Perforating device for circuit board processing
By using adjustable positioning components and positioning mechanisms in the circuit board hole punching device and combining buffer components, the problem of positioning and drilling accuracy in circuit board processing is solved, and efficient positioning and precise punching of circuit boards of different sizes is achieved. Holes avoid circuit board damage.
Patent Information
- Application Number
- CN202323497613.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-21
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2033-12-21
AI Technical Summary
During the processing of circuit boards, existing hole punching equipment needs to frequently adjust the positioning structure when handling circuit boards of different high sizes, which leads to troublesome operation, and when the drill bit speed is too fast, it may cause circuit board damage and hole punching accuracy.
A hole punching device for circuit board processing is designed, using adjustable positioning components and position adjustment mechanism, combined with buffer components to ensure stable positioning of the circuit board and accurate adjustment of the hole punching head, and using a dual-axis reducer motor and Z-axis , Y-axis, X-axis electric guide rails and buffer springs, etc., realize the positioning of circuit boards of different sizes and the precise adjustment of the drill head, and provide buffer protection when the drill bit is first contacted.
It effectively solves the problems of circuit board positioning and drilling accuracy, reduces the complexity of equipment adjustment, and protects the circuit board through buffer components, avoids damage in the initial stage of drilling, and improves the overall drilling accuracy and stability.
Smart Images
Figure CN222309089U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board processing, in particular to a punching device for circuit board processing. Background Art
[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts.
[0003] During the processing of circuit boards, they need to be punched. Some punching equipment needs to frequently adjust the internal positioning structure of the device when drilling different high-size circuits, which is very troublesome. At the same time, in the early stage of drilling, the drill bit will jitter at high speed when it contacts the circuit board, causing damage to the circuit board and affecting the drilling accuracy.
[0004] Therefore, the present invention proposes a punching device for processing a circuit board to solve the above problems. Utility Model Content
[0005] In order to overcome the defects of the prior art, the utility model aims to provide a punching device for processing a circuit board.
[0006] To achieve the above-mentioned purpose, the technical solution of the utility model is implemented as follows: a punching device for circuit board processing, comprising a circuit board and a punching table, characterized in that positioning components for positioning the circuit board are provided on both sides of the top of the punching table, and a distance adjustment mechanism for adjusting the positioning components on both sides is provided inside the punching table, and a positioning mechanism and a buffer component connected to its output end are provided on the top of the punching table, wherein a punching head is docked at the bottom of the buffer component.
[0007] Preferably, the pitch adjustment mechanism includes a driving groove, a dual-axis reduction motor, a driving screw and a threaded sleeve. The dual-axis reduction motor is installed at the center of the driving groove. The driving screw has two screws that are rotatably installed on both sides of the driving groove and are respectively connected to the output ends of the dual-axis reduction motor on both sides. The threaded sleeve has two screws that are respectively threaded on the driving screws on both sides, and the tops of the threaded sleeves on both sides are respectively connected to the bottoms of the positioning components on both sides of the top.
[0008] Preferably, the positioning assembly includes a support plate, a side clamping plate, a driving mechanism and a clamping plate, the side clamping plate is installed at 90° on the top of the outer edge of the support plate, the clamping plate is arranged on the inner side of the side clamping plate, the driving mechanism is arranged at the inner center of the side clamping plate and the output end is fixedly connected to the center of the inner side of the clamping plate, and the bottom of the clamping plate is pressed against the top of the edge of the circuit board.
[0009] Preferably, the positioning mechanism includes a Z-axis electric guide rail, a Y-axis electric guide rail and an X-axis electric guide rail, the Z-axis electric guide rail is symmetrically installed on both sides of the top of the punching table, the Y-axis electric guide rail is arranged between the Z-axis electric guide rails on both sides and connected to the up and down sliding output ends thereof, the X-axis electric guide rail is connected to the left and right sliding output ends at the bottom of the Y-axis electric guide rail, and the buffer assembly is installed and connected to the front and rear sliding output ends of the X-axis electric guide rail.
[0010] Preferably, the buffer assembly includes a connecting seat, a tightening pad, a slide plate, a connecting column, a buffer spring and a connecting plate. The slide plate is slid up and down as a whole and is clamped in the internal chamber of the connecting seat. The tightening pad is installed on the top of the slide plate, the connecting column is installed on the bottom of the slide plate, and the connecting plate is installed on the bottom of the connecting column. The buffer spring is sleeved on the connecting column and tightened between the connecting seat and the connecting plate, and the punch head is installed at the bottom of the connecting plate.
[0011] Preferably, the driving mechanism includes a lifting slot, a reduction motor, a lifting screw and a lifting sleeve, the reduction motor is installed at the top of the lifting slot, the lifting screw is rotatably installed inside the lifting slot, the lifting sleeve is threadedly sleeved on the lifting screw, and the outer side surface of the lifting sleeve is fixedly connected to the center of the inner side surface of the clamping plate.
[0012] Preferably, the distance from the top of the tightening pad to the top of the internal chamber of the connecting seat is less than the compression distance of the buffer spring.
[0013] Preferably, one inner end of the support plate is provided with a downwardly inclined cutout.
[0014] The beneficial effects of the utility model are embodied in:
[0015] When the utility model is in use, the circuit board is placed on the top of the punching table, and then the double-axis reduction motor inside the distance adjustment mechanism is started, which synchronously drives the driving screws on both sides, drives the threaded sleeves and the positioning components on both sides to gather toward the center, and at this time, the supporting plates on both sides inside lift up the circuit board, and the side clamps on both sides are clamped on both sides of the circuit board, and then the reduction motor inside the driving mechanism is started to drive the lifting screw to rotate, thereby driving the lifting sleeve and the clamping plate to move downward, and then clamping the edges of both sides of the circuit board, and then the Z-axis electric guide rail, Y-axis electric guide rail and X-axis electric guide rail inside the adjustment mechanism are started to transfer the punching machine head to the place where holes are punched on the circuit board. At the initial stage of punching, the connecting plate inside the buffer assembly will be retracted upward, and at this time the buffer spring will be compressed and retracted until the internal top tightening pad contacts the top of the internal chamber of the connecting seat, and then the punching operation can be realized.
[0016] The utility model can perform positioning operations on circuit boards of different sizes through the internally arranged distance adjustment mechanism and positioning component. At the same time, the internally arranged position adjustment mechanism can adjust the punch head to any position. The internally arranged buffer component during the punching process can play a good buffering effect when the punching drill bit just contacts the circuit board, thereby ensuring the stability in the initial stage of punching and avoiding damage to the circuit board during the punching process. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In the attached picture:
[0018] Figure 1 It is a schematic diagram of the central section structure of the utility model;
[0019] Figure 2 It is a structural schematic diagram of the distance adjustment mechanism of the utility model;
[0020] Figure 3 It is a structural schematic diagram of the positioning component of the utility model;
[0021] Figure 4 It is a structural schematic diagram of the positioning mechanism of the utility model;
[0022] Figure 5 It is a structural schematic diagram of the buffer component of the utility model;
[0023] Figure 6 It is a structural schematic diagram of the driving mechanism of the utility model;
[0024] Description of reference numerals:
[0025] 1. Circuit board; 2. Punching table; 3. Distance adjustment mechanism; 4. Positioning assembly; 5. Positioning mechanism; 6. Buffer assembly; 7. Punching head; 8. Driving slot; 9. Double-axis reduction motor; 10. Driving screw; 11. Threaded sleeve; 12. Support plate; 13. Side clamp; 14. Driving mechanism; 15. Clamping plate; 16. X-axis electric guide rail; 17. Y-axis electric guide rail; 18. Z-axis electric guide rail; 19. Connecting seat; 20. Tightening pad; 21. Slide plate; 22. Connecting column; 23. Buffer spring; 24. Connecting plate; 25. Lifting slot; 26. Reduction motor; 27. Lifting screw; 28. Lifting sleeve. DETAILED DESCRIPTION
[0026] The utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] It should be noted that if the utility model embodiments involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0028] In addition, "multiple" means more than two. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0029] Please refer to the instruction manual Figure 1 The utility model provides a punching device for circuit board processing, comprising a circuit board 1 and a punching table 2, characterized in that positioning components 4 for positioning the circuit board 1 are arranged on both sides of the top of the punching table 2, and a distance adjustment mechanism 3 for adjusting the positioning components 4 on both sides is arranged inside the punching table 2, and a positioning mechanism 5 and a buffer component 6 connected to its output end are arranged on the top of the punching table 2, wherein a punching head 7 is docked at the bottom of the buffer component 6.
[0030] In one embodiment, please continue to refer to the attached manual. Figure 1 and Figure 2The pitch adjustment mechanism 3 includes a driving groove 8, a dual-axis reduction motor 9, a driving screw 10 and a threaded sleeve 11. The dual-axis reduction motor 9 is installed at the center of the driving groove 8. The driving screw 10 has two parts that are rotatably installed on both sides of the driving groove 8 and are respectively connected to the output ends of the dual-axis reduction motor 9 on both sides. The threaded sleeve 11 has two parts that are respectively threadedly sleeved on the driving screw 10 on both sides. The tops of the threaded sleeves 11 on both sides are respectively connected to the bottoms of the positioning components 4 on both sides of the top.
[0031] In another embodiment, please continue to refer to the attached manual. Figure 1 and Figure 3 The positioning assembly 4 includes a support plate 12, a side clamping plate 13, a driving mechanism 14 and a clamping plate 15. The side clamping plate 13 is installed at 90° on the top of the outer edge of the support plate 12, and the clamping plate 15 is arranged on the inner side of the side clamping plate 13. The driving mechanism 14 is arranged at the inner center of the side clamping plate 13 and the output end is fixedly connected to the center of the inner side of the clamping plate 15. The bottom of the clamping plate 15 is pressed against the top of the edge of the circuit board 1.
[0032] In one embodiment, please continue to refer to the attached manual. Figure 1 and Figure 4 The positioning mechanism 5 includes a Z-axis electric guide rail 18, a Y-axis electric guide rail 17 and an X-axis electric guide rail 16. The Z-axis electric guide rail 18 is symmetrically installed on both sides of the top of the punching table 2. The Y-axis electric guide rail 17 is arranged between the Z-axis electric guide rails 18 on both sides and connected to the up and down sliding output ends thereof. The X-axis electric guide rail 16 is connected to the left and right sliding output ends at the bottom of the Y-axis electric guide rail 17. The buffer assembly 6 is installed and connected to the front and back sliding output ends of the X-axis electric guide rail 16.
[0033] In another embodiment, please continue to refer to the attached manual. Figure 1 and Figure 5 The buffer assembly 6 includes a connecting seat 19, a tightening pad 20, a slide plate 21, a connecting column 22, a buffer spring 23 and a connecting plate 24. The slide plate 21 is slidably connected to the inner chamber of the connecting seat 19 as a whole. The tightening pad 20 is installed on the top of the slide plate 21, the connecting column 22 is installed on the bottom of the slide plate 21, and the connecting plate 24 is installed on the bottom of the connecting column 22. The buffer spring 23 is sleeved on the connecting column 22 and tightened between the connecting seat 19 and the connecting plate 24. The punch head 7 is installed at the bottom of the connecting plate 24.
[0034] In one embodiment, please continue to refer to the attached manual. Figure 1 and Figure 6The driving mechanism 14 includes a lifting slot 25, a reduction motor 26, a lifting screw 27 and a lifting sleeve 28. The reduction motor 26 is installed at the top of the lifting slot 25. The lifting screw 27 is rotatably installed inside the lifting slot 25. The lifting sleeve 28 is threadedly sleeved on the lifting screw 27. The outer side surface of the lifting sleeve 28 is fixedly connected to the center of the inner side surface of the pressing plate 15.
[0035] In another embodiment, please continue to refer to the attached manual. Figure 1 and Figure 6 The distance from the top of the tightening pad 20 to the top of the internal chamber of the connecting seat 19 is less than the compression distance of the buffer spring 23.
[0036] In one embodiment, please continue to refer to the attached manual. Figure 1 and Figure 3 One end of the inner side of the support plate 12 is set as a downwardly inclined cutout.
[0037] When in use, the circuit board 1 is placed on the top of the punching table 2, and then the double-axis reduction motor 9 inside the distance adjustment mechanism 3 is started, which synchronously drives the driving screws 10 on both sides, drives the threaded sleeves 11 on both sides and the positioning assembly 4 to gather towards the center, at this time, the supporting plates 12 on both sides inside lift the circuit board 1, and the side clamps 13 on both sides are clamped on both sides of the circuit board 1, and then the reduction motor 26 inside the driving mechanism 14 is started to drive the lifting screw 27 to rotate, thereby driving the lifting sleeve 28 and the clamping plate 15 to move downward, thereby clamping the edges of both sides of the circuit board 1, and then start the Z-axis electric guide rail 18, Y-axis electric guide rail 17 and X-axis electric guide rail 16 inside the positioning mechanism 5, so that the punching head 7 is transferred to the place with holes on the circuit board 1. At the initial stage of punching, the connecting plate 24 inside the buffer assembly 6 will be retracted upward, and at this time, the buffer spring 23 is compressed and retracted until the internal top tightening pad 20 contacts the top of the internal chamber of the connecting seat 19, and then the punching operation can be realized.
[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A punching device for processing a circuit board, comprising a circuit board (1) and a punching table (2), characterized in that: Positioning components (4) for positioning the circuit board (1) are arranged on both sides of the top of the punching table (2); a distance adjustment mechanism (3) capable of adjusting the positioning components (4) on both sides is arranged inside the punching table (2); a position adjustment mechanism (5) and a buffer component (6) connected to the output end thereof are arranged on the top of the punching table (2); a punching head (7) is connected to the bottom of the buffer component (6).
2. A punching device for circuit board processing according to claim 1, characterized in that: The pitch adjustment mechanism (3) comprises a driving groove (8), a double-axis reduction motor (9), a driving screw (10) and a threaded sleeve (11); the double-axis reduction motor (9) is installed at the center of the driving groove (8); the driving screw (10) has two parts which are rotatably installed on two sides of the driving groove (8) and are respectively connected to the output ends of the double-axis reduction motor (9); the threaded sleeve (11) has two parts which are respectively threadedly sleeved on the driving screw (10) on both sides; the tops of the threaded sleeves (11) on both sides are respectively connected to the bottoms of the positioning components (4) on both sides of the top.
3. A punching device for circuit board processing according to claim 1, characterized in that: The positioning assembly (4) comprises a support plate (12), a side clamping plate (13), a driving mechanism (14) and a clamping plate (15); the side clamping plate (13) is installed at a 90° angle on the top of the outer edge of the support plate (12); the clamping plate (15) is arranged on the inner side of the side clamping plate (13); the driving mechanism (14) is arranged at the inner center of the side clamping plate (13) and the output end is fixedly connected to the center of the inner side of the clamping plate (15); the bottom of the clamping plate (15) is pressed against the top of the edge of the circuit board (1).
4. A punching device for circuit board processing according to claim 1, characterized in that: The positioning mechanism comprises a Z-axis electric guide rail (18), a Y-axis electric guide rail (17) and an X-axis electric guide rail (16); the Z-axis electric guide rail (18) is symmetrically mounted on both sides of the top of the punching table (2); the Y-axis electric guide rail (17) is arranged between the Z-axis electric guide rails (18) on both sides and is connected to the up and down sliding output ends thereof; the X-axis electric guide rail (16) is connected to the left and right sliding output ends at the bottom of the Y-axis electric guide rail (17); and the buffer assembly (6) is mounted and connected to the front and back sliding output ends of the X-axis electric guide rail (16).
5. A punching device for circuit board processing according to claim 1, characterized in that: The buffer assembly (6) comprises a connecting seat (19), a tightening pad (20), a slide plate (21), a connecting column (22), a buffer spring (23) and a connecting plate (24); the slide plate (21) as a whole slides up and down and is clamped in the internal chamber of the connecting seat (19); the tightening pad (20) is installed on the top of the slide plate (21); the connecting column (22) is installed on the bottom of the slide plate (21); the connecting plate (24) is installed on the bottom of the connecting column (22); the buffer spring (23) is sleeved on the connecting column (22) and tightened between the connecting seat (19) and the connecting plate (24); and the punch head (7) is installed at the bottom of the connecting plate (24).
6. A punching device for circuit board processing according to claim 3, characterized in that: The driving mechanism (14) comprises a lifting groove (25), a reduction motor (26), a lifting screw (27) and a lifting sleeve (28); the reduction motor (26) is installed at the top end of the lifting groove (25); the lifting screw (27) is rotatably installed inside the lifting groove (25); the lifting sleeve (28) is threadedly sleeved on the lifting screw (27); and the outer side surface of the lifting sleeve (28) is fixedly connected to the center of the inner side surface of the pressing plate (15).
7. A punching device for circuit board processing according to claim 5, characterized in that: The distance from the top of the tightening pad (20) to the top of the internal chamber of the connecting seat (19) is smaller than the compression distance of the buffer spring (23).
8. A punching device for circuit board processing according to claim 3, characterized in that: One end of the inner side of the support plate (12) is provided with a downwardly inclined cutout.