Ball mounting device and ball mounting equipment

Abstract

The utility model relates to the technical field of chip manufacturing, and discloses a ball mounting device and ball mounting equipment. The ball mounting device comprises an upper tool, a lower tool and an adjusting component, an accommodating cavity is formed in one side of the upper tool; a steel sheet is mounted in the accommodating cavity, and a mounting hole is formed in the side wall of the accommodating cavity; the lower tool is provided with a boss detachably connected with the accommodating cavity, and the boss is used for mounting a chip to be subjected to ball mounting; the adjusting part is arranged in the mounting hole, and the first end of the adjusting part is used for being in rolling fit with the side face of the boss. According to the utility model, through the design of the adjusting part, sliding friction between the side wall of the boss and the side wall of the accommodating cavity can be converted into rolling friction between the boss and the adjusting part, so that the resistance of nesting and separation of the upper tool and the lower tool is reduced, and the smoothness of nesting and separation of the upper tool and the lower tool of the ball mounting device is improved; the problem that in the prior art, an upper tool and a lower tool of a ball mounting device are not smoothly disengaged and nested is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a ball planting device and ball planting equipment. Background Art

[0002] Ball grid array package (hereinafter referred to as BGA) is a polar device with the common characteristic of non-ductility, that is, the solder ball cannot be stretched like a long-legged device, so the physical properties of BGA devices do not have material rigidity. All surface solder connection points, PCB substrates and BGA packages may cause solder joints to break under thermal stress or mechanical stress. Only when the BGA pads and PCB pads are connected as accurately as possible can the impact of thermal stress or mechanical stress on the solder joints be reduced. Therefore, under the condition of certain physical and chemical properties, the accuracy of BGA ball planting becomes a key factor in reducing stress and whether an electrical circuit can be formed.

[0003] The process of soldering tin balls on the chip to be processed is called ball planting, and the tooling used for ball planting is called a ball planting device. The ball planting device is also called a BGA ball planting table, IC ball planting table, universal ball planting table, BGA bead planting table, IC bead planting table, universal bead planting table, etc. The ball planting device is affected by machining accuracy and assembly errors as well as human operating experience. When planting thin and fine-pitch BGA (low-profile Fine-pitch Ball Grid Array, LFBGA) type chips, a higher alignment accuracy is often required. However, high alignment accuracy often leads to the upper and lower tooling of the ball planting device being unsmooth in separation and nesting. At the same time, thin BGAs are easily stuck during ball planting. BGAs are polar devices, and manual labor may often cause fatigue. Ignoring the consistent direction during operation leads to rework, which in turn affects the ball planting yield. Therefore, how to improve the smoothness of separation and nesting between the upper and lower tooling of the ball planting device is an issue that the industry urgently needs to solve. Utility Model Content

[0004] The utility model provides a ball planting device and ball planting equipment, which are used to solve the problem of unsmooth separation and nesting of an upper tooling and a lower tooling of the ball planting device existing in the prior art.

[0005] The utility model provides a ball planting device, comprising:

[0006] An upper tooling, wherein a receiving cavity is formed on one side of the upper tooling; a steel sheet is installed inside the receiving cavity, and a mounting hole is provided on a side wall of the receiving cavity;

[0007] The lower tooling is provided with a boss detachably connected to the accommodating cavity, and the boss is used to mount the chip to be implanted;

[0008] An adjusting component is arranged in the mounting hole, and a first end of the adjusting component is used for rolling cooperation with the side surface of the boss.

[0009] According to the ball planting device provided by the utility model, at least two mounting holes are arranged at intervals on the same side wall of the accommodating cavity, and the adjusting components are arranged in a one-to-one correspondence with the mounting holes.

[0010] According to the ball planting device provided by the utility model, the adjustment component includes a Kimi screw, and the ball of the Kimi screw is rollingly matched with the side surface of the boss.

[0011] According to the ball planting device provided by the utility model, the steel sheet is provided with an adjustment hole; the upper tooling comprises:

[0012] upper frame;

[0013] A lower frame body is stacked on the bottom of the upper frame body, the lower frame body cooperates with the upper frame body to enclose the accommodating cavity, and the mounting hole is located in the lower frame body;

[0014] The connecting member is located in the adjusting hole, and two ends of the connecting member are respectively connected to the upper frame and the lower frame in a one-to-one correspondence.

[0015] According to the ball planting device provided by the utility model, the diameter of the adjustment hole is larger than the diameter of the connecting piece.

[0016] According to the ball planting device provided by the utility model, the adjusting component includes:

[0017] A ball assembly, disposed at the opening of the mounting hole, for rolling cooperation with the boss;

[0018] A first elastic component is installed in the installation hole and is located on the other side of the ball assembly away from the boss, and a first end of the first elastic component is in contact with the ball assembly;

[0019] A top screw is abutted against the second end of the first elastic component, and the top screw is threadedly matched with the mounting hole.

[0020] According to the ball implanting device provided by the utility model, the upper surface of the boss is formed with a mounting portion for placing the chip to be implanted, and at least two guide grooves; the guide grooves are evenly spaced around the circumference of the mounting portion; the lower tooling also includes:

[0021] At least two slider assemblies are arranged in the guide groove in a one-to-one correspondence and slidably cooperate with the guide groove; one end of the slider assembly facing the mounting portion abuts against the side edge of the chip to be implanted;

[0022] A second elastic component is abutted against a side wall of the guide groove away from the mounting portion and an end of the slider component away from the mounting portion;

[0023] The fastening assembly is used to fix the slider assembly not connected to the second elastic assembly to the guide groove.

[0024] According to the ball planting device provided by the utility model, the number of the second elastic components is at least two, and two adjacent sliding block components are in contact with the second elastic components.

[0025] According to the ball planting device provided by the utility model, the boss is formed with a first cut angle, and the side wall of the accommodating cavity corresponding to the first cut angle is formed with a second cut angle.

[0026] The utility model also provides a ball planting device, comprising a feeding device and any one of the ball planting devices described above; the feeding device is used to provide solder paste or flux paste to the ball planting device.

[0027] The utility model provides a ball planting device and a ball planting equipment. By setting a mounting hole on the side wall of the accommodating cavity of the lower tooling, by installing an adjusting component in the mounting hole, and the first end of the adjusting component can be used for rolling cooperation with the side of the boss, so that in the process of nesting and disengaging the upper tooling and the lower tooling, the side of the boss and the first end of the adjusting component are rolling cooperation, so that there is rolling friction between the boss and the adjusting component. Compared with the sliding friction between the boss and the side wall of the accommodating cavity in the process of nesting and disengaging the upper tooling and the lower tooling in the prior art, the sliding friction between the side wall of the boss and the side wall of the accommodating cavity can be converted into rolling friction between the boss and the adjusting component through the design of the adjusting component, thereby reducing the resistance of the upper tooling and the lower tooling to nesting and disengaging, improving the smoothness of the upper tooling and the lower tooling of the ball planting device, and solving the problem of the unsmooth nesting and disengaging of the upper tooling and the lower tooling of the ball planting device in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 It is a structural schematic diagram of the lower tooling of the ball planting device provided by the utility model;

[0030] Figure 2 It is a structural schematic diagram of the lower frame of the upper tooling of the ball planting device provided by the utility model;

[0031] Figure 3 It is a structural schematic diagram of an upper frame of an upper tooling of a ball planting device provided by the utility model;

[0032] Figure 4 The utility model is a schematic diagram of the structure of the steel sheet of the ball planting device.

[0033] Reference numerals:

[0034] 20. Chips to be implanted;

[0035] 110, upper frame; 120, lower frame; 130, second cut corner;

[0036] 200, lower tooling; 210, boss; 220, slider assembly; 230, second elastic assembly; 240, fastening assembly; 250, base; 211, mounting portion; 212, guide groove; 213, first cut angle;

[0037] 300, adjustment components;

[0038] 400, steel sheet; 410, mesh area; 420, adjustment hole. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0041] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0042] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0044] There are two main existing solutions for manual ball placement. Solution 1 is to process a tool with higher precision; Solution 2 is to use positioning pins to improve the positioning accuracy of the upper and lower tooling. For Solution 1, the tooling required for processing has strict requirements on the machine tool. No matter how high the precision of the machined tooling is, there will be errors. In addition, when solving the positioning accuracy, the problem of the upper and lower tooling not being able to separate smoothly arises. It is not easy to find a balance between the positioning accuracy and the tooling separation. For Solution 2, due to the same machining errors and assembly errors, when solving the positioning accuracy, the problem of the upper and lower tooling not being able to separate smoothly arises. At the same time, both solutions may have different results due to different levels of experience of the operators, but the poor repeatability accuracy of the personnel is an inherent characteristic that is not subject to human will, which leads to the inability to ensure the yield of BGA ball placement in a continuous and stable manner.

[0045] In order to solve the problem of the upper and lower tooling of the ball planting device existing in the prior art not being able to separate and nest smoothly, the utility model provides a ball planting device. Figures 1 to 4 The ball planting device provided by the utility model is described in detail. Figure 1 This is a schematic diagram of the structure of the lower tooling of the ball planting device provided by the utility model Figure 2 It is a structural schematic diagram of the lower frame of the upper tooling of the ball planting device provided by the utility model; Figure 3 It is a structural schematic diagram of an upper frame of an upper tooling of a ball planting device provided by the utility model; Figure 4 The utility model is a schematic diagram of the structure of the steel sheet of the ball planting device.

[0046] like Figures 1 to 4 As shown, in a specific embodiment of the first aspect of the utility model, a ball implanting device is provided. The ball implanting device comprises an upper tool, a lower tool 200 and an adjusting component 300; a receiving cavity is formed on one side of the upper tool; a steel sheet 400 is installed inside the receiving cavity, and a mounting hole is provided on the side wall of the receiving cavity; the lower tool 200 is provided with a boss 210 detachably connected to the receiving cavity, and the boss 210 is used to install the chip 20 to be implanted; the adjusting component 300 is provided in the mounting hole, and the first end of the adjusting component 300 is used to roll with the side of the boss 210.

[0047] In a specific embodiment of the utility model, a mounting hole is provided on the side wall of the accommodating cavity of the lower tooling 200, and an adjusting component 300 is installed in the mounting hole, and the first end of the adjusting component 300 can be used to roll with the side of the boss 210. Therefore, during the nesting and disengagement of the upper tooling and the lower tooling 200, the side of the boss 210 rolls with the first end of the adjusting component 300, so that rolling friction exists between the boss 210 and the adjusting component 300. Compared with the prior art in which there is sliding friction between the boss 210 and the side wall of the accommodating cavity during the nesting and disengagement of the upper and lower tooling 200, the utility model can transform the sliding friction between the side wall of the boss 210 and the side wall of the accommodating cavity into rolling friction between the boss 210 and the adjusting component 300 through the design of the adjusting component 300, thereby reducing the resistance during the nesting and disengagement of the upper and lower tooling 200, improving the smoothness of the nesting and disengagement of the upper and lower tooling 200 of the ball planting device, and solving the problem of the poor nesting and disengagement of the upper and lower tooling 200 of the ball planting device in the prior art.

[0048] Because the design of the adjustment component 300 can reduce the resistance to the separation of the upper tooling and the lower tooling 200, the risk of the lower tooling 200 shaking can be reduced, thereby improving the ball implantation yield.

[0049] Because the first end of the adjusting component 300 abuts against the side of the boss 210, the first end of the adjusting component 300 cooperates with the other side wall of the accommodating cavity opposite to the mounting hole to fine-tune the vertical distance between the steel sheet 400 and the chip 20 to be implanted, so that only one solder ball can be implanted on the solder pad of the chip 20 to be implanted.

[0050] Because the first end of the adjusting component 300 abuts against the side surface of the boss 210 , the assembly error between the upper tooling and the lower tooling 200 can be reduced, so that the upper tooling and the lower tooling 200 can implant the chip 20 without fine processing.

[0051] like Figure 4 As shown, it can be understood that mesh holes are provided in the mesh area 410 of the steel sheet 400. When the accommodating cavity of the upper tooling is nested on the boss 210 of the lower tooling 200, the mesh holes are located above the chip 20 to be implanted, and the mesh holes correspond to the pads of the chip 20 to be implanted, so that the ball can be implanted to the pads through the mesh holes.

[0052] It can be understood that the chip 20 to be ball-implanted includes a BGA chip.

[0053] like Figure 2 As shown, in a specific embodiment of the utility model, at least two mounting holes are arranged at intervals on the same side wall of the accommodating cavity, and the mounting holes are arranged one by one with adjustment components 300. The two mounting holes are arranged at intervals, which is equivalent to the first ends of the two adjustment components 300 being arranged at intervals, and the first ends of the two adjustment components 300 arranged at intervals form a line (two points determine a line), so the smoothness of the nesting and separation of the upper tooling and the lower tooling 200 can be further improved.

[0054] In a specific embodiment of the utility model, the adjustment component 300 includes a Kimi screw, and the ball of the Kimi screw rolls with the side of the boss 210. The Kimi screw is a standard part, so that the ball of the Kimi screw rolls with the side of the boss 210, avoiding the development and design of new parts, reducing the cost of the ball planting device, and being easy to install and use.

[0055] The operator can adjust the base screws according to his own situation to make the upper and lower tooling 200 reach a suitable degree of separation and smooth nesting. When the same operator subsequently uses the ball planting device of the utility model to plant the ball chip 20, there is no need to adjust the base screws, which facilitates the separation of the upper and lower tooling and ensures the repeatable accuracy of fixed nesting.

[0056] It can be understood that the appropriate degree of separation includes that during the process of separating the upper tooling from the lower tooling 200 , the lower tooling 200 does not vibrate, which can improve the ball implantation yield.

[0057] Furthermore, the lateral positioning of the Kimi screws can also solve the problem of large ball placement errors caused by the accumulation of assembly errors and machining errors between the upper and lower tooling 200. The ball placement yield effect on thin, small, and dense pitch LFBGA types is more obvious than that of other solutions.

[0058] Furthermore, after the same operator has adjusted the Kimi screw, there is no need to repeat the adjustment when using the ball planting device later, which ensures the repeatable accuracy of the 200 nesting of the upper and lower tooling and solves the problem of unstable operation of the operator.

[0059] Furthermore, the ball implanting device of the present invention can be used for implanting balls of various BGA chips with a pitch of 0.4 and a pitch of 0.4 to 0.5.

[0060] like Figure 2 , Figure 3 and Figure 4 As shown, in a specific embodiment of the utility model, the steel sheet 400 is provided with an adjustment hole 420; the upper tooling includes an upper frame 110, a lower frame 120 and a connecting piece; the lower frame 120 is stacked on the bottom of the upper frame 110, the lower frame 120 cooperates with the upper frame 110 to form a receiving cavity, and the mounting hole is located in the lower frame 120; the connecting piece is located in the adjustment hole 420, and the two ends of the connecting piece are respectively connected to the upper frame 110 and the lower frame 120 in a one-to-one correspondence. The steel sheet 400 is sandwiched between the upper frame 110 and the lower frame 120, which can facilitate the replacement of the steel sheet 400, and is convenient for disassembly, maintenance and restoration.

[0061] In a specific embodiment of the present invention, the aperture of the adjustment hole 420 is larger than the diameter of the connecting piece, and the position of the steel sheet 400 relative to the upper tooling can be adjusted so that when the upper tooling is nested on the lower tooling 200, the mesh of the steel sheet 400 always corresponds to the pads of the chip to be implanted 20. In addition, it is convenient to adjust the alignment of the steel sheet 400 and the chip to be implanted 20 on the boss 210, and it is convenient to disassemble, maintain and restore.

[0062] When the upper tooling is nested on the lower tooling 200, if the mesh holes are not aligned with the pads of the chip 20 to be implanted, the screws for fastening the upper tooling and the lower tooling 200 are loosened, and the position of the steel sheet 400 is adjusted to align the mesh holes with the pads of the chip 20 to be implanted, and then the screws are tightened. Finally, fingerprints left on the steel sheet 400 by manual operation are cleaned with alcohol to ensure that the steel sheet 400 is clean and dry.

[0063] Because of the design of the base screw and the fact that the diameter of the adjustment hole 420 is larger than the diameter of the connecting piece, the ball planting device of this embodiment can be produced by a rough processing machine; and the experience requirement for the operator applying the ball planting device of this embodiment is not high, and it can be put into production after simple training.

[0064] In some embodiments, the diameter of the adjustment hole 420 is 1 to 2 times larger than the diameter of the connector, so as to facilitate the adjustment of the alignment between the steel sheet 400 and the chip 20 to be implanted on the boss 210, and facilitate disassembly, maintenance and restoration.

[0065] In some embodiments, the connecting member includes a bolt and a nut; the bolt is threadedly connected to the upper frame 110 and the lower frame 120 and is fastened by the nut. Specifically, the bolt is sequentially inserted into the threaded hole of the upper frame 110, the adjustment hole 420 of the steel sheet 400, and the threaded hole of the lower frame 120, and then fastened with the nut. The upper frame 110, the steel sheet 400, and the lower frame 120 can be loosened by adjusting the nut, thereby adjusting the relative position of the steel sheet 400 relative to the upper tooling.

[0066] In some embodiments, the upper tooling and the lower tooling 200 are made of aluminum, which will not rust, thus facilitating the fastening effect of the device and maintaining a longer service life.

[0067] In a specific embodiment of the utility model, the adjustment component 300 includes a ball assembly, a first elastic assembly and a top screw; the ball assembly is arranged at the opening of the mounting hole, and is used for rolling cooperation with the boss 210; the first elastic assembly is installed in the mounting hole, and is located on the other side of the ball assembly away from the boss 210, and the first end of the first elastic assembly abuts against the ball assembly; the top screw abuts against the second end of the first elastic assembly, and the top screw is threadedly engaged with the mounting hole. The ball assembly realizes rolling cooperation with the side of the boss 210, which plays a role in reducing the friction between the boss 210 and the accommodating cavity. The top screw realizes the installation of the first elastic assembly in the mounting hole, and the first elastic assembly plays a role in reducing the ball placement error caused by the accumulation of tooling assembly errors and machining errors.

[0068] In some embodiments, the first elastic component includes a first spring; the first spring is arranged in a compressed state in the mounting hole, and the elastic deformation direction of the first spring is parallel to the axial direction of the mounting hole; the first end of the first spring abuts against the side of the ball away from the boss 210, and the second end abuts against the top screw. The elastic deformation of the first spring can be changed by adjusting the top screw, and the operator can adjust the first spring according to his own situation to make the upper tooling and the lower tooling 200 reach a suitable degree of separation and smooth nesting. When the same operator uses the ball planting device of this embodiment to plant the ball chip 20 in the future, there is no need to adjust the top screw, which facilitates the easy separation of the upper and lower tooling and ensures the repeatable accuracy of fixed nesting.

[0069] Furthermore, the lateral positioning of the first spring and the top screw can also solve the problem of large ball planting alignment errors caused by the accumulation of assembly errors and machining errors between the upper tooling and the lower tooling 200. The ball planting yield effect on thin, small, and dense pitch LFBGA types is more obvious than that of other solutions.

[0070] Furthermore, after the same operator has adjusted the top screw, there is no need to repeat the adjustment when using the ball planting device later, which ensures the repeatable accuracy of the nesting of the upper and lower tooling 200 and solves the problem of unstable operation of the operator.

[0071] like Figure 1 As shown, in a specific embodiment of the utility model, a mounting portion 211 for placing the chip 20 to be implanted is formed on the upper surface of the boss 210, and at least two guide grooves 212; the guide grooves 212 are evenly spaced around the circumference of the mounting portion 211; the lower tooling 200 also includes at least two slider assemblies 220, a second elastic assembly 230, and a fastening assembly 240; the slider assemblies 220 are arranged in the guide grooves 212 in a one-to-one correspondence, and slide in cooperation with the guide grooves 212; one end of the slider assembly 220 facing the mounting portion 211 abuts against the side edge of the chip 20 to be implanted; the second elastic assembly 230 abuts against the side wall of the guide groove 212 away from the mounting portion 211, and one end of the slider assembly 220 away from the mounting portion 211; the fastening assembly 240 is used to fix the slider assembly 220 that is not connected to the second elastic assembly 230 to the guide groove 212.

[0072] In a specific embodiment of the utility model, by adjusting the position of the slider assembly 220 in the guide groove 212, the slider assembly 220 can be adapted to BGA chips of various sizes and can cover all types of BGA chips. By arranging the second elastic component 230 on the side of the slider assembly 220, the friction force of the slider assembly 220 on the side of the chip 20 to be implanted can be increased, so as to avoid the chip BGA to be implanted being stuck by the steel sheet 400 during the process of the upper tooling detaching from the lower tooling 200, thereby preventing the implantation from failing, and solving the problem of chip sticking during the implantation operation in the prior art; in addition, the implantation device of this embodiment is more superior in the implantation process of thin, small, and dense pitch LFBGA types. The reason why the second elastic component 230 can increase the friction force between the chip 20 to be implanted and the slider assembly 220 is that the second elastic component 230 increases the pressure between the slider assembly 220 and the chip 20 to be implanted, so the friction force increases when the contact area remains unchanged. The fastening component 240 fixes the slider component 220 that is not connected to the second elastic component 230 to the guide groove 212 to position the chip 20 to be implanted, thereby preventing the chip 20 from moving during implantation and reducing the implantation yield.

[0073] In some embodiments, the mounting portion 211 is formed with a mounting groove, and the guide groove 212 is communicated with the mounting groove.

[0074] In some embodiments, the second elastic component 230 includes a second spring; the elastic deformation direction of the second spring is parallel to the axial direction of the guide groove 212. It is understandable that when the chip 20 to be implanted is clamped by the slider assembly, the second spring is in a compressed state, and the second spring increases the pressure of the slider assembly 220 on the side of the chip 20 to be implanted, thereby increasing the friction force, effectively solving the problem that the LFBGA is easily stuck by the steel sheet 400 during the implantation process.

[0075] In some embodiments, the number of second elastic components 230 is at least two, and two adjacent slider components 220 are in contact with the second elastic components 230. Under the premise of ensuring that the slider component 220 limits the chip 20 to be implanted, the friction between the slider component 220 and the chip 20 to be implanted can be increased from different directions of the chip 20 to further avoid the problem of LFBGA being stuck to the steel sheet 400.

[0076] In a specific embodiment of the utility model, the boss 210 is formed with a first cut angle 213, and the side wall of the accommodating cavity corresponding to the first cut angle 213 is formed with a second cut angle 130. The design of the first cut angle 213 and the second cut angle 130 enables the boss 210 to fit the accommodating cavity in a unique direction, thereby solving the problem that the existing ball implanting device is not fool-proof and preventing the operator from making mistakes in the polarity of the chip 20 to be implanted during the ball implanting process.

[0077] Specifically, the side wall of the lower chamber of the lower frame 120 is formed with a second cut corner 130, and the second cut corner 130 of the lower frame 120 corresponds to the first cut corner 213 of the boss 210, so as to prevent the lower frame 120 from being nested in the boss 210 in other directions, thereby achieving the purpose of foolproofing. The side wall of the upper chamber of the upper frame 110 is also formed with a second cut corner 130, and the second cut corner 130 of the upper frame 110 serves to remind the operator, so as to facilitate the correspondence between the second cut corner 130 of the lower frame 120 and the first cut corner 213 of the boss 210.

[0078] In a specific embodiment of the utility model, the problem of the upper and lower tooling of the ball planting device being not smoothly separated and nested in the prior art can be solved by providing an adjustment component 300. The problem of chip sticking during the ball planting operation in the prior art can be solved by providing the second elastic component 230 and the slider component 220. The design of the first cut angle 213 and the second cut angle 130 allows the boss 210 to be matched with the accommodating cavity in a unique direction, thereby solving the problem of the existing ball planting device being non-foolproof. At the same time, the ball planting device of this embodiment achieves the purpose of covering all types of BGA ball planting.

[0079] The specific embodiment of the second aspect of the utility model provides a ball planting device. The ball planting device includes a feeding device and a ball planting device of any embodiment; the feeding device is used to provide solder paste or flux paste to the ball planting device. When the upper tooling is nested in the lower tooling 200, the feeding device provides solder paste or flux paste to the steel sheet 400; the solder paste or flux paste can fall from the mesh downward to the pad of the chip 20 to be ball-planted corresponding to the mesh, and only one solder ball is located on the pad.

[0080] Because the ball implanting equipment includes the ball implanting device of any of the above embodiments, it has at least the above advantages.

[0081] Furthermore, the solder paste includes solder balls with a diameter ranging from 20 micrometers to 38 micrometers.

[0082] In a specific embodiment of the present invention, the ball implanting equipment further comprises a material unloading device; the material unloading device is used to transfer the chip with completed ball implantation, and automatically complete the chip ball implantation process.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A bulb planting device, characterized in that: include: An upper tooling, wherein a receiving cavity is formed on one side of the upper tooling; a steel sheet (400) is installed inside the receiving cavity, and a mounting hole is provided on a side wall of the receiving cavity; The lower tooling (200) is provided with a boss (210) detachably connected to the accommodating cavity, and the boss (210) is used to install the chip (20) to be implanted; An adjusting component (300) is arranged in the mounting hole, and a first end of the adjusting component (300) is used for rolling engagement with a side surface of the boss (210).

2. The ball implanting device according to claim 1, characterized in that: At least two mounting holes are arranged at intervals on the same side wall of the accommodating cavity, and the adjusting components (300) are arranged in a one-to-one correspondence with the mounting holes.

3. The ball implanting device according to claim 2, characterized in that: The adjustment component (300) comprises a Kimi screw, and a ball of the Kimi screw is in rolling engagement with a side surface of the boss (210).

4. The ball implanting device according to claim 1, characterized in that: The steel sheet (400) is provided with an adjustment hole (420); the upper tooling comprises: Upper frame(110); A lower frame (120) is stacked on the bottom of the upper frame (110), the lower frame (120) cooperates with the upper frame (110) to form the accommodating cavity, and the mounting hole is located in the lower frame (120); A connecting member is located in the adjusting hole (420), and two ends of the connecting member are respectively connected to the upper frame (110) and the lower frame (120) in a one-to-one correspondence.

5. The ball implanting device according to claim 4, characterized in that: The diameter of the adjustment hole (420) is larger than the diameter of the connecting piece.

6. The ball implanting device according to claim 2, characterized in that: The adjusting component (300) comprises: A ball assembly, arranged at the opening of the mounting hole, and used for rolling cooperation with the boss (210); A first elastic component is installed in the installation hole and is located on the other side of the ball assembly away from the boss (210), and a first end of the first elastic component is in contact with the ball assembly; A top screw is abutted against the second end of the first elastic component, and the top screw is threadedly matched with the mounting hole.

7. The ball implanting device according to any one of claims 1 to 6, characterized in that: The upper surface of the boss (210) is formed with a mounting portion (211) for placing the chip (20) to be implanted, and at least two guide grooves (212); the guide grooves (212) are evenly spaced around the circumference of the mounting portion (211); the lower tooling (200) further comprises: At least two slider assemblies (220) are arranged in the guide groove (212) in a one-to-one correspondence and are slidably matched with the guide groove (212); one end of the slider assembly (220) facing the mounting portion (211) abuts against the side edge of the chip (20) to be implanted; A second elastic component (230) is in contact with a side wall of the guide groove (212) away from the mounting portion (211), and an end of the slider component (220) away from the mounting portion (211); A fastening assembly (240) is used to fix the slider assembly (220) that is not connected to the second elastic assembly (230) to the guide groove (212).

8. The ball implanting device according to claim 7, characterized in that: The number of the second elastic components (230) is at least two, and two adjacent slider components (220) are in abutment with the second elastic components (230).

9. The ball implanting device according to claim 8, characterized in that: The boss (210) is formed with a first cut corner (213), and the side wall of the accommodating cavity corresponding to the first cut corner (213) is formed with a second cut corner (130).

10. A bulb implanting device, characterized in that: It comprises a feeding device and the ball planting device according to any one of claims 1 to 9; the feeding device is used to provide solder paste or flux paste to the ball planting device.

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