Building thermal insulation material
By designing multi-layer structures in building insulation materials, including the temperature conduction layer and buffer layer, the problems of aesthetics, waterproofness and short service life of traditional insulation materials are solved, and better insulation effect and durability are achieved.
Patent Information
- Application Number
- CN202420673647.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-02
AI Technical Summary
Traditional thermal insulation materials have problems such as many joints, poor aesthetics, poor waterproofness and short service life in use environments, and lack effective thermal insulation reflective performance and cushioning, resulting in a gradual decline in thermal insulation effect.
A building insulation material was designed, including base layer, adhesive layer, mucosal protective layer, insulation layer, buffer layer, wear-resistant layer and anti-slip layer. The temperature guidance and concentration are achieved through the design of the temperature guide layer and the thermal storage layer, and the buffering is achieved. The partition structure of the layer absorbs force and uses wear and slip resistance to improve the durability of the material.
It effectively improves the thermal insulation reflective performance of the insulation material, reduces heat loss, extends service life, and adapts to thermal expansion and contraction changes through the design of the buffer layer, enhancing the durability and aesthetics of the material.
Smart Images
Figure CN222332994U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of thermal insulation materials, in particular to a building thermal insulation material. Background Art
[0002] Traditional thermal insulation materials are mainly based on increasing the gas phase void ratio and reducing the thermal conductivity and conduction coefficient. Fiber-based thermal insulation materials must have a thicker coating to increase convection heat transfer and radiation heat transfer in the use environment; while profile-based inorganic thermal insulation materials must be assembled and constructed, which has many joints, damage to the appearance, poor waterproofness, and short service life. For this reason, people have been seeking and researching a new material that can greatly improve the thermal insulation and reflection properties of thermal insulation materials.
[0003] For example, using thermal insulation materials to make thermal insulation wallpaper can effectively improve indoor thermal insulation effects and reduce indoor and outdoor temperature transfer. However, thermal insulation materials usually use materials to achieve thermal insulation effects, lack thermal insulation structures, and are lacking in cushioning properties. When thermal insulation materials are subject to changes in thermal expansion and contraction, they are prone to deformation. Long-term use may cause the thermal insulation effect to gradually decrease. For this reason, a building thermal insulation material is needed to solve the existing deficiencies. Utility Model Content
[0004] Technical issues solved
[0005] The purpose of the utility model is to make up for the deficiencies of the prior art and provide a building thermal insulation material.
[0006] Technical Solution
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a building thermal insulation material, comprising a base layer, a bonding layer fixedly connected to the bottom end of the base layer, and a mucous membrane protective layer fixedly connected to the bottom end of the bonding layer, the thickness of the bonding layer is greater than the thickness of the mucous membrane protective layer, a thermal insulation layer is arranged on the top of the bonding layer, the thickness of the thermal insulation layer is greater than the thickness of the base layer, a buffer layer is arranged on the top of the thermal insulation layer, and the thickness of the buffer layer is greater than the thickness of the thermal insulation layer, a wear-resistant layer is arranged on the top of the buffer layer, and an anti-slip layer is arranged on the top of the wear-resistant layer, and a plurality of anti-slip balls are fixedly connected to the surface of the anti-slip layer.
[0008] As mentioned above, the thermal insulation layer includes a thermal conductive layer 1, a thermal storage layer and a thermal conductive layer 2. The bottom end of the thermal conductive layer 1 is fixedly connected to the top of the base layer, and the bottom end of the thermal storage layer is fixedly connected to the top of the thermal conductive layer 1. The bottom end of the thermal conductive layer 2 is fixedly connected to the top of the thermal storage layer. The thermal storage layer is made of polyurethane foam, and the materials of the thermal conductive layer 1 and the thermal conductive layer 2 are both polystyrene resin.
[0009] As mentioned above, the top of the thermal conductive layer one and the top of the thermal conductive layer two are fixedly connected with several thermal conductive strips, and the thermal conductive strips are distributed in a linear array, and several thermal storage grooves are opened on the upper and lower sides of the thermal storage layer, and the thermal conductive strips are respectively adapted to the thermal storage grooves, and the interior of the thermal storage layer is provided with thermal storage holes, and the cross-section of the thermal storage holes is elliptical.
[0010] As mentioned above, the buffer layer includes a separation layer 1, a structural layer and a separation layer 2, the bottom end of the separation layer 1 is fixedly connected to the top end of the thermal conductive layer 2, and the top end of the separation layer 1 is fixedly connected to the bottom end of the structural layer, the top end of the structural layer is fixedly connected to the bottom end of the separation layer 2, and the top end of the separation layer 2 is fixedly connected to the bottom end of the wear-resistant layer.
[0011] As mentioned above, the structural layer includes buffer strips and buffer rings, the buffer strips and buffer rings are distributed in a linear array, and the buffer strips and buffer rings are distributed in a staggered manner, the buffer strips and buffer rings are fixedly connected at opposite sides, and the cross-section of the buffer ring is elliptical.
[0012] As mentioned above, both sides of the mucosal protective layer, adhesive layer, base layer, thermal conductive layer 1, thermal storage layer, thermal conductive layer 2, separation layer 1, structural layer, separation layer 2, wear-resistant layer and anti-slip layer are provided with card slots, and the card slots are arranged in a rectangular shape.
[0013] Beneficial effects:
[0014] Compared with the prior art, this building thermal insulation material has the following beneficial effects:
[0015] 1. The utility model sets a heat-insulating layer, tears off the mucous membrane protective layer, thereby exposing the adhesive layer, so as to facilitate the use of the adhesive layer to fix the heat-insulating material wallpaper to the surface of the wall, and guides the temperature on both sides of the heat storage layer through the heat-conducting layer 1 and the heat-conducting layer 2, and transfers the temperature to the inside of the heat-conducting groove of the heat storage layer by using the heat-conducting strip, so that the temperature is concentrated in the heat storage layer, and uses the heat storage holes to facilitate the heat storage layer to adapt to changes in thermal expansion and contraction.
[0016] 2. The utility model sets a buffer layer, utilizes separation layer 1 and separation layer 2 to separate the structural layer, so that the structural layer can absorb force effectively, utilizes the deformation of the buffer ring and the buffer strip, has good absorption and dissipation force to protect the thermal insulation wallpaper, and utilizes the wear-resistant layer and the anti-skid layer to enhance the durability of the thermal insulation wallpaper. Through the card slot device, the thermal insulation wallpaper can be quickly connected and combined.
[0017] Other advantages, objectives and features of the present invention will be described in the following description to some extent, and will be apparent to those skilled in the art based on the following examination and study, or may be taught from the practice of the present invention to some extent. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0019] Figure 2 It is a schematic diagram of the explosion structure of the utility model;
[0020] Figure 3 For this utility model Figure 2 A schematic diagram of the enlarged structure at A in the middle;
[0021] Figure 4 For this utility model Figure 2 Schematic diagram of the enlarged structure at point B in the middle.
[0022] In the figure: 1. base layer; 2. adhesive layer; 3. mucous membrane protection layer; 4. thermal insulation layer; 401. thermal conductivity layer 1; 402. thermal storage layer; 403. thermal conductivity layer 2; 5. buffer layer; 501. separation layer 1; 502. structural layer; 503. separation layer 2; 6. wear-resistant layer; 7. anti-skid layer; 8. thermal conductivity strip; 9. thermal storage groove; 10. thermal storage hole; 11. buffer strip; 12. buffer ring; 13. slot. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] like Figure 1-4 As shown, the utility model provides a technical solution: a building thermal insulation material, including a base layer 1, a bonding layer 2 is fixedly connected to the bottom end of the base layer 1, and a mucous membrane protective layer 3 is fixedly connected to the bottom end of the bonding layer 2, the thickness of the bonding layer 2 is greater than the thickness of the mucous membrane protective layer 3, a thermal insulation layer 4 is arranged on the top of the bonding layer 2, the thickness of the thermal insulation layer 4 is greater than the thickness of the base layer 1, a buffer layer 5 is arranged on the top of the thermal insulation layer 4, and the thickness of the buffer layer 5 is greater than the thickness of the thermal insulation layer 4, a wear-resistant layer 6 is arranged on the top of the buffer layer 5, and an anti-skid layer 7 is arranged on the top of the wear-resistant layer 6, and a plurality of anti-skid balls are fixedly connected to the surface of the anti-skid layer 7.
[0025] The mucous membrane protection layer 3, the bonding layer 2, the base layer 1, the thermal insulation layer 4, the buffer layer 5, the wear-resistant layer 6 and the anti-slip layer 7 are connected together by an adhesive. The thermal insulation layer 4 is used to form a temperature difference between the inside and outside of the wall to reduce heat loss. The buffer layer 5 is used to reduce the change in the stress of the wallpaper, so as to protect the thermal insulation wallpaper and extend its service life.
[0026] like Figure 1-3 As shown, the thermal insulation layer 4 includes a thermal conductive layer 1 401, a thermal storage layer 402 and a thermal conductive layer 2 403. The bottom end of the thermal conductive layer 1 401 is fixedly connected to the top of the base layer 1, and the bottom end of the thermal storage layer 402 is fixedly connected to the top of the thermal conductive layer 1 401, and the bottom end of the thermal conductive layer 2 403 is fixedly connected to the top of the thermal storage layer 402. The thermal storage layer 402 is made of polyurethane foam, and the materials of the thermal conductive layer 1 401 and the thermal conductive layer 2 403 are both polystyrene resin. The top of the thermal conductive layer 1 401 and the top of the thermal conductive layer 2 403 are fixedly connected with a plurality of thermal conductive strips 8, and the thermal conductive strips 8 are distributed in a linear array. A plurality of thermal storage grooves 9 are provided on the upper and lower sides of the thermal storage layer 402, and the thermal conductive strips 8 are respectively matched with the thermal storage grooves 9. A thermal storage hole 10 is provided through the interior of the thermal storage layer 402, and the cross-section of the thermal storage hole 10 is elliptical.
[0027] By tearing off the mucosal protective layer 3, the adhesive layer 2 is exposed, so that the thermal insulation material wallpaper can be fixed to the surface of the wall by using the adhesive layer 2, and the temperature is guided on both sides of the thermal storage layer 402 through the thermal conductive layer 1 401 and the thermal conductive layer 2 403, and the temperature is transferred to the inside of the thermal conductive groove of the thermal storage layer 402 by the thermal conductive strip 8, so that the temperature is concentrated in the thermal storage layer 402, and the thermal storage hole 10 is used to facilitate the thermal storage layer 402 to adapt to the changes in thermal expansion and contraction.
[0028] like Figure 1 and Figure 4 As shown, the buffer layer 5 includes a separation layer 1 501, a structural layer 502 and a separation layer 2 503. The bottom end of the separation layer 1 501 is fixedly connected to the top end of the thermal conductive layer 2 403, and the top end of the separation layer 1 501 is fixedly connected to the bottom end of the structural layer 502. The top end of the structural layer 502 is fixedly connected to the bottom end of the separation layer 2 503. The top end of the separation layer 2 503 is fixedly connected to the bottom end of the wear-resistant layer 6. The structural layer 502 includes a buffer strip 11 and a buffer ring 12. The buffer strip 11 and The buffer rings 12 are distributed in a linear array, and the buffer strips 11 and the buffer rings 12 are staggered, the buffer strips 11 and the opposite sides of the buffer rings 12 are fixedly connected, and the cross-section of the buffer rings 12 is elliptical, and the mucosal protection layer 3, the adhesive layer 2, the base layer 1, the thermal conductive layer 401, the thermal storage layer 402, the thermal conductive layer 403, the separation layer 501, the structural layer 502, the separation layer 503, the wear-resistant layer 6 and the anti-slip layer 7 are provided with card grooves 13 on both sides, and the card grooves 13 are arranged in a rectangular shape.
[0029] The separation layer 1 501 and the separation layer 2 503 are used to separate the structural layer 502 so that the structural layer 502 can absorb force effectively. The deformation of the buffer ring 12 and the buffer strip 11 is used to provide good absorption and dissipation force to protect the thermal insulation wallpaper. The wear-resistant layer 6 and the anti-slip layer 7 are used to enhance the durability of the thermal insulation wallpaper. The thermal insulation wallpaper can be quickly connected and combined through the card slot 13 device.
[0030] Working principle: When in use, first, use adhesive to connect the mucous membrane protection layer 3, adhesive layer 2, base layer 1, thermal conductive layer 1 401, thermal storage layer 402, thermal conductive layer 2 403, partition layer 1 501, structural layer 502, partition layer 2 503, wear-resistant layer 6 and anti-slip layer 7, and tear the mucous membrane protection layer 3 to expose the adhesive layer 2, so as to facilitate the use of the adhesive layer 2 to fix the thermal insulation material wallpaper to the surface of the wall, and guide the temperature on both sides of the thermal storage layer 402 through the thermal conductive layer 1 401 and the thermal conductive layer 2 403. The temperature is transferred to the inside of the temperature conducting groove of the temperature storage layer 402 by the temperature conducting strip 8, so that the temperature is concentrated in the temperature storage layer 402, and the temperature storage hole 10 is used to facilitate the temperature storage layer 402 to adapt to the changes of thermal expansion and contraction, and the separation layer 1 501 and the separation layer 2 503 are used to separate the structural layer 502, so that the structural layer 502 can absorb the force effectively, and the deformation of the buffer ring 12 and the buffer strip 11 is used to have good absorption and dissipation force to protect the thermal insulation wallpaper, and the wear-resistant layer 6 and the anti-slip layer 7 are used to enhance the durability of the thermal insulation wallpaper.
[0031] It should be noted that, in this article, the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model; the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "fixed", "installed", "connected", and "connected" should be understood in a broad sense. For example, "installed" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a mechanical connection or an electrical connection; "connected" can be a direct connection, an indirect connection through an intermediate medium, or a connection between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.
[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A building thermal insulation material, comprising a base layer (1), characterized in that: The bottom end of the base layer (1) is fixedly connected to an adhesive layer (2), and the bottom end of the adhesive layer (2) is fixedly connected to a mucosal protective layer (3), the thickness of the adhesive layer (2) is greater than the thickness of the mucosal protective layer (3), the top end of the adhesive layer (2) is provided with a thermal insulation layer (4), the thickness of the thermal insulation layer (4) is greater than the thickness of the base layer (1), the top end of the thermal insulation layer (4) is provided with a buffer layer (5), and the thickness of the buffer layer (5) is greater than the thickness of the thermal insulation layer (4), the top end of the buffer layer (5) is provided with a wear-resistant layer (6), and the top end of the wear-resistant layer (6) is provided with an anti-skid layer (7), and a plurality of anti-skid balls are fixedly connected to the surface of the anti-skid layer (7).
2. A building thermal insulation material according to claim 1, characterized in that: The thermal insulation layer (4) comprises a thermal conductive layer 1 (401), a thermal storage layer (402) and a thermal conductive layer 2 (403); the bottom end of the thermal conductive layer 1 (401) is fixedly connected to the top end of the base layer (1), and the bottom end of the thermal storage layer (402) is fixedly connected to the top end of the thermal conductive layer 1 (401); the bottom end of the thermal conductive layer 2 (403) is fixedly connected to the top end of the thermal storage layer (402); the thermal storage layer (402) is made of polyurethane foam, and the materials of the thermal conductive layer 1 (401) and the thermal conductive layer 2 (403) are both polystyrene resin.
3. A building thermal insulation material according to claim 2, characterized in that: The top of the thermal conductive layer 1 (401) and the top of the thermal conductive layer 2 (403) are both fixedly connected with a plurality of thermal conductive strips (8), and the thermal conductive strips (8) are distributed in a linear array. The upper and lower sides of the thermal storage layer (402) are both provided with a plurality of thermal storage grooves (9), and the thermal conductive strips (8) are respectively matched with the thermal storage grooves (9). The interior of the thermal storage layer (402) is provided with a thermal storage hole (10) extending therethrough, and the cross section of the thermal storage hole (10) is elliptical.
4. A building thermal insulation material according to claim 1, characterized in that: The buffer layer (5) comprises a separation layer 1 (501), a structural layer (502) and a separation layer 2 (503); the bottom end of the separation layer 1 (501) is fixedly connected to the top end of the thermal conductive layer 2 (403); the top end of the separation layer 1 (501) is fixedly connected to the bottom end of the structural layer (502); the top end of the structural layer (502) is fixedly connected to the bottom end of the separation layer 2 (503); and the top end of the separation layer 2 (503) is fixedly connected to the bottom end of the wear-resistant layer (6).
5. A building thermal insulation material according to claim 4, characterized in that: The structural layer (502) comprises buffer strips (11) and buffer rings (12), the buffer strips (11) and buffer rings (12) are both distributed in a linear array, and the buffer strips (11) and buffer rings (12) are distributed in a staggered manner, the buffer strips (11) and buffer rings (12) are fixedly connected at opposite sides, and the cross-section of the buffer ring (12) is elliptical.
6. A building thermal insulation material according to claim 5, characterized in that: The mucosal protective layer (3), the adhesive layer (2), the base layer (1), the thermal conductive layer 1 (401), the thermal storage layer (402), the thermal conductive layer 2 (403), the separation layer 1 (501), the structural layer (502), the separation layer 2 (503), the wear-resistant layer (6) and the anti-slip layer (7) are all provided with card slots (13) on both sides, and the card slots (13) are arranged in a rectangular shape.