Chip heat conduction structure and X-ray flat panel detector
By using highly thermally conductive flexible materials and foam structures in X-ray flat plate detectors, the problem of insufficient temperature rise of traditional detector chips is solved, better heat conduction is achieved, and cost and complexity is reduced.
Patent Information
- Application Number
- CN202420268578.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-02
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-02-02
AI Technical Summary
Traditional digital X-ray flat-panel detectors lack thermal conductivity, resulting in insufficient chip heating, especially in remote areas, which is difficult to effectively control ambient temperature, affecting the performance of the detector, and increasing metal thermal conductivity measures will increase cost and complexity.
Using a highly thermally conductive flexible material and foam structure, the chip is welded on the PCB board, wrapped the foam and placed the highly thermally conductive flexible material on the chip. The thermally conductive material is compressed by using the detector shell to achieve heat exchange between the chip and the shell.
It reduces the cost and weight of the detector, simplifies the assembly and processing process, improves the heat conduction effect, and solves the chip heat exchange problem.
Smart Images
Figure CN222338275U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of X-ray flat panel detector imaging, and in particular to a chip heat conduction structure and an X-ray flat panel detector. Background Art
[0002] Digital X-ray flat-panel detectors usually use integrated circuit chips, which consume relatively high power. Traditional detectors do not use thermal conductivity measures, or conduct heat to the shell through metal, and then the external environment and the shell perform heat exchange. Without thermal conductivity measures, the external environment temperature requirements are relatively high, leaving less room for chip temperature rise. Environmental problems cannot be effectively controlled in remote areas, resulting in a decline in detector product performance. Adding metal thermal conductivity measures to the detector increases costs, and has high design requirements for the processing and assembly of thermally conductive metal parts. Utility Model Content
[0003] The embodiment of the utility model provides a chip heat conduction structure, which solves the technical problem of heat exchange between the chip and the external environment.
[0004] In a first aspect, an embodiment of the utility model provides a chip heat conduction structure for an X-ray flat panel detector, comprising: a detector housing, a high thermal conductivity flexible material, foam, a chip, and a PCB board; wherein:
[0005] The chip is soldered on the PCB board, the high thermal conductivity flexible material wraps the foam and is placed directly on the chip, and then the detector housing compresses the high thermal conductivity flexible material and the foam to make the high thermal conductivity flexible material contact with the chip and the high thermal conductivity flexible material contact with the detector housing for heat conduction.
[0006] Furthermore, the high thermal conductivity flexible material is graphene.
[0007] Furthermore, the foam is easily compressible.
[0008] Furthermore, the positions of the chip and the PCB board are relatively fixed and unchanged.
[0009] Furthermore, the number of the chips is one or more.
[0010] Furthermore, the number of the high thermal conductivity flexible material and the foam is the same as the number of the chips.
[0011] In a second aspect, an embodiment of the utility model provides an X-ray flat panel detector, comprising a chip heat conduction structure based on any one of the above embodiments.
[0012] The technical solution of the embodiment of the utility model reduces the cost and weight of the X-ray flat panel detector through the use of high thermal conductivity flexible materials and foam, makes it easy to assemble and process, and better conducts heat to the external environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a structural schematic diagram of a chip heat conduction structure in an embodiment of the utility model. DETAILED DESCRIPTION
[0014] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0015] It should be mentioned before discussing the exemplary embodiments in more detail that some exemplary embodiments are described as processes or methods depicted as flow charts. Although the flow charts describe the steps as sequential processes, many of the steps therein can be implemented in parallel, concurrently or simultaneously. In addition, the order of the steps can be rearranged. The process can be terminated when its operation is completed, but can also have additional steps not included in the accompanying drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.
[0016] In addition, the terms "first", "second", etc. can be used in this article to describe various directions, actions, steps or elements, but these directions, actions, steps or elements are not limited by these terms. These terms are only used to distinguish a first direction, action, step or element from another direction, action, step or element. For example, without departing from the scope of the present application, the first speed difference can be referred to as the second speed difference, and similarly, the second speed difference can be referred to as the first speed difference. Both the first speed difference and the second speed difference are speed differences, but they are not the same speed difference. The terms "first", "second", etc. cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0017] Reference Figure 1 A chip heat conduction structure according to an embodiment of the utility model is used for an X-ray flat panel detector, comprising: a detector housing 1, a high thermal conductivity flexible material 2, a foam 3, a chip 4, and a PCB board 5; wherein:
[0018] The chip 4 is soldered on the PCB board 5, the high thermal conductivity flexible material 2 wraps the foam 3 and is placed directly on the chip 4, and then the detector housing 1 compresses the high thermal conductivity flexible material 2 and the foam 3, so that the high thermal conductivity flexible material 2 and the chip 4, and the high thermal conductivity flexible material 2 and the detector housing 1 are in contact for heat conduction.
[0019] As an optional embodiment, the high thermal conductivity flexible material 2 is graphene. The thermal conductivity of graphene is 13 times that of copper. It is understandable that the type of the high thermal conductivity flexible material 2 can be other materials besides graphene, and the embodiment of the utility model is not limited to this.
[0020] As an optional embodiment, the foam 3 is easy to compress. Specifically, the foam 3 has a large compression amount and will not cause damage to the chip 4. When the chip 4 generates heat, the heat is conducted to the detector housing 1 through the high thermal conductivity flexible material 2, and the detector housing 1 then exchanges heat with the external environment.
[0021] As an optional embodiment, the positions of the chip 4 and the PCB board 5 are relatively fixed and unchanged.
[0022] As an optional embodiment, the number of the chips 4 is one or more. The number of the highly thermally conductive flexible material 2 and the foam 3 is the same as the number of the chips 4 .
[0023] As an optional embodiment, the chip heat conduction structure further includes a detector outer frame 6, which is assembled with the detector housing 1 to complete the shell.
[0024] The embodiment of the utility model further provides an X-ray flat panel detector, comprising a chip heat conduction structure based on any one of the above embodiments.
[0025] The technical solution of the embodiment of the utility model reduces the cost and weight of the X-ray flat panel detector through the use of high thermal conductivity flexible materials and foam, makes it easy to assemble and process, and better conducts heat to the external environment.
[0026] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims
1. A chip heat conduction structure for an X-ray flat panel detector, characterized in that: include: Detector housing, high thermal conductivity flexible material, foam, chip, PCB board; including: The chip is soldered on the PCB board, the high thermal conductivity flexible material wraps the foam and is placed directly on the chip, and then the detector housing compresses the high thermal conductivity flexible material and the foam, so that the high thermal conductivity flexible material contacts the chip and the high thermal conductivity flexible material contacts the detector housing for heat conduction; The high thermal conductivity flexible material is graphene.
2. The chip heat conduction structure according to claim 1, characterized in that: The foam is easily compressible.
3. The chip heat conduction structure according to claim 1, characterized in that: The positions of the chip and the PCB board are relatively fixed and unchanged.
4. The chip heat conduction structure according to claim 1, characterized in that: The number of the chips is one or more.
5. The chip heat conduction structure according to claim 4, characterized in that: The number of the high thermal conductivity flexible material and the foam is the same as the number of the chips.
6. An X-ray flat panel detector, characterized in that: The invention comprises a chip heat conduction structure according to any one of claims 1 to 5.