Soaking and washing device for semiconductor alkali etching

Abstract

The utility model discloses a soaking and washing device for semiconductor alkali etching, which relates to the technical field of semiconductor etching and comprises a box body, one side surface of the box body is provided with a transduction groove, the upper side of the transduction groove is provided with a second cylinder, the lower end of the second cylinder is provided with a transducer, the inner side surface of the transduction groove is provided with a reflection groove, and the reflection groove is provided with a reflection groove. A soaking and washing frame is arranged on the inner side of the box body, a limiting clamping groove is formed in the upper side face of the soaking and washing frame, a sliding rod is arranged on the upper portion of one side of the soaking and washing frame, and a first air cylinder is connected to the upper side face of the sliding rod. According to the soaking and washing device disclosed by the utility model, through the arrangement of the transduction groove, the second air cylinder, the energy converter and the reflecting groove, when the soaking and washing device is used, the energy converter is pushed into etching liquid in the box body by the second air cylinder, so that the etching liquid can vibrate at a high speed under the action of the energy converter; therefore, impurities in the groove after the semiconductor is etched can be removed by the liquid which vibrates at a high speed, and the etching quality of the semiconductor is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor etching, in particular to a foaming and washing device for semiconductor alkali etching. Background Art

[0002] During the production process of semiconductors, etching equipment is needed to etch the semiconductors so that the production quality of the semiconductors meets the requirements. During the processing of semiconductor alkaline etching, a special foaming device is needed to foam the semiconductors to ensure the production quality of the semiconductors.

[0003] When the existing semiconductor foam cleaning device is in use, the foam cleaning liquid and the semiconductor are naturally etched by immersion, and impurities after etching are easily attached to the grooves of the semiconductor after etching, affecting the etching quality. At the same time, when the existing semiconductor etching foam cleaning device is in use, the foam cleaning frame lacks an effective limiting and fixing device, so that the distance between the semiconductors being foamed in the foam cleaning frame cannot be effectively adjusted. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the existing defects and provide a foam washing device for semiconductor alkaline etching. By arranging the transducer slot, the second cylinder, the transducer and the reflection slot, when the foam washing device is in use, the second cylinder pushes the transducer into the etching liquid in the box body, so that the transducer can make the etching liquid vibrate at a high speed under the action of the transducer, and then the impurities in the groove after the semiconductor is etched can be removed by the high-speed vibrating liquid, thereby ensuring the etching quality of the semiconductor, and can effectively solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a semiconductor alkaline etching foaming device, comprising a box body, a transducer groove is arranged on one side of the box body, a No. 2 cylinder is arranged on the upper side of the transducer groove, a transducer is arranged at the lower end of the No. 2 cylinder, a reflection groove is arranged on the inner side of the transducer groove, a foaming rack is arranged on the inner side of the box body, a limiting slot is arranged on the upper side of the foaming rack, a sliding rod is arranged on the upper part of one side of the foaming rack, and the upper side of the sliding rod is connected to the No. 1 cylinder.

[0006] Furthermore, a support frame is provided on the lower side of the No. 1 cylinder, and a support leg is provided on the lower side of the box body.

[0007] Furthermore, a limiting column is arranged on the lower side of the soaking and washing rack, and the limiting column and the soaking and washing rack are an integrated structure.

[0008] Furthermore, the support frame is welded to the box body, and the output end of the No. 1 cylinder is connected to the sliding rod by bolts.

[0009] Furthermore, the output end of the No. 2 cylinder is connected to the transducer via bolts, and the No. 2 cylinder is connected to the box via bolts.

[0010] Furthermore, the supporting legs are welded to the box body, and the cross-section of the reflecting groove is semicircular.

[0011] Furthermore, the outer ring side of the lower part of the soaking and washing rack is a mesh structure.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model provides a transducer slot, a No. 2 air cylinder, a transducer and a reflective slot, so that when the bubble washing device is in use, the No. 2 air cylinder pushes the transducer into the etching liquid in the box, so that the transducer can make the etching liquid vibrate at a high speed under the action of the transducer, and then the impurities in the groove after the semiconductor is etched can be removed by the high-speed vibrating liquid, thereby ensuring the etching quality of the semiconductor;

[0014] 2. The utility model provides a soaking frame and a limiting card slot, so that the semiconductors to be etched inside the soaking frame can be fixed by the limiting card slot, and the distance between the semiconductors can be accurately adjusted to meet the use requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the top cross-sectional structure of the energy conversion slot in the utility model;

[0017] Figure 3 This is a schematic diagram of the main structure of the foam washing rack of the utility model;

[0018] Figure 4 For this utility model Figure 1 Schematic diagram of the enlarged structure at point A in the middle.

[0019] In the figure: 1. Box body; 2. Support frame; 3. Cylinder No. 1; 4. Sliding rod; 5. Cylinder No. 2; 6. Transducer; 7. Transducer slot; 8. Foaming and washing rack; 9. Reflection slot; 10. Limiting column; 11. Limiting slot; 12. Supporting leg. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-4 The present embodiment provides a technical solution: a semiconductor alkaline etching soaking device, comprising a box body 1, a transducer groove 7 is arranged on one side of the box body 1, a No. 2 cylinder 5 is arranged on the upper side of the transducer groove 7, a transducer 6 is arranged at the lower end of the No. 2 cylinder 5, a reflection groove 9 is arranged on the inner side of the transducer groove 7, a soaking frame 8 is arranged on the inner side of the box body 1, a limit slot 11 is arranged on the upper side of the soaking frame 8, a sliding rod 4 is arranged on the upper part of one side of the soaking frame 8, and the upper side of the sliding rod 4 is connected to the No. 1 cylinder 3.

[0022] like Figure 1-4 As shown, the No. 1 cylinder 3 can push the sliding rod 4 to move up and down, thereby driving the foaming rack 8 to move up and down, so that the semiconductor in the foaming rack 8 can enter or leave the etching solution, thereby adjusting and controlling the etching process, and the reflection groove 9 can reflect the high-frequency vibration wave generated by the balancer 6, so that the vibration wave is transmitted to the inside of the box 1, and then the semiconductor is etched, so that the impurities in the semiconductor etching groove can be effectively vibrated and cleaned, thereby improving the etching quality.

[0023] A support frame 2 is provided at the lower side of the No. 1 cylinder 3 , and a support leg 12 is provided at the lower side of the box body 1 .

[0024] like Figure 1 As shown, the support legs 12 can provide stable support for the box body 1, ensuring that the box body 1 is stably supported and fixed.

[0025] A limiting column 10 is arranged on the lower side of the soaking and washing frame 8, and the limiting column 10 and the soaking and washing frame 8 are an integrated structure.

[0026] like Figure 1 , 3 As shown in FIG. 4 , the limiting column 10 can limit the lower part of the soaking frame 8 to prevent the soaking frame 8 from contacting the inner bottom side of the box body 1 , thereby ensuring the immersion degree of the semiconductor inside the soaking frame 8 .

[0027] The support frame 2 is welded to the box body 1, and the output end of the No. 1 cylinder 3 is connected to the sliding rod 4 by bolts.

[0028] The output end of the No. 2 cylinder 5 is connected to the transducer 6 via bolts, and the No. 2 cylinder 5 is connected to the box body 1 via bolts.

[0029] The supporting legs 12 are welded to the box body 1, and the cross section of the reflecting groove 9 is a semicircle.

[0030] The outer ring side of the lower part of the foaming and washing frame 8 is a mesh structure.

[0031] The working principle of the semiconductor alkali etching soaking device provided by the utility model is as follows: Figure 1-Figure 4As shown, when the etched semiconductor is placed in the soaking rack 8, the semiconductor can be limited and fixed by the limiting slot 11 to ensure the spacing between the semiconductors. The etching liquid in the box 1 can etch the semiconductor. The No. 2 cylinder 5 can push the transducer 6 into the etching liquid. The transducer 6 can make the etching liquid inside the box 1 vibrate at a high speed, and then when etching the semiconductor, the impurities in the semiconductor etching groove can be cleaned out to ensure the etching quality of the semiconductor. After the etching is completed, the No. 1 cylinder 3 can drive the sliding rod 4 and the soaking rack 8 to move upward, so that the semiconductor in the soaking rack 8 is separated from the etching liquid, which makes it easier to replace the semiconductor.

[0032] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor alkali etching soaking device, comprising a housing (1), characterized in that: A transducer groove (7) is provided on one side of the box body (1), a No. 2 cylinder (5) is provided on the upper side of the transducer groove (7), a transducer (6) is provided at the lower end of the No. 2 cylinder (5), a reflection groove (9) is provided on the inner side of the transducer groove (7), a soaking and washing rack (8) is provided on the inner side of the box body (1), a limit slot (11) is provided on the upper side of the soaking and washing rack (8), a sliding rod (4) is provided on the upper part of one side of the soaking and washing rack (8), and the upper side of the sliding rod (4) is connected to the No. 1 cylinder (3).

2. The semiconductor alkali etching soaking device according to claim 1, characterized in that: A support frame (2) is provided on the lower side of the No. 1 cylinder (3), and a support leg (12) is provided on the lower side of the box body (1).

3. The semiconductor alkali etching soaking device according to claim 1, characterized in that: A limiting column (10) is arranged on the lower side of the foaming and washing frame (8), and the limiting column (10) and the foaming and washing frame (8) are an integral structure.

4. The semiconductor alkali etching soaking device according to claim 2, characterized in that: The support frame (2) is welded to the box body (1), and the output end of the No. 1 cylinder (3) is connected to the sliding rod (4) via bolts.

5. The semiconductor alkali etching soaking device according to claim 1, characterized in that: The output end of the No. 2 cylinder (5) is connected to the transducer (6) via bolts, and the No. 2 cylinder (5) is connected to the box (1) via bolts.

6. The semiconductor alkali etching soaking device according to claim 2, characterized in that: The supporting legs (12) are welded to the box body (1), and the cross section of the reflecting groove (9) is semicircular.

7. The semiconductor alkali etching soaking device according to claim 1, characterized in that: The outer ring side of the lower part of the soaking and washing frame (8) is a mesh structure.

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