Multi-layer high-density circuit board

Abstract

The utility model discloses a multilayer high-density circuit board, which relates to the field of circuit boards and comprises four fixing frames, the tops and the bottoms of the four fixing frames are movably connected with adjusting assemblies, the inner sides of the fixing frames are movably clamped with circuit board bodies, the bottoms of the fixing frames are fixedly connected with supporting legs, and the supporting legs are fixedly connected with the circuit board bodies. The adjusting assembly comprises an adjusting frame, a limiting sliding groove is formed in the outer side of the adjusting frame, and a connecting plate is movably connected into the limiting sliding groove in a clamped mode. According to the utility model, the four fixing frames are arranged to cooperate with the adjusting assembly, and the four fixing frames can be pulled outwards along the adjusting assembly so as to adjust the distance between the four fixing frames, so that the distance between the four fixing frames can be adjusted according to different sizes of the circuit board body, and the circuit board body can be clamped between the fixing frames; therefore, adjustment can be carried out according to the length and width of the circuit board bodies of different sizes, and the universality is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a multi-layer high-density circuit board. Background Art

[0002] Circuit board, also known as flexible circuit board or flexible printed circuit board, is a circuit board made of polyimide, which makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property. Circuit boards can be mainly divided into three categories: single-sided board, with parts concentrated on one side and wires concentrated on the other side, so it is called a single-sided board; double-sided board: this kind of circuit board has wiring on both sides, and is more suitable for more complex circuits than single-sided boards; multi-layer board: used for more complex application requirements, the circuit boards can be placed vertically on the bracket at intervals to form a multi-layer circuit board to meet the use requirements, and the size parameters of the circuit boards are the same when stacked once.

[0003] Existing multi-layer high-density circuit boards usually require brackets of corresponding sizes for installation because the lengths and widths of circuit boards of different sizes are different. However, the brackets are inconvenient to adjust and have poor versatility. Utility Model Content

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0005] A multi-layer high-density circuit board comprises four fixed frames, the tops and bottoms of the four fixed frames are movably connected with adjustment components, the inner sides of the fixed frames are movably connected with the circuit board body, and the bottoms of the fixed frames are fixedly connected with supporting feet.

[0006] A further improvement of the technical solution of the utility model is that: the adjustment component includes an adjustment frame, a limiting slide groove is provided on the outer side of the adjustment frame, a connecting plate is movably clamped inside the limiting slide groove, a pin is movably installed inside the connecting plate at one end away from the adjustment frame, positioning holes are equidistantly provided inside the connecting plate, and fixing holes that pass through the limiting slide groove are provided on the top of the adjustment frame, and fixing bolts are connected to the internal threads of the fixing holes.

[0007] A further improvement of the technical solution of the utility model is that: the fixing frame includes a frame and a support block, the support block is equidistantly fixedly connected to the inner side of the frame, and the circuit board body is movably clamped to the inner side of the support block.

[0008] A further improvement of the technical solution of the utility model is that the support block includes a block body, an empty groove is opened inside the block body, a guide column is fixedly installed inside the empty groove, the external movable clamp of the guide column is connected to two movable blocks located at the upper and lower sides of the guide column, and the external movable clamp of the guide column is connected to a support spring located between the two movable blocks.

[0009] A further improvement of the technical solution of the utility model is that the adjustment frame and the connecting plate correspond to the positions of the fixed frame, and the pin is fixedly connected to the top of the fixed frame.

[0010] A further improvement of the technical solution of the utility model is that the positioning holes are arranged at equal distances, and the positioning holes and the fixing holes are adapted to each other.

[0011] A further improvement of the technical solution of the utility model is that: a rubber pad is fixedly connected to the outer side of the movable block, and the rubber pad is fitted to the outer side of the circuit board body.

[0012] A further improvement of the technical solution of the utility model is that the guide posts are arranged in a bilaterally symmetrical manner in the empty slot.

[0013] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0014] 1. The utility model provides a multi-layer high-density circuit board. By setting four fixing frames and cooperating with an adjusting component, the four fixing frames can be pulled outward along the adjusting component to adjust the spacing between the four fixing frames, and then the distance between the four fixing frames can be adjusted according to the different sizes of the circuit board body, and the circuit board body can be clamped between the fixing frames, so that the length and width of the circuit board body of different sizes can be adjusted to improve versatility.

[0015] 2. The utility model provides a multi-layer high-density circuit board. By clamping the circuit board body on the inner side of a fixing frame, the fixing frame can be moved according to the circuit board bodies of different sizes and thicknesses, thereby clamping and fixing the circuit board bodies of different sizes, thereby improving applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a multi-layer high-density circuit board of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the adjustment component of the utility model;

[0018] Figure 3 It is a structural explosion diagram of the adjustment component of the utility model;

[0019] Figure 4 It is a schematic cross-sectional structure diagram of a fixed vertical frame of the utility model;

[0020] Figure 5 It is a structural schematic diagram of the support block of the utility model.

[0021] In the figure: 1. fixed frame; 11. frame; 12. support block; 121. block; 122. empty slot; 123. guide column; 124. movable block; 125. support spring; 126. rubber pad; 2. adjustment assembly; 21. adjustment frame; 22. limit slide groove; 23. connecting plate; 24. pin shaft; 25. positioning hole; 26. fixing hole; 27. fixing bolt; 3. circuit board body; 4. support foot. DETAILED DESCRIPTION

[0022] The utility model is further described in detail below:

[0023] like Figures 1 to 5 As shown, the utility model provides a multi-layer high-density circuit board, including a fixed frame 1, the top and bottom of the fixed frame 1 are movably connected with an adjustment component 2, the inner side of the fixed frame 1 is movably connected with a circuit board body 3, and the bottom of the fixed frame 1 is fixedly connected with a support leg 4.

[0024] By setting four fixing frames 1 to cooperate with the adjusting component 2, the four fixing frames 1 can be pulled outward along the adjusting component 2 to adjust the spacing between the four fixing frames 1, and then the distance between the four fixing frames 1 can be adjusted according to the different sizes of the circuit board body 3. The circuit board body 3 is clamped between the fixing frames 1, so that the length and width of the circuit board body 3 of different sizes can be adjusted to improve the versatility. At the same time, by clamping the circuit board body 3 on the inner side of the fixing frame 1, the fixing frame 1 can be moved according to the circuit board body 3 of different sizes and thicknesses, so that the circuit board body 3 of different sizes can be clamped and fixed, thereby improving the applicability.

[0025] like Figure 2 and Figure 3 As shown, the adjustment component 2 includes an adjustment frame 21, a limiting slide groove 22 is provided on the outer side of the adjustment frame 21, a connecting plate 23 is movably connected inside the limiting slide groove 22, a pin shaft 24 is movably installed inside the connecting plate 23 at one end away from the adjustment frame 21, positioning holes 25 are equidistantly provided inside the connecting plate 23, and fixing holes 26 that pass through the limiting slide groove 22 are provided on the top of the adjustment frame 21, and fixing bolts 27 are connected to the internal threads of the fixing holes 26.

[0026] By pulling the connecting plate 23 outward along the limiting slide groove 22 on the side of the adjustment frame 21 according to the size of the circuit board body 3, the fixing frame 1 is driven to move outward, so that the fixing frame 1 is opened to adapt to the state that the current circuit board body 3 can be placed inside the fixing frame 1, and the circuit board body 3 is correspondingly inserted into the inner side of one corner of the fixing frame 1, and the connecting plate 23 at the other triangular position is pushed into the inside of the limiting slide groove 22 to move the fixing frame 1 inward to limit the circuit board body 3, and the position of the connecting plate 23 is fixed by using fixing bolts 27 that pass through the fixing holes 26 and the positioning holes 25 to fix the position of the connecting plate 23, so that the circuit board body 3 is inserted into the inner side of the fixing frame 1 for fixing, so that it can be adjusted according to circuit board bodies 3 of different sizes, thereby improving versatility.

[0027] like Figure 4 and Figure 5 As shown, the fixing frame 1 includes a frame 11 and a support block 12 . The support block 12 is fixedly connected to the inner side of the frame 11 at equal distances, and the circuit board body 3 is movably connected to the inner side of the support block 12 .

[0028] The support block 12 includes a block body 121, a slot 122 is provided inside the block body 121, a guide column 123 is fixedly installed inside the slot 122, the outer movability of the guide column 123 is connected to two movable blocks 124 located at the upper and lower sides of the guide column 123, and the outer movability of the guide column 123 is connected to a support spring 125 located between the two movable blocks 124.

[0029] By making the side edge of the circuit board body 3 located between the support blocks 12 and contacting the rubber pad 126 first, and pushing the circuit board body 3 into the fixed frame 1, the movable block 124 moves inward along the guide column 123 in the empty groove 122 to compress the support spring 125, so that the movable block 124 is pushed by the elastic force of the support spring 125 to clamp the circuit board body 3, thereby being adaptable to clamping and fixing circuit board bodies 3 of different thicknesses, thereby improving applicability.

[0030] like Figure 1 As shown, the adjustment frame 21 and the connecting plate 23 both correspond to the positions of the fixing frame 1 , and the pin 24 is fixedly connected to the top of the fixing frame 1 .

[0031] The adjusting frame 21 and the connecting plate 23 are connected to the tops of the four fixing frames 1 in cooperation with the pin shaft 24, so that the distance between the four fixing frames 1 can be flexibly adjusted.

[0032] like Figure 3 As shown, the positioning holes 25 are arranged at equal intervals, and the positioning holes 25 and the fixing holes 26 are matched with each other.

[0033] Through the adaptation of the positioning hole 25 and the fixing hole 26 , after the fixing frame 1 is adjusted, the fixing bolts 27 are connected to the positioning hole 25 and the fixing hole 26 for fixing.

[0034] like Figure 5 As shown, a rubber pad 126 is fixedly connected to the outer side of the movable block 124 , and the rubber pad 126 is in contact with the outer side of the circuit board body 3 .

[0035] The rubber pad 126 is attached to the outer side of the circuit board body 3 to improve the anti-slip property and protect the side of the circuit board body 3 .

[0036] like Figure 5 As shown, the guide posts 123 are disposed in a left-right symmetrical manner within the slot 122 .

[0037] The stability of the movement of the movable block 124 is ensured by the symmetrically arranged guide posts 123 .

[0038] The following is a detailed description of the working principle of the multi-layer high-density circuit board.

[0039] like Figures 1 to 5 As shown, according to the size of the circuit board body 3, the connecting plate 23 is pulled outward along the limiting sliding groove 22 on the side of the adjusting frame 21 to drive the fixing frame 1 to move outward, so that the fixing frame 1 is opened to adapt to the state that the current circuit board body 3 can be placed inside the fixing frame 1, and the circuit board body 3 is inserted into the support blocks 12 on the inner side of one of the corner frames 11 one by one, and the side edge of the circuit board body 3 is located between the support blocks 12 and first contacts the rubber pad 126, and the circuit board body 3 is pushed into the fixing frame 1, so that the movable block 124 moves inward along the guide column 123 in the empty groove 122 to compress the support spring 125, so that the movable block 124 is supported by the elastic force. The elastic force of the spring 125 pushes the rubber pad 126 to clamp the circuit board body 3, and the circuit board body 3 is located between the support blocks 12 for limited support. Then, the connecting plates 23 at other triangular positions are pushed toward the inside of the limiting slide groove 22 to move the fixing frame 1 inward to limit the circuit board body 3, so that the circuit board body 3 is clamped into the inner side of the frame 11 for limited position, wherein the positioning hole 25 on the connecting plate 23 corresponds to the position of the fixing hole 26, and the fixing bolt 27 is used to pass through the fixing hole 26 and the positioning hole 25 to fix the position of the connecting plate 23, thereby clamping the circuit board body 3 into the inner side of the fixing frame 1 for fixation.

[0040] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A multi-layer high-density circuit board, characterized in that: It comprises four fixed frames (1), the tops and bottoms of the four fixed frames (1) are movably connected to adjustment components (2), the inner sides of the fixed frames (1) are movably connected to circuit board bodies (3), and the bottoms of the fixed frames (1) are fixedly connected to support feet (4).

2. A multi-layer high-density circuit board according to claim 1, characterized in that: The adjustment assembly (2) comprises an adjustment frame (21), the outer side of the adjustment frame (21) is provided with a limit slide groove (22), the inner side of the limit slide groove (22) is movably connected with a connecting plate (23), the inner side of the connecting plate (23) away from the adjustment frame (21) is movably equipped with a pin shaft (24), the inner side of the connecting plate (23) is provided with equidistant positioning holes (25), the top of the adjustment frame (21) is provided with fixing holes (26) penetrating the limit slide groove (22), and the inner side of the fixing hole (26) is threadedly connected with a fixing bolt (27).

3. A multi-layer high-density circuit board according to claim 2, characterized in that: The fixing frame (1) comprises a frame (11) and a support block (12); the support block (12) is fixedly connected to the inner side of the frame (11) at equal distances; and the circuit board body (3) is movably snap-connected to the inner side of the support block (12).

4. A multi-layer high-density circuit board according to claim 3, characterized in that: The support block (12) comprises a block body (121), a hollow groove (122) is provided inside the block body (121), a guide column (123) is fixedly installed inside the hollow groove (122), the outer part of the guide column (123) is movably connected to two movable blocks (124) located at the upper and lower sides of the guide column (123), and the outer part of the guide column (123) is movably connected to a support spring (125) located between the two movable blocks (124).

5. A multi-layer high-density circuit board according to claim 2, characterized in that: The adjustment frame (21) and the connection plate (23) both correspond to the positions of the fixed frame (1), and the pin shaft (24) is fixedly connected to the top of the fixed frame (1).

6. A multi-layer high-density circuit board according to claim 2, characterized in that: The positioning holes (25) are arranged at equal distances, and the positioning holes (25) and the fixing holes (26) are adapted to each other.

7. A multi-layer high-density circuit board according to claim 4, characterized in that: The outer side of the movable block (124) is fixedly connected with a rubber pad (126), and the rubber pad (126) is in contact with the outer side of the circuit board body (3).

8. The multi-layer high-density circuit board according to claim 4, characterized in that: The guide posts (123) are disposed in a bilaterally symmetrical manner within the empty slot (122).

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