side of the support leg 1, and the top surface of the reinforcing rib 406 is fixedly connected to the bottom surface of the fixed plate 405.

[0024] like Figure 1 , Figure 2 and Figure 5As shown, the transmission assembly 2 includes a transmission box 201 and a second motor 202 fixed to one side of the surface of the transmission box 201. The bottom surface of the transmission box 201 is fixedly connected to the top surfaces of the two support columns 10. A transmission screw 204 is rotatably connected to one side of the inner wall of the transmission box 201. The rod wall of the transmission screw 204 is threadedly connected to two transmission blocks 205. One end of the transmission screw 204 passes through one side of the inner wall of the transmission box 201 and extends to one side of the surface of the transmission box 201 and is fixedly connected to the output end of the second motor 202. The transmission assembly 2 also includes a sliding Groove 203 and a limiting groove 207 opened on one side of the inner wall of the transmission box 201, the sliding groove 203 is communicated with the interior of the transmission box 201, the inner wall of the sliding groove 203 is slidably connected to the surfaces of the two transmission blocks 205, and one side of the two transmission blocks 205 passes through the sliding groove 203 and extends to the surface of the transmission box 201, the inner wall of the limiting groove 207 is slidably connected to two limiting blocks 206, one side of the two limiting blocks 206 is respectively fixedly connected to one side of the two transmission blocks 205, and the limiting blocks 206 and the limiting groove 207 can support and limit the two transmission blocks 205.

[0025] like Figure 1-3 As shown, the adsorption component 3 includes two connecting plates 301, one side of the two connecting plates 301 is fixedly connected to one side of the corresponding transmission block 205, the bottom surfaces of the two connecting plates 301 are commonly fixedly connected with a mounting plate 302, the two sides of the bottom surface of the mounting plate 302 are respectively fixedly connected with a first electric telescopic rod 303 and a second electric telescopic rod 304, the bottom ends of the first electric telescopic rod 303 and the second electric telescopic rod 304 are both fixedly connected with an electric suction cup 305, and the electric suction cup 305 can adsorb the silicon wafer.

[0026] like Figure 1 As shown, the distance between the two electric suction cups 305 is equal to the distance from the center of the conveyor belt 7 to the center of one of the storage baskets 401, so that when the first electric telescopic rod 303 is located directly above the storage basket 401, the second electric telescopic rod 304 can be located directly above the conveyor belt 7, and the top surfaces of the two support plates 5 are fixedly connected with blocks 6, which can prevent silicon wafers from falling.

[0027] Working principle of the utility model: when the device is in use, the first motor 8 is first started to drive the conveyor belt 7 to run and send out the silicon wafer etched by the etcher body 9, and then when sending it out, the second motor 202 is started and drives the transmission screw 204 to rotate, and then drives the two transmission blocks 205 to move to the left during the rotation, and then after moving to the left, the silicon wafer moves to the bottom of the first electric telescopic rod 303, and then the first electric telescopic rod 303 extends downward and then uses the electric suction cup 305 to absorb the silicon wafer, and then after the absorption is completed, the first electric telescopic rod 303 extends downward and then uses the electric suction cup 305 to absorb the silicon wafer. The retracting rod 303 retracts and causes the second motor 202 to reverse, thereby driving the transmission screw 204 to reverse, and then the two transmission blocks 205 on the transmission screw 204 move to the right, and drive the first electric telescopic rod 303 and the second electric telescopic rod 304 to move to the right at the same time, and then when the first electric telescopic rod 303 moves to the top of the storage basket 401 on the right, the electric suction cup 305 on the first electric telescopic rod 303 stops adsorbing the silicon wafer, so that the etched silicon wafer is placed in the storage basket 401 on the right;

[0028] At the same time, the second electric telescopic rod 304 is located just above the conveyor belt 7. Then, when the first electric telescopic rod 303 places the silicon wafer into the storage basket 401 on the right, the second electric telescopic rod 304 extends downward to use the electric suction cup 305 to absorb the etched silicon wafer on the conveyor belt 7, and retracts after the absorption is completed. Then the second motor 202 resumes forward rotation and drives the transmission screw 204 to rotate forward, so that the two transmission blocks 205 on the transmission screw 204 move to the left and drive the first electric telescopic rod 304 to rotate forward. The retractable rod 303 and the second electric telescopic rod 304 move to the left, and then when the second electric telescopic rod 304 moves to just above the storage basket 401 on the left, the electric suction cup 305 stops adsorbing the silicon wafer, so that the silicon wafer is placed in the storage basket 401 on the left, and when the silicon wafer is placed inside the storage basket 401 on the left, the first electric telescopic rod 303 just adsorbs the silicon wafer moved from the conveyor belt 7, so that the above steps can be repeated to achieve fast and efficient unloading of the etched silicon wafers, and they can be aligned for storage.

[0029] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A material unloading device for a silicon wafer etching machine, comprising two supporting legs (1), characterized in that: The top surfaces of the two support legs (1) are fixedly connected to support plates (5), the top surfaces of the two support plates (5) are commonly fixedly connected to an etching machine body (9), a conveyor belt (7) is commonly provided between the two support plates (5), the top surfaces of the two support plates (5) are fixedly connected to support columns (10), one side of the surface of one of the support plates (5) is fixedly connected to a first motor (8), the opposite sides of the two support plates (5) are each provided with a storage component (4) for storing silicon wafers that have been etched, the top surfaces of the two support columns (10) are commonly provided with a transmission component (2) that can be translated, and the transmission component (2) is provided with an adsorption component (3) that can move up and down to adsorb the silicon wafers that have been etched.

2. The unloading device of a silicon wafer etching machine according to claim 1, characterized in that: The storage assembly (4) comprises a fixed plate (405), one side of the surface of the fixed plate (405) is fixedly connected to one side of the support plate (5), the four corners of the top surface of the fixed plate (405) are fixedly connected to limiting columns (404), the inner walls of the four limiting columns (404) are slidably connected to a storage basket (401), both sides of the surface of the storage basket (401) are fixedly connected to handles (403), and the inner wall of the storage basket (401) is fixedly connected to a buffer pad (402).

3. The unloading device of a silicon wafer etching machine according to claim 2, characterized in that: The storage assembly (4) further comprises a reinforcing rib (406), one side of the reinforcing rib (406) being fixedly connected to one side of the supporting leg (1), and the top surface of the reinforcing rib (406) being fixedly connected to the bottom surface of the fixing plate (405).

4. The unloading device of a silicon wafer etching machine according to claim 1, characterized in that: The transmission assembly (2) comprises a transmission box (201) and a second motor (202) fixed to one side of the surface of the transmission box (201); the bottom surface of the transmission box (201) is fixedly connected to the top surfaces of the two support columns (10); one side of the inner wall of the transmission box (201) is rotatably connected to a transmission screw (204); the rod wall of the transmission screw (204) is threadedly connected to two transmission blocks (205); one end of the transmission screw (204) passes through one side of the inner wall of the transmission box (201) and extends to one side of the surface of the transmission box (201) to be fixedly connected to the output end of the second motor (202).

5. The unloading device of a silicon wafer etching machine according to claim 4, characterized in that: The transmission assembly (2) further comprises a sliding groove (203) provided on one side of the surface of the transmission box (201) and a limiting groove (207) provided on one side of the inner wall of the transmission box (201); the sliding groove (203) is communicated with the interior of the transmission box (201); the inner wall of the sliding groove (203) is slidably connected to the surfaces of the two transmission blocks (205); the inner wall of the limiting groove (207) is slidably connected to two limiting blocks (206); one side of the two limiting blocks (206) is fixedly connected to one side of the two transmission blocks (205) respectively.

6. The unloading device of a silicon wafer etching machine according to claim 4, characterized in that: The adsorption assembly (3) comprises two connecting plates (301), one side of the two connecting plates (301) is respectively fixedly connected to one side of the corresponding transmission block (205), the bottom surfaces of the two connecting plates (301) are commonly fixedly connected to a mounting plate (302), the two sides of the bottom surface of the mounting plate (302) are respectively fixedly connected to a first electric telescopic rod (303) and a second electric telescopic rod (304), and the bottom ends of the first electric telescopic rod (303) and the second electric telescopic rod (304) are both fixedly connected to an electric suction cup (305).

7. The unloading device of a silicon wafer etching machine according to claim 6, characterized in that: The distance between the two electric suction cups (305) is equal to the distance from the center of the conveyor belt (7) to the center of one of the storage baskets (401).

8. The unloading device of a silicon wafer etching machine according to claim 1, characterized in that: The top surfaces of the two support plates (5) are both fixedly connected with stoppers (6).

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