Etching machine for chip processing

By adopting the design of automatic adjustment components and positioning components in the etching machine, the accuracy problems caused by manual adjustment are solved, and high-precision chip processing is achieved, ensuring the avoidance of processing errors and process stability.

CN222320220UActive Publication Date: 2025-01-07SNAIL DIGITAL (XIAN) TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421145877.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-24
Publication Date
2025-01-07
Estimated Expiration
2034-05-24

AI Technical Summary

Technical Problem

When faced with high-precision manufacturing, existing etching machines rely on manual adjustments to risk subtle deviations, resulting in processing errors and poor product quality.

Method used

An etching machine including adjustment components and positioning components is designed, through a mechanical structure driven by an electric telescopic rod and cylinder, automatically adjusting the position and angle of the chip to ensure a constant distance and angle between the machining tool or laser beam and the chip surface. .

Benefits of technology

High-precision chip processing is achieved, processing errors are avoided, process stability is enhanced, and high-precision manufacturing needs are met.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an etching machine for chip processing, and relates to the technical field of etching machines, in particular to an etching machine for chip processing, which comprises an etching machine, a processing table is arranged on the etching machine and is used for adjusting the position of a chip, the processing table comprises an adjusting assembly, a control assembly and a control assembly, comprising a base fixed in an etching machine workbench, three lower extending lugs distributed circumferentially are fixed to the outer wall of the base, two lower universal joints are fixed to the tops of the lower extending lugs, electric telescopic rods are installed on the lower universal joints, upper universal joints are installed at the output ends of the electric telescopic rods, and a pedestal is arranged above the base; after the chip is fixed on the base through the positioning assembly, telescopic adjustment is performed through the output end of each electric telescopic rod, so that the base is kept horizontal, it is ensured that the angle and distance between a machining tool or a laser beam and the surface of the chip are constant, and therefore machining errors caused by inclination are avoided, and the requirement for high-precision manufacturing is met.
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Description

Technical Field

[0001] The utility model relates to the technical field of etching machines, in particular to an etching machine used for chip processing. Background Art

[0002] The etcher is one of the key equipment used in chip processing. Its main function is to remove specific parts of the surface of semiconductor materials through physical or chemical methods to form the required circuit patterns and structures.

[0003] After checking the disclosure (announcement) number: CN219286339U, a semiconductor processing plasma etcher is disclosed. This technology discloses "a semiconductor processing plasma etcher, including an etcher body, wherein a processing chamber is arranged inside the etcher body, a fixing frame is fixedly connected to the bottom of the etcher body, first support rods are movably connected to both sides of the fixing frame, one end of each of the two first support plates is movably connected to the second support rod, a mounting plate is movably connected to the bottom of the second support rod, and a supporting foot is fixedly connected to the bottom of the mounting plate" and other technical solutions, which have "a supporting mechanism consisting of a fixing frame, a first support rod, a second support rod, a mounting plate, a supporting foot, a rotating shaft, a fixing cylinder and an adjusting rod is arranged at the bottom of the etcher body, so that the semiconductor processing plasma etcher can be stably placed on an uneven ground, and the adjusting rod can be turned to adjust the device during use, which is convenient to use and has a stable supporting effect" and other technical effects;

[0004] Although the above solution has solved the problem of poor support effect when facing uneven ground to a certain extent, its limitations are obvious when facing the extremely high precision requirements of etching machine processing. During the manufacturing process of the etcher, any slight deviation may have a significant impact on the quality of the product, and even cause the product to fail to meet the specifications. The current solution relies on manual adjustment of the entire etcher, which inevitably has the risk of slight deviations. This deviation may cause the movement trajectory of the tool or laser beam on the material surface to deviate from the preset path, thereby causing distortion or deformation of the etching pattern, seriously affecting the final processing effect and product quality. Utility Model Content

[0005] In view of the shortcomings of the prior art, the utility model provides an etcher for chip processing, which has the characteristics of automatically positioning the chip and adjusting the level, ensuring that the angle and distance between the processing tool or laser beam and the chip surface are constant, avoiding processing errors, and thus meeting the needs of high-precision manufacturing.

[0006] To achieve the above purpose, the utility model is implemented through the following technical solutions: an etcher for chip processing, including an etcher, wherein a processing table is provided on the etcher and used to adjust the position of the chip, and the processing table includes:

[0007] The adjustment component comprises a base fixed in the workbench of the etching machine, and three lower extension ears distributed in a circle are fixed on the outer wall of the base, two lower universal joints are fixed on the top of the lower extension ears, an electric telescopic rod is installed on the lower universal joint, and an upper universal joint is installed on the output end of the electric telescopic rod, a base is arranged above the base, and three upper extension ears distributed in a circle are fixed on the outer wall of the base, and the upper universal joint is installed at the bottom of the upper extension ear;

[0008] The positioning component is arranged on the adjusting component and is used for positioning the chip.

[0009] Preferably, the positioning assembly includes three circumferentially distributed slide grooves opened inside the base, and a positioning head is slidably installed inside the slide groove, and a positioning frame is fixed at the bottom of the positioning head, an inner cylinder is fixed at the center of the bottom of the base, and an outer cylinder is slidably installed on the inner cylinder, three circumferentially distributed side ears are fixed on the outer wall of the outer cylinder, and the upper and lower ends of the side ears are respectively pivotally connected with an upper connecting rod and a lower connecting rod, a cylinder is installed inside the inner cylinder, and the output end of the cylinder is connected to the lower end of the outer cylinder.

[0010] Preferably, the upper end of the upper connecting rod and the upper end of the lower connecting rod are both pivotally connected to the positioning frame, and the upper connecting rod and the lower connecting rod are parallel to each other.

[0011] Preferably, the processing table further comprises a groove formed at the upper end of the inner cylinder, and a bubble level installed inside the groove.

[0012] Preferably, the bubble level is located in the inner center of the base, and the top of the bubble level is flush with the top of the base.

[0013] Preferably, the three lower extending ears on the base and the three upper extending ears on the pedestal are staggered in position.

[0014] Beneficial Effects

[0015] The utility model provides an etching machine for chip processing. Compared with the prior art, it has the following beneficial effects:

[0016] (1) After the chip is fixed on the base by the positioning assembly, the output end of each electric telescopic rod is used to adjust the telescopic position so that the base remains horizontal, ensuring that the angle and distance between the processing tool or laser beam and the chip surface are constant, thereby avoiding processing errors caused by tilt and meeting the needs of high-precision manufacturing.

[0017] (2) After the chip is placed on the base, the output end of the cylinder drives the outer tube to move the side ears downward. The side ears drive the positioning head on the positioning frame to move toward the axis through the upper connecting rod and the lower connecting rod, thereby positioning the chip in between, ensuring that the position of the chip remains consistent during the etching process, thereby enhancing the stability of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the processing table in the utility model;

[0020] Figure 3 It is a structural schematic diagram of the positioning component in the utility model;

[0021] Figure 4 It is a schematic diagram of the internal structure of the inner cylinder in the utility model.

[0022] In the figure: 1, etcher; 2, processing table; 21, adjustment assembly; 211, base; 212, lower extension ear; 213, lower universal joint; 214, electric telescopic rod; 215, upper universal joint; 216, base; 217, upper extension ear; 22, positioning assembly; 221, slide; 222, positioning head; 223, positioning frame; 224, inner cylinder; 225, outer cylinder; 226, side ear; 227, upper connecting rod; 228, lower connecting rod; 229, cylinder; 23, groove; 24, bubble level. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-4 The utility model provides a technical solution of an etching machine for chip processing: an etching machine for chip processing, comprising an etching machine 1, a processing table 2 is arranged on the etching machine 1 and is used to adjust the position of the chip, and the processing table 2 comprises:

[0025] The adjustment assembly 21 comprises a base 211 fixed in the workbench of the etching machine 1, and three circumferentially distributed lower extension ears 212 are fixed to the outer wall of the base 211, two lower universal joints 213 are fixed to the top of the lower extension ears 212, an electric telescopic rod 214 is installed on the lower universal joint 213, and an upper universal joint 215 is installed at the output end of the electric telescopic rod 214, a base 216 is arranged above the base 211, and three circumferentially distributed upper extension ears 217 are fixed to the outer wall of the base 216, and the upper universal joint 215 is installed at the bottom of the upper extension ear 217;

[0026] The positioning component 22 is disposed on the adjusting component 21 and is used to position the chip.

[0027] In this embodiment, after the chip is fixed on the base 216 by the positioning assembly 22, the output end of each electric telescopic rod 214 is telescopically adjusted so that the base 216 remains horizontal, ensuring that the angle and distance between the processing tool or laser beam and the chip surface are constant, thereby avoiding processing errors caused by tilt, thereby meeting the needs of high-precision manufacturing.

[0028] Specifically, the positioning assembly 22 includes three circumferentially distributed slide grooves 221 opened inside the base 216, and a positioning head 222 is slidably installed inside the slide groove 221, and a positioning frame 223 is fixed to the bottom of the positioning head 222, an inner cylinder 224 is fixed at the bottom center of the base 216, and an outer cylinder 225 is slidably installed on the inner cylinder 224, three circumferentially distributed side ears 226 are fixed on the outer wall of the outer cylinder 225, and the upper and lower ends of the side ears 226 are respectively pivotally connected with an upper connecting rod 227 and a lower connecting rod 228, a cylinder 229 is installed inside the inner cylinder 224, and the output end of the cylinder 229 is connected to the lower end of the outer cylinder 225.

[0029] In this embodiment, after the chip is placed on the base 216, the output end of the cylinder 229 drives the outer cylinder 225 to drive the side ear 226 to move downward, and the side ear 226 drives the positioning head 222 on the positioning frame 223 to move toward the axis through the upper connecting rod 227 and the lower connecting rod 228, thereby positioning the chip in between, ensuring that the position of the chip remains consistent during the etching process, thereby enhancing the stability of the process.

[0030] Specifically, the upper end of the upper connecting rod 227 and the upper end of the lower connecting rod 228 are both pivotally connected to the positioning frame 223, and the upper connecting rod 227 and the lower connecting rod 228 are parallel to each other.

[0031] In this embodiment, the upper connecting rod 227 and the lower connecting rod 228 cooperate to drive the positioning frame 223 to move horizontally.

[0032] Specifically, the processing table 2 further includes a groove 23 formed at the upper end of the inner cylinder 224 , and a bubble level 24 installed inside the groove 23 .

[0033] Specifically, the bubble level 24 is located in the inner center of the base 216 , and the top of the bubble level 24 is flush with the top of the base 216 .

[0034] Specifically, the three lower extending ears 212 on the base 211 and the three upper extending ears 217 on the base 216 are staggered in position.

[0035] The working principle and use process of the utility model are as follows: first, after the chip is placed on the base 216, the output end of the cylinder 229 drives the outer cylinder 225 to drive the side ear 226 to move downward, and the side ear 226 drives the positioning head 222 on the positioning frame 223 to move toward the axis through the upper connecting rod 227 and the lower connecting rod 228, thereby positioning the chip therebetween; then, the output end of each electric telescopic rod 214 is telescopically adjusted to keep the base 216 horizontal, ensuring that the angle and distance between the processing tool or laser beam and the chip surface are constant; finally, the horizontally positioned chip is processed by the etcher 1.

[0036] The model of the electric telescopic rod is: LAF16-09, and the model of the cylinder is: DSNU-20-50-PPV-A. In order to adopt existing mature technology products, they will not be elaborated in detail here, and the electrical components appearing in this article are all connected to the external main controller and 220V AC power.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An etcher for chip processing, comprising an etcher (1), characterized in that: The etching machine (1) is provided with a processing table (2) for adjusting the position of the chip, and the processing table (2) comprises: The adjustment component (21) comprises a base (211) fixed on a workbench of an etching machine (1), and three circumferentially distributed lower extension ears (212) are fixed on the outer wall of the base (211), two lower universal joints (213) are fixed on the top of the lower extension ears (212), an electric telescopic rod (214) is installed on the lower universal joint (213), and an upper universal joint (215) is installed on the output end of the electric telescopic rod (214), a base (216) is arranged above the base (211), and three circumferentially distributed upper extension ears (217) are fixed on the outer wall of the base (216), and the upper universal joint (215) is installed at the bottom of the upper extension ear (217); The positioning component (22) is arranged on the adjusting component (21) and is used for positioning the chip.

2. An etching machine for chip processing according to claim 1, characterized in that: The positioning assembly (22) comprises three circumferentially distributed slide grooves (221) opened inside the base (216), and a positioning head (222) is slidably installed inside the slide groove (221), and a positioning frame (223) is fixed at the bottom of the positioning head (222), an inner cylinder (224) is fixed at the center of the bottom of the base (216), and an outer cylinder (225) is slidably installed on the inner cylinder (224), three circumferentially distributed side ears (226) are fixed on the outer wall of the outer cylinder (225), and the upper and lower ends of the side ears (226) are respectively pivotally connected to an upper connecting rod (227) and a lower connecting rod (228), and a cylinder (229) is installed inside the inner cylinder (224), and the output end of the cylinder (229) is connected to the lower end of the outer cylinder (225).

3. An etching machine for chip processing according to claim 2, characterized in that: The upper ends of the upper connecting rod (227) and the lower connecting rod (228) are both pivotally connected to the positioning frame (223), and the upper connecting rod (227) and the lower connecting rod (228) are parallel to each other.

4. The etching machine for chip processing according to claim 2, characterized in that: The processing table (2) further comprises a groove (23) formed at the upper end of the inner cylinder (224), and a bubble level (24) installed inside the groove (23).

5. The etching machine for chip processing according to claim 4, characterized in that: The bubble level (24) is located at the inner center of the base (216), and the top of the bubble level (24) is flush with the top of the base (216).

6. The etching machine for chip processing according to claim 1, characterized in that: The three lower extension ears (212) on the base (211) and the three upper extension ears (217) on the pedestal (216) are staggered in position.

Citation Information

Patent Citations

  • Semiconductor processing plasma etching machine

    CN219286339U