Semiconductor detection equipment sample loading tool and semiconductor detection equipment

Abstract

The utility model relates to a semiconductor detection equipment sample loading tool and semiconductor detection equipment, and the semiconductor detection equipment sample loading tool comprises a sample rack assembly which is configured to load samples, the sample rack assembly comprises a base body, a baffle plate and a pressing block, the base body comprises an accommodating groove which is arranged in a through manner along a first direction, and the baffle plate is arranged in the accommodating groove; the baffle is fixed to the first end of the base body and covers an opening of the containing groove, the baffle is perpendicular to the first direction, a sample window is formed in the baffle, the sample and the pressing block are both placed in the containing groove from the second end of the base body, and the sample is located between the sample window and the pressing block; the pressure applying assembly is configured to apply pressure towards the direction close to the sample window to the upper surface of the pressing block in the first direction, so that the pressing block moves by a preset distance in the first direction and then reaches a preset position, the pressure applying assembly comprises a pressure applying plate, the pressure applying plate is perpendicular to the first direction and has a preset thickness in the first direction, and the preset thickness is equal to the preset distance; the size of the pressing plate is smaller than or equal to that of the containing groove.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor testing technology, and in particular to a semiconductor testing equipment sample loading tool and a semiconductor testing equipment. Background Art

[0002] Secondary ion mass spectrometer is a large-scale testing instrument commonly used in the semiconductor field. It is an important tool for detecting the concentration of trace impurity ions in high-purity semiconductor materials. Sample loading is a key process in the secondary ion mass spectrometry testing process.

[0003] The sample loading process requires that the sample surface be level and the sample height in each window be consistent, so as to ensure the uniformity of the electromagnetic field on the sample surface and the accuracy of the test results. However, the size of the pressing block is close to the size of the accommodating slot of the sample holder base, and it is very easy to tilt during the movement to the preset position, resulting in the sample being non-level or the level height being inconsistent, affecting the accuracy of the test results. Utility Model Content

[0004] The embodiments of the present disclosure provide a semiconductor testing equipment sample loading tool and a semiconductor testing equipment, which can improve the accuracy of the testing results.

[0005] According to one aspect of the present disclosure, a semiconductor testing equipment sample loading tool is provided, comprising:

[0006] A sample holder assembly is configured to load a sample, the sample holder assembly includes a base, a baffle and a pressing block, the base includes a receiving groove arranged through along a first direction, the baffle is fixed to a first end of the base and covers an opening of the receiving groove, the baffle is perpendicular to the first direction, a sample window is provided on the baffle, the sample and the pressing block are both placed in the receiving groove from a second end of the base, and the sample is located between the sample window and the pressing block; and

[0007] The pressure assembly is configured to apply pressure to the upper surface of the pressing block in a direction close to the sample window along a first direction so that the pressing block reaches a preset position after moving a preset distance along the first direction. The pressure assembly includes a pressure plate, which is perpendicular to the first direction and has a preset thickness along the first direction. The preset thickness is equal to the preset distance, and the size of the pressure plate is less than or equal to the size of the accommodating groove.

[0008] In some embodiments, the pressure applying component further comprises:

[0009] A cover plate connected to a side of the pressure plate away from the pressure block, the cover plate abutting against the top surface of the base body; and

[0010] The force applying member is connected to a side of the cover plate away from the pressure applying plate, and is configured to receive an external force.

[0011] In some embodiments, there are multiple pressure assemblies, and the preset thickness of the pressure plate of each pressure assembly is different. The semiconductor testing equipment sample loading tool can selectively use a pressure assembly adapted to the sample thickness.

[0012] In some embodiments, the semiconductor testing equipment sample loading tool further includes:

[0013] The support assembly is arranged on a side of the sample holder assembly close to the sample window, and is configured to support the sample holder assembly so that the sample window is suspended in the air.

[0014] In some embodiments, the support assembly includes:

[0015] A base is spaced apart from the sample window along a first direction; and

[0016] Two supporting platforms are arranged relatively spaced apart along the second direction, and both supporting platforms extend along the third direction, the second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction, the two supporting platforms are configured to support baffles, and the sample window is located in the space between the two supporting platforms along the second direction.

[0017] In some embodiments, the support assembly further comprises:

[0018] A first limiting plate and a second limiting plate are respectively arranged on the two bearing platforms, the first limiting plate and the second limiting plate both extend along the third direction, and the first limiting plate and the second limiting plate are configured to limit the side wall of the base along the second direction; and

[0019] The third limiting plate is connected between the two supporting platforms, and extends along the second direction. The third limiting plate is configured to limit the side wall of the substrate along the third direction. The first limiting plate, the second limiting plate and the third limiting plate together form a accommodating cavity for accommodating the substrate.

[0020] In some embodiments,

[0021] The first limiting plate is flush with a side of the carrying platform away from the base, and along the second direction, the thickness of the first limiting plate is less than the thickness of the carrying platform; and / or

[0022] The second limiting plate is flush with a side of the carrying platform away from the base body, and along the second direction, the thickness of the second limiting plate is less than the thickness of the carrying platform.

[0023] In some embodiments, a fixing member is provided on the base, and the fixing member is configured to fix the pressing block at a preset position.

[0024] The third limiting plate is spaced apart from the first limiting plate to form a first spacing space, and the fixing member is located in the first spacing space; and / or

[0025] The third limiting plate is spaced apart from the second limiting plate to form a second spacing space, and the fixing member is located in the second spacing space.

[0026] According to another aspect of the present disclosure, a semiconductor testing device is provided, and samples are loaded by the semiconductor testing device sample loading tool of the above embodiment.

[0027] In some embodiments, the semiconductor inspection equipment includes a secondary ion mass spectrometer.

[0028] Based on the above technical scheme, the semiconductor testing equipment sample loading tooling structure of the disclosed embodiment is simple and easy to operate. The preset thickness of the pressure plate is equal to the preset distance that the pressure block moves along the first direction, which can ensure that the pressure block sinks a fixed distance, so that the pressure applied to the sample is constant and controllable, thereby solving the various disadvantages of uncontrollable pressure in the sample loading process; the pressure plate can ensure that the pressure block remains horizontally placed, so that the pressure on the sample window corresponding to the sample is uniform and consistent, that is, the sample is placed horizontally and in the same horizontal plane, thereby ensuring that the electromagnetic field on the sample surface is uniform, reducing test errors, and improving the accuracy of the test results and the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of the present application. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation on the present disclosure. In the drawings:

[0030] Figure 1 Exploded views of some embodiments of sample loading tools for semiconductor testing equipment disclosed herein.

[0031] Figure 2 It is a structural schematic diagram from the first perspective of some embodiments of the semiconductor testing equipment sample loading tooling disclosed in the present invention.

[0032] Figure 3 It is a schematic structural diagram of some embodiments of the pressure-applying assembly of the present disclosure from a first perspective.

[0033] Figure 4 It is a structural schematic diagram of some embodiments of the pressure-applying assembly of the present disclosure from a second perspective.

[0034] Figure 5 It is a schematic structural diagram of some embodiments of the support assembly of the present disclosure.

[0035] Figure 6 It is a schematic structural diagram of some embodiments of the support assembly of the present disclosure in cooperation with the base and the baffle.

[0036] Figure 7 A schematic structural diagram of some embodiments of the semiconductor testing equipment sample loading tooling disclosed in the present invention from a second perspective.

[0037] Description of Reference Numerals

[0038] 1. Sample rack assembly; 2. Pressure assembly; 3. Support assembly; 10. Receiving groove; 11. Base; 12. Baffle; 13. Pressing block; 14. Transition connection; 15. Fixing member; 16. Connecting member; 120. Sample window; 21. Pressure plate; 22. Cover plate; 23. Force member; 31. Base; 32. Support platform; 301. First limiting plate; 302. Second limiting plate; 303. Third limiting plate; x, first direction; y, second direction; z, third direction. DETAILED DESCRIPTION

[0039] The present disclosure is described in detail below. In the following paragraphs, different aspects of the embodiments are defined in more detail. Each aspect so defined can be combined with any other aspect or aspects, unless explicitly stated not to be combined. In particular, any feature that is considered to be preferred or advantageous can be combined with one or more other features that are considered to be preferred or advantageous.

[0040] The terms "first", "second", etc. that appear in the present disclosure are only for the convenience of description to distinguish different components with the same name, and do not indicate a sequence or a primary and secondary relationship.

[0041] In the description of the present disclosure, it is necessary to understand that the terms "upper", "lower", "inside" or "outside" etc. indicating orientation or positional relationship are defined based on baffles, receiving grooves, substrates or samples etc., and are only for the convenience of describing the present disclosure, and do not indicate or imply that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present disclosure.

[0042] During the testing process, the semiconductor testing equipment needs to be fixed to the sample rack assembly of the sample loading tooling. For example, for the original four-window sample rack, the corresponding loading process can be simply described as: select four samples of appropriate size, place them face down on the corresponding four sample windows 120 from the sample holes on the back of the sample rack, then place four gold-plated springs of the same specification on the back of the sample, then put in the pressure block 13 to press the springs, and finally fix the pressure block 13 in the preset position with the fixing screws. The loading process requires that the sample surface is horizontal and the sample height in each window is consistent, so as to ensure the uniformity of the electromagnetic field on the sample surface and the accuracy of the test results.

[0043] During the research, the inventors found that during the above-mentioned sample loading process, the weight of the pressing block 13 is insufficient, and manual pressure is required to fix the sample. This process is uncontrollable and can easily lead to: (i) excessive pressure, resulting in the baffle 12 being unsoldered; (ii) insufficient pressure, resulting in the sample sliding; (iii) uneven pressure, resulting in the sample being non-level or inconsistent in level height.

[0044] To solve the above problems, Figures 1 to 7 As shown, the present disclosure proposes a semiconductor testing equipment sample loading tool, comprising:

[0045] A sample holder assembly 1 is configured to load a sample, the sample holder assembly 1 comprises a base 11, a baffle 12 and a pressing block 13, the base 11 comprises a receiving groove 10 which is arranged through along a first direction x, the baffle 12 is fixed to a first end of the base 11 and covers an opening of the receiving groove 10, the baffle 12 is perpendicular to the first direction x, a sample window 120 is provided on the baffle 12, the sample and the pressing block 13 are both placed in the receiving groove 10 from a second end of the base 11, and the sample is located between the sample window 120 and the pressing block 13; and

[0046] The pressure-applying assembly 2 is configured to apply pressure to the upper surface of the pressing block 13 in a direction close to the sample window 120 along a first direction x, so that the pressing block 13 moves a preset distance along the first direction x to reach a preset position. The pressure-applying assembly 2 includes a pressure plate 21, which is perpendicular to the first direction x and has a preset thickness along the first direction x, the preset thickness is equal to the preset distance, and the size of the pressure plate 21 is less than or equal to the size of the accommodating groove 10.

[0047] Specifically, the base 11 constitutes the main frame of the sample holder assembly 1, and the baffle 12 is fixed to one end of the base 11, and cooperates with the pressing block 13 to ensure that the sample is positioned stably and does not slip out of the opening. Specifically, the pressure plate 21 can evenly and effectively apply pressure to the pressing block 13, causing the pressing block to move to a preset position along the first direction x.

[0048] Specifically, the second end of the base 11 is the back side, and the receiving groove 10 is the sample placement hole. Specifically, the sample is placed into the receiving groove 10 from the back side of the sample holder assembly 1 with the front side facing downward, and is placed on the sample window 120, and then a gold-plated spring is placed on the back side of the sample, and then a pressure block 13 is placed to press the spring, and the pressure block 13 is moved along the first direction x by the pressure assembly 2 to reach a preset position after a preset distance, and finally the pressure block 13 is fixed at the preset position by the fixing member 15.

[0049] Specifically, because the preset thickness is equal to the preset distance, the pressure plate 21 can ensure that the pressure block 13 sinks a fixed distance, so that the pressure applied to the sample is constant and controllable, and neither excessive pressure will cause the baffle 12 to become unsoldered, nor insufficient pressure will cause the sample to slip; the pressure plate 21 can ensure that the pressure block 13 remains horizontally placed, so that the pressure on the sample window 120 corresponding to the sample is uniform and consistent, that is, the sample is horizontal and highly consistent.

[0050] Specifically, when a spring is provided between the sample and the pressure block 13, the pressure of the pressure block 13 is applied to the sample via the spring, and the pressure plate 21 can ensure that the pressure block 13 is pressed horizontally at a constant and controllable distance. On the one hand, the controllable downward pressing distance means that the spring pressure is controllable, which can prevent the sample from slipping or the front baffle 12 from becoming unsoldered. On the other hand, the horizontal downward pressing means that the sample is subjected to uniform and consistent spring pressure, that is, the sample itself is horizontal and different samples are of consistent height, thereby ensuring that the electromagnetic field on the sample surface is uniform and reducing the test error.

[0051] Optionally, the baffle 12 can be welded to the first end of the substrate 11. Optionally, one or more sample windows 120 can be provided, for example, four. Optionally, the preset thickness of the pressure plate 21 can be customized according to the sample thickness, for example, the preset thickness can be 2 mm, etc. Optionally, the receiving groove 10 is a columnar receiving groove, such as a cylindrical shape. Optionally, the material of the pressure plate 21 can be selected from 304 stainless steel, etc., and the processing accuracy requirement is less than 0.1 mm. Optionally, a connecting piece 16 can also be provided on the substrate 11 for fixing to a robot arm of a detection device, etc.

[0052] The semiconductor testing equipment sample loading tooling of this embodiment has a simple structure and is easy to operate. The preset thickness of the pressure plate 21 is equal to the preset distance that the pressure block 13 moves along the first direction x, so that it can ensure that the pressure block 13 sinks a fixed distance, so that the pressure applied to the sample is constant and controllable, and various disadvantages of uncontrollable pressure in the sample loading process are solved; the pressure plate 21 can ensure that the pressure block 13 remains horizontally placed, so that the pressure on the sample window 120 corresponding to the sample is uniform and consistent, that is, the sample is placed horizontally and in the same horizontal plane, thereby ensuring that the electromagnetic field on the sample surface is uniform, reducing test errors, and improving the accuracy of the test results and the detection efficiency.

[0053] In some embodiments, Figures 1 to 7 As shown, the pressure component 2 also includes:

[0054] A cover plate 22 connected to a side of the pressure plate 21 away from the pressure block 13, the cover plate 22 abutting against the top surface of the base 11; and

[0055] The force applying member 23 is connected to a side of the cover plate 22 away from the pressure applying plate 21 , and is configured to receive an external force.

[0056] Specifically, the cover plate 22 abuts against the top surface of the base 11, the size of the cover plate 22 is larger than the size of the receiving groove 10, and the size of the pressure plate 21 is smaller than or equal to the size of the receiving groove 10. The cover plate 22 and the pressure plate 21 cooperate to ensure that the pressure block 13 is pressed down a fixed distance while maintaining a horizontal state, so that the pressure applied to the sample is constant, controllable and uniform.

[0057] Specifically, the force member 23 is used as an input component of the external force. The setting of the force member 23 can facilitate the operator to control the pressure assembly 2. Optionally, the force member 23 can be in any structural form, for example, it can be a handle extending along the first direction x, or it can be a pull ring or other structures. Optionally, the force member 23 can be connected to any driving component. Optionally, the pressure assembly 2 can be composed of a pressure plate 21, a cover plate 22 and a force member 23 welded together.

[0058] The force-applying member 23 of this embodiment can facilitate the manipulation of the pressure-applying assembly; the cover plate 22 abuts against the top surface of the base 11, and the cover plate 22 cooperates with the pressure plate 21 to ensure that the pressure block 13 is pressed down a fixed distance while maintaining a horizontal state, so that the pressure applied to the sample is constant, controllable and uniform, which can reduce test errors and improve the accuracy of test results and detection efficiency.

[0059] In some embodiments, there are multiple pressure assemblies 2, and the preset thickness of the pressure plate 21 of each pressure assembly 2 is different. The semiconductor testing equipment sample loading tool can selectively use the pressure assembly 2 adapted to the sample thickness.

[0060] The sample loading tool of this embodiment includes a plurality of pressure plates 21 with different preset thicknesses, and can select an appropriate pressure component 2 according to the actual thickness of the sample to be tested, thereby improving the detection accuracy and the applicable range of the sample, and improving the flexibility and pertinence of the sample loading tool.

[0061] The inventors also found during the research that during the sample loading process, the baffle 12 and the sample window 120 are pressed against the table, and the thickness of the sample window 120 is very thin (less than one millimeter), and foreign matter on the table can easily scratch the sample surface. To solve this problem, in some embodiments, Figures 1 to 7 As shown, the semiconductor testing equipment sample loading tooling also includes:

[0062] The support assembly 3 is disposed on a side of the sample holder assembly 1 close to the sample window 120 . The support assembly 3 is configured to support the sample holder assembly 1 so that the sample window 120 is suspended in the air.

[0063] Specifically, the support component 3 can support the portion of the baffle 12 where the sample window 120 is not provided, so that the sample can be suspended in the air without contacting the desktop, protecting the surface of the sample from being scratched by desktop particles. At the same time, supporting the baffle 12 can reduce the probability of desoldering of the baffle 12.

[0064] The sample loading tool of this embodiment can prevent foreign objects on the desktop from touching the sample window 120 by suspending the sample window 120, thereby protecting the sample; at the same time, it can also support the baffle 12 to prevent the baffle 12 from becoming desoldered.

[0065] In some embodiments, Figures 1 to 7 As shown, the support assembly 3 includes:

[0066] The base 31 is spaced apart from the sample window 120 along the first direction x; and

[0067] Two supporting platforms 32 are arranged relatively spaced apart along the second direction y, and both supporting platforms 32 extend along the third direction z, the second direction y is perpendicular to the first direction x, the third direction z is perpendicular to the first direction x and the second direction y, the two supporting platforms 32 are configured to support the baffle 12, and the sample window 120 is located in the space between the two supporting platforms 32 along the second direction y.

[0068] Specifically, the base 31 is used to increase the weight and stability of the support assembly 3. Specifically, the two support platforms 32 directly support the baffle 12, so that the sample window 120 is located between the two support platforms, which can ensure that the sample window area is suspended during the pressure application process, protecting the surface of the sample from being scratched by desktop particles.

[0069] Optionally, a groove may be provided on the upper surface of the base 31 to further increase the interval between the sample window 120 and the base 31 along the first direction x, or no groove may be provided. Optionally, the number of the support platforms 32 may be changed to three or four to support three or four boundaries of the baffle 12 .

[0070] The support assembly 3 of this embodiment can not only fix the position of the base 11 so that the base 11 is not easy to slide when the pressing block 13 is fixed, but also can suspend the sample to protect the surface of the sample from being scratched by desktop particles, while supporting the baffle 12 of the sample holder assembly 1 to reduce the probability of desoldering of the baffle 12.

[0071] In some embodiments, Figure 5 and Figure 6 As shown, the support assembly 3 also includes:

[0072] A first limiting plate 301 and a second limiting plate 302 are respectively arranged on the two bearing platforms 32, and the first limiting plate 301 and the second limiting plate 302 both extend along the third direction z, and the first limiting plate 301 and the second limiting plate 302 are configured to limit the side wall of the substrate 11 along the second direction y; and

[0073] The third limiting plate 303 is connected between the two supporting platforms 32. The third limiting plate 303 extends along the second direction y. The third limiting plate 303 is configured to limit the side wall of the substrate 11 along the third direction z. The first limiting plate 301, the second limiting plate 302 and the third limiting plate 303 enclose a receiving cavity for receiving the substrate 11.

[0074] Specifically, the first limiting plate 301 and the second limiting plate 302 are respectively mounted on the two bearing platforms 32, and they limit the side wall of the substrate 11 in the second direction y to ensure that the sample holder assembly 1 is stable and does not shift. Specifically, the third limiting plate 303 is connected between the two bearing platforms 32, and limits the side wall of the substrate 11 along the third direction z, which can further enhance the stability of the sample holder assembly 1.

[0075] Specifically, the receiving cavity formed by the three limiting plates is close to the size of the original sample rack of the semiconductor testing equipment, so as to fix the sample rack assembly 1. Optionally, the three limiting plates, the two bearing platforms and the base 31 can be welded to form the support assembly 3.

[0076] The three limiting plates of this embodiment work together to form a receiving cavity for receiving the substrate 11 , which can not only stably support and fix the sample holder assembly 1 to improve the stability and reliability of sample loading, but also ensure the precise position of the sample window 120 .

[0077] In some embodiments, Figures 1 to 7 As shown,

[0078] The first limiting plate 301 is flush with the side of the carrying platform 32 away from the base 11, and along the second direction y, the thickness of the first limiting plate 301 is less than the thickness of the carrying platform 32; and / or

[0079] The second limiting plate 302 is flush with a side of the carrying platform 32 away from the base 11 , and along the second direction y, the thickness of the second limiting plate 302 is less than the thickness of the carrying platform 32 .

[0080] Specifically, by defining the position and thickness of the first limiting plate 301 and the second limiting plate 302, the three limiting plates, the two bearing platforms and the base 31 are combined to form a receiving cavity with a slide groove, and the substrate 11 can slide into the receiving cavity from the opening side of the receiving cavity. Specifically, both ends of the baffle 12 are supported by the bearing platform 32, the three side walls of the substrate 11 are limited by the three limiting plates, and the sample window 120 on the baffle 12 is spaced from the base 31 along the first direction x.

[0081] In this embodiment, three limiting plates, two bearing platforms and a base 31 are combined to form a receiving cavity with a slide groove, which can facilitate the installation of the sample rack assembly 1 to the supporting assembly 3 and improve the convenience of using the sample loading tool.

[0082] In some embodiments, Figure 1 and Figure 2 As shown, a fixing member 15 is provided on the base 11, and the fixing member 15 is configured to fix the pressing block 13 at a preset position.

[0083] The third limiting plate 303 is spaced apart from the first limiting plate 301 to form a first spacing space, and the fixing member 15 is located in the first spacing space; and / or

[0084] The third limiting plate 303 and the second limiting plate 302 are spaced apart to form a second spacing space, and the fixing member 15 is located in the second spacing space.

[0085] Specifically, the fixing member 15 can fix the pressing block 13 at a preset position. Specifically, because the support assembly 3 can fix the position of the base 11, the base 11 is not easy to slide when the fixing member 15 is installed, and the installation process will be safer and more convenient. Optionally, the fixing member 15 can be a screw or the like. Optionally, the outer contour of the base 11 is a hexahedral structure, and a transition connection portion 14, such as a chamfer or a rounded corner, can be provided on the base 11, and the fixing member 15 is provided at the position where the transition connection portion 14 is located.

[0086] The support assembly of this embodiment can provide a gap for the installation of the fixing member 15 by presetting the first spacing space and the second spacing space, so that the installation process of the fixing member 15 is safer and more convenient, and the ease of use of the sample loading tooling can be improved.

[0087] The following is a specific example to illustrate the method of using the semiconductor testing equipment sample loading tooling disclosed in the present invention. Figures 4 to 7 As shown, the following steps can be followed when loading the sample:

[0088] 1. Place the sample rack assembly 1 with its front side facing downward in a receiving cavity with a slide groove formed by the first limiting plate 301, the second limiting plate 302, the third limiting plate 303, the two bearing platforms 32 and the base 31, so that the mounting fixture 15 is located in the first spacing space and / or the second spacing space;

[0089] 2. After the substrate 11 is placed in place, the sample window 120 is suspended and located between the two supporting platforms 32. Four samples of appropriate size are selected and placed face down on the sample window 120 one by one, and a gold-plated spring of the same specification is placed on the back of each sample;

[0090] 3. Gently place the pressing block 13 into the receiving groove, and keep the pressing block 13 as horizontal as possible;

[0091] Fourth, select a pressure assembly 2 that matches the sample thickness, and horizontally cover the pressure plate 21 on the pressure block 13. The operator applies pressure along the first direction x through the force member 23 until the cover plate 22 abuts against the top surface of the base 11;

[0092] 5. Keep the pressure assembly 2 in place and install the fixing member 15 to fix the pressure block 13;

[0093] 6. Remove the pressure component 2, take down the loaded sample holder component 1 from the support component 3, and install the sample holder component 1 to the semiconductor testing equipment for testing.

[0094] Secondly, the present disclosure proposes a semiconductor testing device, which is loaded with samples through the semiconductor testing device sample loading tooling of the above embodiment.

[0095] In the semiconductor testing device of this embodiment, the loaded samples are placed horizontally and in the same horizontal plane. During the testing process, the electromagnetic field on the surface of the samples is uniform, which can reduce test errors, and the test results are highly accurate and efficient.

[0096] In some embodiments, the semiconductor inspection equipment includes a secondary ion mass spectrometer.

[0097] The above is a detailed introduction to a semiconductor testing equipment sample loading tool and semiconductor testing equipment provided by the present disclosure. Specific embodiments are used in this article to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only used to help understand the method and core ideas of the present disclosure. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present disclosure, several improvements and modifications can be made to the present disclosure, and these improvements and modifications also fall within the scope of protection of the claims of the present disclosure.

Claims

1. A semiconductor testing equipment sample loading tool, characterized in that: include: A sample rack assembly (1) is configured to load a sample, the sample rack assembly (1) comprising a base (11), a baffle (12) and a pressing block (13), the base (11) comprising a receiving groove (10) extending through the base (11) along a first direction (x), the baffle (12) being fixed to a first end of the base (11) and covering an opening of the receiving groove (10), the baffle (12) being perpendicular to the first direction (x), a sample window (120) being provided on the baffle (12), the sample and the pressing block (13) being both placed in the receiving groove (10) from a second end of the base (11), and the sample being located between the sample window (120) and the pressing block (13); and The pressure-applying assembly (2) is configured to apply pressure to the upper surface of the pressing block (13) in a direction close to the sample window (120) along the first direction (x), so that the pressing block (13) moves a preset distance along the first direction (x) to reach a preset position. The pressure-applying assembly (2) includes a pressure plate (21), the pressure plate (21) is perpendicular to the first direction (x) and has a preset thickness along the first direction (x), the preset thickness is equal to the preset distance, and the size of the pressure plate (21) is less than or equal to the size of the accommodating groove (10).

2. The semiconductor testing equipment sample loading tool according to claim 1, characterized in that: The pressure applying component (2) further comprises: A cover plate (22) connected to a side of the pressure plate (21) away from the pressure block (13), wherein the cover plate (22) abuts against the top surface of the base body (11); and A force applying member (23) is connected to a side of the cover plate (22) away from the pressure applying plate (21), and the force applying member (23) is configured to receive an external force.

3. The semiconductor testing equipment sample loading tool according to claim 1, characterized in that: The pressure-applying components (2) are provided in plurality, and the preset thickness of the pressure plate (21) of each pressure-applying component (2) is different. The semiconductor testing equipment sample loading tool can selectively use the pressure-applying component (2) adapted to the sample thickness.

4. The semiconductor testing equipment sample loading tool according to any one of claims 1 to 3, characterized in that: Also includes: The support component (3) is arranged on a side of the sample rack component (1) close to the sample window (120), and the support component (3) is configured to support the sample rack component (1) so that the sample window (120) is suspended in the air.

5. The semiconductor testing equipment sample loading tool according to claim 4, characterized in that: The support assembly (3) comprises: a base (31) spaced apart from the sample window (120) along the first direction (x); and Two support platforms (32), the two support platforms (32) are arranged relatively spaced apart along a second direction (y), and the two support platforms (32) both extend along a third direction (z), the second direction (y) is perpendicular to the first direction (x), and the third direction (z) is perpendicular to the first direction (x) and the second direction (y), the two support platforms (32) are configured to support the baffle (12), and the sample window (120) is located in the space between the two support platforms (32) along the second direction (y).

6. The semiconductor testing equipment sample loading tool according to claim 5, characterized in that: The support assembly (3) further comprises: A first limiting plate (301) and a second limiting plate (302) are respectively arranged on the two supporting platforms (32), the first limiting plate (301) and the second limiting plate (302) both extend along the third direction (z), and the first limiting plate (301) and the second limiting plate (302) are configured to limit the side wall of the substrate (11) along the second direction (y); and A third limiting plate (303) is connected between the two supporting platforms (32), and the third limiting plate (303) extends along the second direction (y). The third limiting plate (303) is configured to limit the side wall of the substrate (11) along the third direction (z). The first limiting plate (301), the second limiting plate (302) and the third limiting plate (303) are combined to form a receiving cavity for receiving the substrate (11).

7. The semiconductor testing equipment sample loading tool according to claim 6, characterized in that: The first limiting plate (301) is flush with a side of the bearing platform (32) away from the base (11), and along the second direction (y), the thickness of the first limiting plate (301) is less than the thickness of the bearing platform (32); and / or The second limiting plate (302) is flush with a side of the bearing platform (32) away from the base (11), and along the second direction (y), the thickness of the second limiting plate (302) is less than the thickness of the bearing platform (32).

8. The semiconductor testing equipment sample loading tool according to claim 6, characterized in that: The base (11) is provided with a fixing member (15), and the fixing member (15) is configured to fix the pressing block (13) at the preset position, wherein: The third limiting plate (303) and the first limiting plate (301) are spaced apart to form a first spacing space, and the fixing member (15) is located in the first spacing space; and / or The third limiting plate (303) and the second limiting plate (302) are spaced apart to form a second spacing space, and the fixing member (15) is located in the second spacing space.

9. A semiconductor testing device, characterized in that: The sample is loaded by using the semiconductor testing equipment sample loading tool as described in any one of claims 1 to 8.

10. The semiconductor testing device according to claim 9, characterized in that: Includes secondary ion mass spectrometer.

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