High-flatness release film

Abstract

The utility model discloses a high-flatness release film, which comprises a base material layer, which is provided with a first surface and a second surface which are opposite to each other along the thickness direction; the release layer is arranged on the first surface; at least one epoxy resin coating is arranged between the base material layer and the release layer. The high-flatness release film is reasonable in structure, the surface smoothness and flatness of the base material layer 1 are improved by arranging the epoxy resin coating between the base material layer and the release layer, and the adhesion between the ultrathin release layer and the base material layer and the short-term or long-term heat resistance of the release film are improved through chemical bonding between the layers; and the release film can still keep good structural stability at a relatively high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of release films, in particular to a high-flatness release film. Background Art

[0002] MLCC release film is a consumable product that must be used in the production process of MLCC (laminated ceramic capacitors). In the process of MLCC production, ceramic slurry needs to be coated on the MLCC release film. After drying and cutting, the product needs to be stacked in multiple layers. The MLCC release film plays a role in bottom support and surface protection in the entire production process.

[0003] Hundreds of stackings are required inside the MLCC to achieve the requirements of small size and large capacitance. Therefore, the MLCC release film has extremely high requirements on the flatness of the base film surface, and the height difference of the base film surface is required to be controlled within 500nm.

[0004] The surface roughness of the grade substrate used for MLCC is low, which is not conducive to the adhesion and leveling of the release coating. It is easy to be adsorbed after cutting and winding, and the release layer is damaged when unwinding for use, resulting in unstable release force of the release film. The high-grade substrate used for MLCC is expensive and mainly imported.

[0005] Therefore, it is necessary to improve the release film in the prior art. Utility Model Content

[0006] The purpose of the utility model is to overcome the defects in the prior art and provide a high-flatness release film, which improves the surface smoothness and flatness of the substrate layer 1 by setting an epoxy resin coating between the substrate layer and the release layer, and improves the adhesion between the ultra-thin release layer and the substrate layer through chemical bonding between the layers, and improves the short-term or long-term heat resistance of the release film, so that the release film can still maintain good structural stability at higher temperatures.

[0007] In order to achieve the above technical effects, the technical solution of the utility model is: a high-flatness release film, comprising:

[0008] A substrate layer having a first surface and a second surface opposite to each other in a film thickness direction;

[0009] A release layer, disposed on the first surface;

[0010] At least one layer of epoxy resin coating is arranged between the substrate layer and the release layer.

[0011] A preferred technical solution is that the epoxy resin coating and / or release layer is an antistatic layer.

[0012] A preferred technical solution is that the epoxy resin coating includes two layers of epoxy resin unit coatings, and one of the two layers of epoxy resin unit coatings is an antistatic layer close to the release layer.

[0013] A preferred technical solution is that the thickness of the epoxy resin unit coating layer close to the substrate layer is greater than or equal to the thickness of another epoxy resin unit coating layer.

[0014] A preferred technical solution is that a polyurethane coating is provided on the second surface of the substrate layer.

[0015] A preferred technical solution is that the polyurethane coating is an antistatic layer.

[0016] A preferred technical solution is that the release layer has a thickness of 0.1 to 0.3 μm, the epoxy resin coating has a thickness of 0.4 to 0.8 μm, and the polyurethane coating has a thickness of 1 to 5 μm.

[0017] A preferred technical solution is that the substrate layer is a high temperature resistant PET substrate layer.

[0018] The advantages and beneficial effects of the utility model are:

[0019] The high-flatness release film has a reasonable structure. The epoxy resin coating is arranged between the substrate layer and the release layer to improve the surface smoothness and flatness of the substrate layer 1. The chemical bonding between the layers is used to improve the adhesion between the ultra-thin release layer and the substrate layer, and the short-term or long-term heat resistance of the release film is improved, so that the release film can still maintain good structural stability at higher temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of Embodiment 1 of the high-flatness release film of the utility model;

[0021] Figure 2 This is a schematic structural diagram of Embodiment 2 of the high-flatness release film of the utility model;

[0022] Figure 3 It is a structural schematic diagram of embodiment 3 of the high-flatness release film of the utility model.

[0023] In the figure: 1, substrate layer; 2, release layer; 3, epoxy resin coating; 4, polyurethane coating; 30, epoxy resin unit coating; 101, first surface; 102, second surface. DETAILED DESCRIPTION

[0024] The following is a further description of the specific implementation of the present invention in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0025] The “surface” is based on the normal use state of the high-flatness release film and is only for the convenience of describing the present invention and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0026] like Figures 1 to 3 As shown, the utility model discloses a high-flatness release film, including a substrate layer 1 and a release layer 2, the substrate layer 1 has a first surface 101 and a second surface 102 opposite to each other along the film thickness direction; the release layer 2 is arranged on the first surface 101; at least one layer of epoxy resin coating 3 is arranged between the substrate layer 1 and the release layer 2.

[0027] Among them, the epoxy resin coating 3 improves the surface smoothness and flatness of the substrate layer 1; the epoxy resin coating 3 has excellent adhesion properties, and through chemical bonding between layers, it improves the adhesion performance of the ultra-thin release layer and the substrate layer, prevents delamination or peeling, especially in applications such as bending, stretching or high stress, to ensure the stability of the overall structure; the epoxy resin coating 3 has excellent acid and alkali resistance, solvent resistance, oil resistance and other properties, and can effectively block the erosion of chemical substances on the substrate layer, protecting it from damage when contacting various chemical media; the epoxy resin coating 3 has high hardness and strong impact resistance after hardening, thereby improving the mechanical properties of the release film; the epoxy resin coating 3 can further improve the short-term or long-term heat resistance of the release film, so that the release film can still maintain good structural stability at higher temperatures.

[0028] In some embodiments, the epoxy resin coating 3 is an antistatic layer. An antistatic agent is added to the coating liquid of the epoxy resin coating. A commonly used antistatic agent is polythiophene conductive liquid.

[0029] In some embodiments, the release layer 2 is an antistatic layer. An antistatic agent compatible with the main agent is added to the coating liquid of the release layer. The commonly used antistatic agent is polythiophene conductive liquid.

[0030] In some embodiments, both the epoxy resin coating 3 and the release layer 2 are antistatic layers.

[0031] In some embodiments, the epoxy resin coating 3 includes two layers of epoxy resin unit coatings 30, one of the two layers of epoxy resin unit coatings 30 is an antistatic layer close to the release layer 2, which better exerts the antistatic performance and prevents the precipitation of the antistatic agent. Further, the thickness of the epoxy resin unit coating 30 close to the substrate layer 1 is greater than or equal to the thickness of the other epoxy resin unit coating 30. The provision of two layers of epoxy resin unit coatings 30 can further improve the flatness of the first surface 101 of the substrate layer 1, and prevent the high curing temperature of the thick epoxy resin coating from affecting the flatness of the substrate layer.

[0032] The second surface 102 of the substrate layer 1 is provided with a polyurethane coating 4. The polyurethane coating 4 improves the scratch resistance and wear resistance of the surface of the substrate layer 1, improves the applicable scenarios and service life; it can give the surface of the substrate layer 1 a higher hardness, increase its compression and impact resistance, and prevent depression and deformation caused by a rough contact surface, thereby affecting the flatness of the release layer surface in contact with the material and the shape stability of the release film.

[0033] Functional additives are added to the polyurethane coating 4 as needed to give the surface of the substrate layer 1 special properties such as antistatic, antibacterial, antifog, self-cleaning, and flame retardant to meet the needs of specific applications. In order to be suitable for the production of electronic products, the polyurethane coating 4 is further an antistatic layer.

[0034] The thickness of the release layer 2 is 0.1-0.3 μm, the thickness of the epoxy resin coating 3 is 0.4-0.8 μm, and the thickness of the polyurethane coating 4 is 1-5 μm.

[0035] Wherein, the substrate layer 1 is a high temperature resistant PET substrate layer.

[0036] Example 1

[0037] like Figure 1 As shown, the high-flatness release film of Example 1 includes a substrate layer 1 and a release layer 2, the substrate layer 1 has a first surface 101 and a second surface 102 opposite to each other along the film thickness direction; the release layer 2 is arranged on the first surface 101; a layer of epoxy resin coating 3 is arranged between the substrate layer 1 and the release layer 2, the substrate layer 1 is a high-temperature resistant PET substrate layer, wherein the layer thickness of the release layer 2 is 0.1μm, the layer thickness of the epoxy resin coating 3 is 0.7μm, and the layer thickness of the substrate layer 1 is 50μm.

[0038] Example 2

[0039] like Figure 2 As shown, Example 2 is based on Example 1, except that the second surface 102 of the substrate layer 1 is provided with a polyurethane coating 4, the epoxy resin coating 3 and the polyurethane coating 4 are both antistatic layers, and the thickness of the polyurethane coating 4 is 2 μm.

[0040] Example 3

[0041] like Figure 3 As shown, Example 3 is based on Example 2, except that the epoxy resin coating 3 includes two layers of epoxy resin unit coatings 30, one of the two epoxy resin unit coatings 30 is an antistatic layer close to the release layer 2, and the thickness of the epoxy resin unit coating 30 close to the substrate layer 1 is greater than the thickness of the other epoxy resin unit coating 30. The thickness of one epoxy resin unit coating 30 is 0.4 μm, and the thickness of the other epoxy resin unit coating 30 is 0.3 μm.

[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A high-flatness release film, comprising: A substrate layer having a first surface and a second surface opposite to each other in a film thickness direction; A release layer, disposed on the first surface; It is characterized in that At least one layer of epoxy resin coating is arranged between the substrate layer and the release layer.

2. The high-flatness release film according to claim 1, characterized in that: The epoxy resin coating and / or release layer is an antistatic layer.

3. The high-flatness release film according to claim 1, characterized in that: The epoxy resin coating comprises two layers of epoxy resin unit coatings, and one of the two layers of epoxy resin unit coatings is an antistatic layer close to the release layer.

4. The high-flatness release film according to claim 3, characterized in that: The thickness of the epoxy resin unit coating layer close to the substrate layer is greater than or equal to the thickness of another epoxy resin unit coating layer.

5. The high-flatness release film according to claim 1, characterized in that: The second surface of the substrate layer is provided with a polyurethane coating.

6. The high-flatness release film according to claim 5, characterized in that: The polyurethane coating is an antistatic layer.

7. The high-flatness release film according to claim 5, characterized in that: The release layer has a thickness of 0.1 to 0.3 μm, the epoxy resin coating has a thickness of 0.4 to 0.8 μm, and the polyurethane coating has a thickness of 1 to 5 μm.

8. The high-flatness release film according to claim 1, characterized in that: The substrate layer is a high temperature resistant PET substrate layer.

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