High-strength multilayer copper-clad plate
By setting up reinforcement plates and limit blocks inside the multi-layer copper clad plate, and using the cooperation between the side plates and the connecting layer, the problems of loosening and bending between layers are solved, and the stability and electrical and thermal performance of the multi-layer copper clad plate are improved.
Patent Information
- Application Number
- CN202420726860.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-04-10
AI Technical Summary
Multi-layer copper clad plates are prone to loose interlayer connections, cracking of solder joints and insufficient bending resistance under specific stress conditions.
By installing reinforcement plates, reinforcement ribs, limit blocks and connecting blocks inside the multi-layer copper clad plate, and using the cooperation of side plates with the connecting layer, bumps and fixing rods, the electrical conduction, thermal conduction and mechanical support of the copper foil layer are increased. , realize positioning and stable connection.
The overall bending resistance and stability of the multi-layer copper clad plate is improved, ensuring the firmness of interlayer connections and electrical and thermal performance.
Smart Images
Figure CN222302075U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of multi-layer copper-clad plates, in particular to a high-strength multi-layer copper-clad plate. Background Art
[0002] Multilayer copper clad laminates are actually formed by stacking multiple ordinary copper clad laminates together. Each ordinary copper clad laminate is called a layer or inner layer. These inner layers are stacked and insulated by interlayer dielectrics (such as pre-impregnated glass fiber cloth or thin dielectric layers), and then connected by interlayer connection holes (usually blind holes or through holes). However, in actual use, multilayer copper clad laminates with similar structures still have many defects, such as: multilayer copper clad laminates may cause loosening of interlayer connections and cracking of solder joints under certain stress conditions, and the bending resistance of multilayer copper clad laminates is poor, so it is necessary to design a high-strength multilayer copper clad laminate. Utility Model Content
[0003] The utility model aims to provide a high-strength multi-layer copper-clad laminate to solve the problems raised in the above-mentioned background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-strength multi-layer copper clad laminate, comprising a copper clad laminate body, a base layer and a reinforcement plate, the copper clad laminate body is fixedly connected with a base layer inside, the base layer is fixedly connected with a reinforcement plate inside, the reinforcement plate is fixedly connected with a reinforcement rib inside, a copper foil layer is fixedly connected to the top of the base layer inside the copper clad laminate body, a limiting block is fixedly connected to the copper foil layer and the base layer, a connecting block is fixedly connected between the limiting blocks, side plates are fixedly installed on both sides of the copper clad laminate body, a fixing hole is opened inside the copper clad laminate body between the side plates, and the copper clad laminate bodies are fixedly connected through a connecting layer.
[0005] Because the multi-layer copper clad laminate is actually formed by stacking multiple ordinary copper clad laminate bodies together, and the multi-layer copper clad laminate may cause loosening of interlayer connections and cracking of solder joints under specific stress conditions, and the multi-layer copper clad laminate is connected to multiple copper clad laminate bodies inside it; through the mutual cooperation between the side plate and the connecting layer and the mutual cooperation between the protrusion and the fixing rod, the positioning of the copper clad laminate bodies during installation can be achieved, so that the screws can be fixed to the copper clad laminate bodies through the fixing holes, and the purpose of increasing the stability between the copper clad laminate bodies can also be achieved. Because the multi-layer copper clad laminate may be prone to bending under specific stress conditions, the copper clad laminate body inside the multi-layer copper clad laminate is internally provided with reinforcing plates, reinforcing ribs, limit blocks and connecting blocks inside the base layer, so as to achieve the purpose of improving the overall bending resistance of the multi-layer copper clad laminate, and the copper foil layer on the copper clad laminate body plays multiple roles such as electrical conduction, heat conduction, mechanical support and welding on the multi-layer copper clad laminate, and at the same time plays an important role in the functionality, reliability and performance of the circuit board.
[0006] Preferably, the connection layer is fixedly connected to the copper foil layer via a bump, and the bump is fixedly connected to the copper foil layer via a fixing rod. The bump can be used to position the copper clad board body during installation, and the fixing rod can fix the bump inside the copper foil layer.
[0007] Preferably, the copper foil layer around the limit block and the connection block and the base layer are provided with connection grooves, and the copper foil layer around the protrusion is provided with grooves. The connection grooves can provide installation positions for the limit block and the connection block, and the grooves can provide installation positions for the protrusion.
[0008] Preferably, a dielectric layer is fixedly connected between the connection layers, and a limiting cavity is provided inside the side plate. The dielectric layer can insulate the copper-clad plate bodies, and the limiting cavity can provide an installation position for the spring.
[0009] Preferably, a baffle is movably connected inside the limiting cavity, and a connecting rod is fixedly connected to the top of the baffle through the limiting cavity. The baffle can squeeze the spring when the connecting rod moves upward, and the movable key can be connected to the baffle through the connecting rod.
[0010] Preferably, a spring is fixedly installed inside the limiting cavity outside the connecting rod at the top of the baffle, and a clamping block is fixedly connected between the connecting rods at the top of the limiting cavity. The baffle can be reset by the spring, so as to achieve the purpose of fixing the clamping block inside the clamping slot, and the side plate can be fixed to both sides of the copper clad board body by the clamping block.
[0011] Preferably, a card slot is provided inside the copper foil layer outside the card block, and a movable key is fixedly connected to the top of the connecting rod inside the side plate. The card slot can provide a fixed position for the card block, and the movable key can drive the connecting rod to move.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] Through the mutual cooperation between the side plate and the connecting layer, because the multi-layer copper clad laminate is actually formed by stacking multiple ordinary copper clad laminate bodies together, and the multi-layer copper clad laminate may cause loosening of interlayer connections and cracking of solder joints under specific stress conditions, when the multi-layer copper clad laminate is connected to multiple copper clad laminate bodies inside it, the mutual cooperation between the protrusions and the fixing rods between the copper clad laminate bodies can achieve the positioning during installation between the copper clad laminate bodies, so that the screws can be fixed to the copper clad laminate bodies through the fixing holes, and the purpose of increasing the stability between the copper clad laminate bodies can also be achieved.
[0014] Through the mutual cooperation between the reinforcing plate and the limit block, the multi-layer copper clad laminate may be prone to bending under specific stress conditions. Therefore, a reinforcing plate, reinforcing ribs, limit blocks and connecting blocks are arranged inside the copper clad laminate body inside the multi-layer copper clad laminate to achieve the purpose of improving the overall bending resistance of the multi-layer copper clad laminate. The card slot can provide a fixed position for the card block, the movable key can drive the connecting rod to move, and the baffle can be reset by the spring, thereby achieving the purpose of fixing the card block inside the card slot, and the side panels can be fixed to the two sides of the copper clad laminate body through the card block. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is the main sectional view of the utility model;
[0016] Figure 2 It is a side sectional view of the utility model;
[0017] Figure 3 It is a top sectional view of the utility model;
[0018] Figure 4 This is a schematic diagram of the card block structure of the utility model;
[0019] Figure 5 This is a schematic diagram of the limit block structure of the utility model.
[0020] In the figure: 1. copper clad laminate body; 2. base layer; 3. reinforcing plate; 4. reinforcing ribs; 5. copper foil layer; 6. groove; 7. side plate; 701. limit cavity; 702. fixing rod; 8. fixing hole; 9. movable key; 10. connecting rod; 11. clamping block; 12. clamping slot; 13. baffle; 14. spring; 15. connecting slot; 16. limit block; 17. connecting block; 18. dielectric layer; 19. connecting layer; 20. bump. DETAILED DESCRIPTION
[0021] The technical solution of the utility model is further described below in conjunction with the accompanying drawings and specific embodiments. Embodiment 1
[0022] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the utility model proposes a high-strength multi-layer copper clad laminate, including a copper clad laminate body 1, a base layer 2 and a reinforcing plate 3, the copper clad laminate body 1 is fixedly connected with the base layer 2, the base layer 2 is fixedly connected with the reinforcing plate 3, the reinforcing rib 4 is fixedly connected with the reinforcing plate 3, the top of the base layer 2 inside the copper clad laminate body 1 is fixedly connected with a copper foil layer 5, the copper foil layer 5 and the base layer 2 are fixedly connected with a limiting block 16, and the limiting blocks 16 are fixedly connected with a connecting block 17, side panels 7 are fixedly installed on both sides of the copper clad laminate body 1, and a fixing hole 8 is opened inside the copper clad laminate body 1 between the side panels 7, the copper clad laminate bodies 1 are fixedly connected by a connecting layer 19, the connecting layer 19 is fixedly connected to the copper foil layer 5 through a protrusion 20, and the protrusion 20 is fixedly connected to the copper foil layer 5 through a fixing rod 702.
[0023] The working principle of the high-strength multi-layer copper-clad laminate based on Example 1 is as follows: because the multi-layer copper-clad laminate is actually formed by stacking a plurality of ordinary copper-clad laminate bodies 1 together, and the multi-layer copper-clad laminate may cause loosening of the interlayer connection and cracking of the solder joints under certain stress conditions;
[0024] When the multi-layer copper-clad laminate is used to connect multiple copper-clad laminate bodies 1 therein, the copper-clad laminate bodies 1 can be positioned during installation by the cooperation between the side plate 7 and the connecting layer 19 and the cooperation between the bump 20 and the fixing rod 702, so that the copper-clad laminate bodies 1 can be fixed by screws through the fixing holes 8, and the purpose of increasing the stability between the copper-clad laminate bodies 1 can also be achieved.
[0025] And because the multi-layer copper clad laminate may be prone to bending under specific stress conditions, the copper clad laminate body 1 inside the multi-layer copper clad laminate is provided with a reinforcing plate 3, a reinforcing rib 4, a limit block 16 and a connecting block 17 inside the base layer 2, so as to achieve the purpose of improving the overall bending resistance of the multi-layer copper clad laminate. The copper foil layer 5 on the copper clad laminate body 1 plays multiple roles in the multi-layer copper clad laminate, such as electrical conduction, heat conduction, mechanical support and welding, and plays an important role in the functionality, reliability and performance of the circuit board. Embodiment 2
[0026] like Figure 1 , Figure 2 , Figure 4 and Figure 5As shown, the utility model proposes a high-strength multi-layer copper clad laminate. Compared with the first embodiment, this embodiment also includes: a connecting groove 15 is opened inside the copper foil layer 5 and the base layer 2 outside the limiting block 16 and the connecting block 17, a groove 6 is opened inside the copper foil layer 5 outside the protrusion 20, a dielectric layer 18 is fixedly connected between the connecting layers 19, a limiting cavity 701 is opened inside the side plate 7, a baffle 13 is movably connected inside the limiting cavity 701, the top of the baffle 13 passes through the limiting cavity 701 and is fixedly connected to a connecting rod 10, a spring 14 is fixedly installed inside the limiting cavity 701 outside the connecting rod 10 at the top of the baffle 13, a clamping block 11 is fixedly connected between the connecting rods 10 at the top of the limiting cavity 701, a clamping groove 12 is opened inside the copper foil layer 5 outside the clamping block 11, and a movable key 9 is fixedly connected to the top of the connecting rod 10 inside the side plate 7.
[0027] In this embodiment, Figure 1 , Figure 2 and Figure 5 As shown, the connection groove 15 can provide a mounting position for the limit block 16 and the connection block 17, and the groove 6 can provide a mounting position for the protrusion 20; Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the dielectric layer 18 can play an insulating role between the copper-clad board body 1, and the limiting cavity 701 can provide an installation position for the spring 14;
[0028] like Figure 2 and Figure 4 As shown, the baffle 13 can squeeze the spring 14 when the connecting rod 10 moves upward, and the movable key 9 can be connected to the baffle 13 through the connecting rod 10; Figure 2 and Figure 4 As shown, the baffle 13 can be reset by the spring 14, so as to achieve the purpose of fixing the block 11 inside the slot 12, and the side plate 7 can be fixed on both sides of the copper clad board body 1 by the block 11; Figure 2 and Figure 4 As shown, the card slot 12 can provide a fixed position for the card block 11, and the movable key 9 can drive the connecting rod 10 to move.
[0029] The above-mentioned specific embodiments are only several preferred embodiments of the present invention. Based on the technical solution of the present invention and the relevant inspiration of the above-mentioned embodiments, those skilled in the art can make various alternative improvements and combinations to the above-mentioned specific embodiments.
Claims
1. A high-strength multi-layer copper-clad laminate, comprising a copper-clad laminate body (1), a base layer (2) and a reinforcing plate (3), characterized in that: The copper-clad laminate body (1) is fixedly connected to a base layer (2), the base layer (2) is fixedly connected to a reinforcing plate (3), the reinforcing plate (3) is fixedly connected to a reinforcing rib (4), the top of the base layer (2) inside the copper-clad laminate body (1) is fixedly connected to a copper foil layer (5), the copper foil layer (5) and the base layer (2) are fixedly connected to a limiting block (16), a connecting block (17) is fixedly connected between the limiting blocks (16), side plates (7) are fixedly installed on both sides of the copper-clad laminate body (1), a fixing hole (8) is opened inside the copper-clad laminate body (1) between the side plates (7), and the copper-clad laminate bodies (1) are fixedly connected via a connecting layer (19).
2. The high-strength multi-layer copper-clad laminate according to claim 1, characterized in that: The connection layer (19) is fixedly connected to the copper foil layer (5) via a bump (20), and the bump (20) is fixedly connected to the copper foil layer (5) via a fixing rod (702).
3. The high-strength multi-layer copper-clad laminate according to claim 1, characterized in that: The copper foil layer (5) outside the limit block (16) and the connection block (17) and the base layer (2) are provided with a connection groove (15), and the copper foil layer (5) outside the protrusion (20) is provided with a groove (6).
4. The high-strength multi-layer copper-clad laminate according to claim 1, characterized in that: The medium layer (18) is fixedly connected between the connection layers (19), and a limiting cavity (701) is provided inside the side plate (7).
5. The high-strength multi-layer copper-clad laminate according to claim 4, characterized in that: The interior of the limiting cavity (701) is movably connected to a baffle (13), and the top of the baffle (13) passes through the limiting cavity (701) and is fixedly connected to a connecting rod (10).
6. The high-strength multi-layer copper-clad laminate according to claim 5, characterized in that: A spring (14) is fixedly installed inside the limiting cavity (701) on the periphery of the connecting rod (10) at the top of the baffle (13), and a clamping block (11) is fixedly connected between the connecting rods (10) at the top of the limiting cavity (701).
7. The high-strength multi-layer copper-clad laminate according to claim 6, characterized in that: A card slot (12) is provided inside the copper foil layer (5) on the periphery of the card block (11), and a movable key (9) is fixedly connected to the top of the connecting rod (10) inside the side plate (7).