Multi-pin mounting structure of lead selenide detector

Abstract

The utility model discloses a multi-pin installation structure of a lead selenide detector, which comprises a detector body, a power supply pin is fixedly installed at the bottom of the detector body, and a signal output pin is fixedly installed at the bottom of the detector body and located on one side of the power supply pin. A reset pin is fixedly installed at the bottom of the detector body and located on one side of the signal output pin, a control pin is fixedly installed at the bottom of the detector body and located on one side of the reset pin, and a data input pin is fixedly installed at the bottom of the detector body and located on one side of the control pin. The utility model aims to solve the problems that the contact area between the pin and a circuit board is limited when the pin of the existing detector is installed, so that the connection strength is not high, the situation of excessive glue injection is easy to occur when welding spots are sealed by glue injection, and the exposed epoxy resin glue is easy to be damaged by a traction belt and the welding spots are damaged. And meanwhile, signal exposure is easy to occur at the welding spot position, and the signal intensity is easy to influence on the whole.

Description

Technical Field

[0001] The utility model relates to the technical field of detectors, in particular to a multi-pin installation structure of a lead selenide detector. Background Art

[0002] The detector generally consists of a main component and a pin structure. The pin structure is the main connection structure between the sensor and the circuit board. Usually, the metal pins are welded to the corresponding positions of the circuit board to achieve electrical connection, and then the solder joints are protected by sealing with epoxy glue.

[0003] When the existing detector pins are installed, the contact area between the pins and the circuit board is limited, so the connection strength is not high. Secondly, when the solder joints are sealed with glue, it is easy to apply too much glue, and the epoxy resin glue is exposed to the outside and is easily damaged by pulling and damaging the solder joints. At the same time, the signal is easily exposed at the solder joint position, which is easy to affect the overall signal strength. Utility Model Content

[0004] The utility model aims to provide a multi-pin installation structure of a lead selenide detector to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: comprising a detector body, a power pin is fixedly installed on the bottom of the detector body, a signal output pin is fixedly installed on the bottom of the detector body and on one side of the power pin, a reset pin is fixedly installed on the bottom of the detector body and on one side of the signal output pin, a control pin is fixedly installed on the bottom of the detector body and on one side of the reset pin, a data input pin is fixedly installed on the bottom of the detector body and on one side of the control pin, a data output pin is fixedly installed on the bottom of the detector body and on one side of the data input pin, a protective cover is provided on the bottom of the detector body and on the outside of the power pin, the signal output pin, the reset pin, the control pin, the data input pin and the data output pin, a supporting component is provided on the bottom of the protective cover, and a shielding component is provided inside the protective cover.

[0006] As a further preferred embodiment of the present technical solution, the support assembly includes a glue injection tube, and the glue injection tube is fixedly connected to the top of the protective cover.

[0007] As a further preferred embodiment of the present technical solution, the support assembly further includes a support pad, and the support pad is fixedly connected to the bottom of the protective cover.

[0008] As a further preferred embodiment of the present technical solution, a glue injection port is provided through the top of the glue injection tube.

[0009] As a further preferred embodiment of the present technical solution, the shielding assembly includes a copper foil coating layer, and the copper foil coating layer is arranged inside the protective cover.

[0010] As a further preferred embodiment of the present technical solution, the shape of the protective cover is set to be conical.

[0011] As a further preferred embodiment of the present technical solution, a filling cavity is provided inside the protective cover.

[0012] The utility model provides a multi-pin installation structure of a lead selenide detector, which has the following beneficial effects:

[0013] (1) The utility model moves the protective cover downward so that the bottom of the protective cover contacts the circuit board, thereby protecting the solder joint position. Then, a filling cavity is formed between the inside of the protective cover and the pin. Then, epoxy resin is injected into the filling cavity inside the protective cover through the injection port at the top of the injection tube. The cured sealant can be covered, which can further prevent the sealant from falling off, thereby enhancing the stability of the solder joint.

[0014] (2) The utility model forms a metal shielding structure around the solder joint through the shielding component inside the protective cover, which can reduce the interference of external signals and also reduce the disordered external emission of electromagnetic signals at the solder joint position. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 This is a bottom-up three-dimensional structural schematic diagram of the utility model;

[0017] Figure 3 This is a schematic diagram of the support assembly structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the internal structure of the support assembly of the utility model;

[0019] In the figure: 1. Detector body; 2. Power pin; 3. Signal output pin; 4. Control pin; 5. Reset pin; 6. Protective cover; 7. Data output pin; 8. Data input pin; 9. Glue injection tube; 10. Glue injection port; 11. Support pad; 12. Copper foil coating layer; 13. Filling cavity. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0021] The utility model provides a technical solution: Figure 1-Figure 4As shown, in this embodiment, the multi-pin installation structure of the lead selenide detector includes a detector body 1, a power pin 2 is fixedly installed at the bottom of the detector body 1, a signal output pin 3 is fixedly installed at the bottom of the detector body 1 and on one side of the power pin 2, a reset pin 5 is fixedly installed at the bottom of the detector body 1 and on one side of the signal output pin 3, a control pin 4 is fixedly installed at the bottom of the detector body 1 and on one side of the reset pin 5, a data input pin 8 is fixedly installed at the bottom of the detector body 1 and on one side of the control pin 4, a data output pin 7 is fixedly installed at the bottom of the detector body 1 and on one side of the data input pin 8, a protective cover 6 is arranged at the bottom of the detector body 1 and on the outside of the power pin 2, the signal output pin 3, the reset pin 5, the control pin 4, the data input pin 8 and the data output pin 7, a supporting component is arranged at the bottom of the protective cover 6, and a shielding component is arranged inside the protective cover 6.

[0022] First, by soldering the power pin 2, signal output pin 3, reset pin 5, control pin 4, data input pin 8 and data output pin 7 on the circuit board, the power pin 2 is used to provide the power supply required by the detector, the signal output pin 3 is used to output the signal detected by the detector, the reset pin 5 is used to reset the detector and restore it to its initial state, the control pin 4 is used to control the working state of the detector, such as start, stop, etc., the data input pin 8 is used to input data to the detector, and the data output pin 7 is used to output data from the detector. The functionality of the detector body 1 is increased by the cooperation of multiple pins, and then the welding is completed. After completion, the protective cover 6 is moved down so that the bottom of the protective cover 6 contacts the circuit board, thereby protecting the solder joint position. Then, a filling cavity 13 is formed between the inside of the protective cover 6 and the pin, and then epoxy resin is injected into the filling cavity 13 inside the protective cover 6 through the injection port 10 at the top of the injection tube 9. The cured sealant can be covered, which can further prevent the sealant from falling off, thereby enhancing the stability of the solder joint. Then, a metal shielding structure is formed on the periphery of the solder joint through the shielding component inside the protective cover 6, which can reduce the interference of external signals and the disordered external emission of electromagnetic signals at the solder joint position.

[0023] like Figure 1-Figure 4 As shown, the support assembly includes a glue injection tube 9, which is fixedly connected to the top of the protective cover 6. The support assembly also includes a support pad 11, which is fixedly connected to the bottom of the protective cover 6. A glue injection port 10 is opened through the top of the glue injection tube 9. The shape of the protective cover 6 is set to be conical, and a filling cavity 13 is set inside the protective cover 6.

[0024] After welding is completed, the protective cover 6 is moved down to make the support pad 11 contact with the surface of the circuit board. Then, the protective cover 6 has the advantage of a large conical bottom area to better protect the soldering point position and increase the stability of the pin on the circuit board. Then, epoxy resin is injected into the filling cavity 13 inside the protective cover 6 through the injection port 10 at the top of the injection tube 9. The cured sealant can be covered, which can further prevent the sealant from falling off and further increase the stability of the device.

[0025] like Figure 1-Figure 4 As shown, the shielding component includes a copper foil coating layer 12 , and the copper foil coating layer 12 is arranged inside the protective cover 6 .

[0026] The copper foil coating layer 12 disposed inside the protective cover 6 can form a shielding cover to effectively block interference and radiation of external electromagnetic signals, which helps to improve the anti-interference capability of the device and ensure the normal operation of the device.

[0027] The utility model provides a multi-pin installation structure of a lead selenide detector, and the specific working principle is as follows: first, after welding is completed, the protective cover 6 is moved down to make the support pad 11 contact with the surface of the circuit board, and then the advantage of the large conical bottom area of ​​the protective cover 6 is used to better protect the soldering point position, thereby increasing the stability of the pin on the circuit board, and then epoxy resin is injected into the filling cavity 13 inside the protective cover 6 through the injection port 10 at the top of the injection tube 9, and the cured sealant can be covered, which can further prevent the sealant from falling off and further increase the stability of the device. Finally, a shielding cover can be formed by the copper foil coating layer 12 arranged inside the protective cover 6 to effectively block the interference and radiation of external electromagnetic signals, which helps to improve the anti-interference ability of the equipment and ensure the normal operation of the equipment.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-pin mounting structure of a lead selenide detector, comprising a detector body (1), characterized in that: A power pin (2) is fixedly mounted on the bottom of the detector body (1); a signal output pin (3) is fixedly mounted on the bottom of the detector body (1) and located on one side of the power pin (2); a reset pin (5) is fixedly mounted on the bottom of the detector body (1) and located on one side of the signal output pin (3); a control pin (4) is fixedly mounted on the bottom of the detector body (1) and located on one side of the reset pin (5); a data input pin (8) is fixedly mounted on the bottom of the detector body (1) and located on one side of the control pin (4); a data output pin (7) is fixedly mounted on the bottom of the detector body (1) and located on one side of the data input pin (8); a protective cover (6) is provided on the bottom of the detector body (1) and located outside the power pin (2), the signal output pin (3), the reset pin (5), the control pin (4), the data input pin (8) and the data output pin (7); a supporting component is provided at the bottom of the protective cover (6); and a shielding component is provided inside the protective cover (6).

2. The multi-pin mounting structure of the lead selenide detector according to claim 1, characterized in that: The support assembly comprises a glue injection tube (9), and the glue injection tube (9) is fixedly connected to the top of the protective cover (6).

3. The multi-pin mounting structure of the lead selenide detector according to claim 1, characterized in that: The support assembly further comprises a support pad (11), wherein the support pad (11) is fixedly connected to the bottom of the protective cover (6).

4. The multi-pin mounting structure of the lead selenide detector according to claim 2, characterized in that: A glue injection port (10) is provided through the top of the glue injection tube (9).

5. The multi-pin mounting structure of the lead selenide detector according to claim 1, characterized in that: The shielding component comprises a copper foil coating layer (12), and the copper foil coating layer (12) is arranged inside the protective cover (6).

6. The multi-pin mounting structure of the lead selenide detector according to claim 1, characterized in that: The shape of the protective cover (6) is set to be conical.

7. The multi-pin mounting structure of the lead selenide detector according to claim 1, characterized in that: A filling cavity (13) is provided inside the protective cover (6).

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