Gallium nitride module and semiconductor device

Abstract

The utility model relates to a gallium nitride module and a semiconductor device, and belongs to the technical field of gallium nitride. The heat dissipation structure comprises a first PCB and a copper clamp arranged on the first surface of the first PCB, the surface of the copper clamp is provided with a heat dissipation sheet, and the heat dissipation sheet is used for clamping a gallium nitride chip between the copper clamp and the first surface of the first PCB and carrying out heat dissipation on the gallium nitride chip; the gallium nitride chip can be connected with the PCB without wire bonding, and heat generated in the operation process of the gallium nitride chip can be rapidly conducted out through the good heat conduction performance of the copper clamp. Meanwhile, the radiating fins are arranged on the surface of the copper clamp, the radiating surface area is further increased, the radiating efficiency is improved, when the gallium nitride module works, heat generated by the gallium nitride chip is conducted to the surrounding environment through the radiating fins on the surface of the copper clamp, performance reduction or overheating damage of the gallium nitride chip is prevented, and the radiating performance of the gallium nitride module is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of gallium nitride, in particular to a gallium nitride module and a semiconductor device. Background Art

[0002] Gallium nitride module is a power semiconductor device made of gallium nitride material. Due to its excellent power characteristics and high-frequency characteristics, it has higher power density and lower switching losses than traditional silicon-based power devices. Therefore, it is usually used in high-frequency, high-power and high-temperature applications.

[0003] In the prior art, the GaN chip is directly connected to the PCB board by patch welding, and the GaN driving circuit is used to drive the GaN chip. However, since the GaN module has a high power density, it will generate a lot of heat when working, and the heat dissipation effect of the PCB board material is poor. The heat generated by the GaN chip cannot be dissipated in time, so that the temperature of the GaN chip increases with the use time, affecting the service life of the GaN chip, thereby causing the performance of the GaN module to deteriorate or cause damage.

[0004] In summary, how to design a GaN module with good heat dissipation performance is an urgent problem to be solved. Utility Model Content

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the problem of poor heat dissipation performance of the gallium nitride module in the prior art.

[0006] In order to solve the above technical problems, the utility model provides a gallium nitride module, comprising:

[0007] First PCB board;

[0008] A copper clip is arranged on the first surface of the first PCB board, and a heat sink is arranged on the surface of the copper clip, and is used to clamp the gallium nitride chip between the copper clip and the first surface of the first PCB board, and to dissipate heat for the gallium nitride chip;

[0009] Wherein, the gallium nitride chip is electrically connected to the first PCB board.

[0010] Preferably, the pins of the gallium nitride chip are soldered to the first surface of the first PCB board.

[0011] Preferably, the copper clip is welded to the first surface of the first PCB board.

[0012] Preferably, the gallium nitride driving circuit is arranged on the second surface of the first PCB board and is electrically connected to the first PCB board.

[0013] Preferably, the gallium nitride driving circuit is soldered to the second surface of the first PCB board.

[0014] Preferably, it also includes:

[0015] A second PCB board, a first surface of which faces the second surface of the first PCB board;

[0016] The copper column is arranged between the first PCB board and the second PCB board, one end of which is connected to the second surface of the first PCB board, and the other end of which is connected to the first surface of the second PCB board.

[0017] Preferably, through holes matching the copper pillars are provided on the second surface of the first PCB board and the first surface of the second PCB board, one end of the copper pillar is inserted into the through hole on the second surface of the first PCB board, and the other end of the copper pillar is inserted into the through hole on the first surface of the second PCB board.

[0018] Preferably, one end of the copper column is welded to the second surface of the first PCB board, a through hole matching the copper column is provided on the first surface of the second PCB board, and the other end of the copper column is plugged into the through hole on the first surface of the second PCB board.

[0019] Preferably, the gallium nitride module is molded by epoxy resin.

[0020] The utility model also provides a semiconductor device, which comprises the above-mentioned gallium nitride module.

[0021] The gallium nitride module provided by the utility model comprises a first PCB board and a copper clip arranged on a first surface of the first PCB board. The gallium nitride chip is clamped between the first surface of the first PCB board and the copper clip by using the copper clip, and the gallium nitride chip is electrically connected to the first PCB board, so that the gallium nitride chip can be connected to the PCB board without wire bonding, and the good thermal conductivity of the copper clip can quickly conduct away the heat generated during the operation of the gallium nitride chip; at the same time, by arranging a heat sink on the surface of the copper clip, the heat dissipation surface area is further increased, and the heat dissipation efficiency is improved. When the gallium nitride module is working, the heat generated by the gallium nitride chip is conducted to the surrounding environment through the heat sink on the surface of the copper clip, so as to prevent the gallium nitride chip from being degraded in performance or damaged by overheating, thereby improving the heat dissipation performance of the gallium nitride module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein

[0023] Figure 1 A schematic diagram of the structure of a gallium nitride module provided in this application;

[0024] Figure 2 A schematic diagram of the structure of the second gallium nitride module provided in this application;

[0025] Figure 3 A schematic diagram of the structure of the third gallium nitride module provided in this application;

[0026] Explanation of the reference numerals in the specification: 1. First PCB board; 2. Copper clip; 3. Gallium nitride chip; 4. Gallium nitride driving circuit; 5. Second PCB board; 6. Copper pillar. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0028] See also Figure 1 , Figure 1 This is a structural schematic diagram of the gallium nitride module provided in the present application, and the module specifically comprises: a first PCB board 1 and a copper clip 2;

[0029] The copper clip 2 is arranged on the first surface of the first PCB board 1, and a heat sink is arranged on the surface of the copper clip 2, which is used to clamp the gallium nitride chip 3 between the copper clip 2 and the first surface of the first PCB board 1 and dissipate heat for the gallium nitride chip 3;

[0030] The gallium nitride chip 3 is electrically connected to the first PCB board 1 .

[0031] For example, Figure 1 As shown in the figure, the shape of the copper clip can be L-shaped, one end of which is connected to the first PCB board, and a certain space is left between the other end and the first surface of the first PCB board for accommodating and fixing the gallium nitride chip. By adjusting the clamping force of the copper clip, an effective connection between the gallium nitride chip and the first PCB board is ensured.

[0032] Optionally, in some embodiments of the present application, the heat sink may be in the shape of a fin or a rectangular sheet, or may be other sheet structures that can be used for heat dissipation, which is not limited in the present application.

[0033] The gallium nitride module provided by the present application uses a copper clip to clamp the gallium nitride chip between the first surface of the first PCB board and the copper clip, so that the gallium nitride chip can be connected to the PCB board without wire bonding. The gallium nitride chip can be conveniently fixed on the PCB board by adjusting the clamping force of the copper clip, which simplifies the installation and removal process of the gallium nitride chip. In addition, the good thermal conductivity of the copper clip can quickly conduct the heat generated during the operation of the gallium nitride chip to maintain a stable operating temperature of the gallium nitride chip. At the same time, by arranging a heat sink on the surface of the copper clip, the heat dissipation surface area is further increased, and the heat dissipation efficiency is improved. When the gallium nitride module is working, the heat generated by the gallium nitride chip is conducted to the surrounding environment through the heat sink on the surface of the copper clip, thereby extending the service life of the gallium nitride chip, preventing the gallium nitride chip from performance degradation or overheating damage, and improving the heat dissipation performance of the gallium nitride module.

[0034] Specifically, in some embodiments of the present application, the pins of the gallium nitride chip 3 are soldered to the first surface of the first PCB board 1 by soldering and are electrically connected to the first PCB board; the gallium nitride chip is clamped between the first PCB board and the copper clip using a copper clip. Although the connection between the gallium nitride chip and the PCB board can be achieved, the connection between the two may be affected by factors such as the environment or vibration. Therefore, in order to establish a stable electrical connection between the gallium nitride chip and the PCB board, the present application solders the pins of the gallium nitride chip to the first PCB board.

[0035] Optionally, the copper clip 2 may be arranged on the first surface of the first PCB board 1 by mechanical fixing, welding, bonding or hot pressing fixing.

[0036] For example, a through hole or a fixing groove matching the copper clip 2 can be set on the first surface of the first PCB board 1, and the copper clip 2 can be fixed to the first PCB board 1 through the through hole or the fixing groove; the copper clip 2 can also be adhered to the first surface of the first PCB board 1 using a special double-sided tape or adhesive.

[0037] In a specific example of the present application, the copper clip 2 is welded to the first surface of the first PCB board 1 to ensure the connection reliability between the copper clip 2 and the first PCB board.

[0038] Optionally, in some embodiments of the present application, the gallium nitride driving circuit in the gallium nitride module can be connected to the gallium nitride chip through a connecting line, so as to control the working state of the gallium nitride chip; in some other embodiments of the present application, the gallium nitride driving circuit can also be set on the first surface of the first PCB board, and connected to the gallium nitride chip through routing on the PCB board, so as to improve the integration of the gallium nitride module.

[0039] As preferably, Figure 2As shown, in some embodiments of the present application, the gallium nitride driving circuit 4 is disposed on the second surface of the first PCB board 1 and is electrically connected to the first PCB board 1 .

[0040] Specifically, the gallium nitride driving circuit 4 is soldered to the second surface of the first PCB board.

[0041] By placing the GaN chip and the GaN driving circuit on both sides of the PCB board, the integration of the GaN module can be greatly improved, making the GaN module more compact and efficient. In addition, the high degree of integration can reduce the failure points caused by too many connecting lines and improve the reliability of the system. In addition, since the physical distance between the GaN chip and the GaN driving circuit is shortened, the delay in signal transmission between the two is also greatly reduced, which improves the response speed and performance of the GaN module.

[0042] Furthermore, if Figure 3 As shown, the gallium nitride module further includes a second PCB board 5 and a copper pillar 6;

[0043] The first surface of the second PCB board 5 faces the second surface of the first PCB board 1;

[0044] The copper pillar 6 is disposed between the first PCB board 1 and the second PCB board 5 , with one end of the copper pillar connected to the second surface of the first PCB board 1 and the other end of the copper pillar connected to the first surface of the second PCB board.

[0045] The second PCB board arranged above the gallium nitride driving circuit can serve as a protective layer of the gallium nitride driving circuit, which is used to isolate electromagnetic interference, reduce thermal effects, and prevent the external environment from interfering with or damaging the gallium nitride driving circuit; at the same time, since the gallium nitride driving circuit also generates heat when working, by arranging the second PCB board above the gallium nitride driving circuit, the heat dissipation area can also be increased, thereby improving the thermal management efficiency of the entire gallium nitride module; in addition, in some application scenarios, since the gallium nitride driving circuit may require a large number of connecting wires and interfaces, the first PCB board may not be able to meet the wiring requirements. By setting a separate second PCB board, more complex circuit wiring can be achieved, thereby increasing the density and flexibility of wiring.

[0046] Optionally, the number of copper pillars can be determined according to the size of the PCB board. When the area of ​​the PCB board is small, one or two copper pillars can be used to fix the second PCB board parallel to the first PCB board. When the area of ​​the PCB board is large, multiple copper pillars are required to support the second PCB board.

[0047] Optionally, in some embodiments of the present application, through holes matching the copper pillars 6 are provided on the second surface of the first PCB board 1 and the first surface of the second PCB board 5, one end of the copper pillar 6 is plugged into the through hole on the second surface of the first PCB board 1, and the other end of the copper pillar 6 is plugged into the through hole on the first surface of the second PCB board 5; by providing through holes on the surfaces of the two PCB boards and setting the copper pillar between the two PCB boards in a plug-in manner, the entire gallium nitride module can be flexibly disassembled and is easy to install.

[0048] In some other embodiments of the present application, one end of the copper pillar 6 is welded to the second surface of the first PCB board 1, and a through hole matching the copper pillar 6 is provided on the first surface of the second PCB board 5, and the other end of the copper pillar 6 is plugged into the through hole on the first surface of the second PCB board 5; one end of the copper pillar is welded to the surface of the first PCB board, and the other end is connected to the second PCB board by plugging, so that the connection between the copper pillar and the first PCB board is more reliable, and the copper pillar and the second PCB board can also be flexibly disassembled.

[0049] In other embodiments of the present application, the two ends of the copper pillar 6 may also be welded to the second surface of the first PCB board 1 and the first surface of the second PCB board 5 respectively, so as to make the gallium nitride module more stable.

[0050] Furthermore, in some embodiments of the present application, the gallium nitride module is plastic-encapsulated with epoxy resin to protect the gallium nitride module from environmental damage.

[0051] Based on the gallium nitride module provided in the above embodiment, an embodiment of the present application further provides a semiconductor device, which includes the above gallium nitride module.

[0052] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A gallium nitride module, characterized in that: include: First PCB board; A copper clip is arranged on the first surface of the first PCB board, and a heat sink is arranged on the surface of the copper clip, and is used to clamp the gallium nitride chip between the copper clip and the first surface of the first PCB board, and to dissipate heat for the gallium nitride chip; Wherein, the gallium nitride chip is electrically connected to the first PCB board.

2. The gallium nitride module according to claim 1, characterized in that: The pins of the gallium nitride chip are soldered to the first surface of the first PCB board by soldering.

3. The gallium nitride module according to claim 1, characterized in that: The copper clip is welded to the first surface of the first PCB board.

4. The gallium nitride module according to claim 1, characterized in that: The gallium nitride driving circuit is disposed on the second surface of the first PCB board and is electrically connected to the first PCB board.

5. The gallium nitride module according to claim 4, characterized in that: The gallium nitride driving circuit is soldered to the second surface of the first PCB board.

6. The gallium nitride module according to claim 4, characterized in that: Also includes: A second PCB board, a first surface of which faces the second surface of the first PCB board; The copper column is arranged between the first PCB board and the second PCB board, one end of which is connected to the second surface of the first PCB board, and the other end of which is connected to the first surface of the second PCB board.

7. The gallium nitride module according to claim 6, characterized in that: The second surface of the first PCB board and the first surface of the second PCB board are both provided with through holes matching the copper pillars, one end of the copper pillar is inserted into the through hole on the second surface of the first PCB board, and the other end of the copper pillar is inserted into the through hole on the first surface of the second PCB board.

8. The gallium nitride module according to claim 6, characterized in that: One end of the copper column is welded on the second surface of the first PCB board, a through hole matching the copper column is arranged on the first surface of the second PCB board, and the other end of the copper column is plugged into the through hole on the first surface of the second PCB board.

9. The gallium nitride module according to claim 1, characterized in that: The gallium nitride module is plastic-encapsulated by epoxy resin.

10. A semiconductor device, characterized in that: The semiconductor device comprises the gallium nitride module according to any one of claims 1 to 9.

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