Loudspeaker assembly

Abstract

The utility model discloses a loudspeaker assembly comprising a loudspeaker housing, the inner wall of the loudspeaker housing is glued with a housing, the inner cavity of the housing is fixedly provided with a moving coil unit, the lower part of the moving coil unit is fixedly provided with a circuit board, the lower part of the circuit board is provided with a heat radiation structure, and the heat radiation structure comprises a semiconductor refrigeration ring and a heat radiation ring. According to the utility model, the heat dissipation structure is arranged at the bottom of the loudspeaker shell, so that the circuit board in the loudspeaker and the space around the vibrating diaphragm can be rapidly cooled, heat collection in the loudspeaker is avoided, and the service life of moving coil units such as the vibrating diaphragm in the loudspeaker is prolonged; compared with a traditional mode that holes are only formed in the loudspeaker shell, the structure can improve the heat dissipation efficiency, so that the loudspeaker can be continuously used for a long time, and temperature rise is slowed down; and the heat dissipation structure is small in size, and the metal ring, the heat dissipation fins, the rotating cylinder and other structures are arranged, so that the heat dissipation structure is convenient to disassemble, assemble and maintain.

Description

Technical Field

[0001] The utility model relates to the technical field of loudspeakers, in particular to a loudspeaker assembly. Background Art

[0002] According to the transducer mechanism and structure, speakers are divided into dynamic (electric), capacitive (electrostatic), piezoelectric (crystal or ceramic), electromagnetic (compression spring), ion and pneumatic speakers. Dynamic speakers are equipped with dynamic units, acoustic coupling cavities and diaphragms. When in use, the heat generated inside includes heat generated by the circuit board and heat generated by the friction between the diaphragm and the air. When the speaker is used continuously for a long time, the internal heat increases, which is easy to affect the service life of the speaker.

[0003] Chinese patent CN215529293U discloses a convection heat dissipation type loudspeaker, including a magnetic circuit component, a vibration component and a bracket fixedly connected to the magnetic circuit component and the vibration component, the magnetic circuit component includes a U-iron, and a magnet and a washer arranged inside the U-iron and stacked in sequence, a gap is provided between the magnet, the washer and the inner side wall of the U-iron, and the inner side wall of the U-iron is provided with a plurality of air convection grooves; the vibration component includes a voice coil, a diaphragm connected to the top of the voice coil and a spring clamped in the middle of the voice coil, the voice coil is arranged at the upper end of the washer, the voice coil is a hollow cylinder, and the lower end of the voice coil extends into the gap; the bracket is arranged between the magnetic circuit component and the vibration component, the upper end of the bracket is connected to the diaphragm, and the lower end of the bracket is clamped with the outer side wall of the U-iron.

[0004] The device improves the heat dissipation effect by setting a gap on the inner wall of the U iron and opening a plurality of air convection grooves on the side wall, but the heat dissipation efficiency of this structure is slow and the heat in the speaker cannot be quickly discharged. Utility Model Content

[0005] The utility model aims to provide a speaker assembly to solve the problem that the heat dissipation efficiency of the speaker is not fast enough in the prior art proposed in the background art, that the speaker dissipates heat only by opening holes.

[0006] To achieve the above object, the utility model provides the following technical solution: a speaker assembly, comprising a speaker housing, the inner wall of the speaker housing is glued with a shell, a dynamic unit is fixed in the inner cavity of the shell, a circuit board is fixed below the dynamic unit, and a heat dissipation structure is arranged below the circuit board;

[0007] The heat dissipation structure includes a semiconductor refrigeration coil and a heat dissipation ring. The upper surface of the semiconductor refrigeration coil is in close contact with the lower surface of the circuit board. The bottom of the speaker housing is provided with a heat-conducting structure for dissipating the heat of the heat-conducting rod. The heat dissipation ring is fixed to the top of the speaker housing. The heat dissipation ring is located outside the dynamic coil unit. The cross-section of the heat dissipation ring is U-shaped. The inner cavity of the heat dissipation ring is connected to the outside of the speaker housing. The dynamic coil unit and the semiconductor refrigeration coil are electrically connected to the circuit board.

[0008] Preferably, the heat-conducting structure includes a heat-conducting rod, which is fixed to the lower surface of the semiconductor refrigeration coil. An integrally formed limiting column is provided at the bottom of the inner cavity of the speaker housing. A socket is provided at the center of the limiting column, and the heat-conducting rod passes through the lower surface of the speaker housing through the socket.

[0009] Preferably, the heat conducting rods and the limiting columns are provided in a plurality of groups, and the plurality of groups of heat conducting rods are arranged in a circular array.

[0010] Preferably, the heat-conducting structure further comprises a metal ring, a plurality of heat-dissipating fins are welded on the lower surface of the metal ring, and a connection structure for fixing to a speaker housing is provided on the upper surface of the metal ring.

[0011] Preferably, the connection structure includes a rotating cylinder, the bottom end of which is rotatably connected to the upper surface of the metal ring, a clearance hole for inserting a heat-conducting rod is provided at the center of the rotating cylinder, a screw cylinder is fixed to the lower surface of the speaker housing, and the rotating cylinder is threadedly connected to the outside of the screw cylinder.

[0012] Preferably, a plurality of the rotating cylinders and the spiral cylinders are provided, and the plurality of the rotating cylinders are arranged in a circular array.

[0013] Preferably, an acoustic coupling cavity is provided on the top of the speaker housing, the acoustic coupling cavity is communicated with the inner cavity of the shell, a terminal head is fixed on the bottom of the speaker housing, the metal ring is sleeved on the outside of the terminal head, and the metal ring is arranged cocentrically with the terminal head.

[0014] Preferably, the dynamic unit includes a T-iron, a magnet is sleeved on the outside of the T-iron, a diaphragm is arranged above the magnet, the edge of the diaphragm is glued to the inner cavity of the shell, the inner wall of the inner ring of the heat dissipation ring is tightly attached to the shell, and the heat dissipation ring is located outside the diaphragm.

[0015] Preferably, the heat dissipation ring comprises a left ring and a right ring, and the left ring and the right ring are clamped with each other.

[0016] Preferably, the speaker housing comprises a left shell and a right shell, and the outer walls of the left ring and the right ring are fixed in the left ring and the right ring respectively.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The utility model provides a heat dissipation structure at the bottom of the speaker housing, which can quickly cool the circuit board inside the speaker and the space around the diaphragm, so as to avoid heat accumulation inside the speaker and increase the service life of the dynamic unit such as the diaphragm in the speaker; compared with the traditional method of only opening holes in the speaker housing, this structure can improve the heat dissipation efficiency, so that the speaker can be used continuously for a long time and slow down the temperature rise; and the heat dissipation structure is small in size, and the heat dissipation structure is easy to disassemble and assemble and maintain by providing metal rings and heat dissipation wings, rotating cylinders and other structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an axonometric drawing of the utility model;

[0020] Figure 2 It is a schematic diagram of the structure inside the loudspeaker housing of the utility model;

[0021] Figure 3 It is a schematic diagram of the position of the semiconductor refrigeration ring of the utility model;

[0022] Figure 4 It is an exploded diagram of the heat dissipation structure of the utility model;

[0023] Figure 5 It is a structural schematic diagram of the bottom of the loudspeaker housing of the utility model;

[0024] Figure 6 This utility model Figure 2 Enlarged view of point A in the middle.

[0025] In the figure: 1. speaker shell; 2. shell; 3. dynamic unit; 4. circuit board; 5. heat dissipation structure; 501. semiconductor refrigeration circle; 502. heat dissipation ring; 503. heat conducting rod; 504. limiting column; 505. jack; 506. metal ring; 507. heat dissipation fin; 508. rotating cylinder; 509. clearance hole; 510. screw cylinder; 6. acoustic coupling cavity; 7. terminal; 8. T iron; 9. magnet; 10. diaphragm; 5021. left ring; 5022. right ring; 101. left shell; 102. right shell. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-6The utility model provides a technical solution: a speaker assembly, comprising a speaker housing 1, the inner wall of the speaker housing 1 is glued with a shell 2, a moving coil unit 3 is fixed in the inner cavity of the shell 2, a circuit board 4 is fixed below the moving coil unit 3, and a heat dissipation structure 5 is arranged below the circuit board 4;

[0028] The heat dissipation structure 5 includes a semiconductor refrigeration coil 501 and a heat dissipation ring 502. The upper surface of the semiconductor refrigeration coil 501 is tightly attached to the lower surface of the circuit board 4. The bottom of the speaker housing 1 is provided with a heat-conducting structure for dissipating the heat of the heat-conducting rod 503. The heat dissipation ring 502 is fixed to the top of the speaker housing 1. The heat dissipation ring 502 is located outside the dynamic coil unit 3. The cross-section of the heat dissipation ring 502 is U-shaped. The inner cavity of the heat dissipation ring 502 is connected to the outside of the speaker housing 1. The dynamic coil unit 3 and the semiconductor refrigeration coil 501 are electrically connected to the circuit board 4.

[0029] By setting up the heat dissipation structure 5, the circuit board 4 and the space around the diaphragm 10 of the speaker are cooled, so as to avoid the accumulation of heat generated by the diaphragm 10 continuously rubbing against the air, shorten the service life of the diaphragm 10, and reduce the heat accumulated in the speaker housing 1 when the circuit board 4 works for a long time.

[0030] The heat-conducting structure includes a heat-conducting rod 503, which is fixed on the lower surface of the semiconductor refrigeration coil 501. An integrally formed limiting column 504 is provided at the bottom of the inner cavity of the speaker housing 1. A plug hole 505 is provided at the center of the limiting column 504. The heat-conducting rod 503 penetrates the lower surface of the speaker housing 1 through the plug hole 505. By providing the semiconductor refrigeration coil 501, the semiconductor refrigeration coil 501 cools the circuit board 4 after power is turned on. The heat is transferred to the metal ring through the heat-conducting rod 503 and is discharged through the heat dissipation fins 507 at the bottom of the metal ring to achieve cooling in the speaker housing 1. The cooling structure will not affect the structure of the acoustic coupling cavity 6, has little effect on the sound quality, and has faster heat dissipation than the method of only opening holes in the speaker housing 1.

[0031] The heat conducting rods 503 and the limiting columns 504 are provided in a plurality of groups, and the plurality of groups of heat conducting rods 503 are arranged in a circular array.

[0032] The heat-conducting structure further comprises a metal ring 506 , a plurality of heat-dissipating fins 507 are welded on the lower surface of the metal ring 506 , and a connection structure for fixing with the speaker housing 1 is disposed on the upper surface of the metal ring 506 .

[0033] The connection structure includes a rotating cylinder 508, the bottom end of which is rotatably connected to the upper surface of the metal ring 506, a clearance hole 509 for inserting the heat-conducting rod 503 is provided at the center of the rotating cylinder 508, a screw cylinder 510 is fixed to the lower surface of the speaker housing 1, and the rotating cylinder 508 is threadedly connected to the outside of the screw cylinder 510. By providing the screw cylinder 510, when the rotating cylinder 508 is sleeved on the outside of the screw cylinder 510 and the rotating cylinder 508 is rotated, the rotating cylinder 508 can be connected to the screw cylinder 510, so that the metal ring 506 and the speaker housing 1 are fixed.

[0034] There are a plurality of rotating cylinders 508 and a plurality of screw cylinders 510 , and the plurality of rotating cylinders 508 are arranged in a circular array.

[0035] An acoustic coupling cavity 6 is provided on the top of the speaker housing 1, and the acoustic coupling cavity 6 is communicated with the inner cavity of the shell 2. A terminal head 7 is fixed on the bottom of the speaker housing 1, and the metal ring 506 is sleeved on the outside of the terminal head 7. The metal ring 506 is provided cocentrically with the terminal head 7.

[0036] The dynamic unit 3 includes a T-iron 8, a magnet 9 is sleeved on the outside of the T-iron 8, a diaphragm 10 is arranged above the magnet 9, the edge of the diaphragm 10 is glued to the inner cavity of the housing 2, the inner wall of the inner ring of the heat dissipation ring 502 is tightly attached to the housing 2, and the heat dissipation ring 502 is located outside the diaphragm 10. The structure of the dynamic unit 3 is an existing structural unit of the speaker in the earphone, and will not be repeated.

[0037] The heat dissipation ring 502 includes a left ring 5021 and a right ring 5022 , and the left ring 5021 and the right ring 5022 are engaged with each other.

[0038] The speaker housing 1 includes a left housing 101 and a right housing 102, and the outer walls of the left ring 5021 and the right ring 5022 are respectively fixed in the left ring 5021 and the right ring 5022. By configuring the speaker housing 1 and the heat dissipation ring 502 as two parts, the structural parts inside the speaker housing 1 are easy to assemble.

[0039] When in use, the semiconductor refrigeration ring 501 cools the circuit board 4 after being powered on, and the heat is transferred to the metal ring through the heat-conducting rod 503, and is discharged through the heat dissipation fins 507 at the bottom of the metal ring to achieve cooling inside the speaker housing 1. The inner wall of the inner ring of the heat dissipation ring 502 is in close contact with the housing 2 that fixes the diaphragm 10, and is located on the periphery of the diaphragm 10. The cavity inside the heat dissipation ring 502 is conducive to heat exchange between the heat dissipation ring 502 and the external space of the speaker, avoiding the accumulation of heat generated by the continuous friction of the diaphragm 10 with the air, and can extend the service life of the diaphragm 10. This cooling structure will not affect the structure of the acoustic coupling cavity 6, has little impact on the sound quality, and has faster heat dissipation than the method of only opening holes in the speaker housing 1.

[0040] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A speaker assembly, characterized in that: The speaker comprises a loudspeaker housing (1), the inner wall of the speaker housing (1) being glued with a shell (2), a moving coil unit (3) being fixed in the inner cavity of the shell (2), a circuit board (4) being fixed below the moving coil unit (3), and a heat dissipation structure (5) being arranged below the circuit board (4); The heat dissipation structure (5) comprises a semiconductor refrigeration coil (501) and a heat dissipation ring (502); the upper surface of the semiconductor refrigeration coil (501) is in close contact with the lower surface of the circuit board (4); the bottom of the speaker housing (1) is provided with a heat-conducting structure for dissipating heat from the heat-conducting rod (503); the heat dissipation ring (502) is fixed to the top of the speaker housing (1); the heat dissipation ring (502) is located outside the dynamic coil unit (3); the cross-section of the heat dissipation ring (502) is U-shaped; the inner cavity of the heat dissipation ring (502) is connected to the outside of the speaker housing (1); the dynamic coil unit (3) and the semiconductor refrigeration coil (501) are both electrically connected to the circuit board (4).

2. A speaker assembly according to claim 1, characterized in that: The heat-conducting structure comprises a heat-conducting rod (503), wherein the heat-conducting rod (503) is fixed on the lower surface of the semiconductor refrigeration coil (501), and an integrally formed limiting column (504) is provided at the bottom of the inner cavity of the speaker housing (1), and a plug hole (505) is provided at the center of the limiting column (504), and the heat-conducting rod (503) passes through the lower surface of the speaker housing (1) through the plug hole (505).

3. A speaker assembly according to claim 2, characterized in that: The heat conducting rods (503) and the limiting columns (504) are both provided in a plurality of groups, and the plurality of groups of heat conducting rods (503) are arranged in a circular array.

4. A speaker assembly according to claim 3, characterized in that: The heat-conducting structure further comprises a metal ring (506), a plurality of heat-dissipating fins (507) are welded on the lower surface of the metal ring (506), and a connection structure for fixing to a loudspeaker housing (1) is provided on the upper surface of the metal ring (506).

5. A speaker assembly according to claim 4, characterized in that: The connection structure comprises a rotating cylinder (508), the bottom end of the rotating cylinder (508) is rotatably connected to the upper surface of the metal ring (506), a clearance hole (509) for inserting the heat-conducting rod (503) is arranged at the center of the rotating cylinder (508), a screw cylinder (510) is fixed to the lower surface of the speaker housing (1), and the rotating cylinder (508) is threadedly connected to the outside of the screw cylinder (510).

6. A speaker assembly according to claim 5, characterized in that: A plurality of the rotating cylinders (508) and the spiral cylinders (510) are provided, and the plurality of rotating cylinders (508) are arranged in a circular array.

7. A speaker assembly according to claim 6, characterized in that: An acoustic coupling cavity (6) is arranged on the top of the loudspeaker housing (1), and the acoustic coupling cavity (6) is communicated with the inner cavity of the shell (2). A wiring head (7) is fixed on the bottom of the loudspeaker housing (1), and the metal ring (506) is sleeved on the outside of the wiring head (7). The metal ring (506) and the wiring head (7) are arranged cocentrically.

8. A speaker assembly according to claim 7, characterized in that: The dynamic coil unit (3) includes a T-iron (8), a magnet (9) is sleeved on the outside of the T-iron (8), a diaphragm (10) is arranged above the magnet (9), the edge of the diaphragm (10) is glued to the inner cavity of the shell (2), the inner wall of the inner ring of the heat dissipation ring (502) is tightly attached to the shell (2), and the heat dissipation ring (502) is located outside the diaphragm (10).

9. A speaker assembly according to claim 8, characterized in that: The heat dissipation ring (502) comprises a left ring (5021) and a right ring (5022), and the left ring (5021) and the right ring (5022) are mutually clamped.

10. A loudspeaker assembly according to claim 9, characterized in that: The loudspeaker housing (1) comprises a left housing (101) and a right housing (102), and the outer walls of the left ring (5021) and the right ring (5022) are respectively fixed in the left ring (5021) and the right ring (5022).

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