Air conveying mechanism of reflow soldering machine

Abstract

The utility model discloses a wind conveying mechanism of a reflow soldering machine, which relates to the technical field of reflow soldering machines and comprises a reflow soldering machine main body, a conveying chain plate is fixedly arranged on the reflow soldering machine main body, a top cover is fixedly arranged at the top of the reflow soldering machine main body and above the conveying chain plate, and a guide mechanism is arranged on the inner side of the top cover. An air supply pump and absorption type waste gas treatment equipment are sequentially installed on the reflow soldering machine body and close to the top cover, a U-shaped air guide pipe is fixedly installed between the air supply pump and the absorption type waste gas treatment equipment, the guide mechanism comprises flow guide grooves evenly formed in the top of the inner side of the top cover, and a partition plate is fixedly installed on the top cover and located below the flow guide grooves. By collecting and recycling hot air, the energy consumption is greatly reduced, the production cost can be reduced, the hot air recycling system is environment-friendly, carbon emission is reduced, and direct emission of hot air into a workshop can be effectively reduced, so that the temperature of the workshop is reduced, and the working environment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering machines, in particular to an air conveying mechanism of a reflow soldering machine. Background Art

[0002] Reflow soldering machine, also known as reflow soldering machine or "reflow oven", is an important electronic device. Its main function is to provide a heating environment to melt the solder paste by heat, so that the surface mounted components and PCB pads can be reliably combined together through the solder paste alloy. The solder of this welding technology is solder paste, and the process includes drying, preheating, melting, wetting and cooling of the solder paste. According to the development of technology, reflow soldering machines can be divided into many types, including vapor phase reflow soldering, infrared reflow soldering, far infrared reflow soldering, infrared heating air reflow soldering and full hot air reflow soldering, water-cooled reflow soldering, etc. This welding technology has developed with the emergence of miniaturized electronic products and is mainly used in electronic integrated boards.

[0003] During the operation of the reflow soldering machine, hot air is an important medium to complete the soldering process. However, during the operation of the reflow soldering machine, a large amount of hot air will be directly discharged into the workshop environment after soldering is completed, which not only causes energy waste, but also increases the temperature of the workshop and deteriorates the working environment. Therefore, we propose an air transport mechanism for the reflow soldering machine to solve the above technical problems. Utility Model Content

[0004] In view of this, the present invention is missing, and its main purpose is to provide an air supply mechanism for a reflow soldering machine, which serves to solve the above-mentioned problem.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: it includes a reflow soldering machine body, a conveying chain plate is fixedly arranged on the reflow soldering machine body, a top cover is fixedly installed on the top of the reflow soldering machine body and above the conveying chain plate, a guiding mechanism is arranged on the inner side of the top cover, an air supply pump and an absorption-type exhaust gas treatment device are sequentially installed on the reflow soldering machine body and near the top cover, and a U-shaped air guide duct is fixedly installed between the air supply pump and the absorption-type exhaust gas treatment device.

[0006] As a preferred solution, the guiding mechanism includes a guide groove evenly opened on the inner top of the top cover, a partition plate is fixedly installed on the top cover and below the guide groove, and the partition plate has flow holes evenly opened on it.

[0007] As a preferred solution, the guide groove passes through the top cover, an L-shaped circular tube is fixedly connected to the absorption-type exhaust gas treatment equipment, connectors are evenly installed on one side of the L-shaped circular tube close to the top cover, and a sealing tube is fixedly installed on one end of the connector away from the L-shaped circular tube.

[0008] As a preferred solution, one end of the sealing tube away from the connector is fixedly connected to the top cover, and the sealing tube sleeve is arranged on the outside of the guide groove.

[0009] As a preferred solution, a connecting pipe is fixedly connected to the air supply pump, the connecting pipe is U-shaped, and air supply pipes are symmetrically installed on the connecting pipe. The air supply pipes are symmetrically distributed on both sides of the conveying chain plate and correspond to the conveying chain plate.

[0010] As a preferred solution, a pre-loading hole is symmetrically opened on the top cover and located below the circulation hole, a loading hole is opened on the pre-loading hole, the connecting tube is plugged into the loading hole, and the connecting tube is arranged on the inner side of the pre-loading hole, and a sealing plate is fixedly installed on the top cover and located on the outer side of the pre-loading hole.

[0011] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that it mainly has the following advantages:

[0012] The device is used to control and guide the hot air through the top cover when the device is processing, so that there is enough hot air flowing inside the device for processing the circuit board. The guiding mechanism is used to guide the hot air inside the device when the device is in use, so that harmful gases have a limited flow direction. The absorption-type exhaust gas treatment equipment is used to recover the hot air gas after internal use. During the recovery process, the harmful gases in the hot air are filtered by the absorption-type exhaust gas treatment equipment. After filtering, the hot air is introduced into the interior of the air supply pump through the U-shaped air guide duct. The hot air recovered by the air supply pump is redirected into the inner side of the top cover for processing the circuit board. Therefore, the device greatly reduces energy consumption by collecting and reusing hot air, which not only reduces production costs, but is also environmentally friendly and reduces carbon emissions. In addition, the hot air recycling system can effectively reduce the direct discharge of hot air into the workshop, thereby reducing the workshop temperature and improving the working environment.

[0013] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0015] Figure 2 It is a schematic diagram of the internal structure of an embodiment of the utility model;

[0016] Figure 3 It is a schematic diagram of the top cover structure of an embodiment of the utility model;

[0017] Figure 4It is a schematic cross-sectional view of the top cover structure of an embodiment of the utility model.

[0018] Explanation of the reference numerals: 1. Reflow soldering machine body; 2. Conveyor chain plate; 3. Air supply pump; 4. Absorption-type exhaust gas treatment equipment; 5. U-shaped air duct; 6. Connecting pipe; 7. Air supply pipe; 8. L-shaped circular pipe; 9. Connecting head; 10. Sealing pipe; 11. Top cover; 12. Pre-installed hole; 13. Sealing plate; 14. Loading hole; 15. Partition plate; 16. Flow hole; 17. Guide groove. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0021] See also Figures 1 to 4 The embodiment of the utility model provides an air conveying mechanism of a reflow soldering machine, comprising a reflow soldering machine body 1, a conveying chain plate 2 is fixedly arranged on the reflow soldering machine body 1, a top cover 11 is fixedly installed on the top of the reflow soldering machine body 1 and above the conveying chain plate 2, a guiding mechanism is arranged on the inner side of the top cover 11, an air supply pump 3 and an absorption-type exhaust gas treatment device 4 are sequentially installed on the reflow soldering machine body 1 and near the top cover 11, and a U-shaped air guide duct 5 is fixedly installed between the air supply pump 3 and the absorption-type exhaust gas treatment device 4;

[0022] In this embodiment, the reflow soldering machine body 1 serves as the main body of the equipment, and is used to process the circuit board. The circuit board described here is the prior art and will not be described in detail in this article. The conveying chain plate 2 is used to control the flow of the circuit board when the circuit board is processed. The top cover 11 is used to control and guide the hot air when the device is processed, so that there is enough hot air flowing inside the device for processing the circuit board. The guiding mechanism is used to guide the internal hot air when the device is used, so that the harmful gas has a limited flow direction. The absorption-type exhaust gas treatment device 4 is used to remove the internal hot air. The used hot air gas is recovered, and during the recovery process, harmful gases in the hot air are filtered by the absorption-type exhaust gas treatment equipment 4. After filtering, the hot air is introduced into the interior of the air supply pump 3 through the U-shaped air duct 5. The hot air recovered by the air supply pump 3 is redirected into the inner side of the top cover 11 for processing the circuit board. The device greatly reduces energy consumption by collecting and reusing hot air, which not only reduces production costs, but is also environmentally friendly and reduces carbon emissions. In addition, the hot air recycling system can effectively reduce the direct discharge of hot air into the workshop, thereby reducing the workshop temperature and improving the working environment.

[0023] See also Figures 1 to 4 The guide mechanism includes a guide groove 17 evenly provided on the inner top of the top cover 11, a partition plate 15 is fixedly installed on the top cover 11 and below the guide groove 17, and a flow hole 16 is evenly provided on the partition plate 15;

[0024] In this embodiment, the flowing hot air can be linearly guided by the streamlined guide groove 17 so that the hot air can flow to a specified position, and the guide groove 17 can also prevent the hot air from turbulent inside the top cover 11 and affect the processing environment of the circuit board. The partition plate 15 is used to block the internal space of the top cover 11, and the flow hole 16 is used for the flow of hot air inside the top cover 11.

[0025] See also Figures 1 to 4 , the guide groove 17 passes through the top cover 11, the absorption type exhaust gas treatment device 4 is fixedly connected with an L-shaped circular tube 8, and a connector 9 is evenly installed on the L-shaped circular tube 8 and on one side close to the top cover 11. A sealing tube 10 is fixedly installed on the end of the connector 9 away from the L-shaped circular tube 8, and the end of the sealing tube 10 away from the connector 9 is fixedly connected to the top cover 11, and the sealing tube 10 is sleeved on the outside of the guide groove 17;

[0026] In this embodiment, by starting the absorption-type exhaust gas treatment equipment 4, the hot air inside the top cover 11 enters the sealing tube 10 through the guide groove 17, and then enters the connecting head 9 and the L-shaped circular tube 8 along the sealing tube 10, and then flows into the interior of the absorption-type exhaust gas treatment equipment 4 for filtration.

[0027] See also Figures 1 to 4 The air supply pump 3 is fixedly connected with a connecting pipe 6, the connecting pipe 6 is U-shaped, and the connecting pipe 6 is symmetrically installed with an air supply pipe 7, which is symmetrically distributed on both sides of the conveying chain plate 2 and corresponds to the conveying chain plate 2;

[0028] In this embodiment, the hot air filtered by the absorption-type exhaust gas treatment equipment 4 is introduced into the interior of the air supply pump 3 through the U-shaped air duct 5, and the air supply pump 3 pumps the hot air into the connecting pipe 6, and then passes through the air supply pipe 7 to blow the hot air onto the circuit board being processed and located on the top of the conveying chain plate 2.

[0029] See also Figures 1 to 4 A pre-installation hole 12 is symmetrically provided on the top cover 11 and below the flow hole 16, a loading hole 14 is provided on the pre-installation hole 12, a connecting pipe 6 is plugged into the loading hole 14, and the connecting pipe 6 is arranged on the inner side of the pre-installation hole 12, and a sealing plate 13 is fixedly installed on the top cover 11 and on the outer side of the pre-installation hole 12;

[0030] In this embodiment, the pre-installation hole 12 is used to load the connecting tube 6, the loading hole 14 is used to limit the connecting tube 6, and the sealing plate 13 is used to seal the pre-installation hole 12 to prevent hot air from escaping from the pre-installation hole 12 during the process of processing the circuit board by the device.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wind conveying mechanism for a reflow soldering machine, characterized in that: The invention comprises a reflow soldering machine body (1), a conveying chain plate (2) being fixedly arranged on the reflow soldering machine body (1), a top cover (11) being fixedly installed on the top of the reflow soldering machine body (1) and above the conveying chain plate (2), a guiding mechanism being arranged on the inner side of the top cover (11), an air supply pump (3) and an absorption-type waste gas treatment device (4) being sequentially installed on the reflow soldering machine body (1) and near the top cover (11), and a U-shaped air guide duct (5) being fixedly installed between the air supply pump (3) and the absorption-type waste gas treatment device (4).

2. The air conveying mechanism of a reflow soldering machine according to claim 1, characterized in that: The guide mechanism comprises a guide groove (17) evenly arranged on the top of the inner side of the top cover (11); a partition plate (15) is fixedly installed on the top cover (11) and below the guide groove (17); and flow holes (16) are evenly arranged on the partition plate (15).

3. The air conveying mechanism of the reflow soldering machine according to claim 2, characterized in that: The guide groove (17) passes through the top cover (11); an L-shaped circular tube (8) is fixedly connected to the absorption-type waste gas treatment device (4); a connector (9) is evenly installed on one side of the L-shaped circular tube (8) close to the top cover (11); and a sealing tube (10) is fixedly installed on one end of the connector (9) away from the L-shaped circular tube (8).

4. The air conveying mechanism of the reflow soldering machine according to claim 3, characterized in that: One end of the sealing tube (10) away from the connector (9) is fixedly connected to the top cover (11), and the sealing tube (10) is sleeved on the outside of the guide groove (17).

5. The air conveying mechanism of the reflow soldering machine according to claim 1, characterized in that: The air supply pump (3) is fixedly connected to a connecting pipe (6), the connecting pipe (6) is U-shaped, and air supply pipes (7) are symmetrically mounted on the connecting pipe (6), the air supply pipes (7) are symmetrically distributed on both sides of the conveying chain plate (2) and correspond to the conveying chain plate (2).

6. The air conveying mechanism of the reflow soldering machine according to claim 5, characterized in that: A pre-installation hole (12) is symmetrically provided on the top cover (11) and located below the circulation hole (16); a loading hole (14) is provided on the pre-installation hole (12); the connecting pipe (6) is plugged into the loading hole (14), and the connecting pipe (6) is arranged on the inner side of the pre-installation hole (12); and a sealing plate (13) is fixedly installed on the top cover (11) and located on the outer side of the pre-installation hole (12).

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