MIL-STD-1553B data bus communication interface transceiver module

Abstract

An MIL-STD-1553B data bus communication interface transceiver module comprises a plastic package body, two 1553B isolation transformer modules, a 1553B transceiver module and a heat sink, the 1553B isolation transformer modules, the 1553B transceiver module and the heat sink are stacked together from top to bottom and then are plastically packaged in the plastic package body, and the bottom surface of the heat sink is exposed out of the plastic package body; according to the utility model, the hybrid laminated compression molding packaging of the integrated circuit and the magnetic element is realized for the first time in the plastic packaging technical field, and the blank of no hybrid laminated compression molding packaging technology in the microcircuit plastic packaging field is filled.

Description

Technical Field

[0001] The utility model belongs to the technical field of aviation bus communication, and relates to a MIL-STD-1553B data bus communication interface transceiver module, specifically a bus interface transceiver module for converting Manchester II type biphase level and complementary CMOS level signal in a MIL-STD-1553B bus communication system, and is used between a MIL-STD-1553B bus physical layer protocol controller and a terminal load. Background Art

[0002] MIL-STD-1553B (hereinafter referred to as "1553B") is the abbreviation of "Aircraft Internal Time Division Command / Response Multiplexed Data Bus". It is a US military standard. It is widely used in aviation, aerospace, navigation and other equipment due to its excellent performance. my country has conducted follow-up research on it, formulated the corresponding standard - GJB289, and has put it into practical application.

[0003] The 1553B data bus communication interface transceiver module is a key component of the 1553B bus system. It is used in conjunction with the 1553B protocol control chip or FPGA to realize the long-distance long-line transceiver communication of the 1553B bus. In the prior art, the module adopts LCCC type ceramic packaging, which has the problem that thermal mismatch under temperature cycle stress after installation can easily lead to pin solder joint breakage. In addition, in traditional designs, magnetic components and integrated circuits are generally placed side by side and laid flat on the same substrate for packaging. Not only is the product volume large, but the bonding wires are directly exposed under the flat structure, and there is a disadvantage that the stress between the packaging material cannot be released. The above problems all hinder the miniaturization and reliability of the product, and can no longer meet the needs of miniaturization and high reliability of products in the aviation application field. Utility Model Content

[0004] The utility model aims to provide a MIL-STD-1553B data bus communication interface transceiver module, which adopts a laminated plastic packaging structure to reduce the volume of the module and improve packaging and application reliability.

[0005] The technical solution of the utility model is: a MIL-STD-1553B data bus communication interface transceiver module, including a plastic package, two 1553B isolation transformer modules, a 1553B transceiver module and a heat sink, wherein the 1553B isolation transformer module, the 1553B transceiver module and the heat sink are stacked together from top to bottom and then plastic-sealed in the plastic package, and the bottom surface of the heat sink is exposed from the plastic package; the 1553B transceiver module adopts an MTJ1579NLC chip, and the back side of the PCB substrate of the MTJ1579NLC chip is symmetrically provided with a plurality of first The 1553B transceiver module is arranged with the back side of the PCB substrate facing downward, the 1553B isolation transformer module is symmetrically fixed above the 1553B transceiver module, and the leads of the two 1553B isolation transformer modules are respectively electrically connected to the second pads according to the electrical connection relationship; the heat sink is arranged below the 1553B transceiver module and fixed on the third pad, and two rows of pins are symmetrically welded on the first pad according to the electrical connection relationship, and the two rows of pins extend out of the plastic package.

[0006] Furthermore, the 1553B isolation transformer module is fixed on top of the 1553B transceiver module by epoxy resin.

[0007] Furthermore, the MTJ1579NLC chip is packaged in LGA form.

[0008] Furthermore, the PCB substrate adopts a BT substrate with a Tg value greater than 250°C.

[0009] Furthermore, the third pad is provided with heat dissipation holes that penetrate the PCB substrate evenly distributed thereon;

[0010] Furthermore, the heat sink is made of tungsten-copper alloy material.

[0011] Furthermore, the 1553B isolation transformer adopts a toroidal magnetic core, a double-wire parallel winding method for the primary winding, and a single-wire evenly distributed winding method for the secondary winding. After the primary winding is wound, it is wrapped with polytetrafluoroethylene raw tape, and then the secondary winding is wound. After the secondary winding is wound, it is also wrapped with polytetrafluoroethylene raw tape.

[0012] Furthermore, the pin row is in SOP surface mount form.

[0013] The utility model has the following advantages and effects:

[0014] 1. The utility model realizes the hybrid laminated plastic packaging of integrated circuits and magnetic components for the first time in the field of plastic packaging technology, filling the gap of hybrid laminated plastic packaging technology in the field of microcircuit plastic packaging;

[0015] 2. Compared with the traditional design of packaging solutions that lay magnetic components and integrated circuits side by side on the same substrate, the utility model adopts a stacked packaging structure that has more advantages in terms of miniaturization, and solves the drawback that the stress between the bonding wire and the packaging material cannot be released due to the direct exposure of the bonding wire under the flat structure, thereby achieving the purpose of improving product reliability;

[0016] 3. The utility model solves the problem of pin solder joint breakage caused by thermal mismatch under temperature cycle stress after installation in existing LCCC ceramic packaged products (1553 bus transceiver and isolation transformer "two-in-one"), and realizes in-situ plug-in replacement of LCCC ceramic packaged products, meeting the welding reliability requirements in the field of aviation applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the back structure of the PCB substrate of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the front side (unpackaged) of the PCB substrate of the utility model;

[0020] Figure 4 This is the appearance diagram of the utility model;

[0021] Figure 5 This is the circuit principle block diagram of the utility model;

[0022] Figure 6 It is a schematic diagram of an application example of the utility model.

[0023] Explanation of figure numbers: 1--plastic package, 2--1553B isolation transformer module, 3--heat sink, 4--1553B transceiver module, 5--pin row, 6--first pad, 7--PCB substrate, 8--second pad, 9--third pad, 10--chip wafer, 11--bonding wire. DETAILED DESCRIPTION

[0024] The following is combined with Figure 1-5 The utility model is described in detail with specific implementation modes.

[0025] The utility model comprises a plastic package, two 1553B isolation transformer modules, a 1553B transceiver module and a heat sink, wherein the 1553B isolation transformer module, the 1553B transceiver module and the heat sink are stacked together from top to bottom and then plastic-sealed in the plastic package, and the bottom surface of the heat sink is exposed from the plastic package; the 1553B transceiver module adopts an MTJ1579NLC chip, and the back side of the PCB substrate of the MTJ1579NLC chip is symmetrically provided with a plurality of first solder pads on both sides, symmetrically provided with a plurality of second solder pads on both ends, and a central It has a third solder pad; the 1553B transceiver module is arranged with the back side of the PCB substrate facing downward, the 1553B isolation transformer module is symmetrically fixed above the 1553B transceiver module, and the leads of the two 1553B isolation transformer modules are respectively electrically connected to the second solder pad according to the electrical connection relationship; the heat sink is arranged below the 1553B transceiver module and fixed on the third solder pad, and two rows of pins are symmetrically welded on the first solder pad according to the electrical connection relationship, and the two rows of pins extend out of the plastic package.

[0026] Furthermore, the MTJ1579NLC chip adopts LGA packaging. The PCB substrate adopts a BT resin substrate with a Tg value greater than 250°C. The chip wafer is bonded to the front of the PCB substrate, and the chip wafer is connected to the printed circuit on the front of the PCB substrate through bonding wires. The chip is then injection molded using an integrated circuit encapsulation mold, and the chip wafer and the front of the PCB substrate are fully encapsulated to finally form the MTJ1579NLC chip, which has been mass-produced by the applicant. Among them, the PCB is a multi-layer printed circuit board.

[0027] Furthermore, the 1553B isolation transformer module is fixed on top of the 1553B transceiver module by epoxy resin, and then the leads of the isolation transformer module are led to the corresponding first pads on the back side of the PCB substrate for welding.

[0028] Furthermore, the third pad is evenly distributed with heat dissipation holes penetrating the PCB substrate; the chip wafer bonding area is opposite to the third pad up and down, forming a thermal via array, which has an ideal heat dissipation effect and ensures the working reliability of the MTJ1579NLC chip.

[0029] Furthermore, the 1553B isolation transformer adopts a toroidal magnetic core, which ensures the height requirements of the transformer, while also ensuring the impedance requirements at different temperatures, and also ensuring indicators such as overshoot and ringing; the primary winding adopts a double-wire parallel winding method and the secondary winding adopts a single-wire average distribution winding method to reduce the distributed capacitance and leakage inductance of the transformer, and ensure the rise time and fall time indicators of the transformer output waveform; after the primary winding is wound, it is wrapped with polytetrafluoroethylene raw tape, and then the secondary winding is wound. After the secondary winding is wound, it is also wrapped with polytetrafluoroethylene raw tape to reduce the impact of packaging stress on transformer performance.

[0030] Furthermore, the pin row is in SOP surface mount form.

[0031] Preferably, the heat sink is made of tungsten-copper alloy material to improve the thermal conductivity and quickly conduct heat from the inside of the module to the assembly board surface.

[0032] Preferably, the plastic package body is made of epoxy resin molding compound, which realizes comprehensive functions such as temperature resistance, moisture resistance, pressure resistance, insulation, and structural support, thereby ensuring the reliability and stability of the module under harsh conditions.

[0033] Preferably, the foot row is made of copper alloy plated with tin-lead to improve its salt spray resistance and oxidation resistance.

[0034] Preferably, the 1553B isolation transformer is a miniaturized isolation transformer for the MIL-STD-1553B data bus that has been mass-produced by the applicant.

[0035] In one embodiment, the first soldering pads are in two rows of 24 and are symmetrically distributed on both sides of the back side of the PCB substrate, the pin rows are in 24 and are respectively welded to the 24 first soldering pads; the second soldering pads are in 5 and are respectively welded to the leads of the 1553B isolation transformer.

[0036] In one embodiment, the plastic package is formed by a mold compression molding process, that is, the assembled transceiver module is placed in a mold cavity, and the epoxy resin molding material is pressed into the mold cavity by compression transfer molding, and the 1553B isolation transformer module, 1553B transceiver module and heat sink stacked from top to bottom are plastic-encapsulated in the plastic package, and the bottom surface of the heat sink is exposed to the plastic package, and the plastic package is taken out after the plastic package is cured at medium temperature in the mold cavity to become a MIL-STD-1553B data bus communication interface transceiver module with a SOP24 structural appearance. The epoxy resin molding material after compression molding can withstand lead-free reflow soldering with a peak of 260°C, and can maintain excellent electrical properties in high temperature and high humidity environments, ensuring the reliability and stability of the utility model under harsh conditions.

[0037] The effective working temperature range of the utility model can reach -55°C to 125°C, and the external dimensions are no more than 21.0mm×11.8mm×5.08mm; the 1553B transceiver module (MTJ1579NLC chip) of the utility model has dual-channel multiplexing functions of A-channel (including sending channel and receiving channel) and B-channel (including sending channel and receiving channel), and realizes dual-redundancy 1553 bus communication function together with two 1553B isolation transformer modules.

[0038] The above embodiments are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, all equivalent changes made to the contents described in the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A MIL-STD-1553B data bus communication interface transceiver module, characterized in that: The invention comprises a plastic package, two 1553B isolation transformer modules, a 1553B transceiver module and a heat sink, wherein the 1553B isolation transformer module, the 1553B transceiver module and the heat sink are stacked together from top to bottom and then plastic-sealed in the plastic package, and the bottom surface of the heat sink is exposed from the plastic package; the 1553B transceiver module adopts an MTJ1579NLC chip, and the back side of the PCB substrate of the MTJ1579NLC chip is symmetrically provided with a plurality of first pads on both sides, symmetrically provided with a plurality of second pads on both ends, and a plurality of The third soldering pad; the 1553B transceiver module is arranged with the back side of the PCB substrate facing downward, the 1553B isolation transformer module is symmetrically fixed above the 1553B transceiver module, and the leads of the two 1553B isolation transformer modules are respectively electrically connected to the second soldering pad according to the electrical connection relationship; the heat sink is arranged below the 1553B transceiver module and fixed on the third soldering pad, and two rows of pins are symmetrically welded on the first soldering pad according to the electrical connection relationship, and the two rows of pins extend out of the plastic package body.

2. The MIL-STD-1553B data bus communication interface transceiver module according to claim 1, characterized in that: The 1553B isolation transformer module is fixed on top of the 1553B transceiver module by epoxy resin.

3. The MIL-STD-1553B data bus communication interface transceiver module according to claim 1 or 2, characterized in that: The MTJ1579NLC chip is packaged in LGA format.

4. The MIL-STD-1553B data bus communication interface transceiver module according to claim 3, characterized in that: The PCB substrate adopts a BT substrate with a Tg value greater than 250°C.

5. The MIL-STD-1553B data bus communication interface transceiver module according to claim 4, characterized in that: The third pad is evenly distributed with heat dissipation holes penetrating the PCB substrate.

6. The MIL-STD-1553B data bus communication interface transceiver module according to claim 4, characterized in that: The heat sink is made of tungsten-copper alloy material.

7. The MIL-STD-1553B data bus communication interface transceiver module according to claim 4, characterized in that: The 1553B isolation transformer adopts a toroidal magnetic core, a double-wire parallel winding method for the primary winding, and a single-wire evenly distributed winding method for the secondary winding. After the primary winding is wound, it is wrapped with polytetrafluoroethylene raw tape, and then the secondary winding is wound. After the secondary winding is wound, it is also wrapped with polytetrafluoroethylene raw tape.

8. The MIL-STD-1553B data bus communication interface transceiver module according to claim 4, characterized in that: The pin row is in SOP surface mount form.

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