Supporting block fixing structure of semiconductor cavity

Abstract

The utility model discloses a supporting block fixing structure of a semiconductor chamber, which comprises a chamber body, a supporting block and a supporting block, and is characterized in that the surface of the chamber body is provided with two vacuum grooves; the fixing assembly is located in the cavity body, and the fixing assembly is used for supporting and reinforcing a frame of the cavity body; the sealing assembly is fixedly connected with the bottom of the chamber body, and the sealing assembly is used for sealing when the chamber body works; and an exhaust pipe of the vacuum pump is communicated with the vacuum tank. According to the supporting block fixing structure of the semiconductor chamber, by means of the arrangement of the fixing assembly, the device adopts the central isolation plate to reliably support the top and the bottom of the inner wall of the chamber body, the strength of the inner wall of the semiconductor chamber is improved, meanwhile, the surface of the central isolation plate is fixed after a first clamping plate and a second clamping plate are embedded into a plug-in folded plate, and the stability of the semiconductor chamber is improved. And a worker can conveniently and quickly install the device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chambers, in particular to a supporting block fixing structure of a semiconductor chamber. Background Art

[0002] Physical vapor deposition technology refers to the technology of using physical methods under vacuum conditions to vaporize the surface of the material source (solid or liquid) into gaseous atoms or molecules, or partially ionize it into ions, and deposit a thin film with certain special functions on the surface of the substrate through a low-pressure gas (or plasma) process.

[0003] The patent with the announcement number CN218901179U discloses an inlet and outlet structure of a semiconductor chamber, including a chamber, a cooling mechanism, a filtering mechanism, and an air outlet. The chamber is provided with a cooling mechanism, a support block is fixedly connected to the chamber, a screw is threadedly connected to the support block, an inlet pipe is provided at the upper end of the chamber, an air flare is provided on the inlet pipe, and the air outlet is connected to the chamber. The patent designs a circulator, a water inlet pipe, a condenser, etc., and the condensate circulates in the condenser through the circulator, thereby cooling the gas in the gas. By designing a sealing sleeve, a filter net, and a positioning groove, the gas in the chamber can filter the particulate matter in the gas when it passes through, thereby cleaning the gas.

[0004] As shown in the above technology, after the sputtering process starts in actual production, the vacuum pump continuously removes the air inside the semiconductor chamber until a vacuum is formed inside the semiconductor chamber, and then injects a small amount of argon gas into the semiconductor chamber to form a low-pressure argon gas environment. The low-pressure environment may cause the chamber to collapse slightly. The magnet array in the sputtering target will generate a lot of heat during operation, and thermal expansion and contraction may also cause slight deformation of the semiconductor chamber, thereby affecting the vacuum environment. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a support block fixing structure for a semiconductor chamber, which solves the problem that a vacuum pump continuously removes air from the inside of the semiconductor chamber until a vacuum is formed inside the semiconductor chamber, and then injects a small amount of argon gas into the inside of the semiconductor chamber to form a low-pressure argon gas environment. The low-pressure environment may cause the chamber to undergo a micro-collapse deformation, and the magnet array in the sputtering target will generate a large amount of heat during operation. Thermal expansion and contraction may also cause a slight deformation of the semiconductor chamber, thereby affecting the vacuum environment.

[0006] To achieve the above objectives, the utility model is implemented through the following technical solutions: A support block fixing structure of a semiconductor chamber, comprising:

[0007] A chamber body, wherein two vacuum grooves are provided on the surface of the chamber body;

[0008] A fixing assembly, the fixing assembly is located inside the chamber body and is used to support and strengthen the frame of the chamber body;

[0009] A sealing assembly, wherein the sealing assembly is fixedly connected to the bottom of the chamber body and is used for sealing the chamber body when it is working;

[0010] A vacuum pump, wherein an exhaust pipe of the vacuum pump is connected to the vacuum tank, and one side of the bottom of the vacuum pump is fixedly connected to one side of the back side of the chamber body through a bracket.

[0011] Preferably, the fixing assembly includes corner bracket plates fixedly connected to the four corners of the inner wall of the chamber body, the top and bottom of the inner wall of the chamber body are fixedly connected to the first clamping plate and the second clamping plate, the surfaces of the first clamping plate and the second clamping plate are penetrated by screw rods, and the inner walls of the first clamping plate and the second clamping plate are movably connected with a connecting folding plate.

[0012] Preferably, one side of the connecting folding plate is fixedly connected to a central isolation plate, and both sides of the surface of the central isolation plate are fixedly connected to sealing strips.

[0013] Preferably, a reinforcement ring is fixedly connected to the inner wall of the vacuum groove, and a cross plate is fixedly connected to the inner wall of the reinforcement ring.

[0014] Preferably, the sealing assembly comprises an auxiliary plate fixedly connected to the bottom of the chamber body, and a telescopic rod is fixedly connected to one side of the auxiliary plate.

[0015] Preferably, one end of the telescopic rod is fixedly connected to a connecting plate, one side of the connecting plate is fixedly connected to a sealing cover, and one side of the sealing cover is fixedly connected to a sealing gasket.

[0016] Beneficial Effects

[0017] The utility model provides a support block fixing structure for a semiconductor chamber. Compared with the prior art, the utility model has the following beneficial effects:

[0018] (1) The support block fixing structure of the semiconductor chamber utilizes the setting of the fixing assembly. The device uses a central isolation plate to reliably support the top and bottom of the inner wall of the chamber body, thereby improving the inner wall strength of the semiconductor chamber. At the same time, the surface of the central isolation plate is fixed after being embedded with the first clamping plate and the second clamping plate using a plug-in folding plate, which is convenient for the staff to quickly install it. The inner surface of the vacuum groove is effectively supported by the reinforcement ring and the cross plate, which further helps to improve the stability of the chamber. By utilizing the setting of the corner bracket plate, the four corners of the chamber are stably supported, and the device can operate stably.

[0019] (2) The support block fixing structure of the semiconductor chamber utilizes the setting of the sealing component. The device uses a telescopic rod as a power source to move the sealing cover and the sealing gasket, and controls the sealing cover and the sealing gasket to seal the surface of the chamber body. The sealed cavity can effectively ensure the vacuum level, and the sealing gasket can support the inner wall of the chamber body, further improving the strength of use. The two independently arranged telescopic rods can ensure that at least one side of the semiconductor chamber is in a reliable working state. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0021] Figure 2 It is a cross-sectional view of the fixing assembly structure of the utility model;

[0022] Figure 3 For this utility model Figure 2 A partial enlarged view of the middle A;

[0023] Figure 4 It is a three-dimensional schematic diagram of the sealing strip structure of the utility model;

[0024] Figure 5 It is a three-dimensional schematic diagram of the sealing component structure of the utility model.

[0025] In the figure: 1. Chamber body; 2. Vacuum groove; 3. Fixing assembly; 31. Corner bracket plate; 32. First clamping plate; 33. Second clamping plate; 34. Screw rod; 35. Connecting folding plate; 36. Central isolation plate; 37. Sealing strip; 38. Reinforcement ring; 39. Cross plate; 4. Sealing assembly; 41. Auxiliary plate; 42. Telescopic rod; 43. Connecting plate; 44. Sealing cover; 45. Sealing gasket; 5. Vacuum pump. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-Figure 5 , the utility model provides two technical solutions:

[0028] Embodiment 1, a support block fixing structure of a semiconductor chamber, comprising:

[0029] A chamber body 1, wherein two vacuum grooves 2 are provided on the surface of the chamber body 1;

[0030] A fixing assembly 3, which is located inside the chamber body 1 and is used to support and strengthen the frame of the chamber body 1;

[0031] A sealing component 4, which is fixedly connected to the bottom of the chamber body 1 and is used for sealing the chamber body 1 when it is working;

[0032] The vacuum pump 5, the exhaust pipe of the vacuum pump 5 is connected to the vacuum tank 2, and one side of the bottom of the vacuum pump 5 is fixedly connected to one side of the back of the chamber body 1 through a bracket. By using the setting of the fixing component 3, the device uses a central isolation plate 36 to reliably support the top and bottom of the inner wall of the chamber body 1, thereby improving the inner wall strength of the semiconductor chamber. At the same time, the surface of the central isolation plate 36 is fixed after being embedded with the first clamping plate 32 and the second clamping plate 33 using a plug-in folding plate 35, so that the staff can install it quickly. The inner surface of the vacuum tank 2 is effectively supported by a reinforcing ring 38 and a cross plate 39, thereby further helping to improve the stability of the chamber. By using the setting of the corner bracket plate 31, the four corners of the chamber are stably supported, and the device can operate stably.

[0033] Embodiment 2 is mainly different from Embodiment 1 in that: a support block fixing structure of a semiconductor chamber, a fixing assembly 3 includes corner bracket plates 31 fixedly connected to the four corners of the inner wall of the chamber body 1, a first clamping plate 32 and a second clamping plate 33 fixedly connected to the top and bottom of the inner wall of the chamber body 1, a screw rod 34 penetrates the surface of the first clamping plate 32 and the second clamping plate 33, a plug-in folding plate 35 is movably connected to the inner wall of the first clamping plate 32 and the second clamping plate 33, a central isolation plate 36 is fixedly connected to one side of the plug-in folding plate 35, and sealing strips 37 are fixedly connected to both sides of the surface of the central isolation plate 36, a reinforcing ring 38 is fixedly connected to the inner wall of the vacuum groove 2, and a cross plate 39 is fixedly connected to the inner wall of the reinforcing ring 38, and a sealing assembly 4 It includes an auxiliary plate 41 fixedly connected to the bottom of the chamber body 1, a telescopic rod 42 is fixedly connected to one side of the auxiliary plate 41, one end of the telescopic rod 42 is fixedly connected to a connecting plate 43, one side of the connecting plate 43 is fixedly connected to a sealing cover 44, one side of the sealing cover 44 is fixedly connected to a sealing gasket 45, and by utilizing the setting of the sealing assembly 4, the device uses the telescopic rod 42 as a power source to move the sealing cover 44 and the sealing gasket 45, and controls the sealing cover 44 and the sealing gasket 45 to seal the surface of the chamber body 1, the sealed cavity can effectively ensure the vacuum degree, the sealing gasket 45 can support the inner wall of the chamber body 1, and further improve the use strength, and the two independently arranged telescopic rods 42 can ensure that at least one side of the semiconductor chamber is in a reliable working state.

[0034] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0035] During installation, align the connecting folding plate 35 on the surface of the central isolation plate 36 with the first clamping plate 32 and the second clamping plate 33 and insert the central isolation plate 36 stably into the interior of the chamber body 1, then rotate the screw rod 34, the cross plate 39 in the reinforcing ring 38 effectively supports the inner wall of the vacuum groove 2, and the corner bracket plate 31 supports the chamber. When preparing for operation, turn on the vacuum pump 5, retract the telescopic rod 42, and drive the sealing gasket 45 to seal the device through the sealing cover 44. After the vacuuming is completed, start the subsequent normal operation.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A support block fixing structure for a semiconductor chamber, characterized in that: include: A chamber body (1), wherein two vacuum grooves (2) are provided on the surface of the chamber body (1); A fixing component (3), the fixing component (3) being located inside the chamber body (1), and the fixing component (3) being used to support and strengthen the frame of the chamber body (1); A sealing component (4), the sealing component (4) being fixedly connected to the bottom of the chamber body (1), and the sealing component (4) being used for sealing the chamber body (1) when it is working; A vacuum pump (5), wherein the vacuum pump (5) has an exhaust pipe connected to the vacuum tank (2), and one side of the bottom of the vacuum pump (5) is fixedly connected to one side of the back side of the chamber body (1) via a bracket.

2. The support block fixing structure of a semiconductor chamber according to claim 1, characterized in that: The fixing assembly (3) includes corner bracket plates (31) fixedly connected to the four corners of the inner wall of the chamber body (1), the top and bottom of the inner wall of the chamber body (1) are fixedly connected to the first clamping plate (32) and the second clamping plate (33), the surfaces of the first clamping plate (32) and the second clamping plate (33) are penetrated by screw rods (34), and the inner walls of the first clamping plate (32) and the second clamping plate (33) are movably connected with a plug-in folding plate (35).

3. The support block fixing structure of a semiconductor chamber according to claim 2, characterized in that: One side of the plug-in folding plate (35) is fixedly connected to a central isolation plate (36), and both sides of the surface of the central isolation plate (36) are fixedly connected to sealing strips (37).

4. The support block fixing structure of a semiconductor chamber according to claim 1, characterized in that: A reinforcement ring (38) is fixedly connected to the inner wall of the vacuum groove (2), and a cross plate (39) is fixedly connected to the inner wall of the reinforcement ring (38).

5. The support block fixing structure of a semiconductor chamber according to claim 1, characterized in that: The sealing assembly (4) comprises an auxiliary plate (41) fixedly connected to the bottom of the chamber body (1), and a telescopic rod (42) is fixedly connected to one side of the auxiliary plate (41).

6. The support block fixing structure of a semiconductor chamber according to claim 5, characterized in that: One end of the telescopic rod (42) is fixedly connected to a connecting plate (43), one side of the connecting plate (43) is fixedly connected to a sealing cover (44), and one side of the sealing cover (44) is fixedly connected to a sealing pad (45).

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