Heat dissipation structure and electronic product
By using liquid metal in the circulation pipeline and using electromagnetic pump to drive, the existing heat dissipation solution is solved by small heat area, large noise and high power consumption, and high efficiency and low noise multi-faceted structure heat dissipation is achieved, which is suitable for electronic products. Ultra-thin design.
Patent Information
- Application Number
- CN202420326217.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-21
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-02-21
AI Technical Summary
Existing heat dissipation solutions such as steam heat pipes and metal pipes combined with water pump circulation heat dissipation solutions have problems such as small heat area, poor system heat homogeneity, large noise, and high power consumption, which are difficult to meet the needs of low noise, low power consumption and multi-faceted structure heat dissipation.
The circulation pipeline is filled with liquid metal and the circulation flow is driven by the electromagnetic pump. The high thermal conductivity and high electrical conductivity of the liquid metal are used to achieve circulating heat dissipation. The electromagnetic pump is noise-free and has low energy consumption, and is not affected by the angle of the circulation pipeline. limit.
It improves heat dissipation efficiency and heat exchange area, achieves high-efficiency heat dissipation with low noise and low power consumption, and is suitable for multi-faceted electronic products.
Smart Images
Figure CN222322011U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation structure and an electronic product. Background Art
[0002] Currently, electronic products are developing towards thinness. Take laptop computers as an example. Since the cooling fan has a large volume and occupies a large space in the product, a cooling fan-free design can be adopted, that is, other cooling solutions can be used to replace the cooling fan, which can effectively reduce the thickness of the laptop computer.
[0003] In order to improve the competitiveness of products, electronic products without cooling fans also need to meet requirements such as low noise, low surface temperature and low power consumption. For this, the current cooling solutions include: steam heat pipe cooling solution or metal pipe combined with water pump circulation cooling solution.
[0004] In the steam heat pipe cooling solution, capillary force is used to drive internal water circulation to transfer heat to the bottom surface of the electronic product shell. The heat dissipation power consumption is low, but there are also problems such as small thermal area, poor system thermal uniformity, poor heat pipe anti-gravity ability, noise generated by internal water boiling, and inability to reach other positions of the shell due to bending angle limitations.
[0005] In the metal tube and water pump circulation heat dissipation solution, the liquid cooling water circulation transfers heat to multiple surfaces of the shell. Its heat dissipation power consumption is improved compared to the steam heat pipe heat dissipation solution, but there are still problems such as the high thickness of the water pump, high noise and low thermal conductivity of water. Utility Model Content
[0006] In order to solve at least the above technical problems existing in the prior art, the utility model provides a heat dissipation structure and an electronic product.
[0007] On the one hand, the utility model provides a heat dissipation structure, including a circulation pipeline, liquid metal and an electromagnetic pump; the circulation pipeline is filled with the liquid metal, a part of the circulation pipeline is used for contacting and exchanging heat with a heating element, and another part of the circulation pipeline is used for contacting and exchanging heat with a shell of an electronic product; at least one electromagnetic pump is arranged on the outer wall of the circulation pipeline, and the electromagnetic pump is used to drive the liquid metal in the circulation pipeline to circulate.
[0008] In some embodiments, the circulation pipeline includes a first pipeline and a second pipeline, and the first pipeline and / or the second pipeline are used for contact and heat exchange with the heating element; the two ends of the first pipeline are respectively rotatably connected to the two ends of the second pipeline, the first pipeline is located in a first plane, and the second pipeline is located in a second plane, and there is a set angle between the first plane and the second plane.
[0009] In some embodiments, the end of the first pipeline is sleeved on the end of the second pipeline, and a sealing ring is provided in the sleeved portion of the first pipeline and the second pipeline, between the inner wall of the first pipeline and the outer wall of the second pipeline.
[0010] On the other hand, the utility model also provides an electronic product, comprising the above-mentioned heat dissipation structure; a part of the circulation pipeline contacts and exchanges heat with a heating element in the electronic product, and another part of the circulation pipeline contacts and exchanges heat with a housing of the electronic product.
[0011] On the other hand, the utility model also provides an electronic product, including a system end and a display end, and the above-mentioned heat dissipation structure; the first pipeline is arranged at the system end, and a part of the first pipeline is in contact with the heating element of the system end for heat exchange, and another part of the first pipeline is in contact with the shell of the system end for heat exchange; the second pipeline is arranged at the display end, and the second pipeline is in contact with the shell of the display end for heat exchange.
[0012] In some embodiments, a plurality of first electromagnetic pumps are disposed on the first pipeline, and a foot pad is disposed at the bottom of the shell of the system end; the first electromagnetic pump is disposed in the foot pad.
[0013] In some embodiments, a through hole is provided on the inner wall of the shell of the system end at the overlapping position with the foot pad, and a receiving groove is provided on the foot pad, and the notch of the receiving groove is connected with the through hole, and the first electromagnetic pump is located in the receiving space formed by the receiving groove and the through hole.
[0014] In some embodiments, the system end and the display end are connected via a rotating shaft; a second electromagnetic pump is provided at both ends of the second pipeline; the outer wall of the second electromagnetic pump is connected to the rotating shaft, and the second electromagnetic pump and the end of the second pipeline rotate synchronously with the rotating shaft.
[0015] In some embodiments, a bracket is provided at the bottom of the second electromagnetic pump, and the second electromagnetic pump is connected to the rotating shaft through the bracket.
[0016] In some embodiments, the outer wall of the first pipeline is connected to a heat-conducting block, and the first pipeline contacts and exchanges heat with the heating element through the heat-conducting block.
[0017] The utility model provides a heat dissipation structure and electronic products, which utilize liquid metal for circulating heat dissipation, wherein the liquid metal has a high thermal conductivity, the thermal resistance of the circulation system is small, and the heat dissipation efficiency is high; in addition, since the liquid metal has a high electrical conductivity, it can be driven by an electromagnetic pump, and the electromagnetic pump has the advantages of no noise, low energy consumption, and no mechanical moving parts when in use; and the electronic products used in the heat dissipation structure are not limited by the angle of the circulation pipeline, and can be used in a multi-faceted structure with an angle, further increasing the heat exchange area and heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] By reading the detailed description below with reference to the accompanying drawings, the above and other objects, features and advantages of the exemplary embodiments of the present invention will become readily understood. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, wherein:
[0019] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0020] Figure 1 A schematic diagram of the heat dissipation structure provided by the embodiment of the utility model Figure 1 ;
[0021] Figure 2 A schematic diagram of the heat dissipation structure provided by the embodiment of the utility model Figure 2 ;
[0022] Figure 3 A cross-sectional view of the connection between the first pipeline and the second pipeline in the heat dissipation structure provided by an embodiment of the utility model;
[0023] Figure 4 A schematic diagram of the structure of the electronic product provided by the embodiment of the utility model Figure 1 ;
[0024] Figure 5 A schematic diagram of the structure of the electronic product provided by the embodiment of the utility model Figure 2 ;
[0025] Figure 6 A cross-sectional view of a first electromagnetic pump in an electronic product provided by an embodiment of the utility model;
[0026] Figure 7 This is a schematic structural diagram of the second electromagnetic pump in the electronic product provided by an embodiment of the utility model.
[0027] In the figure:
[0028] 1: circulation pipeline; 2: electromagnetic pump; 3: heating element; 4: shell; 5: system end; 6: display end;
[0029] 11: first pipeline; 12: second pipeline; 13: sealing ring;
[0030] 21: first electromagnetic pump; 22: second electromagnetic pump;
[0031] 51: foot pad; 52: through hole; 53: receiving groove; 54: bracket. DETAILED DESCRIPTION
[0032] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0033] An embodiment of the utility model provides a heat dissipation structure, including a circulation pipeline, liquid metal and an electromagnetic pump; the circulation pipeline is set according to the heat dissipation requirements, the liquid metal is located in the circulation pipeline, and is used to exchange heat with the heating element, and the electromagnetic pump is used to provide power for the liquid metal, so that the liquid metal circulates in the circulation pipeline.
[0034] The embodiment of the utility model also provides an electronic product, which uses the above-mentioned heat dissipation structure to exchange heat and dissipate heat from the heating elements in the electronic product. The above-mentioned heat dissipation structure is not limited by the bending angle and can perform cyclic heat dissipation on different planes with angles, thereby achieving higher heat dissipation efficiency.
[0035] The heat dissipation structure and various structures in the electronic product provided by the embodiment of the utility model, as well as the positional relationship and connection relationship of the various structures are described in detail below in conjunction with the accompanying drawings.
[0036] like Figures 1 to 3 As shown, the circulation path setting of the circulation pipeline 1 can be determined according to the position of the heating element 3, the heat dissipation position and the area of the electronic product. For example, the electronic product with the heat dissipation structure includes multiple heating elements 3 that need to be dissipated. A set of curved circulation pipelines 1 can be set, or multiple sets of circulation pipelines 1 for different heating elements 3 can be set. The circulation pipeline 1 is filled with liquid metal, and a part of the circulation pipeline 1 is used for heat exchange with the heating element 3, and another part of the circulation pipeline 1 is used for heat exchange with the shell 4 of the electronic product. For example, the outer wall of the circulation pipeline 1 directly contacts the heating element 3 or the shell 4 of the electronic product for heat exchange, or indirectly contacts the heat exchange, for example, a heat conduction block (not shown in the figure) is connected to the outer wall of the circulation pipeline 1, and the circulation pipeline 1 contacts the heating element 3 or the shell 4 of the electronic product through the heat conduction block for heat exchange.
[0037] In the embodiment of the utility model, the liquid metal only needs to meet the thermal conductivity requirement, and there is no limitation on its material.
[0038] Since liquid metal has a high electrical conductivity, a silent, low-energy-consuming, and mechanically moving-part-free electromagnetic pump 2 can be used to provide driving force (thrust). The electromagnetic pump 2 is arranged on the outer wall of the circulation pipeline 1, and one or more electromagnetic pumps 2 can be arranged according to the driving force requirements. Specifically, the electromagnetic pump 2 drives the conductor of the liquid metal in the magnetic field, and when the current passes through, the conductor will be subjected to the thrust of the magnetic field, wherein the directions of the magnetic field, the current, and the flow direction of the liquid metal are perpendicular to each other. The magnitude of the driving force (thrust) is directly related to the magnitude of the current flowing through the conductor (liquid metal). Therefore, when it is necessary to accelerate or slow down the flow speed of the liquid metal, dynamic control can be achieved, that is, the magnitude of the current applied to the liquid metal is dynamically adjusted according to the temperature of the heating element 3.
[0039] In the embodiment of the utility model, the circulation path formed by a circulation pipeline 1 is located in the same plane. When the circulation pipeline 1 is installed, the circulation pipeline 1 contacts and exchanges heat with the heating element 3 and the electronic product housing 4 in the same plane. However, in actual application, it is necessary to use a circulation pipeline 1 with a certain angle. Therefore, under this structure, multiple circulation pipelines 1 can be set, and the joints of the circulation pipelines 1 are set as a rotatable structure. Through the rotation connection, the angle between the planes where the circulation pipelines 1 are located between different planes can be adjusted.
[0040] For example, the circulation pipeline 1 includes a first pipeline 11 and a second pipeline 12, and the first pipeline 11 and / or the second pipeline 12 are used for contacting and exchanging heat with the heating element 3; the two ends of the first pipeline 11 are respectively rotatably connected with the two ends of the second pipeline 12, the first pipeline 11 is located in a first plane, the second pipeline 12 is located in a second plane, and there is a set angle between the first plane and the second plane. For example, the set angle is a fixed angle, such as 90 degrees or 120 degrees, or, for example, the angle is a variable angle, such as varying between 90 degrees and 120 degrees.
[0041] The junction of the first pipeline 11 and the second pipeline 12 is located on the same straight line, and the relative angle between the first pipeline 11 and the second pipeline 12 is adjusted with the straight line as the rotation axis. For example, the end of the first pipeline 11 is sleeved on the end of the second pipeline 12, and in the sleeved portion of the first pipeline 11 and the second pipeline 12, a sealing ring 13 is provided between the inner wall of the first pipeline 11 and the outer wall of the second pipeline 12. For example, the sealing ring 13 is a type II sealing ring. While ensuring the rotation between the first pipeline 11 and the second pipeline 12, a good sealing effect is achieved.
[0042] For example, the cross-sectional shape of the circulation pipeline 1 (the first pipeline 11 and the second pipeline 12) can be circular, or elliptical, etc., or, for example, the contact side of the circulation pipeline 1 and the electronic product shell 4 is set to be flat, which includes a flat contact surface, so that when the circulation pipeline 1 contacts the shell 4, it has a larger contact area, which facilitates heat exchange between the circulation pipeline 1 and the shell 4.
[0043] like Figure 4 As shown, based on the above heat dissipation structure, the embodiment of the utility model provides an electronic product, which includes the above heat dissipation structure, and the heat dissipation structure includes a circulation pipeline 1 located in the same plane, and the circulation pipeline 1 is used to dissipate heat from the heating element 3 of the electronic product. Among them, a part of the circulation pipeline 1 contacts and exchanges heat with the heating element 3 in the electronic product, and another part of the circulation pipeline 1 contacts and exchanges heat with the shell 4 of the electronic product. The circulation pipeline 1 and the heating element 3 and the shell 4 of the electronic product are in direct contact and heat exchange, or indirect contact and heat exchange. In the case of indirect heat exchange, a heat conduction block can be arranged between the heating element 3 and / or the shell 4 of the electronic product. Taking the heating element 3 as an example, the size and area of the heat conduction block are the same as the surface of the heating element 3, and the two are closely fitted to achieve the maximum heat exchange area; or, for example, on the surface of the heat conduction block, a semi-arc groove structure is arranged, and the curvature of the groove structure is adapted to the curvature of the circulation pipeline 1, so that the heat conduction pipe and the circulation pipeline 1 have a larger contact area. In the embodiment of the utility model, the material of the heat conduction block is not limited, and it can meet the heat conduction requirements.
[0044] For example, the electronic product is a mobile terminal, a tablet computer, etc. In the electronic product, the main control chip is a high-heat generating electronic component. The circulation pipeline 1 is arranged in the electronic product, part of the circulation pipeline 1 is attached to the surface of the main control chip, and the rest is in contact with the shell 4 of the electronic product. Among them, the electromagnetic pump 2 is fixedly connected to the shell 4 of the electronic product. For the specific installation method of the electromagnetic pump 2, refer to the description below.
[0045] like Figures 5 to 7 As shown, an embodiment of the utility model further provides an electronic product, including a system end 5 and a display end 6, and the above-mentioned heat dissipation structure; a first pipeline 11 is arranged at the system end 5, and a part of the first pipeline 11 is in contact with the heating element 3 of the system end 5 for heat exchange, and another part of the first pipeline 11 is in contact with the shell of the system end 5 for heat exchange; a second pipeline 12 is arranged at the display end 6, and the second pipeline 12 is in contact with the shell of the display end 6 for heat exchange.
[0046] For example, the electronic product is a laptop computer, which includes a mainboard at the system end 5. A main control chip is arranged on the mainboard. The main control chip is a high-heat generating electronic component. The first pipeline 11 contacts and exchanges heat with the main control chip. After a portion of the first pipeline 11 exchanges heat with the main control chip, the liquid metal absorbs heat and heats up. As the liquid metal flows, the liquid metal exchanges heat with the housing 4 of the electronic product at other locations, thereby reducing the temperature of the liquid metal.
[0047] For example, the liquid metal is circulated to the display terminal 6 through the second pipeline 12, and the second circuit is deployed in a certain area at the display terminal 6, further increasing the heat exchange area of the liquid metal, thereby improving the heat exchange efficiency. Or, for example, the system terminal 5 or the display terminal 6 also includes other heating elements 3 that need to dissipate heat, and the first pipeline 11 and / or the second pipeline 12 are arranged at the heating elements 3 that need heat exchange, and contact heat exchange is performed through liquid metal.
[0048] The first pipeline 11, the second pipeline 12 and the heating element 3 and the shell 4 of the electronic product are in direct contact heat exchange, or indirect contact heat exchange. In the case of indirect heat exchange, a heat-conducting block can be set between the heating element 3 and / or the shell 4 of the electronic product. Taking the heating element 3 as an example, the size and area of the heat-conducting block are the same as the surface of the heating element 3, and the two fit tightly to achieve the maximum heat exchange area; or, for example, on the surface of the heat-conducting block, a semi-arc groove structure is set, and the curvature of the groove structure is adapted to the curvature of the first pipeline 11 and the second pipeline 12, so that the heat-conducting pipe has a larger contact area with the first pipeline 11 and the second pipeline 12. In the embodiment of the utility model, the material of the heat-conducting block is not limited, and it only needs to meet the heat conduction requirements.
[0049] The electromagnetic pump 2 can effectively provide thrust for the electromagnetic pump 2, but the electromagnetic pump 2 has a certain thickness. After being set in the electronic product, it occupies a certain thickness, which is not conducive to the development of ultra-thin electronic products. In the embodiment of the utility model, the position of the electromagnetic pump 2 is optimized to reduce the space occupied by the electromagnetic pump 2 in the thickness direction of the electronic product.
[0050] For example, in the embodiment of the utility model, a plurality of first electromagnetic pumps 21 are arranged on the first pipeline 11, and a foot pad 53 is arranged at the bottom of the housing 4 of the system end 5; the first electromagnetic pump 21 is arranged in the foot pad 53. The foot pad 53 is arranged on the outside of the housing 4, and the foot pad 53 can make the system end 5 have a certain distance from the placement plane, so the foot pad 53 occupies a certain thickness, and the electromagnetic pump 2 is placed in the foot pad 53, which can effectively reduce the thickness occupied by the electromagnetic pump 2 in the housing 4.
[0051] For example, a through hole 52 is provided on the inner wall of the shell 4 of the system end 5 at a position overlapping with the foot pad 53, a receiving groove 53 is provided on the foot pad 53, and the notch of the receiving groove 53 is connected with the through hole 52, and the first electromagnetic pump 21 is located in the receiving space formed by the receiving groove 53 and the through hole 52. For example, the top surface of the foot pad 53 is provided with the receiving groove 53, and the top surface of the foot pad 53 is bonded to the shell 4. Or, for example, the outer wall of the electromagnetic pump 2 is fixedly connected to the inner wall of the receiving groove 53 to improve the stability of the installation of the electromagnetic pump 2. For example, the outer wall of the electromagnetic pump 2 is clamped or bonded to the receiving groove 53, etc.
[0052] For example, in the embodiment of the utility model, the system end 5 and the display end 6 are connected by a rotating shaft (not shown in the figure); the second electromagnetic pump 22 is respectively provided at both ends of the second pipeline 12; the outer wall of the second electromagnetic pump 22 is connected to the rotating shaft, and the second electromagnetic pump 22 and the end of the second pipeline 12 rotate synchronously with the rotating shaft. The opening and closing state of the system end 5 and the display end 6 is realized by the rotating shaft, wherein the rotating shaft includes a rotating part, and connecting parts are respectively provided on both sides of the rotating part, the display end 6 is connected to one connecting part, and the system end 5 is connected to the other connecting part. When the display end 6 rotates, the rotating part can be driven to rotate. The outer side of the rotating shaft can be wrapped with a rotating shaft shell, and the rotating shaft shell can have a certain space in addition to the rotating shaft. Therefore, the second electromagnetic pump 22 is arranged inside the rotating shaft shell. For example, a bracket 54 is provided at the bottom of the second electromagnetic pump 22, and the second electromagnetic pump 22 is connected to the rotating shaft through the bracket 54.
[0053] During the rotation of the display terminal 6 , the bracket 54 rotates synchronously with the shaft, wherein the bracket 54 drives the electromagnetic pump 2 and the second pipeline 12 to rotate synchronously. Since the second pipeline 12 is rotatably connected to the first pipeline 11 , the first pipeline 11 will not rotate synchronously with the second pipeline 12 .
[0054] In the embodiment of the utility model, by reasonably setting the position of the electromagnetic pump 2, the influence on the thickness direction of the electronic product can be reduced, which is still beneficial to the ultra-thin design of the electronic product.
[0055] The utility model provides a heat dissipation structure and electronic products, which utilize liquid metal for circulating heat dissipation, wherein the liquid metal has a high thermal conductivity, the thermal resistance of the circulation system is small, and the heat dissipation efficiency is high; in addition, due to the high electrical conductivity of the liquid metal, it can be driven by an electromagnetic pump 2, and the electromagnetic pump 2 has the advantages of no noise, low energy consumption, and no mechanical moving parts when in use; and the electronic products used in the heat dissipation structure are not limited by the angle of the circulation pipeline 1, and can be used in a multi-faceted structure with an angle, further increasing the heat exchange area and heat exchange efficiency.
[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.
[0057] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0058] The above are only specific implementations of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
Claims
1. A heat dissipation structure, characterized in that: It comprises a circulation pipeline (1), liquid metal and an electromagnetic pump (2); The circulation pipeline (1) is filled with the liquid metal, a portion of the circulation pipeline (1) is used for contacting and exchanging heat with the heating element (3), and another portion of the circulation pipeline (1) is used for contacting and exchanging heat with the housing (4) of the electronic product; At least one electromagnetic pump (2) is arranged on the outer wall of the circulation pipeline (1), and the electromagnetic pump (2) is used to drive the liquid metal in the circulation pipeline (1) to circulate.
2. The heat dissipation structure according to claim 1, characterized in that: The circulation pipeline (1) comprises a first pipeline (11) and a second pipeline (12), wherein the first pipeline (11) and / or the second pipeline (12) are used for contacting and exchanging heat with the heating element (3); The two ends of the first pipeline (11) are rotatably connected to the two ends of the second pipeline (12), respectively; the first pipeline (11) is located in a first plane, the second pipeline (12) is located in a second plane, and there is a set angle between the first plane and the second plane.
3. The heat dissipation structure according to claim 2, characterized in that: The end of the first pipeline (11) is sleeved on the end of the second pipeline (12), and a sealing ring (13) is provided in the sleeved portion of the first pipeline (11) and the second pipeline (12), between the inner wall of the first pipeline (11) and the outer wall of the second pipeline (12).
4. An electronic product, characterized in that: comprising the heat dissipation structure as claimed in claim 1; A portion of the circulation pipeline (1) contacts and exchanges heat with a heating element (3) in the electronic product, and another portion of the circulation pipeline (1) contacts and exchanges heat with a housing (4) of the electronic product.
5. An electronic product, characterized in that: It comprises a system end (5) and a display end (6), and a heat dissipation structure as claimed in claim 2 or 3; The first pipeline (11) is arranged at the system end (5), and a part of the first pipeline (11) is in contact with the heating element (3) of the system end (5) for heat exchange, and another part of the first pipeline (11) is in contact with the shell of the system end (5) for heat exchange; The second pipeline (12) is arranged at the display end (6), and the second pipeline (12) is in contact with the shell of the display end (6) for heat exchange.
6. The electronic product according to claim 5, characterized in that: A plurality of first electromagnetic pumps (21) are provided on the first pipeline (11), and a foot pad (51) is provided at the bottom of the shell of the system end (5); The first electromagnetic pump (21) is arranged in the foot pad (51).
7. The electronic product according to claim 6, characterized in that: A through hole (52) is provided on the inner wall of the shell of the system end (5) at a position overlapping with the foot pad (51); a receiving groove (53) is provided on the foot pad (51); a notch of the receiving groove (53) is connected to the through hole (52); and the first electromagnetic pump (21) is located in a receiving space formed by the receiving groove (53) and the through hole (52).
8. The electronic product according to claim 5, characterized in that: The system end (5) and the display end (6) are connected via a rotating shaft; second electromagnetic pumps (22) are respectively provided at both ends of the second pipeline (12); The outer wall of the second electromagnetic pump (22) is connected to the rotating shaft, and the second electromagnetic pump (22) and the end of the second pipeline (12) rotate synchronously with the rotating shaft.
9. The electronic product according to claim 8, characterized in that: A bracket (54) is provided at the bottom of the second electromagnetic pump (22), and the second electromagnetic pump (22) is connected to the rotating shaft via the bracket (54).
10. The electronic product according to claim 5, characterized in that: The outer wall of the first pipeline (11) is connected to a heat-conducting block, and the first pipeline (11) is in contact with the heating element (3) for heat exchange through the heat-conducting block.