Ultrathin heat dissipation type power module
By directly connecting the heat dissipation components in the power module and using the design of the heat conductor and the flow tank, the problem of low heat dissipation efficiency of the power module in the prior art is solved, and more efficient heat dissipation and module lightness are achieved, which improves the improvement of Safety and reliability.
Patent Information
- Application Number
- CN202323537882.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-25
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2033-12-25
AI Technical Summary
The existing power modules are large in size and have more thermal resistance layers, resulting in low heat dissipation efficiency and affecting the working performance and safety of the module.
It adopts an ultra-thin heat dissipation power module design, in which the power module is directly connected to the heat dissipation component through a metal layer, and uses heat conductors and flow tanks to transfer heat and coolant medium, reducing thermal resistance layer and improving heat dissipation efficiency.
It greatly improves the heat dissipation effect and efficiency, realizes the lightness and thinness of the power module, reduces the volume and cost, and enhances the safety and reliability of the module.
Smart Images
Figure CN222320249U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power modules, in particular to an ultra-thin heat dissipation type power module. Background Art
[0002] As a key component of high-power converters, power modules tend to develop in high power and high integration. Due to their high-frequency conduction and opening and closing, power modules continuously generate a large amount of heat, which affects the performance of the device. At present, the failure of most power modules is related to the heat generated by themselves. If there is no effective heat dissipation method, the module temperature will quickly reach or even exceed the junction temperature (such as 150°C), seriously affecting the working performance, safety and reliability of the power module, and making the performance indicators such as the opening and closing speed, on-state voltage drop, current tail time, turn-off voltage spike and loss of the power module worse. Excessive temperature may even cause damage to the entire device and even the entire system module, posing a serious threat to the safety and reliability of the power module. Therefore, in order to ensure the safe and stable operation of the power module, the problem of power module heat dissipation must be solved.
[0003] The existing power module is to layout the power chip, power terminal and bonding wire on the DBC board, and then weld them to the heat dissipation substrate through solder to achieve the purpose of heat dissipation. The existing heat dissipation substrate usually mainly includes a pin-type heat dissipation substrate and a flat-bottom heat dissipation substrate. The pin-type heat dissipation substrate has a pin-fin structure, and the flat-bottom heat dissipation substrate is a common heat dissipation structure of power semiconductor modules in the traditional field. Its main function is to transfer the heat of the power module to the outside and provide mechanical support for the power module. However, whether it is a pin-type heat dissipation substrate or a flat-bottom heat dissipation substrate, the heat dissipation path is: power chip junction temperature → DBC substrate → heat dissipation substrate. When the above method is used for heat dissipation, there are more thermal resistance layers. Although the effect of combining liquid cooling is better, it still cannot meet the needs of high-power power modules. In addition, this power module is larger in size, and the space occupied needs to be increased, which is not conducive to the application of power modules on automotive electrodes, and the cost is also relatively high.
[0004] In the process of implementing the present utility model, the inventors found that there are at least the following problems in the prior art:
[0005] The existing power module is relatively large in size and has many thermal resistance layers, resulting in low heat dissipation efficiency of the power module. Utility Model Content
[0006] The purpose of the utility model is to provide an ultra-thin heat dissipation power module to solve the technical problem that the power module in the prior art is large in size and has many thermal resistance layers, resulting in low heat dissipation efficiency of the power module. The preferred technical solution among the many technical solutions provided by the utility model can produce many technical effects as described below.
[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0008] The utility model provides an ultra-thin heat dissipation power module, comprising: a power component and a heat dissipation component, wherein the power component is arranged on the heat dissipation component;
[0009] The power component includes a metal layer and a power element arranged above the metal layer, and the metal layer is arranged on the heat dissipation component.
[0010] Preferably, the heat dissipation assembly comprises a heat conducting member and a flow groove, and the heat conducting member is located between the metal layer and the flow groove;
[0011] The heat conducting member is used to receive the heat generated by the power component, and the flow groove is used to transport the cooling medium to carry away the heat received by the heat conducting member.
[0012] Preferably, the material of the heat conducting element is ceramic.
[0013] Preferably, the heat conducting member comprises a heat conducting plate and at least one convex ridge, the at least one convex ridge is evenly arranged on the heat conducting plate, and a channel for the cooling medium to flow is formed between two adjacent convex ridges;
[0014] The heat conducting plate and the convex ridge are an integral structure.
[0015] Preferably, the size of the flow groove matches the size of the heat conducting plate;
[0016] The height of the ridge is lower than the depth of the flow groove.
[0017] Preferably, the shape of the convex ridge is cylindrical, elliptical, S-shaped strip or elongated strip.
[0018] Preferably, at least one pair of input pipe openings and output pipe openings are provided on opposite sides of the flow groove, wherein the input pipe openings are used to input the cooling medium, and the output pipe openings are used to output the cooling medium;
[0019] The positions of the inlet and outlet pipe openings are parallel to the convex ridges.
[0020] Preferably, the metal layer is connected to the heat conducting plate via a sealant or a high temperature curing adhesive;
[0021] The flow groove is connected to the heat conduction plate by means of sealant, high temperature curing glue, threads or bolts.
[0022] Preferably, the power element comprises a plurality of power chips and a plurality of power terminals, and the plurality of power chips and the plurality of power terminals are connected to the metal layer via solder;
[0023] The adjacent power terminals and the power chips are connected via bonding wires, and the adjacent two power chips are connected via bonding wires.
[0024] Preferably, the power module further comprises an encapsulation colloid for encapsulating the metal layer, the plurality of power chips and the plurality of power terminals.
[0025] Implementing one of the above technical solutions of the utility model has the following advantages or beneficial effects:
[0026] The power element in the utility model is directly connected to the heat dissipation component through the metal layer, which reduces the thermal resistance layer in the traditional power module, greatly improves the heat dissipation effect and heat dissipation efficiency, and at the same time reduces the volume of the power module, thereby achieving a light and thin power module. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:
[0028] Figure 1 It is a cross-sectional view from a first perspective of the overall structure of an embodiment of the utility model;
[0029] Figure 2 is a cross-sectional view from a second viewing angle of the overall structure in an embodiment of the utility model;
[0030] Figure 3 It is a schematic diagram of a heat conducting member in an embodiment of the utility model;
[0031] Figure 4 It is a schematic diagram of the flow tank in the embodiment of the utility model.
[0032] In the figure: 1. power component; 11. metal layer; 111. first copper layer; 112. second copper layer; 113. third copper layer; 12. power element; 121. first power chip; 122. second power chip; 123. first power terminal; 124. second power terminal; 13. bonding wire; 14. solder; 2. heat dissipation component; 21. heat conducting member; 211. heat conducting plate; 212. ridge; 213. channel; 22. flow groove; 23. input nozzle; 24. output nozzle; 3. packaging colloid. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical solutions and advantages of the utility model clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which constitute a part of the exemplary embodiments, wherein various exemplary embodiments that may be used to implement the utility model are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present disclosure. It should be understood that they are only examples of processes, methods, and devices that are consistent with some aspects of the utility model disclosed as detailed in the attached claims, and other embodiments may also be used, or the embodiments listed herein may be modified in structure and function without departing from the scope and essence of the utility model.
[0034] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", etc. indicate the orientation or position relationship based on the drawings, which is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the elements referred to must have a specific orientation, be constructed and operated in a specific orientation. The terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "multiple" means two or more. The terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.
[0035] In order to illustrate the technical solution of the present invention, a specific embodiment is provided below, in which only the parts related to the embodiment of the present invention are shown.
[0036] Example:
[0037] like Figure 1 , Figure 2 As shown, the utility model provides an ultra-thin heat dissipation power module, including: a power component 1 and a heat dissipation component 2, the power component 1 is arranged on the heat dissipation component 2; the power component 1 includes a metal layer 11 and a power element 12 arranged above the metal layer 11, and the metal layer 11 is arranged on the heat dissipation component 2.
[0038] Specifically, the power component 1 generates heat during use, and the generated heat needs to be discharged in time. The power element 12 in this embodiment is arranged on the metal layer 11, and the metal layer 11 is directly arranged on the heat dissipation component 2 through a sealant or a high-temperature curing adhesive. The heat generated by the power element 12 placed on the metal layer 11 during use will be directly transferred to the heat dissipation component 2, and the heat will be dissipated through the heat dissipation component 2.
[0039] The power element 12 in the utility model is directly connected to the heat dissipation component 2 through the metal layer 11, which reduces the thermal resistance layer in the traditional power module, greatly improves the heat dissipation effect and heat dissipation efficiency, and at the same time reduces the volume of the power module to achieve a lightweight and thin power module.
[0040] As an optional implementation, Figure 1-4 As shown, the heat dissipation component 2 includes a heat conductor 21 and a flow groove 22, wherein the heat conductor 21 is located between the metal layer 11 and the flow groove 22; the heat conductor 21 is used to receive the heat generated by the power component 1, and the flow groove 22 is used to transport the cooling medium to carry out the heat received by the heat conductor 21.
[0041] Specifically, the heat conducting member 21 in the heat dissipation assembly 2 is arranged below the metal layer 11, and directly absorbs the heat generated by the power element 12 above the metal layer 11. The flow groove 22 can transport the cooling medium, and after the heat conducting member 21 absorbs the heat, the heat conducting member 21 will directly contact the cooling medium in the flow groove 22, and the cooling medium will take out the heat received by the heat conducting member 21, thereby achieving the purpose of heat dissipation for the power element 12.
[0042] When the power assembly 1 is working, the heat generated by the chip on the power element 12 is directly transferred to the heat conductor 21 through the metal layer 11 , and the effective heat dissipation of the power element 12 is achieved through the flow of the cooling medium in the flow groove 22 .
[0043] It should be noted that the material of the heat conductor 21 is ceramic. Ceramics have good insulation and thermal conductivity. The material of the heat conductor 21 is ceramic, so that the chips in the power module are effectively isolated from the flow slot 22 during use of the power module, thereby enhancing the insulation capacity of the module; the heat can also be effectively transferred to the flow slot 22, further dissipating the heat to achieve overall heat dissipation of the power module; and ceramics also have good mechanical strength and reliability, providing a basis for the normal use of the power module.
[0044] In this embodiment, the cooling medium includes but is not limited to condensate, water or low-temperature non-flammable gas.
[0045] In this embodiment, the material of the heat conducting member 21 is preferably ceramic, but other metals with good thermal conductivity, such as copper, aluminum and the like, may also be used.
[0046] As an optional implementation, Figure 3 As shown, the heat conducting member 21 includes a heat conducting plate 211 and at least one ridge 212, at least one ridge 212 is evenly arranged on the heat conducting plate 211, and a channel 213 for the flow of cooling medium is formed between two adjacent ridges 212; the heat conducting plate 211 and the ridge 212 are an integral structure.
[0047] Specifically, if Figure 1 , Figure 3 As shown, the heat conducting member 21 includes a heat conducting plate 211 directly connected to the metal layer 11 and at least one ridge 212 disposed on the heat conducting plate 211. In this embodiment, a plurality of ridges 212 are disposed, and the plurality of ridges 212 are evenly disposed on the heat conducting plate 211, and a channel 213 is formed between two adjacent ridges 212, so as to facilitate the flow of the cooling medium and evenly dissipate the heat received by the heat conducting plate 211. Moreover, the cooling medium in the flow groove 22 flows in real time, and the cooling medium in the flow groove 22 is combined with the ridges 212, so as to take away the heat in a very short time, thereby improving the heat dissipation efficiency of the power module.
[0048] The shape of the ridge 212 is cylindrical, elliptical, S-shaped or elongated. In this embodiment, the shape of the ridge 212 is preferably an elongated body. The elongated ridge 212 can quickly take away the heat received by the heat conducting plate 211, and perform effective heat exchange.
[0049] As an optional implementation, the size of the flow groove 22 matches the size of the heat conducting plate 211 ; the height of the ridge 212 is lower than the depth of the flow groove 22 .
[0050] Specifically, the flow groove 22 is a groove body, and its size matches the size of the heat conducting plate 211, so as to facilitate installation with the heat conducting plate 211. It should be noted that the flow groove 22 is connected to the heat conducting plate 211 by means of sealant, high temperature curing glue, threads or bolts. The specific connection method is not specifically limited in this embodiment.
[0051] To facilitate installation and to facilitate the flow of cooling medium in the flow groove 22, the height of the ridge 212 is lower than the depth of the flow groove 22, which can ensure that the cooling medium in the flow groove 22 flows in the channel 213 formed between adjacent ridges 212, and evenly takes away the heat received by the heat conductor 21.
[0052] As an optional implementation, Figure 2 , Figure 4 As shown, at least one pair of input pipe openings 23 and output pipe openings 24 are provided on opposite sides of the flow groove 22. The input pipe openings 23 are used to input the cooling medium, and the output pipe openings 24 are used to output the cooling medium.
[0053] Specifically, the flow groove 22 contains a cooling medium that flows in real time. Therefore, at least one pair of input nozzles 23 and output nozzles 24 are provided on opposite sides of the flow groove 22 for inputting cooling medium and outputting cooling medium that has undergone heat exchange. The provision of the input nozzles 23 and the output nozzles 24 enables the cooling medium to enter and flow out quickly, and quickly exchange heat with the heat received by the heat conducting member 21, thereby improving the heat dissipation effect and heat dissipation efficiency.
[0054] It should be noted that the positions of the input pipe opening 23 and the output pipe opening 24 are parallel to the ridges 212. After the cooling medium enters the flow groove 22, it will directly flow into the channel 213 formed between adjacent ridges 212, so that the cooling medium flows through each channel 213 to ensure heat dissipation efficiency.
[0055] In this embodiment, 1 to 3 pairs of the input pipe openings 23 and the output pipe openings 24 are provided, and they can be reasonably arranged according to the power of the power element 12 .
[0056] Furthermore, each of the input pipe opening 23 and the output pipe opening 24 is connected with an input pipe and an output pipe for inputting and discharging the cooling medium. It should be noted that the input pipe and the output pipe are preferably high temperature resistant plastic pipes and / or metal pipes.
[0057] As an optional implementation, Figure 1-2 As shown, the power element 12 includes multiple power chips and multiple power terminals, and the multiple power chips and multiple power terminals are connected to the metal layer 11 through solder 14; adjacent power terminals and power chips are connected through bonding wires 13, and two adjacent power chips are connected through bonding wires 13.
[0058] Specifically, if Figure 1 As shown, the power element 12 includes a first power chip 121, a second power chip 122, a first power terminal 123 and a second power terminal 124. A first copper layer 111, a second copper layer 112 and a third copper layer 113 are etched on the metal layer 11, the first power chip 121 is arranged on the first copper layer 111 by solder 14 or ultrasonic bonding, the first power chip 121 is arranged on the second copper layer 112 by solder 14 or ultrasonic bonding, and the second power chip 122 and the second power terminal 124 are both arranged on the third copper layer 113 by solder 14 or ultrasonic bonding.
[0059] The first copper layer 111 is connected to the first power chip 121 through the bonding wires 13 , and the second copper layer 112 is connected to the second power chip 122 through the bonding wires 13 .
[0060] The power chip is preferably an IGBT chip, an FRD chip or a MOSFET.
[0061] As an optional embodiment, the power module further includes an encapsulation colloid 3 for encapsulating the metal layer 11, multiple power chips and multiple power terminals. The encapsulation colloid 3 can completely encapsulate the metal layer 11 and multiple power chips, and partially encapsulate the power terminals, so that the power module remains stable during use. The encapsulation colloid 3 in this embodiment is an encapsulation resin or silicone gel.
[0062] The embodiment is only a special case and does not indicate that the present invention is implemented in such a way.
[0063] The above description is only the preferred embodiment of the present invention. Those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the guidance of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the protection scope of the present invention.
Claims
1. An ultra-thin heat dissipation power module, characterized in that: include: A power component (1) and a heat dissipation component (2), wherein the power component (1) is arranged on the heat dissipation component (2); The power component (1) comprises a metal layer (11) and a power element (12) arranged above the metal layer (11); the metal layer (11) is arranged on the heat dissipation component (2); The heat dissipation component (2) comprises a heat conducting member (21) and a flow groove (22), wherein the heat conducting member (21) is located between the metal layer (11) and the flow groove (22); The heat conducting member (21) is used to receive heat generated by the power component (1), and the flow groove (22) is used to transport a cooling medium to carry out the heat received by the heat conducting member (21); The heat conducting member (21) comprises a heat conducting plate (211) and at least one ridge (212), wherein the at least one ridge (212) is evenly arranged on the heat conducting plate (211), and a channel (213) for the cooling medium to flow is formed between two adjacent ridges (212); The heat conducting plate (211) and the convex ridge (212) are an integral structure; The size of the flow groove (22) matches the size of the heat conducting plate (211); The height of the ridge (212) is lower than the depth of the flow groove (22).
2. The ultra-thin heat dissipation power module according to claim 1, characterized in that: The material of the heat conducting element (21) is ceramic.
3. The ultra-thin heat dissipation power module according to claim 1, characterized in that: The convex ridge (212) is in the shape of a cylinder, an elliptical cylinder, an S-shaped strip or a long strip.
4. The ultra-thin heat dissipation power module according to claim 1, characterized in that: At least one pair of input pipe openings (23) and output pipe openings (24) are provided on opposite sides of the flow groove (22), wherein the input pipe openings (23) are used to input cooling medium, and the output pipe openings (24) are used to output cooling medium; The positions of the inlet pipe opening (23) and the outlet pipe opening (24) are parallel to the convex ridge (212).
5. The ultra-thin heat dissipation power module according to claim 1, characterized in that: The metal layer (11) is connected to the heat conducting plate (211) via a sealant or a high-temperature curing adhesive; The flow groove (22) is connected to the heat conducting plate (211) by means of sealant, high temperature curing glue, threads or bolts.
6. An ultra-thin heat dissipation power module according to any one of claims 1 to 5, characterized in that: The power element (12) comprises a plurality of power chips and a plurality of power terminals, and the plurality of power chips and the plurality of power terminals are connected to the metal layer (11) via solder (14); Adjacent power terminals and power chips are connected via bonding wires (13), and two adjacent power chips are connected via bonding wires (13).
7. The ultra-thin heat dissipation power module according to claim 6, characterized in that: The power module further comprises a packaging colloid (3) for packaging the metal layer (11), the plurality of power chips and the plurality of power terminals.