Novel ice making device

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By using a combination of temperature conducting blocks, low-temperature sintered heat pipes and semiconductor refrigeration sheets in the ice making device, replacing the traditional compressor parts, solving the problems of high power consumption, high noise and high cost in the existing ice making machine, achieving a lower level of power consumption, high noise and low cost. New ice making device with power consumption and convenient maintenance.

CN222335672UActive Publication Date: 2025-01-10GUANGDONG LELING METAL IND CO LTD

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Patent Information

Application Number: CN202421140434.7
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2024-05-23
Publication Date: 2025-01-10
Estimated Expiration: 2034-05-23

AI Technical Summary

Technical Problem

The existing compression mechanism ice machines consume high power, are noisy, are costly, and have complex internal components, making them inconvenient to maintain.

Method used

The temperature conduction block, low-temperature sintered heat pipe, semiconductor refrigeration sheet, heat dissipation mechanism, heat pipe condenser, heat dissipation fan and heat sink are used to cool the low-temperature sintered heat pipe through the electric cooling end of the semiconductor refrigeration sheet. The heat pipe condenser will cool the semiconductor refrigeration sheet. The heat dissipates heat at the hot end, replacing traditional compressor parts, and using a fixed mechanism to simplify the installation and disassembly process.

Benefits of technology

It reduces the power consumption and cost of ice making equipment, reduces noise, simplifies the structure and maintenance process, and improves the installation and disassembly of equipment.

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Abstract

The utility model discloses a novel ice-making device, which relates to the technical field of ice-making equipment and comprises a temperature conducting block, a low-temperature sintering heat pipe is fixedly sleeved on the inner side of the temperature conducting block, a semiconductor chilling plate is fixedly connected on the rear side of the low-temperature sintering heat pipe, and a heat dissipation mechanism is fixedly connected on the rear side of the semiconductor chilling plate. The left side and the right side of the heat dissipation mechanism are fixedly connected with two fixing mechanisms which are symmetrically distributed left and right, the heat dissipation mechanism comprises a heat pipe condenser, and the position, close to the lower side, of the middle of the front side of the heat pipe condenser is fixedly connected to the rear side of a semiconductor chilling plate. According to the novel ice-making device disclosed by the utility model, the low-temperature sintering heat pipe is cooled through the electrified cold end of the semiconductor chilling plate, and the heat pipe condenser is used for dissipating heat of the hot end of the semiconductor chilling plate, so that the low-temperature sintering heat pipe can be used for cooling water to make ice blocks, and the novel ice-making device is simple in structure and low in cost. Parts such as a compressor of a traditional ice maker are directly replaced, product cost is greatly reduced, and power consumption is reduced.

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Description

Technical Field

[0001] The utility model relates to the technical field of ice making equipment, in particular to a novel ice making device. Background Art

[0002] An ice maker is a device that generates ice by cooling water with the refrigerant of a refrigeration system through an evaporator. It is mainly used in homes and commercial places to meet the ice needs of different users. These ice making devices usually use a compressor to cool down and make ice.

[0003] Currently available compression ice makers consume high power, have many internal pipes and components, and produce a lot of noise during the ice-making process. Compression ice makers must use compressors and other components, which are relatively expensive. Utility Model Content

[0004] The utility model provides a novel ice-making device to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0006] A novel ice-making device comprises a temperature conducting block, a low-temperature sintered heat pipe is fixedly sleeved on the inner side of the temperature conducting block, a semiconductor refrigeration plate is fixedly connected to the rear side of the low-temperature sintered heat pipe, a heat dissipation mechanism is fixedly connected to the rear side of the semiconductor refrigeration plate, and two fixing mechanisms symmetrically distributed on the left and right sides of the heat dissipation mechanism are fixedly connected.

[0007] Preferably, the heat dissipation mechanism includes a heat pipe condenser, a middle portion of the front side of the heat pipe condenser close to the lower side is fixedly connected to the rear side of the semiconductor refrigeration plate, and a heat dissipation fan is provided on the front side of the heat pipe condenser.

[0008] Preferably, a plurality of evenly distributed heat sinks are fixedly connected to the outer side of the heat pipe condenser.

[0009] Preferably, the fixing mechanism includes a fixing frame, a side of the fixing frame close to the semiconductor refrigeration plate is fixedly connected to the left and right sides of the heat pipe condenser through a cylinder, a side of the fixing frame away from the semiconductor refrigeration plate is slidably connected to a fixing plate, a side of the fixing plate away from the semiconductor refrigeration plate is provided with a plurality of evenly distributed fixing holes near the front and rear sides, a middle part of the side of the fixing frame away from the semiconductor refrigeration plate is provided with a slot near the upper side, a middle part of the side of the fixing frame close to the semiconductor refrigeration plate is fixedly connected with a claw near the upper side, and the outer side of the claw is movably sleeved on the inner side of the slot.

[0010] Preferably, a dislocation component is movably sleeved on the inner side of the fixing frame near the upper side of one side of the fixing plate, and the dislocation component includes a push plate, and the side of the push plate away from the semiconductor refrigeration plate is fixedly connected to two limit rods symmetrically distributed front and back through a cross plate, the outer walls of the two limit rods are movably sleeved with springs, and the dislocation component is located on the lower side of the cross plate, the upper and lower ends of the limit rods are fixedly connected to the upper and lower surfaces inside the side wall of the fixing frame, and the boss on the side of the push plate away from the semiconductor refrigeration plate is movably sleeved in the inner vertical groove of the fixing frame.

[0011] Preferably, a surface of the push plate close to the semiconductor refrigeration plate is provided with friction patterns.

[0012] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0013] The utility model provides a novel ice-making device, which adopts a temperature conducting block, a low-temperature sintered heat pipe, a semiconductor refrigeration sheet, a heat dissipation mechanism, a heat pipe condenser, a heat dissipation fan and a heat dissipation sheet. The low-temperature sintered heat pipe is cooled by the cold end of the semiconductor refrigeration sheet being energized, and the heat pipe condenser dissipates heat from the hot end of the semiconductor refrigeration sheet, so that the low-temperature sintered heat pipe can cool water to make ice cubes. The product has a simple structure and can directly replace the compressor and other components of a traditional ice-making machine, thereby greatly reducing product costs and power consumption.

[0014] The utility model provides a novel ice-making device, which adopts the cooperation of a fixing mechanism, a fixing frame, a fixing plate, a slot, a clamping claw, a dislocation component, a push plate, a limiting rod and a spring. The clamping claw is movably sleeved into the inner side of the slot so that the fixing frame is fixed and the whole can be quickly installed. The push plate is pushed downward to cause the clamping claw to be disengaged from the slot so that the whole can be quickly disassembled. The device is easy to install and disassemble, and is convenient for maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the heat dissipation mechanism of the utility model;

[0017] Figure 3 It is a partial cross-sectional three-dimensional structural schematic diagram of the fixing mechanism of the utility model;

[0018] Figure 4 It is a partial cross-sectional three-dimensional structural schematic diagram of the fixing frame of the utility model;

[0019] Figure 5 It is a three-dimensional structural schematic diagram of the dislocation component part of the utility model.

[0020] In the figure: 1. temperature conducting block; 2. low temperature sintered heat pipe; 3. semiconductor refrigeration plate; 4. heat dissipation mechanism; 41. heat pipe condenser; 42. cooling fan; 43. heat sink; 5. fixing mechanism; 51. fixing frame; 52. fixing plate; 53. slot; 54. claw; 55. dislocation assembly; 551. push plate; 552. limit rod; 553. spring. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] like Figure 1 As shown, a novel ice-making device comprises a temperature conducting block 1, a low-temperature sintered heat pipe 2 is fixedly sleeved on the inner side of the temperature conducting block 1, a semiconductor refrigeration plate 3 is fixedly connected to the rear side of the low-temperature sintered heat pipe 2, a heat dissipation mechanism 4 is fixedly connected to the rear side of the semiconductor refrigeration plate 3, and two fixing mechanisms 5 symmetrically distributed on the left and right sides of the heat dissipation mechanism 4 are fixedly connected.

[0023] It should be noted that when the semiconductor refrigeration sheet 3 is powered on, its cold end cools down and its hot end heats up. The cold end of the semiconductor refrigeration sheet 3 cools down the temperature conductive block 1, and the lower side of the low-temperature sintered heat pipe 2 is placed in water, causing the low-temperature sintered heat pipe 2 to cool down the water and freeze it.

[0024] like Figure 1 , Figure 2 As shown, the heat dissipation mechanism 4 includes a heat pipe condenser 41 , the middle of the front side of the heat pipe condenser 41 near the lower side is fixedly connected to the rear side of the semiconductor cooling plate 3 , and a heat dissipation fan 42 is provided on the front side of the heat pipe condenser 41 .

[0025] It should be noted that the upper side of the heat pipe condenser 41 is connected to the hot end of the semiconductor refrigeration sheet 3. The interior of the heat pipe condenser 41 is vacuum and filled with refrigerant and other media for cooling. The semiconductor refrigeration sheet 3 heats the lower liquid storage box portion of the heat pipe condenser 41. Due to the heat, the refrigerant evaporates upward in the pipeline, releases heat through the heat dissipation fan 42 blowing on the heat sink 43, and then liquefies and flows into the liquid storage box, so that the heat pipe condenser 41 can continuously cool the hot end of the semiconductor refrigeration sheet 3.

[0026] like Figure 2 As shown, a plurality of evenly distributed heat sinks 43 are fixedly connected to the outer side of the heat pipe condenser 41 .

[0027] It should be noted that the heat sink 43 increases the contact area between the heat pipe condenser 41 and the air, so that the cooling speed of the refrigerant inside the heat pipe condenser 41 is increased.

[0028] like Figure 3 , Figure 4As shown, the fixing mechanism 5 includes a fixing frame 51, and the side of the fixing frame 51 close to the semiconductor cooling plate 3 is fixedly connected to the left and right sides of the heat pipe condenser 41 through a cylinder, and the side of the fixing frame 51 away from the semiconductor cooling plate 3 is slidably connected with a fixing plate 52, and the fixing plate 52 is provided with a plurality of evenly distributed fixing holes at positions near the front and rear sides on the side away from the semiconductor cooling plate 3, and a slot 53 is provided at a middle position near the upper side of the side of the fixing frame 51 away from the semiconductor cooling plate 3, and a claw 54 is fixedly connected at a middle position near the upper side of the side of the fixing plate 52 close to the semiconductor cooling plate 3, and the outer side of the claw 54 is movably sleeved on the inner side of the slot 53.

[0029] It should be noted that the fixing plate 52 is fixed on the vertical plane through the fixing hole, and the fixing frame 51 moves downward from the upper side to be slidably connected with the fixing plate 52. The fixing frame 51 continues to move downward, causing the claw 54 to move into the lower side of the slot 53, so that the fixing frame 51 is fixed. A horizontal plate is provided on the lower side of the fixing plate 52 for limiting the lowest position of the fixing frame 51.

[0030] like Figure 3 , Figure 5 As shown, a dislocation component 55 is movably sleeved on the inner side of the fixed frame 51 near the upper side of one side of the fixed plate 52, and the dislocation component 55 includes a push plate 551. The side of the push plate 551 away from the semiconductor cooling plate 3 is fixedly connected with two limit rods 552 symmetrically distributed front and back through a cross plate. The outer walls of the two limit rods 552 are movably sleeved with springs 553, and the dislocation component 55 is located on the lower side of the cross plate, and the upper and lower ends of the limit rods 552 are fixedly connected to the upper and lower surfaces of the inner side wall of the fixed frame 51, and the boss of the push plate 551 away from the semiconductor cooling plate 3 is movably sleeved in the inner vertical groove of the fixed frame 51.

[0031] It should be noted that, on the boss of the push plate 551 on the side away from the semiconductor cooling plate 3, there are grooves overlapping with the card slots 53, so that the claws 54 are movably sleeved in these grooves in the same direction, and the push plate 551 is pushed downward, so that the grooves on the push plate 551 push the claws 54 downward, so that the claws 54 twist out of the card slots 53, so that the fixing frame 51 can be pulled upward.

[0032] like Figure 3 , Figure 5 As shown, a side of the push plate 551 close to the semiconductor cooling plate 3 is provided with friction lines.

[0033] It should be noted that the friction pattern is used to increase the friction between the hand and the push plate 551 , making it easier for the user to push the push plate 551 .

[0034] The working principle of the utility model is as follows: first, when the semiconductor refrigeration sheet 3 is powered on, its cold end is cooled down and its hot end is heated up. The cold end of the semiconductor refrigeration sheet 3 cools down the temperature conducting block 1. The lower side of the low-temperature sintered heat pipe 2 is placed in water. According to the property of the sintered heat pipe conducting heat upward and the principle that it can work at a low temperature, the low-temperature sintered heat pipe 2 cools down the water and freezes it. The upper side of the heat pipe condenser 41 is connected to the hot end of the semiconductor refrigeration sheet 3. A refrigerant for cooling is provided inside the heat pipe condenser 41. The semiconductor refrigeration sheet 3 heats up the lower side of the heat pipe condenser 41. Due to the internal The refrigerant evaporates after being heated, and at this time, the cooling fan 42 blows air to cool the refrigerant inside the heat pipe condenser 41 and liquefy it. Through the two conversions of the internal refrigerant, the uninterrupted cycle enables the heat pipe condenser 41 to continuously cool the hot end of the semiconductor refrigeration sheet 3. The heat sink 43 increases the contact area between the heat pipe condenser 41 and the air, so that the heat inside the heat pipe condenser 41 is quickly dissipated, and the low-temperature sintered heat pipe 2 is cooled by the cold end of the semiconductor refrigeration sheet 3. The heat pipe condenser 41 dissipates heat from the hot end of the semiconductor refrigeration sheet 3, so that the low-temperature sintered heat pipe 2 can cool water to make ice cubes. The product has a simple structure and can directly replace the compressor and other parts of the traditional ice maker, greatly reducing product costs and power consumption. Finally, the fixing plate 52 is fixed on the vertical plane through the fixing hole, and the fixing frame 51 moves down from the upper side to be slidably connected with the fixing plate 52. The fixing frame 51 continues to move down, causing the claw 54 to move into the lower side of the card slot 53, so that the fixing frame 51 is fixed. A horizontal plate is provided on the lower side of the fixing plate 52 to limit the lowest position of the fixing frame 51. The push plate 551 is away from the boss on one side of the semiconductor refrigeration plate 3 and is There are grooves that coincide with the card slots 53, so that the claws 54 are movably sleeved in these grooves in the same direction, and the push plate 551 is pushed downward, so that the grooves on the push plate 551 push the claws 54 downward, so that the claws 54 are twisted out of the card slots 53, so that the fixing frame 51 can be pulled out upward, and the claws 54 are movably sleeved into the inner side of the card slots 53, so that the fixing frame 51 is fixed, so that the whole can be quickly installed, and the push plate 551 is pushed downward, so that the claws 54 are out of the card slots 53, so that the whole can be quickly disassembled, the installation is convenient, the disassembly is simple, and the maintenance of the device is convenient.

[0035] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A novel ice-making device, comprising a temperature conducting block (1), characterized in that: A low-temperature sintered heat pipe (2) is fixedly sleeved on the inner side of the temperature conducting block (1), a semiconductor refrigeration sheet (3) is fixedly connected to the rear side of the low-temperature sintered heat pipe (2), a heat dissipation mechanism (4) is fixedly connected to the rear side of the semiconductor refrigeration sheet (3), and two fixing mechanisms (5) symmetrically distributed on the left and right sides of the heat dissipation mechanism (4) are fixedly connected.

2. A novel ice-making device according to claim 1, characterized in that: The heat dissipation mechanism (4) comprises a heat pipe condenser (41), the middle of the front side of the heat pipe condenser (41) being fixedly connected to the rear side of the semiconductor cooling sheet (3) near the lower side, and a heat dissipation fan (42) is provided on the front side of the heat pipe condenser (41).

3. A novel ice-making device according to claim 2, characterized in that: A plurality of evenly distributed heat sinks (43) are fixedly connected to the outer side of the heat pipe condenser (41).

4. A novel ice-making device according to claim 2, characterized in that: The fixing mechanism (5) comprises a fixing frame (51), wherein a side of the fixing frame (51) close to the semiconductor cooling plate (3) is fixedly connected to the left and right sides of the heat pipe condenser (41) via a cylinder, a side of the fixing frame (51) away from the semiconductor cooling plate (3) is slidably connected to a fixing plate (52), a side of the fixing plate (52) away from the semiconductor cooling plate (3) is provided with a plurality of evenly distributed fixing holes at positions close to the front and rear sides, a middle portion of a side of the fixing frame (51) away from the semiconductor cooling plate (3) is provided with a slot (53) close to the upper side, and a middle portion of a side of the fixing plate (52) close to the semiconductor cooling plate (3) is fixedly connected to a claw (54), and the outer side of the claw (54) is movably sleeved on the inner side of the slot (53).

5. A novel ice-making device according to claim 4, characterized in that: A dislocation component (55) is movably sleeved on the inner side of the fixing frame (51) near the fixing plate (52) near the upper side, and the dislocation component (55) includes a push plate (551), and the side of the push plate (551) away from the semiconductor cooling plate (3) is fixedly connected to two limit rods (552) symmetrically distributed front and back through a transverse plate, and the outer walls of the two limit rods (552) are movably sleeved with springs (553), and the dislocation component (555) is located on the lower side of the transverse plate, and the upper and lower ends of the limit rods (552) are fixedly connected to the upper and lower surfaces inside the side wall of the fixing frame (51), and the boss of the side of the push plate (551) away from the semiconductor cooling plate (3) is movably sleeved in the inner vertical groove of the fixing frame (51).

6. A novel ice-making device according to claim 5, characterized in that: A surface of the push plate (551) close to the semiconductor cooling plate (3) is provided with friction patterns.