Circuit board and cleaning equipment

Abstract

The embodiment of the utility model discloses a circuit board and cleaning equipment, and belongs to the technical field of electronics. The circuit board comprises a plurality of conductive layers which are arranged in a laminated manner, wherein the plurality of conductive layers comprise at least two wiring layers and two reference plane layers; any two wiring layers in the at least two wiring layers are electrically connected through the layer changing hole structure, and signal reference planes of the two wiring layers electrically connected with the layer changing hole structure correspond to the two reference plane layers respectively; the capacitor is arranged close to the layer changing hole structure, and the two ends of the capacitor are correspondingly and electrically connected with the two reference plane layers respectively. According to the embodiment of the invention, the electromagnetic radiation at the layer change hole structure can be reduced, so that the interference to other components in the product is reduced.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and in particular to a circuit board and a cleaning device. Background Art

[0002] When the high-speed signal in the circuit board switches from one wiring layer to another through the layer-changing hole structure, if the signal reference planes of the two wiring layers are not of the same network attribute, it will cause large electromagnetic radiation at the layer-changing hole structure, thereby interfering with other components in the product. The existing shielding cover and shielding copper foil solutions only block the electromagnetic field transmission path, but do not improve the radiation source. In addition, this shielding solution has problems such as high cost, poor manufacturability, and low reliability. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a circuit board and a cleaning device, which can reduce the electromagnetic radiation at the layer-changing hole structure, thereby reducing the interference to other components in the product.

[0004] In a first aspect, the present application provides a circuit board, comprising:

[0005] A plurality of conductive layers arranged in a stacked manner, wherein the plurality of conductive layers include at least two wiring layers and two reference plane layers;

[0006] A layer-changing hole structure, wherein any two wiring layers of the at least two wiring layers are electrically connected through the layer-changing hole structure, and the signal reference planes of the two wiring layers electrically connected to the layer-changing hole structure correspond to the two reference plane layers respectively;

[0007] A capacitor is arranged close to the layer-changing hole structure, and two ends of the capacitor are electrically connected to the two reference plane layers respectively.

[0008] According to the circuit board of the present application, a capacitor is arranged near the layer-changing hole structure, and the two ends of the capacitor are electrically connected to the two reference plane layers respectively, so that when the high-speed signal switches from one wiring layer to another wiring layer through the layer-changing hole structure, a coupling path is provided for the return path of the high-speed signal, thereby reducing the impedance of the return path and the electromagnetic radiation at the layer-changing hole structure, thereby reducing interference to other components in the product.

[0009] According to one embodiment of the present application, the circuit board further includes at least two connection hole structures;

[0010] The two ends of the capacitor are electrically connected to the two reference plane layers respectively through different connection hole structures among the at least two connection hole structures, wherein there is one or more connection hole structures connected to any one end of the capacitor.

[0011] According to an embodiment of the present application, the layer-changing hole structure includes any one or more of a through hole structure, a blind hole structure and a buried hole structure; and / or,

[0012] The connection hole structure includes any one or more of a through hole structure, a blind hole structure and a buried hole structure.

[0013] According to one embodiment of the present application, the circuit board also includes two connecting lines respectively connected to the two ends of the capacitor, and the capacitor is respectively connected to the different connecting hole structures through the two connecting lines to achieve corresponding electrical connection with the two reference plane layers.

[0014] According to one embodiment of the present application, the widths of the two connecting lines are the same or different;

[0015] The width of the connecting line is greater than or equal to 12 mil; and / or,

[0016] The distances between the capacitor and two connection holes of the two reference plane layers electrically connected to the capacitor are both less than or equal to 50 mil.

[0017] According to an embodiment of the present application, the capacitor is disposed in the same layer as any one of the conductive layers.

[0018] According to one embodiment of the present application, the two reference plane layers are located between the at least two wiring layers;

[0019] or,

[0020] One of the reference plane layers is located between the at least two wiring layers, and another of the reference plane layers is located on one side of the at least two wiring layers;

[0021] or,

[0022] The at least two wiring layers are located between the two reference plane layers.

[0023] According to an embodiment of the present application, the circuit board further includes a plurality of insulating layers, wherein the insulating layers are located between any adjacent conductive layers; and / or,

[0024] At least one hole plate is also arranged on each of the at least two wiring layers.

[0025] According to an embodiment of the present application, the ratio of the number of the layer-changing hole structures to the number of the capacitors is less than or equal to 4:1; and / or,

[0026] The distance between the capacitor and the layer-changing hole structure is less than or equal to 200 mil; and / or,

[0027] The capacitance of the capacitor includes any one of 2.2nf, 10nf, 22nf and 100nf.

[0028] In a second aspect, the present application provides a cleaning device, comprising the circuit board described in the first aspect.

[0029] The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0030] By setting a capacitor near the layer-changing hole structure, and the two ends of the capacitor are electrically connected to the two reference plane layers respectively, when the high-speed signal switches from one wiring layer to another wiring layer through the layer-changing hole structure, a coupling path is provided for the return path of the high-speed signal, thereby reducing the impedance of the return path and the electromagnetic radiation at the layer-changing hole structure, thereby reducing interference to other components in the product.

[0031] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0033] Figure 1 is a cross-sectional schematic diagram of a circuit board provided in an embodiment of the present application;

[0034] Figure 2 It is one of the wiring schematic diagrams of the circuit board provided in the embodiment of the present application;

[0035] Figure 3 yes Figure 2 A cross-sectional schematic diagram corresponding to the embodiment;

[0036] Figure 4 This is the second wiring diagram of the circuit board provided in the embodiment of the present application;

[0037] Figure 5 yes Figure 4 Schematic cross-sectional view corresponding to the embodiment. DETAILED DESCRIPTION

[0038] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0039] The circuit board and cleaning equipment provided in the embodiments of the present application are described below with reference to the accompanying drawings.

[0040] Figure 1 A schematic cross-sectional view of a circuit board provided in an embodiment of the present application, Figure 2 This is one of the wiring diagrams of the circuit board provided in the embodiment of the present application. The circuit board can be applied to cleaning equipment.

[0041] like Figure 1 , 2 As shown, the circuit board provided in the embodiment of the present application includes multiple conductive layers, a layer-changing hole structure 2 and a capacitor 3.

[0042] Multiple conductive layers are stacked. The multiple conductive layers include at least two wiring layers 11 and two reference plane layers 12. Each wiring layer 11 includes at least one signal line 9, and the signal line 9 is used to transmit high-speed signals. Different signal lines 9 transmit different high-speed signals. The two reference plane layers 12 do not belong to the same network attribute.

[0043] The number and arrangement of the wiring layers 11 can be set according to actual needs and are not specifically limited here. For example, the circuit board includes six conductive layers stacked, and the six conductive layers include four wiring layers 11 and two reference plane layers 12. Among them, the four wiring layers 11 include a first wiring layer 11a, a second wiring layer 11b, a third wiring layer 11c, and a fourth wiring layer 11d. The two reference plane layers 12 include a first reference plane layer 12a and a second reference plane layer 12b.

[0044] Any two wiring layers 11 in at least two wiring layers 11 are electrically connected through the layer-changing hole structure 2, and the signal reference planes of the two wiring layers 11 electrically connected to the layer-changing hole structure 2 correspond to two reference plane layers 12 respectively. The signal lines 9 for transmitting the same high-speed signal in the two wiring layers 11 can be electrically connected through the layer-changing hole structure 2, so that the high-speed signal can be switched from one wiring layer 11 to another wiring layer 11 through the layer-changing hole structure 2. The wiring layer 11 uses the reference plane layer 12 closest to it as the signal reference plane. When the two wiring layers 11 electrically connected to the layer-changing hole structure 2 are respectively arranged close to the two reference plane layers 12, the signal reference planes of the two wiring layers 11 electrically connected to the layer-changing hole structure 2 correspond to two reference plane layers 12 respectively, that is, the signal reference planes of the two wiring layers 11 electrically connected to the layer-changing hole structure 2 are not of the same network attribute.

[0045] For example, the first wiring layer 11a and the second wiring layer 11b are arranged close to the first reference plane layer 12a, and the signal reference planes of the first wiring layer 11a and the second wiring layer 11b are both the first reference plane layer 12a. The third wiring layer 11c and the fourth wiring layer 11d are arranged close to the second reference plane layer 12b, and the signal reference planes of the third wiring layer 11c and the fourth wiring layer 11d are both the second reference plane layer 12b. The first wiring layer 11a and the fourth wiring layer 11d are electrically connected through the layer-changing hole structure 2 so that the high-speed signal changes layers from the first wiring layer 11a to the fourth wiring layer 11d. The signal reference planes of the first wiring layer 11a and the fourth wiring layer 11d correspond to the first reference plane layer 12a and the second reference plane layer 12b, respectively, and are not the same network attributes.

[0046] The capacitor 3 is disposed close to the layer-changing hole structure 2 , and two ends of the capacitor 3 are electrically connected to the two reference plane layers 12 respectively.

[0047] In the related art, when a high-speed signal switches from one wiring layer to another through a layer-changing hole structure, if the signal reference planes of the two wiring layers are not of the same network attribute, the return path of the high-speed signal switches from one signal reference plane to another signal reference plane, the impedance is large, and there is no coupling path, resulting in large electromagnetic radiation at the layer-changing hole structure, and more energy is radiated, which interferes with the receiving sensitivity of other antennas in the product at the operating frequency, thereby interfering with other components and products in the product.

[0048] In some embodiments, the structure corresponding to the layer-changing hole structure 2 on the wiring layer 11 or the reference plane layer 12 is the layer-changing hole 10. The inner wall of the layer-changing hole structure 2 is generally provided with metal (e.g., copper) to facilitate signal transmission. The signal line 9 is generally not directly connected to the layer-changing hole structure 2, which may be easily melted after a long period of use. Therefore, it is generally necessary to use a hole plate 13 (in the drawings of the present application, several small black dots are drawn on the hole plate 13 to distinguish it from the layer-changing hole 10 or the connection hole 14). The signal line 9 is first electrically connected to the hole plate 13. The hole plate 13 is provided on the wiring layer 11, covers the layer-changing hole 10 of the wiring layer 11 and is electrically connected thereto. The radius of the hole plate 13 needs to be larger than the layer-changing hole 10 and can completely cover the layer-changing hole 10. For example, the radius of the hole plate 13 is 5-6 mil larger than the radius of the layer-changing hole 10.

[0049] In some embodiments, at least two wiring layers 11 are respectively provided with at least one hole plate 13. Generally speaking, at least one hole plate 13 is provided on the bottom layer and the top layer (corresponding to the hole plate 13) of the circuit board. Figure 1The corresponding positions on the first wiring layer 11a and the fourth wiring layer 11d (on the layer change holes 10 that need to be electrically connected to the signal line 9 or on the connection holes 14 that are electrically connected to the two ends of the capacitor 3) are respectively provided with hole disks 13, and other conductive layers are provided with hole disks 13 as needed. For example, the layer change holes 10 on the wiring layer 11 that are electrically connected to the signal line 9 need to be provided with hole disks 13.

[0050] In the embodiment of the present application, a capacitor 3 is arranged near the layer-changing hole structure 2, and the two ends of the capacitor 3 are electrically connected to the two reference plane layers 12 respectively, so as to provide a coupling path for the return path of the high-speed signal when the high-speed signal changes layers from one wiring layer 11 to another wiring layer 11 through the layer-changing hole structure 2, thereby reducing the impedance of the return path, thereby reducing the electromagnetic radiation at the layer-changing hole structure 2, and further reducing interference to other components in the product.

[0051] For example, when the circuit board is used in a cleaning device, the high-speed storage DDR bus signal in the circuit board switches from one wiring layer to another through a layer-changing hole structure, and the signal reference planes of the two wiring layers are not of the same network attribute, resulting in a large radiation of the high-speed storage DDR bus signal, which interferes with the RF antenna in the cleaning device and affects the receiving sensitivity of the RF antenna. In this embodiment, a capacitor is arranged near the layer-changing hole structure, and the two ends of the capacitor are electrically connected to the two reference plane layers respectively, so as to reduce the radiation of the high-speed storage DDR bus signal, reduce the interference with the RF antenna in the cleaning device, and avoid affecting the receiving sensitivity of the RF antenna.

[0052] In some embodiments, the number of the layer-changing hole structures 2 may be one or more. In the case where the circuit board includes multiple layer-changing hole structures 2, each layer-changing hole structure 2 may be electrically connected to any two wiring layers 11 of at least two wiring layers 11. The number of the layer-changing hole structures 2 may be set according to actual conditions, and this application does not impose any specific restrictions.

[0053] Figure 2 , Figure 3 What is shown is that high-speed signals are exchanged between the first wiring layer 11a and the fourth wiring layer 11d, and the signal line 9 is electrically connected to the hole plate 13 on the first wiring layer 11a and the hole plate 13 on the fourth wiring layer 11d, respectively, and the layer-changing hole structure 2 is not electrically connected to the second wiring layer 11b, the third wiring layer 11c, the first reference plane layer 12a, and the second reference plane layer 12b. Figure 4 , Figure 5The figure shows that high-speed signals are exchanged between the second wiring layer 11b and the fourth wiring layer 11d. The signal line 9 is electrically connected to the hole pad 13 on the second wiring layer 11b and the hole pad 13 on the fourth wiring layer 11d, respectively, and is not electrically connected to the first wiring layer 11a, the third wiring layer 11c, the first reference plane layer 12a, and the second reference plane layer 12b. Figure 2 , Figure 4 In the figure, the layer-changing hole 10 is a large circle and is not connected to the layer-changing hole structure 2 to indicate no electrical connection, and the layer-changing hole 10 is a small circle and is connected to the layer-changing hole structure 2 to indicate electrical connection.

[0054] The two wiring layers 11 electrically connected by different layer-changing hole structures 2 may be the same. For example, the first wiring layer 11a includes a first signal line and a second signal line, and the fourth wiring layer 11d includes a third signal line and a fourth signal line. Among them, the first signal line and the third signal line are both used to transmit the first high-speed signal, and the second signal line and the fourth signal line are both used to transmit the second high-speed signal. The first signal line in the first wiring layer 11a and the third signal line in the fourth wiring layer 11d can be electrically connected through a layer-changing hole structure 2, so that the first high-speed signal changes layers from the first wiring layer 11a to the fourth wiring layer 11d. The second signal line in the first wiring layer 11a and the fourth signal line in the fourth wiring layer 11d can be electrically connected through another layer-changing hole, so that the second high-speed signal changes layers from the first wiring layer 11a to the fourth wiring layer 11d.

[0055] The two wiring layers 11 electrically connected by different layer-changing hole structures 2 may also be different. For example, the first wiring layer 11a includes a fifth signal line, and the third wiring layer 11c includes a sixth signal line. The fifth signal line and the sixth signal line are both used to transmit the third high-speed signal. The fifth signal line in the first wiring layer 11a and the sixth signal line in the third wiring layer 11c can be electrically connected through a layer-changing hole structure 2, so that the third high-speed signal changes layers from the first wiring layer 11a to the third wiring layer 11c. The second wiring layer 11b includes a seventh signal line, and the fourth wiring layer 11d includes an eighth signal line. The seventh signal line and the eighth signal line are both used to transmit the fourth high-speed signal. The seventh signal line in the second wiring layer 11b and the eighth signal line in the fourth wiring layer 11d are electrically connected through a layer-changing hole structure 2, so that the fourth high-speed signal changes layers from the second wiring layer 11b to the fourth wiring layer 11d.

[0056] The two wiring layers 11 electrically connected by different layer-changing hole structures 2 may also be partially identical, that is, one wiring layer 11 electrically connected by different layer-changing hole structures 2 is identical, and the other wiring layer 11 is different. For example, the first wiring layer 11a includes the ninth signal line and the tenth signal line, the third wiring layer 11c includes the eleventh signal line, and the fourth wiring layer 11d includes the twelfth signal line. The ninth signal line and the eleventh signal line are both used to transmit the fifth high-speed signal, and the tenth signal line and the twelfth signal line are both used to transmit the sixth high-speed signal. The ninth signal line in the first wiring layer 11a is electrically connected to the eleventh signal line in the third wiring layer 11c through a layer-changing hole structure 2, so that the fifth high-speed signal changes layers from the first wiring layer 11a to the third wiring layer 11c. The tenth signal line in the first wiring layer 11a is electrically connected to the twelfth signal line in the fourth wiring layer 11d through another layer-changing hole structure 2, so that the sixth high-speed signal changes layers from the first wiring layer 11a to the fourth wiring layer 11d.

[0057] The different connection methods of the layer change hole structure 2 and the wiring layer 11 described in the above embodiments are merely exemplary, and the scope of the present application is not limited thereto. In actual application, one or more layer change holes 2 can be used to electrically connect two or more wiring layers 11 as required.

[0058] When the circuit board includes a plurality of layer-changing hole structures 2, the number of capacitors 3 may be one or more. In some embodiments, the ratio of the number of layer-changing hole structures 2 to the number of capacitors 3 may be less than or equal to 4:1.

[0059] In some embodiments, one of the two reference plane layers 12 is a power plane layer, and the other reference plane layer 12 is a ground plane layer. The power plane layer includes at least one power line for connecting a power supply. The ground plane layer includes a ground line for grounding. For example, the first reference plane layer 12a is a power plane layer, and the second reference plane layer 12b is a ground plane layer.

[0060] In some embodiments, two reference plane layers 12 are located between the at least two wiring layers 11. There may be at least one wiring layer 11 between the two reference plane layers 12, or there may be no wiring layer 11. For example, the first wiring layer 11a, the first reference plane layer 12a, the second wiring layer 11b, the third wiring layer 11c, the second reference plane layer 12b and the fourth wiring layer 11d are stacked in sequence, that is, the first reference plane layer 12a is located between the first wiring layer 11a and the second wiring layer 11b, and the second reference plane layer 12b is located between the third wiring layer 11c and the fourth wiring layer 11d.

[0061] In some embodiments, one reference plane layer 12 is located between the at least two wiring layers 11, and another reference plane layer 12 is located on one side of the at least two wiring layers 11. For example, the first reference plane layer 12a, the first wiring layer 11a, the second wiring layer 11b, the second reference plane layer 12b, the third wiring layer 11c, and the fourth wiring layer 11d are stacked in sequence, that is, the second reference plane layer 12b is located between the second wiring layer 11b and the third wiring layer 11c, and the first reference plane layer 12a is located on one side of the four wiring layers 11.

[0062] In some embodiments, the at least two wiring layers are located between two reference plane layers. For example, the first reference plane layer 12a, the first wiring layer 11a, the second wiring layer 11b, the third wiring layer 11c, the fourth wiring layer 11d and the second reference plane layer 12b are stacked in sequence, that is, the four wiring layers 11 are located between the first reference plane layer 12a and the second reference plane layer 12b.

[0063] The configuration of the different conductive layers described in the above embodiments is only exemplary and can be configured according to actual needs, and the scope of the present application is not limited thereto; in addition, the stacking configuration of the conductive layers can be stacked from the bottom layer to the top layer, or from the top layer to the bottom layer, and can be configured according to actual needs, and the present application is not limited thereto. Figure 1 As shown, the circuit board also includes a plurality of insulating layers 6, and there is an insulating layer 6 between any adjacent conductive layers to ensure that the adjacent conductive layers are insulated. For example, the first wiring layer 11a, the first reference plane layer 12a, the second wiring layer 11b, the third wiring layer 11c, the second reference plane layer 12b and the fourth wiring layer 11d are stacked in sequence, and there is an insulating layer 6 between the first wiring layer 11a and the first reference plane layer 12a, there is an insulating layer 6 between the first reference plane layer 12a and the second wiring layer 11b, there is an insulating layer 6 between the second wiring layer 11b and the third wiring layer 11c, there is an insulating layer 6 between the third wiring layer 11c and the second reference plane layer 12b, and there is an insulating layer 6 between the second reference plane layer 12b and the fourth wiring layer 11d.

[0064] The material and thickness of the insulating layer 6 and the thickness of the conductive layer can be set according to actual conditions, and the present application does not limit them. Exemplarily, the insulating layer 6 can be a FR4 sheet layer, and the interlayer spacing of the insulating layer 6 between the first wiring layer 11a (copper foil thickness 1-2.5 mil) and the first reference plane layer 12a (copper foil thickness 0.5-2.5 mil) is 2-5 mil, the interlayer spacing of the insulating layer 6 between the first reference plane layer 12a and the second wiring layer 11b (copper foil thickness 0.5-2.5 mil) is 3-6 mil, the interlayer spacing of the insulating layer 6 between the second wiring layer 11b and the third wiring layer 11c (copper foil thickness 0.5-2.5 mil) is 6-50 mil, the interlayer spacing of the insulating layer 6 between the third wiring layer 11c and the second reference plane layer 12b (copper foil thickness 0.5-2.5 mil) is 3-6 mil, and the interlayer spacing of the insulating layer 6 between the second reference plane layer 12b and the fourth wiring layer 11d (copper foil thickness 1-2.5 mil) is 2-5 mil.

[0065] In some embodiments, capacitor 3 can be disposed in the same layer as any conductive layer, that is, capacitor 3 can be disposed in the same layer as any wiring layer 11, and capacitor 3 can also be disposed in the same layer as any reference plane layer 12. For example, capacitor 3 is disposed in the same layer as the fourth wiring layer 11d.

[0066] In some embodiments, the distance between the capacitor 3 and the layer-changing hole structure 2 is less than or equal to 200 mil, so as to ensure that the capacitor 3 is disposed close to the layer-changing hole structure 2 .

[0067] In some embodiments, the capacitance of the capacitor 3 includes any one of 2.2nf, 10nf, 22nf and 100nf.

[0068] The distance between the capacitor 3 and the layer-changing hole structure 2 and the capacitance of the capacitor 3 described in the above embodiment are only exemplary and can be set according to actual situations in practical applications, and this application does not impose any restrictions thereon.

[0069] In some embodiments, the layer-changing hole structure 2 includes any one or more of a through-hole structure, a blind hole structure, and a buried hole structure, that is, two or more layer-changing hole structures 2 can be different combinations of through-hole structures, blind hole structures, or buried hole structures. In the case where the layer-changing hole structure 2 includes a through-hole structure, the layer-changing hole structure 2 runs through all conductive layers and all insulating layers 6, which can be understood as all conductive layers and all insulating layers 6 are correspondingly provided with layer-changing holes 10. Figures 1 to 3 As shown, the layer-changing hole structure 2 passes through six conductive layers and the insulating layer 6 between the six conductive layers. The first wiring layer 11a and the fourth wiring layer 11d are electrically connected to the layer-changing hole structure 2 respectively. The second wiring layer 11b, the third wiring layer 11d, the first reference plane layer 12a and the fourth reference plane layer 12b are insulated from the layer-changing hole structure 2 respectively.

[0070] In the case where the layer-changing hole structure 2 includes a blind hole structure, the layer-changing hole structure 2 penetrates part of the conductive layer and the insulating layer 6 between the part of the conductive layers starting from the top or bottom conductive layer, and it can be understood that only one or more conductive layers opened from the top or bottom conductive layer and the corresponding insulating layer 6 are provided with the layer-changing hole 10. For example, the layer-changing hole structure 2 penetrates the fourth wiring layer 11d, the second reference plane layer 12b, the third wiring layer 11c, the second wiring layer 11b and the insulating layer 6 between these film layers, the second wiring layer 11b and the fourth wiring layer 11d are electrically connected to the layer-changing hole structure 2 respectively, and the second reference plane layer 12b and the third wiring layer 11c are insulated from the layer-changing hole structure 2 respectively. For another example, a layer-changing hole structure 2 (blind hole) penetrates the fourth wiring layer 11d, the second reference plane layer 12b and the insulating layer 6 between them, the fourth wiring layer 11d and the second reference plane layer 12b are electrically connected through the layer-changing hole structure 2, and other wiring layers can be electrically connected through other layer-changing hole structures 2.

[0071] In the case where the layer-changing hole structure 2 includes a buried hole structure, the layer-changing hole structure 2 penetrates two or more wiring layers 11 electrically connected thereto and the insulating layer 6 (and the conductive layer) between these wiring layers 11, and it can be understood that only one or more conductive layers and their corresponding insulating layers 6 located inside the circuit board are provided with the layer-changing hole 10. For example, the layer-changing hole structure 2 penetrates the third wiring layer 11c, the second wiring layer 11b, the first reference plane layer 11a, the first wiring layer 11a and the insulating layer 6 between these film layers, the first wiring layer 11a and the third wiring layer 11c are electrically connected to the layer-changing hole structure 2 respectively, and the second wiring layer and the first reference plane layer 11a are insulated from the layer-changing hole structure 2 respectively.

[0072] In some embodiments, the circuit board further includes at least two connection hole structures 4. The two ends of the capacitor 3 are electrically connected to the two reference plane layers 12 respectively through different connection hole structures 4 in the at least two connection hole structures 4. There are one or more connection hole structures 4 connected to any end of the capacitor 3.

[0073] For example, the at least two connection hole structures 4 include at least one first connection hole structure 4a and at least one second connection hole structure 4b. One end of the capacitor 3 is electrically connected to the first reference plane layer 12a through at least one first connection hole structure 4a, and the other end of the capacitor 3 is electrically connected to the second reference plane layer 12b through at least one second connection hole structure 4b. The number of the first connection hole structures 4a and the second connection hole structures 4b may be the same or different.

[0074] In some embodiments, the connection hole structure 4 includes any one or more of a through hole structure, a blind hole structure, and a buried hole structure, that is, two or more connection hole structures 4 can be different combinations of through hole structures, blind hole structures, or buried hole structures. In the case where the connection hole structure 4 includes a through hole structure, the connection hole structure 4 passes through all conductive layers and all insulating layers 6, which can be understood as all conductive layers and all insulating layers 6 are provided with corresponding connection holes. Figures 1 to 3 As shown, the first connection hole structure 4a and the second connection hole structure 4b both penetrate the six conductive layers and the insulating layer 6 between the six conductive layers, and the capacitor 3 is arranged in the same layer as the fourth wiring layer 11d. The first connection hole structure 4a is electrically connected to one end of the capacitor 3 and the first reference plane layer 12a respectively, and the first connection hole structure 4a is insulated from other conductive layers. The second connection hole structure 4b is electrically connected to the other end of the capacitor 3 and the second reference plane layer 12b respectively, and the second connection hole structure 4b is insulated from other conductive layers.

[0075] In the case where the connection hole structure 4 includes a blind hole structure, the connection hole structure 4 penetrates part of the conductive layer and the insulating layer 6 between the part of the conductive layer starting from the top or bottom conductive layer, which can be understood as the conductive layer starting from the top or bottom conductive layer and its corresponding insulating layer 6 are provided with connection holes. For example, the capacitor 3 is arranged in the same layer as the fourth wiring layer 11d. The first connection hole structure 4a penetrates the fourth wiring layer 11d, the second reference plane layer 12b, the third wiring layer 11c, the second wiring layer 11b, the first reference plane layer 12a and the insulating layer 6 between these film layers, and the first connection hole structure 4a is electrically connected to one end of the capacitor 3 and the first reference plane layer 12a respectively, and the first connection hole structure 4a is insulated from the second reference plane layer 12b, the third wiring layer 11c and the second wiring layer 11b respectively. The second connection hole structure 4b penetrates the fourth wiring layer 11d and the second reference plane layer 12a and the insulating layer 6 between the two, and the second connection hole structure 4a is electrically connected to the other end of the capacitor 3 and the second reference plane layer 12a respectively.

[0076] In the case where the connection hole structure 4 includes a buried hole structure, the connection hole structure 4 penetrates the corresponding reference plane layer 12, the wiring layer 11 arranged on the same layer as the capacitor 3, and the insulating layer 6 (and the conductive layer) therebetween, and only one or more conductive layers and the corresponding insulating layer 6 located inside the circuit board are provided with connection holes. For example, the capacitor 3 is arranged on the same layer as the third wiring layer 11c. The first connection hole structure 4a penetrates the third wiring layer 11c, the second wiring layer 11b, the first reference plane layer 12a, and the insulating layer 6 between these film layers, and the first connection hole structure 4a is electrically connected to one end of the capacitor 3 and the first reference plane layer 12a, respectively, and the first connection hole structure 4a is insulated from the second wiring layer 11b. The second connection hole structure 4b penetrates the second reference plane layer 12b, the third wiring layer 11c, and the insulating layer 6 therebetween, and the second connection hole structure 4b is electrically connected to the second reference plane layer 12b and the other end of the capacitor 3, respectively.

[0077] The structures of the connection hole structures 4 electrically connected to the two ends of the capacitor 3 can be the same or different. In the case where multiple connection hole structures 4 are electrically connected to any one end of the capacitor 3, the structures of the multiple connection hole structures 4 can be the same or different. The structures of the connection hole structure 4 and the layer-changing hole structure 2 can be the same or different.

[0078] In some embodiments, the distance between the capacitor 3 and the connection hole structure 4 is less than or equal to 200 mil to ensure that the capacitor 3 is disposed close to the connection hole structure 4 .

[0079] The structures of the connection hole structure 4 and the layer-changing hole structure 2 in the embodiment of the present application may be the same or different. Both are used to realize electrical connection between different conductive layers. Because the objects connected by the two may be different, they are named differently in the embodiment of the present application to distinguish them.

[0080] In some embodiments, the circuit board also includes two connecting wires 5 respectively connected to the two ends of the capacitor 3. The capacitor 3 is respectively connected to different connecting hole structures 4 through the two connecting wires 5 to achieve corresponding electrical connection with the two reference plane layers 12.

[0081] The two connection lines 5 can be arranged in the same layer as the capacitor 3. For example, the two connection lines 5 include a first connection line 5a and a second connection line 5b, and the first connection line 5a, the second connection line 5b and the capacitor 3 are arranged in the same layer. One end of the capacitor 3 is connected to at least one first connection hole structure 4a through the first connection line 5a, and at least one first connection hole structure 4a is connected to the first reference plane layer 12a, so that one end of the capacitor 3 is electrically connected to the first reference plane layer 12a. The other end of the capacitor 3 is connected to at least one second connection hole structure 4b through the second connection line 5b, and at least one second connection hole structure 4b is connected to the second reference plane layer 12b, so that the other end of the capacitor 3 is electrically connected to the second reference plane layer 12b.

[0082] In some embodiments, the widths of the two connection lines 5 may be the same or different.

[0083] In some embodiments, the width of the connection line 5 is greater than or equal to 12 mil.

[0084] In some embodiments, the distance between the capacitor 3 and the two connection holes 14 on the two reference plane layers 12 electrically connected to the capacitor 3 is less than or equal to 50 mil. For example, when the two reference plane layers 12 are respectively a ground layer and a power layer, the two corresponding connection holes 14 of the connection hole structure 4 on the two reference plane layers 12 are respectively a ground hole and a power hole, that is, the distance between the pad of the capacitor and the ground hole and the power hole is less than or equal to 50 mil.

[0085] Figure 2-Figure 5 It is shown that the two ends of the capacitor 3 are electrically connected to the first reference plane layer 12a and the second reference plane layer 12b respectively through the first connection hole structure 4a and the second connection hole structure 4b, and the connection hole structure 4 is not electrically connected to the first wiring layer 11a, the second wiring layer 11b, the third wiring layer 11c, and the fourth wiring layer 11d. Figure 2 , Figure 4 In the figure, the connection hole 14 is a large circle and is not connected to the connection hole structure 4 to indicate no electrical connection, and the connection hole 14 is a small circle and is connected to the connection hole structure 4 to indicate electrical connection.

[0086] In some embodiments, Figure 1 As shown, the circuit board further comprises a first covering layer 7 and a second covering layer 8. A plurality of conductive layers and a plurality of insulating layers 6 are both located between the first covering layer 7 and the second covering layer 8. The first covering layer 7 and the second covering layer 8 may both comprise ink layers.

[0087] According to the circuit board provided in the embodiment of the present application, a capacitor is arranged near the layer-changing hole structure, and the two ends of the capacitor are electrically connected to the two reference plane layers respectively, so that when the high-speed signal switches from one wiring layer to another wiring layer through the layer-changing hole structure, a coupling path is provided for the return path of the high-speed signal, thereby reducing the impedance of the return path, reducing the electromagnetic radiation at the layer-changing hole structure, and thus reducing interference with other components in the product.

[0088] Correspondingly, an embodiment of the present application also provides a cleaning device.

[0089] The cleaning device provided in the embodiment of the present application includes the circuit board in the above embodiment, which will not be described in detail here. Among them, the cleaning device includes but is not limited to a sweeper, a mop, a scrubber, a sweeper and mop all-in-one, a vacuum cleaner, a vacuum cleaner, etc.

[0090] According to the cleaning device provided in the embodiment of the present application, a capacitor is arranged near the layer-changing hole structure, and the two ends of the capacitor are electrically connected to the two reference plane layers respectively, so that when the high-speed signal switches from one wiring layer to another wiring layer through the layer-changing hole structure, a coupling path is provided for the return path of the high-speed signal, thereby reducing the impedance of the return path and the electromagnetic radiation at the layer-changing hole structure, thereby reducing interference with other components in the cleaning device.

[0091] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0092] In the description of the present application, “plurality” means two or more.

[0093] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0094] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board, characterized in that: include: A plurality of conductive layers arranged in a stacked manner, wherein the plurality of conductive layers include at least two wiring layers and two reference plane layers; A layer-changing hole structure, wherein any two wiring layers of the at least two wiring layers are electrically connected through the layer-changing hole structure, and the signal reference planes of the two wiring layers electrically connected to the layer-changing hole structure correspond to the two reference plane layers respectively; A capacitor is arranged close to the layer-changing hole structure, and two ends of the capacitor are electrically connected to the two reference plane layers respectively.

2. The circuit board according to claim 1, characterized in that: The circuit board also includes at least two connection hole structures; The two ends of the capacitor are electrically connected to the two reference plane layers respectively through different connection hole structures among the at least two connection hole structures, wherein there is one or more connection hole structures connected to any one end of the capacitor.

3. The circuit board according to claim 2, characterized in that: The layer-changing hole structure includes any one or more of a through hole structure, a blind hole structure and a buried hole structure; and / or, The connection hole structure includes any one or more of a through hole structure, a blind hole structure and a buried hole structure.

4. The circuit board according to claim 2, characterized in that: The circuit board also includes two connecting wires respectively connected to the two ends of the capacitor, and the capacitor is respectively connected to the different connecting hole structures through the two connecting wires to achieve corresponding electrical connection with the two reference plane layers.

5. The circuit board according to claim 4, characterized in that: The widths of the two connecting lines are the same or different; The width of the connecting line is greater than or equal to 12 mil; and / or, The distances between the capacitor and two connection holes of the two reference plane layers electrically connected to the capacitor are both less than or equal to 50 mil.

6. The circuit board according to claim 1, characterized in that: The capacitor is arranged in the same layer as any one of the conductive layers.

7. The circuit board according to claim 1, characterized in that: The two reference plane layers are located between the at least two wiring layers; or, One of the reference plane layers is located between the at least two wiring layers, and another of the reference plane layers is located on one side of the at least two wiring layers; or, The at least two wiring layers are located between the two reference plane layers.

8. The circuit board according to claim 1, characterized in that: The circuit board further comprises a plurality of insulating layers, wherein the insulating layers are located between any adjacent conductive layers; and / or, At least one hole plate is also arranged on each of the at least two wiring layers.

9. The circuit board according to any one of claims 1 to 8, characterized in that: The ratio of the number of the layer-changing hole structures to the number of the capacitors is less than or equal to 4:1; and / or, The distance between the capacitor and the layer-changing hole structure is less than or equal to 200 mil; and / or, The capacitance of the capacitor includes any one of 2.2nf, 10nf, 22nf and 100nf.

10. A cleaning device, characterized in that: Comprising a circuit board as described in any one of claims 1-9.

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