Semiconductor device surface mounting device

Abstract

The utility model discloses a semiconductor device surface mounting device, which comprises a workbench, the top of the workbench is fixedly connected with a U-shaped frame, the top of the U-shaped frame is fixedly connected with an air cylinder, and the output end of the air cylinder is fixedly connected with a connecting plate. Compared with a traditional device, the device is provided with an air cylinder, a connecting plate, racks, gears, a first rotating plate, a movable plate, a third limiting rod, an L-shaped clamping block and a first spring, the air cylinder can be driven to push the connecting plate to move downwards, and the connecting plate drives the two gears to rotate through the two racks; according to the utility model, the gear is driven to move through the first rotating plate and the L-shaped clamping block so as to clamp and fix the semiconductor device, and the semiconductor device can be protected through the first spring, so that accurate position surface mounting is realized, and the phenomenon that the semiconductor device moves and deviates is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, in particular to a semiconductor device patch device. Background Art

[0002] In life, semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion.

[0003] Currently, when semiconductor devices are processed, a patch device is required to perform the patch work. However, the existing patch devices do not have a positioning function when patching semiconductor devices, which causes the semiconductor devices to move and deviate, making it impossible to accurately position the patch. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor device mounting device to solve the problem raised in the above-mentioned background technology that a mounting device is currently needed to perform mounting work when semiconductor devices are processed, but the existing mounting devices do not have a positioning function when mounting semiconductor devices, which causes the semiconductor devices to move and deviate, resulting in the inability to accurately position the mounting.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor device patch device comprises a workbench, the top of the workbench is fixedly connected to a U-shaped frame, the top of the U-shaped frame is fixedly connected to a cylinder, the output end of the cylinder is fixedly connected to a connecting plate, the bottom of the connecting plate is fixedly connected to two racks, the inner side of the U-shaped frame is fixedly connected to two first fixed blocks, one side of the two first fixed blocks is rotatably connected to a gear, the gear is meshed with the rack, the outer wall of the gear is provided with a first rotating plate, the end of the first rotating plate away from the gear is rotatably connected to a movable plate, and the inner side of the movable plate is slidably connected to two third limiting plates. The third limiting rod has an L-shaped clamping block at one end, a first spring is sleeved on the outside of the third limiting rod and is located between the movable plate and the L-shaped clamping block, an electromagnet is fixedly connected to the top of the L-shaped clamping block, a fourth limiting rod is slidably connected inside the L-shaped clamping block and is located inside the electromagnet, a magnet is fixedly connected to the top of the fourth limiting rod, a clamping plate is fixedly connected to the bottom of the fourth limiting rod and is located inside the L-shaped clamping block, a second spring is sleeved on the outside of the fourth limiting rod and is located above the clamping plate, and the top of the second spring is fixedly connected to the L-shaped clamping block, and the bottom of the second spring is fixedly connected to the clamping plate.

[0006] As a preferred solution of the utility model: two first limiting rods are fixedly connected to the top of the connecting plate, and the two first limiting rods are slidably connected to the U-shaped frame, which can play a guiding and limiting role for the connecting plate.

[0007] As a preferred solution of the utility model: two second limit rods are fixedly connected to one side of the two movable plates, the second limit rods are slidably connected to the U-shaped frame, and a limit groove matching the clamping plate is provided inside the L-shaped clamping block. The second limit rod is provided to guide and limit the movable plate, and the limit groove is provided to guide and limit the clamping plate.

[0008] As a preferred solution of the utility model: a conveyor is arranged inside the workbench, the bottom of the connecting plate is located between two racks and is fixedly connected to an electric telescopic rod, the output end of the electric telescopic rod is fixedly connected to a patch mechanism, the conveyor is arranged to facilitate the conveyance of semiconductor devices, and the electric telescopic rod patch mechanism is arranged to facilitate the patch work.

[0009] As a preferred solution of the utility model: a control panel is fixedly connected to one side of the workbench, and the control panel is electrically connected to the cylinder, conveyor, electromagnet, electric telescopic rod and patch mechanism, so as to facilitate the control of the overall operation of the utility model.

[0010] The beneficial effects of the utility model are as follows: the utility model has a novel structure, is simple to operate, and is easy to use. It is not only compact in structure, but also more practical. Compared with the traditional device, the utility model is provided with a cylinder, a connecting plate, a rack, a gear, a first rotating plate, a movable plate, a third limiting rod, an L-shaped clamping block and a first spring. The connecting plate can be pushed downward by driving the cylinder, and the connecting plate drives the two gears to rotate through the two racks, so that the gears move through the first rotating plate and the L-shaped clamping block to clamp and fix the semiconductor device, and the first spring can provide protection for the semiconductor device, thereby realizing precise positioning of the patch and preventing the semiconductor device from shifting its position; an electromagnet, a fourth limiting rod, a magnet, a clamping plate and a second spring are provided, and the magnetic poles on one side of the electromagnet and the magnet are opposite, so that the electromagnet attracts the magnet and drives the clamping plate to clamp the semiconductor device, thereby providing assistance for the patch work. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a front view of the utility model;

[0012] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0013] Figure 3 It is a three-dimensional structural schematic diagram of the movable plate and the third limiting rod of the utility model;

[0014] Figure 4 It is an enlarged view of point A of the present utility model.

[0015] In the figure: 1. workbench; 2. control panel; 3. U-shaped frame; 4. cylinder; 5. connecting plate; 6. first limit rod; 7. rack; 8. first fixed block; 9. gear; 10. first rotating plate; 11. movable plate; 12. second limit rod; 13. third limit rod; 14. L-shaped clamping block; 15. first spring; 16. electromagnet; 17. clamping plate; 18. limit groove; 19. second spring; 20. fourth limit rod; 21. electric telescopic rod; 22. patch mechanism; 23. magnet; 24. conveyor. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] See also Figures 1 to 4The utility model provides a technical solution: a semiconductor device patch device, including a workbench 1, a U-shaped frame 3 is fixedly connected to the top of the workbench 1, a cylinder 4 is fixedly connected to the top of the U-shaped frame 3, a connecting plate 5 is fixedly connected to the output end of the cylinder 4, two racks 7 are fixedly connected to the bottom of the connecting plate 5, two first fixed blocks 8 are fixedly connected to the inner side of the U-shaped frame 3, one side of the two first fixed blocks 8 is rotatably connected to a gear 9, the gear 9 is meshed with the rack 7, a first rotating plate 10 is arranged on the outer wall of the gear 9, and the end of the first rotating plate 10 away from the gear 9 is rotatably connected to The movable plate 11 has two third limiting rods 13 slidably connected inside the movable plate 11, one end of the third limiting rod 13 is fixedly connected to an L-shaped clamping block 14, a first spring 15 is sleeved on the outside of the third limiting rod 13 and is located between the movable plate 11 and the L-shaped clamping block 14, an electromagnet 16 is fixedly connected to the top of the L-shaped clamping block 14, a fourth limiting rod 20 is slidably connected inside the L-shaped clamping block 14 and is located inside the electromagnet 16, a magnet 23 is fixedly connected to the top of the fourth limiting rod 20, and a magnet 23 is fixedly connected to the bottom of the fourth limiting rod 20 and is located inside the L-shaped clamping block 14. A second spring 19 is sleeved on the outer side of the clamping plate 17 and the fourth limiting rod 20, and the top of the second spring 19 is fixedly connected to the L-shaped clamping block 14, and the bottom of the second spring 19 is fixedly connected to the clamping plate 17. A cylinder 4, a connecting plate 5, a rack 7, a gear 9, a first rotating plate 10, a movable plate 11, a third limiting rod 13, an L-shaped clamping block 14 and a first spring 15 are provided. The connecting plate 5 can be pushed downward by driving the cylinder 4, and the connecting plate 5 drives the two gears 9 to rotate through the two racks 7, so that the gear 9 passes The first rotating plate 10 and the L-shaped clamping block 14 move to clamp and fix the semiconductor device, and the first spring 15 can provide protection for the semiconductor device, so as to achieve precise position patch and prevent the semiconductor device from position movement and deviation; an electromagnet 16, a fourth limiting rod 20, a magnet 23, a clamping plate 17 and a second spring 19 are provided, and the electromagnet 16 and the magnet 23 can face each other with opposite magnetic poles on one side, so that the electromagnet 16 attracts the magnet 23 and then drives the clamping plate 17 to clamp the semiconductor device, providing assistance for the patch work.

[0018] Two first limiting rods 6 are fixedly connected to the top of the connecting plate 5, and the two first limiting rods 6 are slidably connected to the U-shaped frame 3, which can guide and limit the connecting plate 5; two second limiting rods 12 are fixedly connected to one side of the two movable plates 11, and the second limiting rods 12 are slidably connected to the U-shaped frame 3. A limiting groove 18 matching the clamping plate 17 is provided inside the L-shaped clamping block 14, and the second limiting rod 12 can guide and limit the movable plate 11, and the limiting groove 18 can guide and limit the clamping plate 17; the interior of the workbench 1 A conveyor 24 is provided, and the bottom of the connecting plate 5 is fixedly connected with an electric telescopic rod 21 between the two racks 7, and the output end of the electric telescopic rod 21 is fixedly connected with a patch mechanism 22. The conveyor 24 is provided to facilitate the transportation of semiconductor devices, and the electric telescopic rod 21 and the patch mechanism 22 are provided to facilitate the patch work; a control panel 2 is fixedly connected to one side of the workbench 1, and the control panel 2 is electrically connected to the cylinder 4, the conveyor 24, the electromagnet 16, the electric telescopic rod 21 and the patch mechanism 22, so as to facilitate the control of the overall operation of the utility model.

[0019] Specifically, when in use, the device is powered on, semiconductor devices are placed on the conveyor 24, and the control panel 2 is operated to control the conveyor 24 to run for conveying. When the semiconductor devices need to be mounted, the conveyor 24 stops running, and the control cylinder 4 pushes the connecting plate 5 to move downward. The connecting plate 5 drives the two first limiting rods 6 to slide downward in the U-shaped frame 3 to limit the position. When the connecting plate 5 drives the rack 7 to move downward, it drives the gear 9 to rotate. The gear 9 pushes the movable plate 11 to move through the first rotating plate 10, thereby bringing the two movable plates 11 closer together. At the same time, the movable plate 11 drives the second limiting rod 12 to slide in the U-shaped frame 3 for limiting the position. When the clamping block 14 clamps the semiconductor device, it will compress the first spring 15, and then control the electromagnet 16 to operate and energize. The magnetic poles of the electromagnet 16 and the magnet 23 are opposite, so that the electromagnet 16 attracts the magnet 23 to move downward, and the magnet 23 drives the clamping plate 17 to slide downward in the limiting groove 18 through the fourth limiting rod 20. When the clamping plate 17 moves downward, it will stretch the second spring 19, and the semiconductor device will be clamped by the clamping plate 17. Then, the electric telescopic rod 21 is controlled to push the patch mechanism 22 to move downward close to the semiconductor device for patch work, and finally repeat the above operations, and transport it through the conveyor 24.

[0020] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0021] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one of such features.

[0022] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.

[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device mounting device, comprising a workbench (1), characterized in that: The top of the workbench (1) is fixedly connected to a U-shaped frame (3), the top of the U-shaped frame (3) is fixedly connected to a cylinder (4), the output end of the cylinder (4) is fixedly connected to a connecting plate (5), the bottom of the connecting plate (5) is fixedly connected to two racks (7), the inner side of the U-shaped frame (3) is fixedly connected to two first fixed blocks (8), one side of the two first fixed blocks (8) is rotatably connected to a gear (9), the gear (9) is meshingly connected to the rack (7), the outer wall of the gear (9) is provided with a first rotating plate (10), the end of the first rotating plate (10) away from the gear (9) is rotatably connected to a movable plate (11), the interior of the movable plate (11) is slidably connected to two third limiting rods (13), one end of the third limiting rod (13) is fixedly connected to an L-shaped clamping block (14) A first spring (15) is sleeved on the outer side of the third limiting rod (13) and is located between the movable plate (11) and the L-shaped clamping block (14); an electromagnet (16) is fixedly connected to the top of the L-shaped clamping block (14); a fourth limiting rod (20) is slidably connected inside the L-shaped clamping block (14) and is located inside the electromagnet (16); a magnet (23) is fixedly connected to the top of the fourth limiting rod (20); a clamping plate (17) is fixedly connected to the bottom of the fourth limiting rod (20) and is located inside the L-shaped clamping block (14); a second spring (19) is sleeved on the outer side of the fourth limiting rod (20) and is located above the clamping plate (17); the top of the second spring (19) is fixedly connected to the L-shaped clamping block (14); and the bottom of the second spring (19) is fixedly connected to the clamping plate (17).

2. The semiconductor device mounting device according to claim 1, characterized in that: Two first limiting rods (6) are fixedly connected to the top of the connecting plate (5), and the two first limiting rods (6) are slidably connected to the U-shaped frame (3).

3. The semiconductor device mounting device according to claim 1, characterized in that: Two second limiting rods (12) are fixedly connected to one side of the two movable plates (11), and the second limiting rods (12) are slidably connected to the U-shaped frame (3). A limiting groove (18) matching with the clamping plate (17) is provided inside the L-shaped clamping block (14).

4. The semiconductor device mounting device according to claim 1, characterized in that: A conveyor (24) is arranged inside the workbench (1); the bottom of the connecting plate (5) is located between two racks (7) and is fixedly connected to an electric telescopic rod (21); and the output end of the electric telescopic rod (21) is fixedly connected to a patch mechanism (22).

5. The semiconductor device mounting device according to claim 4, characterized in that: A control panel (2) is fixedly connected to one side of the workbench (1), and the control panel (2) is electrically connected to the cylinder (4), the conveyor (24), the electromagnet (16), the electric telescopic rod (21) and the patch mechanism (22).

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