Wafer disc clamping device

Abstract

The utility model discloses a wafer disc clamping device which comprises a main installation assembly, side sealing assemblies are arranged on the two sides of the main installation assembly, a left rotating shaft and a right rotating shaft are arranged on the main installation assembly, a lower rotating block is arranged on the left rotating shaft, a left jacking column is arranged on the lower rotating block, and a right jacking column is arranged on the right rotating shaft. A left side gas circuit board is arranged on the left side jacking column, a lower clamping assembly is arranged on the lower rotating block, an upper rotating block is arranged on the right side rotating shaft, a right side jacking column is arranged on the upper rotating block, a right side gas circuit board is arranged below the right side jacking column, and an upper clamping assembly is arranged on the upper rotating block. Compared with the prior art, the wafer disc clamping device has the advantages that the wafer disc clamping device is ingenious in structural design, high in practicability, small in size and stable in clamping, the wafer disc is effectively prevented from being damaged in the clamping process by applying the wafer disc clamping device, and the clamping and carrying efficiency of the wafer disc is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer disc clamping, in particular to a wafer disc clamping device. Background Art

[0002] The wafer disc raw materials of the fully automatic crystal bonding machine are usually loaded manually. This is because the structure of the wafer disc is soft and fragile, and is a perfect circle with a circle of steel wire on the edge and a taut plastic film inside. Conventional pneumatic grippers and cylinders cannot be used for wafer disc loading due to their large size and strong clamping force. For this reason, a wafer disc clamping device is designed. Utility Model Content

[0003] The utility model aims to solve the above problems and designs a wafer disc clamping device.

[0004] To achieve the above-mentioned purpose, the technical solution of the utility model is: a wafer disk clamping device, including a main mounting assembly, the main mounting assembly is provided with side sealing assemblies on both sides, the main mounting assembly is provided with a left rotating shaft and a right rotating shaft, the left rotating shaft is provided with a lower rotating block, the lower rotating block is provided with a left lifting column, the left lifting column is provided with a left air circuit plate, the lower rotating block is provided with a lower clamping assembly, the right rotating shaft is provided with an upper rotating block, the upper rotating block is provided with a right lifting column, the right air circuit plate is provided below the right lifting column, the upper rotating block is provided with an upper clamping assembly, the main mounting assembly is provided with a spring for supporting the upper rotating block, and the main mounting assembly is provided with a spring for supporting the lower rotating block.

[0005] As a further description of the technical solution, the main mounting assembly includes a main mounting base, and side sealing assemblies are arranged on both sides of the main mounting base.

[0006] As a further description of the technical solution, the side sealing assembly includes side sealing covers arranged on both sides of the main mounting assembly.

[0007] As a further description of the technical solution, a left lifting soft membrane is arranged on the left gas circuit plate, and a left gas circuit joint is arranged on the side of the left gas circuit plate.

[0008] As a further description of the technical solution, a right lifting soft membrane is arranged on the right gas circuit plate, and a right gas circuit joint is arranged on the side of the right gas circuit plate.

[0009] As a further description of the technical solution, the lower clamping assembly includes a lower clamping plate arranged on the lower rotating block.

[0010] As a further description of the technical solution, the upper clamping assembly includes an upper clamping plate arranged on the upper rotating block.

[0011] The beneficial effect is that the wafer disc clamping device of the technical solution has an ingenious structural design, strong practicality, small size, and stable clamping. The use of this wafer disc clamping device can effectively avoid damage to the wafer disc during the clamping process and effectively improve the efficiency of wafer disc clamping and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 It is a schematic diagram of the installation structure of the left side gas circuit board of the utility model;

[0014] Figure 3 It is a schematic diagram of the installation structure of the right side gas circuit board of the utility model;

[0015] Figure 4 It is a schematic diagram of the installation structure of the right rotating shaft of the utility model.

[0016] In the figure, 1. main installation assembly; 2. side sealing assembly; 3. left rotating shaft; 4. right rotating shaft; 5. lower rotating block; 6. left lifting column; 7. left air circuit board; 8. lower clamping assembly; 9. upper rotating block; 10. right lifting column; 11. right air circuit board; 12. upper clamping assembly; 13. main installation base; 14. side sealing cover; 15. left lifting soft membrane; 16. left air circuit connector; 17. right lifting soft membrane; 18. right air circuit connector; 19. lower clamping plate; 20. upper clamping plate. DETAILED DESCRIPTION

[0017] First of all, the design intention of the utility model is explained. The wafer disc raw materials of the fully automatic crystal bonding machine are usually manually loaded by humans. This is because the structure of the wafer disc is soft and easily damaged, and is a perfect circle with a circle of steel wire on the edge and a taut plastic film inside. Conventional pneumatic clamps and cylinders are too large in size and have too much impact in clamping to be used for wafer disc loading. Therefore, the utility model designs a wafer disc clamping device.

[0018] The utility model is described in detail below in conjunction with the accompanying drawings. Figure 1-Figure 4 As shown, a wafer disk clamping device includes a main mounting component 1. The main mounting component 1 will be described in detail below. The main mounting component 1 includes a main mounting base 13. Side sealing components 2 are arranged on both sides of the main mounting base 13. The main mounting component 1 is provided with a spring for supporting an upper rotating block 9. The main mounting component 1 is provided with a spring for supporting a lower rotating block 5.

[0019] In order to ensure the sealing performance, side sealing components 2 are arranged on both sides of the main installation component 1. The side sealing components 2 will be described in detail below. The side sealing components 2 include side sealing covers 14 arranged on both sides of the main installation component 1.

[0020] In order to facilitate the installation of the lower rotating block 5 and the upper rotating block 9, a left rotating shaft 3 and a right rotating shaft 4 are arranged on the main installation component 1, the lower rotating block 5 is arranged on the left rotating shaft 3, the lower rotating block 5 is arranged with a left lifting column 6, the left lifting column 6 is arranged with a left air circuit plate 7, the left lifting soft membrane 15 is arranged on the left air circuit plate 7, and the left air circuit joint 16 is arranged on the side of the left air circuit plate 7.

[0021] An upper rotating block 9 is arranged on the right rotating shaft 4, a right lifting column 10 is arranged on the upper rotating block 9, a right air path plate 11 is arranged below the right lifting column 10, a right lifting soft film 17 is arranged on the right air path plate 11, and a right air path joint 18 is arranged on the side of the right air path plate 11.

[0022] A lower clamping assembly 8 is arranged on the lower rotating block 5 . The lower clamping assembly 8 will be described in detail below. The lower clamping assembly 8 includes a lower clamping plate 19 arranged on the lower rotating block 5 .

[0023] An upper clamping assembly 12 is arranged on the upper rotating block 9 . The upper clamping assembly 12 will be described in detail below. The upper clamping assembly 12 includes an upper clamping plate 20 arranged on the upper rotating block 9 .

[0024] The specific structure of the utility model is described in detail above. The working principle of the utility model will be described below: when the non-clamping action is in progress, there is no air pressure in the air circuit, the lower rotating block 5 and the upper rotating block 9 are rotated and opened by the spring from the main mounting assembly 1, thereby opening the lower clamping plate 19 and the upper clamping plate 20. When the clamping action is in progress, the left air circuit connector 16 and the right air circuit connector 18 are respectively connected to positive pressure gas, and positive pressure gas is generated inside the left lifting soft film 15 and the right lifting soft film 17. The left lifting soft film 15 and the right lifting soft film 17 are inflated by the gas, driving the left lifting column 6 to move downward, and the left lifting column 6 gives the lower rotating block 5 a torque, thereby driving the lower rotating block 5 to move downward. The lower rotating block 5 rotates, thereby causing the lower clamping plate 19 to rotate upward, and the right-side lifting soft film 17 is inflated by the gas, driving the right-side lifting column 10 to move upward, and the right-side lifting column 10 gives the upper rotating block 9 a torque, thereby driving the upper rotating block 9 to rotate, thereby causing the upper clamping plate 20 to rotate downward, and the upper clamping plate 20 and the lower clamping plate 19 together constitute a closed clamping state, thereby clamping the wafer disc. The wafer disc clamping device of the present technical solution has a clever structural design, strong practicality, small size, and stable clamping. The use of this wafer disc clamping device can effectively avoid damage to the wafer disc during the clamping process, and also effectively improve the efficiency of wafer disc clamping and transportation.

[0025] The above technical solutions only reflect the preferred technical solutions of the technical solutions of the present utility model. Some changes that may be made to certain parts thereof by technicians in this technical field all reflect the principles of the present utility model and fall within the protection scope of the present utility model.

Claims

1. A wafer clamping device, characterized in that: The invention comprises a main mounting assembly (1), wherein the main mounting assembly (1) is provided with side sealing assemblies (2) on both sides, the main mounting assembly (1) is provided with a left rotating shaft (3) and a right rotating shaft (4), the left rotating shaft (3) is provided with a lower rotating block (5), the lower rotating block (5) is provided with a left jacking column (6), the left jacking column (6) is provided with a left air path plate (7), the lower rotating block (5) is provided with a lower clamping assembly (8), the right rotating shaft (4) is provided with an upper rotating block (9), the upper rotating block (9) is provided with a right jacking column (10), a right air path plate (11) is provided below the right jacking column (10), the upper rotating block (9) is provided with an upper clamping assembly (12), the main mounting assembly (1) is provided with a spring for supporting the upper rotating block (9), and the main mounting assembly (1) is provided with a spring for supporting the lower rotating block (5).

2. A wafer clamping device according to claim 1, characterized in that: The main installation assembly (1) comprises a main installation base (13), and side sealing assemblies (2) are arranged on both sides of the main installation base (13).

3. The wafer clamping device according to claim 1, characterized in that: The side sealing assembly (2) comprises side sealing covers (14) arranged on both sides of the main mounting assembly (1).

4. The wafer clamping device according to claim 1, characterized in that: A left lifting soft film (15) is arranged on the left gas circuit plate (7), and a left gas circuit connector (16) is arranged on the side of the left gas circuit plate (7).

5. The wafer clamping device according to claim 1, characterized in that: A right lifting soft film (17) is arranged on the right gas circuit plate (11), and a right gas circuit connector (18) is arranged on the side of the right gas circuit plate (11).

6. The wafer clamping device according to claim 1, characterized in that: The lower clamping assembly (8) comprises a lower clamping plate (19) arranged on the lower rotating block (5).

7. The wafer clamping device according to claim 1, characterized in that: The upper clamping assembly (12) comprises an upper clamping plate (20) arranged on an upper rotating block (9).

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