Electronic device

Abstract

The utility model discloses an electronic device. The electronic equipment comprises a frame body, a cover plate assembly and a display module, the cover plate assembly is arranged on one side of the frame body, a containing cavity is defined by the cover plate assembly and the frame body, and the display module is arranged in the containing cavity; wherein the cover plate assembly comprises a base plate, an explosion-proof film and an edge sealing layer, the explosion-proof film is attached to the surface of the side, facing the frame body, of the base plate, the edge sealing layer is in lap joint with the base plate and the explosion-proof film and covers the edge of the explosion-proof film, and the edge sealing layer is in lap joint with the base plate and the explosion-proof film and covers the edge of the explosion-proof film so that the connection strength of the explosion-proof film and the base plate can be enhanced; the problem that the explosion-proof membrane and the substrate are layered due to the fact that the explosion-proof membrane is easily pulled away from the substrate by mucilage glue between the cover plate assembly and the frame body under the action of external force is solved, and the reliability of the electronic equipment is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the development of foldable electronic devices, the size and shape of the secondary screen are also a part that people pay attention to. Judging from the development trajectory of the secondary screen of foldable mobile phones, the full-screen secondary screen is an inevitable trend. At present, the secondary screen and the middle frame of the device are connected by double-sided tape. Considering the industry processing requirements of double-sided tape and the waterproof requirements of the whole machine, the double-sided tape must maintain a certain width, generally 2mm, which leads to a black border of at least the width of the double-sided tape on the secondary screen.

[0003] If the secondary screen is fixed with glue, the size of the glue can be smaller than the size of the double-sided tape, generally 0.5mm, which can reduce the black edge of the secondary screen. However, in order to prevent debris from entering the battery compartment after the secondary screen cracks, an explosion-proof film is provided on the secondary screen cover. Since the adhesion of the glue to the explosion-proof film is much greater than the adhesion between the explosion-proof film and the secondary screen cover, when the device is impacted by external force, the glue can easily pull the explosion-proof film away from the secondary screen cover, causing damage to the secondary screen cover. Therefore, how to reduce the size of the black edge of the secondary screen when using the glue connection solution, reduce the damage to the explosion-proof film of the secondary screen caused by external force impact, and improve the reliability of electronic equipment needs to be solved urgently. Utility Model Content

[0004] An embodiment of the present application provides an electronic device that can solve the problem in the prior art that when a glue spot connection solution is used to reduce the size of the black border of the secondary screen, the glue spot can easily cause damage to the explosion-proof film of the secondary screen when the device is impacted by external force.

[0005] An embodiment of the present application provides an electronic device, comprising: a frame, a cover assembly and a display module, wherein the cover assembly is arranged on one side of the frame and is surrounded by the frame to form a receiving cavity, and the display module is arranged in the receiving cavity; wherein the cover assembly comprises a substrate, an explosion-proof film and an edge sealing layer, wherein the explosion-proof film is attached to a surface of the substrate on one side facing the frame, and the edge sealing layer overlaps the substrate and the explosion-proof film and covers the edge of the explosion-proof film.

[0006] In this way, in the electronic device provided in the embodiment of the present application, the electronic device includes a frame, a cover assembly and a display module. The cover assembly is arranged on one side of the frame and is surrounded by the frame to form a accommodating cavity. The display module is arranged in the accommodating cavity. The display module can realize the secondary screen display effect of the electronic device through the cover assembly. The cover assembly includes a substrate, an explosion-proof film and an edge sealing layer. The explosion-proof film is attached to a surface of the substrate facing the frame. The edge sealing layer overlaps the substrate and the explosion-proof film and covers the edge of the explosion-proof film so as to enhance the connection strength between the explosion-proof film and the substrate through the edge sealing layer.

[0007] Therefore, in the embodiments of the present application, an edge sealing layer is overlapped on the substrate and the explosion-proof membrane and covers the edge of the explosion-proof membrane to enhance the connection strength between the explosion-proof membrane and the substrate, thereby improving the problem that under the action of external force, the adhesive between the cover assembly and the frame can easily pull the explosion-proof membrane away from the substrate, resulting in delamination of the explosion-proof membrane and the substrate, thereby improving the reliability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 A partial structural schematic diagram of an electronic device according to some embodiments of the present application;

[0010] Figure 2 for Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0011] Figure 3 A schematic diagram of a partial structure of a frame of an electronic device according to some embodiments of the present application;

[0012] Figure 4 A schematic diagram of a partial structure of a frame of an electronic device according to some embodiments of the present application;

[0013] Figure 5 A partial structural schematic diagram of an electronic device according to some embodiments of the present application;

[0014] Figure 6 This is a schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application.

[0015] Description of Figure Numbers:

[0016] 100. Electronic equipment;

[0017] 110, frame;

[0018] 120, cover plate assembly; 121, base plate; 122, explosion-proof membrane; 123, edge sealing layer;

[0019] 1222, second surface; 1223, side surface;

[0020] 130. Display module;

[0021] 140, colloidal structure; 141, first segment; 142, second segment;

[0022] 150, accommodating cavity;

[0023] 160, boss; 161, mating surface; 162, recessed portion; 1611, first edge; 1612, second edge. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0025] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0026] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "middle", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] See also Figure 1 and Figure 2 , Figure 1 A partial structural diagram of an electronic device 100 according to some embodiments of the present application; Figure 2 for Figure 1 Schematic diagram of the enlarged structure at point A in the middle.

[0029] The present application embodiment provides an electronic device 100, such as Figure 1and Figure 2 As shown, the electronic device 100 includes a frame 110, a cover assembly 120 and a display module 130. The cover assembly 120 is arranged on one side of the frame 110, and is surrounded by the frame 110 to form a receiving cavity 150, and the display module 130 is arranged in the receiving cavity 150; wherein, the cover assembly 120 includes a substrate 121, an explosion-proof membrane 122 and an edge sealing layer 123, the explosion-proof membrane 122 is attached to a side surface 1223 of the substrate 121 facing the frame 110, and the edge sealing layer 123 overlaps the substrate 121 and the explosion-proof membrane 122, and covers the edge of the explosion-proof membrane 122.

[0030] In the electronic device 100 provided in the embodiment of the present application, the electronic device 100 includes a frame body 110, a cover assembly 120 and a display module 130. The cover assembly 120 is arranged on one side of the frame body 110 and is surrounded by the frame body 110 to form a receiving cavity 150. The display module 130 is arranged in the receiving cavity 150. The display module 130 can realize the secondary screen display effect of the electronic device 100 through the cover assembly 120. The cover assembly 120 includes a substrate 121, an explosion-proof membrane 122 and an edge sealing layer 123. The explosion-proof membrane 122 is attached to a side surface 1223 of the substrate 121 facing the frame body 110. The edge sealing layer 123 is overlapped on the substrate 121 and the explosion-proof membrane 122, and covers the edge of the explosion-proof membrane 122, so as to enhance the connection strength between the explosion-proof membrane 122 and the substrate 121 through the edge sealing layer 123. Therefore, in the embodiment of the present application, the edge sealing layer 123 is overlapped on the substrate 121 and the explosion-proof membrane 122, and covers the edge of the explosion-proof membrane 122 to enhance the connection strength between the explosion-proof membrane 122 and the substrate 121, so as to improve the problem that under the action of external force, the adhesive between the cover assembly 120 and the frame 110 easily pulls the explosion-proof membrane 122 away from the substrate 121, resulting in delamination of the explosion-proof membrane 122 and the substrate 121, thereby improving the reliability of the electronic device 100.

[0031] The electronic device 100 includes a frame 110, a cover assembly 120 and a display module 130. The cover assembly 120 is arranged on one side of the frame 110 and is surrounded by the frame 110 to form a receiving cavity 150. The frame 110 and the cover assembly 120 are bonded together. The display module 130 and the battery of the electronic device 100 are arranged in the receiving cavity 150. The edge portion of the cover assembly 120 and the frame 110 are bonded together. The cover assembly 120 includes a substrate 121 and an explosion-proof membrane 122. The explosion-proof membrane 122 is made of a transparent material, and the substrate 121 is made of a transparent material or a partial area of ​​the substrate 121 is made of a transparent material, so that the electronic device 100 can realize a secondary screen display.

[0032] In the prior art, the cover assembly 120 and the frame 110 are bonded by double-sided tape. Considering the processing size of the double-sided tape and the waterproof requirement of the device, the width of the double-sided tape is not less than 2 mm. In the embodiment of the present application, the width L of the glue point can be made smaller than the double-sided tape, generally 0.5 mm, so that the secondary screen of the electronic device 100 can obtain a smaller black border.

[0033] Glue dispensing refers to a colloid structure 140 disposed between the cover assembly 120 and the frame 110 through a glue dispensing process. The colloid structure 140 can be hot melt glue, epoxy glue, silicone, polyurethane adhesive, etc.

[0034] Since the cover assembly 120 and the display module 130 are located inside the electronic device 100 and are close to the battery of the device, in order to prevent the substrate 121 of the cover assembly 120 from cracking and causing debris to enter the battery compartment and cause battery safety problems, the cover assembly 120 needs to be provided with an explosion-proof membrane 122 on the substrate 121 .

[0035] Since the bonding strength between the colloid structure 140 and the explosion-proof membrane 122 is greater than the bonding strength between the explosion-proof membrane 122 and the substrate 121, the colloid structure 140 can easily pull the explosion-proof membrane 122 away from the substrate 121 under the action of external force, resulting in delamination of the explosion-proof membrane 122 and the substrate 121; or in the process of disassembling the cover assembly 120 and the frame 110 for equipment maintenance, the colloid structure 140 pulls the explosion-proof membrane 122 away from the substrate 121, resulting in the scrapping of the cover assembly 120. Therefore, in the embodiment of the present application, a fixed structure is provided between the explosion-proof membrane 122 and the substrate 121, and the connection strength between the explosion-proof membrane 122 and the substrate 121 is improved by the fixed structure, so as to reduce the risk of the colloid structure 140 pulling the explosion-proof membrane 122 and the substrate 121 apart.

[0036] Exemplarily, the colloid structure 140 is a heat-sensitive adhesive such as hot melt adhesive. When disassembling the cover assembly 120, the cover assembly 120 is first heated to reduce the adhesiveness of the colloid structure 140, while the adhesiveness of the fixed structure is not affected by the temperature, thereby separating the cover assembly 120 and the frame 110 without affecting the bonding strength between the substrate 121 and the explosion-proof membrane 122, thereby reducing the repair and scrap rate of the cover assembly 120 and realizing multiple uses of the cover assembly 120.

[0037] "The substrate 121 component includes an edge sealing layer 123, and the edge sealing layer 123 is overlapped on the substrate 121 and the explosion-proof membrane 122", then along the thickness direction of the explosion-proof membrane 122, the edge sealing layer 123 is arranged between the explosion-proof membrane 122 and the substrate 121, and the edge sealing layer 123 is arranged at the edge of the explosion-proof membrane 122; or the area of ​​the explosion-proof membrane 122 is smaller than the area of ​​the substrate 121, the edge of the explosion-proof membrane 122 and the edge of the substrate 121 are staggered, one end of the edge sealing layer 123 is connected to the explosion-proof membrane 122, and the other end of the fixed structure extends toward the edge of the substrate 121 and is bonded to at least one side of the substrate 121 in its thickness direction; or the explosion-proof membrane 122 completely covers the substrate 121, one end of the fixed structure is connected to the explosion-proof membrane 122, and the other end of the fixed structure is connected to the side of the substrate 121 away from the explosion-proof membrane 122.

[0038] "The edge sealing layer 123 covers the edge of the explosion-proof membrane 122". The specific explosion-proof membrane 122 includes a first surface and a second surface 1222 arranged opposite to each other along its thickness direction, and a side surface 1223 connected between the first surface and the second surface 1222. The first surface is connected to the substrate 121, and the edge sealing layer 123 is connected to the substrate 121 and at least a part of the second surface 1222, and the side surface 1223 is located between the edge sealing layer 123 and the substrate 121, so as to improve the connection strength between the explosion-proof membrane 122 and the substrate 121, especially to improve the connection strength between the end of the explosion-proof membrane 122 and the substrate 121, so as to reduce the risk of the colloid structure 140 pulling the explosion-proof membrane 122 away from the substrate 121 under the action of external force, which helps to reduce the black edge of the secondary screen and improve the reliability of the electronic device 100.

[0039] Optionally, the edge sealing layer 123 covers the side surface 1223 to further improve the connection strength between the explosion-proof membrane 122 and the substrate 121 .

[0040] Specifically, a side surface 1223 of the substrate 121 facing the explosion-proof membrane 122 includes a first area and a second area, the first area is sleeved in the second area, the explosion-proof membrane 122 is bonded to the second area, a portion of the edge sealing layer 123 is filled between the second area and the side wall of the explosion-proof membrane 122, and the edge sealing layer 123 covers the side wall of the explosion-proof membrane 122.

[0041] Optionally, at least part of the edge sealing layer 123 is arranged between the colloid structure 140 and the explosion-proof membrane 122. The colloid structure 140 can help improve the connection strength between the explosion-proof membrane 122 and the edge sealing layer 123. When the colloid structure 140 applies tension to the explosion-proof membrane 122 under the action of external force, the edge sealing layer 123 can share part of the tension from the colloid structure 140 on behalf of the explosion-proof membrane 122, so as to reduce the risk of separation of the explosion-proof membrane 122 and the substrate 121 under the pulling of the colloid structure 140.

[0042] One end of the edge sealing layer 123 is connected to the substrate 121 , and the other end of the edge sealing layer 123 extends between the colloid structure 140 and the explosion-proof membrane 122 , so that part of the colloid structure 140 and the edge sealing layer 123 are bonded and connected, and part of the colloid structure 140 and the explosion-proof membrane 122 are directly connected.

[0043] Optionally, one end of the edge sealing layer 123 extends to the side of the colloid structure 140 away from the other end of the edge sealing layer 123, which reduces the alignment accuracy requirements between the edge sealing layer 123 and the colloid structure 140, and reduces the difficulty of manufacturing the electronic device 100. The colloid structure 140 does not directly contact the cover assembly 120, and the cover assembly 120 is fixed to the frame 110 through the edge sealing layer 123, so that when the cover assembly 120 and the frame 110 are separated, the edge sealing layer 123 can disperse and slow down the pulling force of the colloid structure 140 on the explosion-proof film 122, thereby reducing the risk of separation of the explosion-proof film 122 and the substrate 121.

[0044] In some embodiments, Figure 2 As shown, the edge sealing layer 123 is an adhesive layer or a paint layer.

[0045] In these embodiments, the edge sealing layer 123 is an adhesive layer or a paint layer, which has a reliable bonding effect, good tolerance and stable properties.

[0046] The edge sealing layer 123 is stable in nature and its viscosity does not decrease after heating.

[0047] Exemplarily, the adhesive layer may be curable non-heat-sensitive glue such as shadowless glue, quick-drying glue, etc.

[0048] In some embodiments, Figure 1 and Figure 2 As shown, the frame 110 has a boss 160 , and the boss 160 is used to support the cover assembly 120 .

[0049] In these embodiments, the frame 110 has a boss 160 . After the cover assembly 120 is covered on the frame 110 , the cover assembly 120 and the boss 160 abut against each other. The boss 160 is used to support the cover assembly 120 to improve the connection stability between the cover assembly 120 and the frame 110 .

[0050] Optionally, the boss 160 and the frame 110 are integrally formed to improve the structural strength of the boss 160 and the frame 110, or the boss 160 and the frame 110 are separately prepared, and the boss 160 is bonded or snapped to the frame 110 to facilitate replacement when the boss 160 is damaged.

[0051] In some embodiments, Figure 1 and Figure 2As shown, the cover assembly 120 and the frame 110 are bonded and fixed by the colloid structure 140; the boss 160 of the frame 110 includes a mating surface 161 facing the cover assembly 120 and mating with the edge sealing layer 123, and a recessed portion 162 for accommodating the colloid structure 140 is provided on the mating surface 161.

[0052] In these embodiments, the cover assembly 120 and the frame 110 are bonded and fixed by the colloid structure 140, and the boss 160 of the frame 110 includes a mating surface 161 facing the cover assembly 120 and mating with the edge sealing layer 123, and the mating surface 161 serves to assist in enhancing the connection stability between the edge sealing layer 123 and the substrate 121 and / or the explosion-proof membrane 122. A recessed portion 162 for accommodating the colloid structure 140 is provided on the mating surface 161, so that when the colloid structure 140 is set on the frame 110, the boss 160 can provide support for the colloid structure 140, so as to improve the setting of the colloid structure 140 on the frame 110, and when the cover assembly 120 is covered on the frame 110, the colloid structure 140 is crushed, resulting in a reduction in the connection reliability of the cover assembly 120 and the frame 110.

[0053] Optionally, the shape of the recessed portion 162 may be flexibly designed. For example, the recessed portion 162 may be in a strip shape or a dot shape.

[0054] In some embodiments, Figure 1 and Figure 2 As shown, the side of the cover assembly 120 facing the display module 130 is a curved surface, and the matching surface 161 is an arc-shaped surface, and the curved surface and the arc-shaped surface are in contact and matching.

[0055] In these embodiments, the side of the cover assembly 120 facing the display module 130 is curved, and the mating surface 161 is an arc-shaped surface. The curved surfaces are in contact with each other so that the cover assembly 120 and the boss 160 fit tightly together, thereby reducing the risk of external moisture and impurities entering the interior of the device through the gap between the cover assembly 120 and the boss 160.

[0056] Optionally, the end where the boss 160 contacts the cover assembly 120 should have the same curvature as the cover assembly 120 to improve the matching effect between the boss 160 and the cover assembly 120, to further improve the tightness of the fit between the boss 160 and the cover assembly 120, and to block some external water vapor impurities from entering the interior of the electronic device 100.

[0057] In some embodiments, Figure 1 and Figure 2As shown, the arc surface includes a first edge 1611 close to the display module 130 and a second edge 1612 away from the display module 130. From the first edge 1611 to the second edge 1612, the arc surface is tilted away from the cover assembly 120, and the first edge 1611 is arranged between the second edge 1612 and the recessed portion 162.

[0058] In these embodiments, the curved surface includes a first edge 1611 close to the display module 130, and a second edge 1612 away from the display module 130. In the direction from the first edge 1611 to the second edge 1612, the curved surface is inclined away from the cover assembly 120. The inclined curved surface extends the matching path between the first edge 1611 and the second edge 1612, increases the difficulty of external impurities and water vapor invading between the first edge 1611 and the second edge 1612, and improves the sealing reliability of the device; the first edge 1611 is arranged between the second edge 1612 and the recessed portion 162. Based on the inclined direction of the curved surface, the curved surface can provide a larger supporting surface for the colloid structure 140 at the first edge 1611, and provide better support and limiting effects for the colloid structure 140.

[0059] Specifically, the arc surface includes a first edge 1611 and a second edge 1612 , and a distance from the first edge 1611 to a side of the frame 110 away from the cover assembly 120 is smaller than a distance from the second edge 1612 to a side of the frame 110 away from the cover assembly 120 .

[0060] The first edge 1611 and the second edge 1612 are inclined to form a smooth arc surface to reduce the difficulty of matching the arc surface with the cover assembly 120. The smooth arc surface means that there is no obvious step, groove, or bump structure on the arc surface between the first edge 1611 and the second edge 1612.

[0061] In some embodiments, Figure 1 and Figure 2 As shown, the first edge 1611 is located between the edge of the explosion-proof membrane 122 and the recessed portion 162 .

[0062] In these embodiments, the first edge 1611 is located between the edge of the explosion-proof membrane 122 and the recessed portion 162, that is, the recessed portion 162 and the edge of the explosion-proof membrane 122 are spaced apart to avoid contact between the colloid structure 140 in the recessed portion 162 and the edge of the explosion-proof membrane 122, so as to move the force application point of the colloid structure 140 on the explosion-proof membrane 122 backward, so as to reduce the risk of the colloid structure 140 pulling the explosion-proof membrane 122 away from the substrate 121 under the action of external force.

[0063] “Avoid contact between the colloid structure 140 in the recessed portion 162 and the edge of the explosion-proof membrane 122”. Since the edge of the explosion-proof membrane 122 is covered with the edge sealing layer 123, this does not mean that the colloid structure 140 is in direct contact with the explosion-proof membrane 122, but that the projection of the colloid structure 140 on the explosion-proof membrane 122 and the edge of the explosion-proof membrane 122 are staggered.

[0064] See also Figure 3 , Figure 3 This is a schematic diagram of a partial structure of a frame of an electronic device according to some embodiments of the present application.

[0065] In some embodiments, Figure 2 and Figure 3 As shown, the boss 160 is an annular boss 160 .

[0066] In these embodiments, the boss 160 is an annular boss 160, which is arranged around the side of the frame 110 facing the cover assembly 120. The boss 160 can provide sufficient and stable support for the colloid structure 140 to improve the connection reliability between the cover assembly 120 and the frame 110, and can fully avoid direct contact between the edges of the colloid structure 140 and the explosion-proof membrane 122, and move the force application point of the colloid structure 140 on the explosion-proof membrane 122 backward to reduce the risk of the colloid structure 140 pulling the explosion-proof membrane 122 away from the substrate 121 under the action of external force.

[0067] The boss 160 is disposed around a side of the frame 110 facing the cover assembly 120 and extends continuously.

[0068] Optionally, to ensure the bonding reliability and waterproof requirements between the cover assembly 120 and the frame 110, the width of the colloid structure 140 between the cover assembly 120 and the frame 110 is not less than 0.5 mm. Exemplarily, the width of the colloid structure 140 is 0.5 mm, and the width of the boss 160 is 0.3 mm.

[0069] Optionally, the boss 160 extends uniformly around the colloid structure 140 , and the cross-sections of the boss 160 at all locations along the extending direction thereof are the same.

[0070] See also Figure 4 , Figure 5 and Figure 6 , Figure 4 A schematic diagram of a partial structure of a frame of an electronic device according to some embodiments of the present application; Figure 5 A partial structural schematic diagram of an electronic device according to some embodiments of the present application; Figure 6 This is a schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application.

[0071] In some embodiments, Figures 4 to 6As shown, there are multiple bosses 160 , which are arranged at intervals along the edge of the frame 110 , and the colloid structure 140 is arranged between the recessed portion 162 and the adjacent bosses 160 .

[0072] In these embodiments, there are multiple bosses 160, and the multiple bosses 160 are arranged at intervals along the edge of the frame 110 to reduce the material cost of the boss 160. The colloid structure 140 is arranged between the recessed portion 162 and the adjacent boss 160, and part of the colloid structure 140 is arranged in the recessed portion 162, so that the recessed portion 162 provides support for the entire colloid structure 140 to improve the problem of the colloid structure 140 being crushed during assembly; part of the colloid structure 140 can be arranged between adjacent bosses 160, and this part of the colloid structure 140 can play a role in connecting the cover plate assembly 120 and the frame 110, and since the boss 160 is not arranged here, the black border size can be reduced here, so the overall sub-screen black border size of the device can be reduced, and the sub-screen display effect of the device can be improved.

[0073] Optionally, the colloid structure 140 includes a first segment 141 and a second segment 142, the first segment 141 is located between adjacent bosses 160, the second segment 142 is accommodated in the recessed portion 162, and the width L1 of the first segment 141 is greater than the width L2 of the second segment 142. The boss 160 provides support force for the entire colloid structure 140 through the second segment 142 to improve the problem of the colloid structure 140 being crushed; the width L1 of the first segment 141 is greater than the width L2 of the second segment 142, the first segment 141 of the colloid structure 140 provides reliable bonding force for the cover assembly 120 and the frame 110, and the size of the boss 160 is reduced to ensure that the overall size of the black border of the secondary screen of the electronic device 100 is reduced, thereby improving the display effect of the secondary screen of the electronic device 100.

[0074] In the extension direction of the colloid structure 140 , the length of the first segment 141 should be greater than the length of the second segment 142 to ensure the connection reliability between the cover assembly 120 and the frame 110 .

[0075] The width dimension of the colloid structure 140 refers to the distance between an edge of the colloid structure 140 facing the display module 130 and an edge of the colloid structure 140 facing away from the display module 130 .

[0076] The width of the colloid structure 140 between adjacent bosses 160 is not less than 0.5 mm to ensure the connection reliability between the cover assembly 120 and the frame 110. The size of the colloid structure 140 accommodated in the recessed portion 162 is less than 0.5 mm, and the size of the curved surface is less than 1.5 mm to ensure that the size at the boss 160 is still smaller than the black edge of the secondary screen of the double-sided tape in the prior art.

[0077] Optionally, the width dimension of the colloid structure 140 between adjacent bosses 160 is equal to the width dimension of the bosses 160, so that the black border of the device's secondary screen can be uniform while reducing the black border of the device's secondary screen, thereby improving the display effect of the device's secondary screen.

[0078] The width dimension of the boss 160 refers to the distance between an edge of the boss 160 facing the display module 130 and an edge of the boss 160 facing away from the display module 130 .

[0079] Optionally, a plurality of bosses 160 are evenly spaced apart on the frame 110 , so that the bosses 160 can provide stable support for the colloid structure 140 , thereby preventing the colloid structure 140 from unbalancedly flowing in a part of the frame 110 , and improving the connection reliability between the cover assembly 120 and the frame 110 .

[0080] Optionally, the frame 110 may be rectangular, circular or in other shapes.

[0081] Exemplarily, the frame 110 is rectangular, and bosses 160 are provided on the two long sides and the two wide sides of the rectangle, and the colloid structure 140 is accommodated in the recessed portion 162 of the boss 160 to prevent the colloid structure 140 on a certain side of the rectangle from being crushed when the cover assembly 120 and the frame 110 are combined, causing the cover assembly 120 to tilt and the combination quality of the cover assembly 120 and the frame 110 to decrease.

[0082] Optionally, the frame body 110 is rectangular, and the boss 160 is disposed at an angle of the frame body 110 .

[0083] In some embodiments, Figure 1 As shown, the electronic device 100 is a foldable electronic device 100 , and the electronic device 100 further includes a flexible display screen. The flexible display screen and the display module 130 are respectively arranged on both sides of the frame 110 .

[0084] In these embodiments, the electronic device 100 is a foldable electronic device 100, which also includes a flexible display screen. The flexible display screen and the display module 130 are respectively arranged on both sides of the frame 110, and the display module 130 is used for the secondary screen display of the foldable electronic device 100. Through the scheme of the above embodiments, the connection strength between the explosion-proof membrane 122 and the substrate 121 at the secondary screen of the foldable device is enhanced, so that the colloid structure 140 can be connected at the secondary screen, the black edge at the secondary screen is reduced, and the secondary screen display effect of the electronic device 100 is improved.

[0085] The electronic device 100 in the embodiment of the present application includes but is not limited to a foldable electronic device 100 such as a mobile phone, a personal digital assistant (PDA), a tablet computer, a laptop computer, an e-book, and a driving recorder.

[0086] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. An electronic device, characterized in that: include: A frame, a cover assembly and a display module, wherein the cover assembly is arranged on one side of the frame and is surrounded by the frame to form a receiving cavity, and the display module is arranged in the receiving cavity; The cover assembly includes a substrate, an explosion-proof membrane and an edge sealing layer. The explosion-proof membrane is attached to a surface of the substrate facing the frame. The edge sealing layer overlaps the substrate and the explosion-proof membrane and covers the edge of the explosion-proof membrane.

2. The electronic device according to claim 1, characterized in that: The edge sealing layer is an adhesive layer or a paint layer.

3. The electronic device according to claim 1, characterized in that: The frame body has a boss, and the boss is used to support the cover plate assembly.

4. The electronic device according to claim 3, characterized in that: The cover plate assembly and the frame are bonded and fixed by a colloid structure; The boss of the frame body comprises a matching surface facing the cover plate assembly and matching with the edge sealing layer, and a recessed portion for accommodating the colloid structure is arranged on the matching surface.

5. The electronic device according to claim 4, characterized in that: The side of the cover plate assembly facing the display module is a curved surface, the matching surface is an arc-shaped surface, and the curved surface is in contact with and matched with the arc-shaped surface.

6. The electronic device according to claim 5, characterized in that: The arcuate surface includes a first edge close to the display module and a second edge away from the display module. In the direction from the first edge to the second edge, the arcuate surface is tilted away from the cover assembly, and the first edge is arranged between the second edge and the recessed portion.

7. The electronic device according to claim 6, characterized in that: The first edge is located between the edge of the explosion-proof membrane and the recessed portion.

8. The electronic device according to claim 5, characterized in that: The boss is an annular boss.

9. The electronic device according to claim 5, characterized in that: There are multiple bosses, and the multiple bosses are arranged at intervals along the edge of the frame. The colloid structure is arranged between the recessed portion and the adjacent bosses.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The electronic device is a foldable electronic device, and the electronic device further comprises a flexible display screen, wherein the flexible display screen and the display module are respectively arranged on two sides of the frame.

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