Electroplating anode device and electroplating equipment

Abstract

The utility model discloses an electroplating anode device and electroplating equipment, which comprise at least one anode plate and a support frame, at least one hollowed-out area is arranged in the supporting frame, and the hollowed-out areas and the anode plates are arranged in a one-to-one correspondence mode; a plurality of jet pipes are arranged in each hollow area, a plurality of jet holes facing the lower surface of the anode plate are formed in each jet pipe, and a plating solution jetted from the jet holes is jetted to the surface of the anode plate so as to wash away bubbles accumulated on the surface of the insoluble anode; and the problem of non-uniform film coating on the surface of the film caused by the fact that bubbles block a power line between the anode and the film surface is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, and more specifically to an electroplating anode device and electroplating equipment. Background Art

[0002] The composite copper foil is made of a "sandwich" structure of metal + polymer film + metal and the key processes of magnetron sputtering and water electroplating. The middle layer of the composite copper foil is usually a base film made of polymer materials such as PET, PP, PI, etc., and the two sides of the base film are copper layers with a thickness of about 1μm. The middle polymer substrate layer has insulating properties. When the lithium battery is heated and the circuit is cut off, the short-circuit current can be greatly reduced in a short time, and it can also effectively prevent lithium dendrites from penetrating the diaphragm and causing thermal runaway.

[0003] In the preparation process of composite copper foil, the copper layer is usually thickened by electroplating. Existing electroplating equipment uses insoluble anodes for electroplating in plating solutions. When electroplating the film, oxygen is precipitated on the surface of the insoluble anode, which will produce a certain amount of bubbles. Excessive bubbles accumulate on the anode plate to block the electric lines between the film surface and the anode, resulting in uneven coating thickness on the film surface. Therefore, it is necessary to remove the bubbles generated on the surface of the insoluble anode to allow sufficient electroplating between the anode and the film surface. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides an electroplating anode device to solve the problem that bubbles precipitated from the surface of the insoluble anode affect the uniformity of the plating layer.

[0005] The technical solution of the utility model is as follows: an electroplating anode device, comprising:

[0006] Anode plate;

[0007] A support frame, the anode plate is arranged on the support frame, at least one hollow area is arranged in the support frame, a plurality of jet tubes are arranged in each of the hollow areas, and each of the jet tubes is provided with a plurality of jet holes facing the lower surface of the anode plate.

[0008] Furthermore, the support frame is hollow inside to form a plating liquid cavity for the plating liquid to flow through, and the plating liquid cavity is communicated with the inner cavity of the jet tube.

[0009] Furthermore, a trapezoidal mounting groove is provided on the outer side of each of the hollow regions, the anode plate is in a trapezoidal shape, and the anode plate is installed in the trapezoidal mounting groove.

[0010] Furthermore, the support frame includes a main frame, a first bracket and a second bracket, the first bracket is arranged in the main frame and along the length direction of the main frame, and a plurality of second brackets are arranged, and the plurality of second brackets are evenly distributed on both sides of the first bracket.

[0011] Furthermore, at least one anode plate is provided, and the anode plate and the hollow area are provided in a one-to-one correspondence.

[0012] Furthermore, a mounting hole is provided in the second bracket and passes through two sides of the second bracket in a horizontal direction, and the plurality of jet tubes arranged in a straight line in the horizontal direction are connected through the mounting hole.

[0013] Furthermore, the main frame includes a first frame body and a second frame body, two first frames and two second frames are connected end to end to form a rectangular structure, and the two first frames are arranged opposite to each other, and the plating liquid chamber extends along the length direction of the first frame body.

[0014] Furthermore, a connecting hole for connecting with a plating liquid pipe is provided on a side wall of the first frame body, and a plurality of the connecting holes are provided, and all of the plurality of connecting holes are communicated with the plating liquid chamber.

[0015] Furthermore, the plurality of connection holes are arranged at equal intervals.

[0016] In addition, the utility model also provides an electroplating device, which includes the above-mentioned electroplating anode device.

[0017] The utility model according to the above scheme has the beneficial effects of: an electroplating anode device, comprising an anode plate and a supporting frame, at least one anode plate is provided; at least one hollow area is provided in the supporting frame, and the hollow area and the anode plate are provided in a one-to-one correspondence; a plurality of jet tubes are provided in each hollow area, and each jet tube is provided with a plurality of jet holes facing the lower surface of the anode plate, and the plating solution ejected from the jet holes is jetted toward the surface of the anode plate to wash away the bubbles accumulated on the surface of the insoluble anode, thereby avoiding the problem of uneven coating on the surface of the thin film caused by bubbles blocking the electric lines between the anode and the membrane surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1A schematic diagram of the three-dimensional structure of an electroplating anode device in an embodiment of the utility model;

[0020] Figure 2 A top view of an electroplating anode device in an embodiment of the utility model;

[0021] Figure 3 It is a schematic diagram of the three-dimensional structure of the support frame in the embodiment of the utility model;

[0022] Figure 4 It is a partial structural schematic diagram of the support frame in the embodiment of the utility model.

[0023] In the figure, 1, anode plate; 2, supporting frame; 21, main frame; 211, first frame; 2111, connecting hole; 212, second frame; 22, first bracket; 23, second bracket; 231, mounting hole; 24, hollow area; 25, trapezoidal mounting groove; 3, jet tube; 31, jet hole. DETAILED DESCRIPTION

[0024] The following detailed description and drawings of the embodiments of the present invention are used to illustrate the principle of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the embodiments described.

[0025] In order to better understand the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0026] See also Figure 1 As shown, an electroplating anode device provided by an embodiment of the utility model includes an anode plate 1 and a supporting frame 2.

[0027] In this embodiment, the anode plate 1 is provided with at least one, and at least one hollow area 24 is provided in the support frame 2, and the hollow area 24 and the anode plate 1 are provided in a one-to-one correspondence, so as to facilitate the installation of the anode plate 1 in the hollow area 24. In this embodiment, a plurality of jet tubes 3 are provided in each hollow area 24, and a plurality of jet holes 31 facing the lower surface of the anode plate 1 are opened on each jet tube 3. Such a design can ensure that the plating solution is sprayed to the lower surface of the anode plate 1, effectively washes away the bubbles accumulated on the surface of the insoluble anode, and can break the attachment of the bubbles on the surface of the anode plate 1, preventing the accumulation and retention of bubbles. Secondly, the plating solution sprayed through the jet hole 31 can replenish the plating solution.

[0028] Specifically, during the electroplating process, bubbles are easily generated on the anode surface due to the electrolytic reaction. If these bubbles are not removed in time, they will hinder the electroplating reaction and cause the quality of the coating to deteriorate. In this embodiment, the plating solution ejected through the jet hole 31 can flush away the bubbles on the anode surface, keep the anode surface clean and reactive, and make the entire electroplating process stable and controllable.

[0029] The interior of the support frame 2 is hollow to form a plating liquid cavity for the plating liquid to flow through. The plating liquid cavity is connected to the inner cavity of the jet tube 3, ensuring that the plating liquid can smoothly enter the jet tube 3 and be sprayed onto the lower surface of the anode plate 1 through the jet hole 31. The replenishment and flow of the plating liquid are efficient. At the same time, it also ensures that the plating liquid can flow from the plating liquid cavity into the jet tube 3 so that the jet hole 31 can continuously and stably spray the plating liquid to wash away the bubbles on the surface of the anode plate 1.

[0030] See also Figure 2 and Figure 3 As shown, a trapezoidal mounting groove 25 is provided on the outside of each hollow area 24, the anode plate 1 is in a trapezoidal shape, and the anode plate 1 is installed in the trapezoidal mounting groove 25. Specifically, the cooperation between the trapezoidal mounting groove 25 and the trapezoidal anode plate 1 improves the installation firmness of the anode plate 1, and the trapezoidal structure has a self-locking property. Once the anode plate 1 is placed in the trapezoidal mounting groove 25, its shape can ensure that the anode plate 1 will not be displaced in the horizontal direction, thereby greatly improving the stability and reliability of the installation.

[0031] Preferably, the support frame 2 includes a main frame 21, a first bracket 22 and a second bracket 23, the first bracket 22 is arranged in the main frame 21 and the first bracket 22 is arranged along the length direction of the main frame 21, and a plurality of second brackets 23 are arranged, and the plurality of second brackets 23 are evenly distributed on both sides of the first bracket 22. Specifically, the main frame 21, the first bracket 22 and the second bracket 23 are an integrated structure. Specifically, by designing the main frame 21, the first bracket 22 and the second bracket 23 as an integrated structure, not only the manufacturing process is simplified and the production cost is reduced, but also the close connection between the structures is ensured, the problem of loose connection or breakage between different components is avoided, and the reliability and durability of the entire support frame 2 are improved.

[0032] See also Figure 4 As shown, the second bracket 23 is provided with mounting holes 231 penetrating through both sides of the second bracket 23 in the horizontal direction, and the multiple jet tubes 3 arranged in a straight line in the horizontal direction are connected through the mounting holes 231. Specifically, the arrangement of the mounting holes 231 enables the multiple jet tubes 3 to be arranged in a straight line in the horizontal direction and connected through the mounting holes 231. This layout ensures that the plating solution can flow smoothly from one jet tube 3 to another jet tube 3, and realizes the smooth flow of the plating solution in each jet tube 3.

[0033] Preferably, the main frame 21 includes a first frame body 211 and a second frame body 212 , the two first frames 211 and the two second frames 212 are connected end to end to form a rectangular structure, and the two first frames 211 are arranged opposite to each other, and the plating liquid chamber extends along the length direction of the first frame body 211 .

[0034] Preferably, the side wall of the first frame 211 is provided with a connection hole 2111 for connecting to the plating liquid tube, and there are multiple connection holes 2111, and the multiple connection holes 2111 are all connected to the plating liquid chamber. In this embodiment, the multiple connection holes 2111 are arranged at equal intervals.

[0035] For further explanation, the embodiment of the utility model also provides a working process of an electroplating anode device, which is as follows:

[0036] The connecting hole 2111 located on the side wall of the first frame 211 is connected to the plating liquid tube, so that the plating liquid chamber inside the first frame 211 and the external plating liquid storage chamber are connected. During electroplating, the plating liquid flows into the plating liquid chamber from the plating liquid tube, and flows into each jet tube 3 through the plating liquid chamber, and then the plating liquid is ejected from the jet hole 31 of the jet tube 3, which can not only expel the bubbles accumulated on the surface of the insoluble anode, but also replenish the plating liquid, and the plating liquid enters the vicinity of the anode plate 1 and the membrane surface in a dispersed manner from each jet hole 31, which can make the plating layer more uniform.

[0037] The indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the application is usually placed when used, or the orientation or position relationship commonly understood by technical personnel in this field, or the orientation or position relationship in which the product of the application is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0038] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0039] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. An electroplating anode device, characterized in that: include: Anode plate (1); A support frame (2), the anode plate (1) being arranged on the support frame (2), at least one hollow area (24) being arranged in the support frame (2), a plurality of jet tubes (3) being arranged in each of the hollow areas (24), and a plurality of jet holes (31) being opened on each of the jet tubes (3) and facing the lower surface of the anode plate (1).

2. An electroplating anode device as claimed in claim 1, characterized in that: The support frame (2) is hollow inside to form a plating liquid cavity for the plating liquid to flow through, and the plating liquid cavity is connected to the inner cavity of the jet tube (3).

3. An electroplating anode device as claimed in claim 1 or 2, characterized in that: A trapezoidal mounting groove (25) is provided on the outer side of each hollow area (24); the anode plate (1) is in a trapezoidal shape, and the anode plate (1) is mounted in the trapezoidal mounting groove (25).

4. An electroplating anode device as claimed in claim 2, characterized in that: The support frame (2) comprises a main frame (21), a first bracket (22) and a second bracket (23); the first bracket (22) is arranged in the main frame (21) and the first bracket (22) is arranged along the length direction of the main frame (21); a plurality of second brackets (23) are arranged, and the plurality of second brackets (23) are evenly distributed on both sides of the first bracket (22).

5. An electroplating anode device as claimed in claim 4, characterized in that: At least one anode plate (1) is provided, and the anode plate (1) and the hollow area (24) are provided in a one-to-one correspondence.

6. An electroplating anode device as claimed in any one of claims 4 to 5, characterized in that: The second bracket (23) is provided with a mounting hole (231) penetrating through both sides of the second bracket (23) in a horizontal direction, and a plurality of jet tubes (3) arranged in a straight line in the horizontal direction are connected through the mounting hole (231).

7. An electroplating anode device as claimed in any one of claims 4 to 5, characterized in that: The main frame (21) comprises a first frame body (211) and a second frame body (212); two first frame bodies (211) and two second frame bodies (212) are connected end to end to form a rectangular structure; the two first frame bodies (211) are arranged opposite to each other; and the plating liquid chamber extends along the length direction of the first frame body (211).

8. An electroplating anode device as claimed in claim 7, characterized in that: The side wall of the first frame (211) is provided with a connection hole (2111) for connecting with a plating liquid tube, and a plurality of the connection holes (2111) are provided, and the plurality of connection holes (2111) are all in communication with the plating liquid chamber.

9. An electroplating anode device as claimed in claim 8, characterized in that: The plurality of connection holes (2111) are arranged at equal intervals.

10. An electroplating device, characterized in that: A plating anode device comprising the electroplating anode device according to any one of claims 1 to 9.

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