High-efficiency horizontal copper deposition device for circuit board

Abstract

An efficient horizontal copper deposition device of a circuit board comprises a workbench, a feeding assembly, a deviation rectifying assembly, a copper deposition assembly and a discharging assembly, mounting grooves are formed in the two sides of the upper end of the workbench respectively, and the feeding assembly and the discharging assembly are arranged in the mounting grooves in the left side and the right side respectively; the deviation rectifying assembly is installed on the workbench and located above the feeding assembly, the upper end of the workbench is further provided with a copper deposition groove with an opening in the upper end, the copper deposition groove is located between the two installation grooves, a plurality of lifting sliding rails are arranged in the copper deposition groove, and the copper deposition assembly is installed on the lifting sliding rails and can movably ascend and descend. According to the utility model, the feeding and discharging assembly is designed to be matched with the copper deposition assembly to realize automatic feeding and discharging of the circuit board, so that the copper deposition efficiency of the circuit board can be greatly improved, the labor intensity of operators is reduced, and the copper deposition processing level of the circuit board is greatly improved; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] The utility model relates to a circuit board processing device, in particular to a high-efficiency horizontal copper deposition device for a circuit board. Background Art

[0002] A circuit board, also known as a circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, must use a circuit board to make electrical interconnections between the various components. The circuit board consists of an insulating base plate, connecting wires, and pads for assembling and welding electronic components. It has the dual functions of a conductive line and an insulating base plate.

[0003] Horizontal copper deposition devices are widely used in the production and processing of circuit boards. Their main purpose is to deposit a layer of copper on a non-conductive substrate through a series of chemical treatment methods, and then thicken it through subsequent electroplating methods to reach a specific designed thickness. In the process of copper deposition on circuit boards, the existing horizontal copper deposition devices often require operators to manually complete the loading and unloading operations of the circuit boards, which not only greatly affects the copper deposition efficiency of the circuit boards, but is also very detrimental to the physical and mental health of the operators. Utility Model Content

[0004] Based on this, it is necessary to provide a high-efficiency horizontal copper deposition device for a circuit board in view of the deficiencies in the prior art.

[0005] A highly efficient horizontal copper deposition device for a circuit board, comprising a workbench, a loading assembly, a deviation correction assembly, a copper deposition assembly and a unloading assembly, wherein mounting grooves are respectively provided on both sides of the upper end of the workbench, wherein the loading assembly and the unloading assembly are respectively installed in the mounting grooves on the left and right sides, wherein the deviation correction assembly is installed on the workbench and is located above the loading assembly, wherein the upper end of the workbench is also provided with a copper deposition groove with an upper end opening, wherein the copper deposition groove is located between the two mounting grooves, and wherein the copper deposition groove is provided with a plurality of lifting rails, wherein the copper deposition assembly is installed on the lifting rails and can be movably lifted and lowered. The copper deposition assembly comprises a plurality of clamps and a first sliding bar, wherein the plurality of clamps are sequentially stacked at intervals from bottom to top, and the plurality of the first sliding bars are arranged on the outside of the plurality of clamps and fix the plurality of clamps. The clamp comprises a clamping plate frame, a plurality of second sliding bars, a push roller and a fixing clamp. The clamping plate frame is hollowed out at the top and bottom, and has card openings on both sides. Several of the second sliding bars are respectively installed on the inner side of the clamping plate frame and can be movably raised and lowered. The two ends of several of the pushing rollers are respectively engaged with the second sliding bars on both sides. The several pushing rollers are arranged at intervals and can be movably rotated. Several of the fixing clamps are respectively installed in the two card openings of the clamping plate frame.

[0006] Furthermore, the push roller is provided with a plurality of water guide grooves, and the plurality of water guide grooves are evenly distributed on the outer side surface of the push roller.

[0007] Furthermore, the outer opening size of the clamping plate opening is larger than the inner opening size.

[0008] Furthermore, the copper sinking assembly also includes a cover plate, which is installed on the upper ends of the second sliding bars.

[0009] Furthermore, the loading assembly and the unloading assembly each include two sets of conveying rollers and a conveyor belt, the two ends of the conveying rollers are engaged with the two sides of the mounting groove and can be movably rotated, and the conveyor belt is sleeved on the conveying rollers and can be driven to rotate by the conveying rollers.

[0010] Furthermore, the correction component includes a sliding frame, a lifting rod, a grab plate suction cup and an alignment camera. The sliding frame is erected on a workbench, the upper end of the lifting rod is mounted on the sliding frame, the lifting rod can slide back and forth and can also rotate movably, the grab plate suction cup is mounted on the lower end of the lifting rod, and the alignment camera is mounted on one side of the sliding frame.

[0011] Furthermore, the high-efficiency horizontal copper deposition device for the circuit board also includes an ultrasonic generator, which is installed at the bottom of the copper deposition tank.

[0012] To sum up, the beneficial effects of the utility model of a high-efficiency horizontal copper plating device for circuit boards are: by designing the loading and unloading components to cooperate with the copper plating components to realize automatic loading and unloading of circuit boards, the copper plating efficiency of circuit boards can be greatly improved, the labor intensity of operators can be reduced, and the copper plating processing level of circuit boards can be greatly improved; the pushing roller with a water guide groove can stir the flow of copper plating liquid, thereby promoting the copper plating reaction efficiency and effect of the circuit board; the correction component can adjust the position of the circuit board on the loading component to avoid the circuit board being tilted during the transmission process and resulting in the inability to load and unload automatically; the ultrasonic generator can oscillate to eliminate bubbles in the copper plating liquid to avoid affecting the effect of the copper plating processing; the utility model is highly practical and has a strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a high-efficiency horizontal copper deposition device for a circuit board according to the utility model;

[0014] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0015] Figure 3 for Figure 2 The structural diagram of the workbench in the middle;

[0016] Figure 4 for Figure 2 Schematic diagram of the exploded structure of the loading assembly;

[0017] Figure 5 for Figure 2 Schematic diagram of the decomposed structure of the copper sinking component;

[0018] Figure 6 for Figure 5 Schematic diagram of the decomposed structure of the middle fixture;

[0019] Figure 7 for Figure 6 The structural diagram of the middle push roller;

[0020] Figure 8 for Figure 2 Schematic diagram of the exploded structure of the correction component. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] like Figures 1 to 8 As shown, the utility model provides a high-efficiency horizontal copper deposition device 100 for a circuit board, which includes a workbench 10, a loading component 20, a correction component 30, a copper deposition component 40 and a unloading component 50. Mounting grooves 11 are respectively provided on both sides of the upper end of the workbench. The loading component 20 and the unloading component 50 are respectively installed in the mounting grooves 11 on the left and right sides. The correction component 30 is installed on the workbench and is located above the loading component 20. A copper deposition groove 12 with an upper end opening is also provided at the upper end of the workbench 10. The copper deposition groove 12 is located between the two mounting grooves 11, and a plurality of lifting rails 13 are provided in the copper deposition groove 12. The copper deposition component 40 is installed on the lifting rails 13 and can be movably lifted and lowered.

[0023] The loading assembly 20 and the unloading assembly 50 both include two groups of conveying rollers 21 and a conveying belt 22. The two ends of the conveying rollers 21 are engaged with the two sides of the mounting groove 11 and can be movably rotated. The conveying belt 22 is sleeved on the conveying rollers 21 and can be driven to rotate by the conveying rollers 21. The copper sinking assembly 40 includes a plurality of clamps 41 and a first sliding bar 42. The plurality of clamps 41 are stacked in sequence from bottom to top. The plurality of first sliding bars 42 are arranged on the outside of the plurality of clamps 41 and fix the plurality of clamps 41.

[0024] The loading component 20 can automatically transfer the circuit board from left to right to the copper sink 12, and the copper sink component 40 further receives and fixes the circuit board and immerses it in the copper sink liquid for reaction processing. After the processing is completed, the circuit board in the copper sink component 40 is unloaded by the unloading component 50. The automatic coordination of multiple components does not require manual intervention, which greatly improves the efficiency of loading and unloading circuit boards.

[0025] The clamp 41 includes a clamping plate frame 411, a plurality of second sliding bars 412, a push roller 413 and a fixed clamp 414. The clamping plate frame 411 is hollowed out from top to bottom, and has a clamping plate opening 411a on both sides. The plurality of second sliding bars 412 are respectively installed on the inner side of the clamping plate frame 411 and can be moved up and down. The two ends of the plurality of push rollers 413 are respectively engaged with the second sliding bars 412 on both sides. The plurality of push rollers 413 are arranged at intervals and can be moved and rotated. The plurality of fixed clamps 414 are respectively installed in the two clamping plate openings 411a of the clamping plate frame 411.

[0026] The circuit board conveyed by the loading assembly 20 can enter the clamping frame 411 from the left clamping plate opening 411a, and be completely clamped into the clamping frame 411 under the push of the push roller 413. Then the two ends of the circuit board are clamped and fixed by the fixing clamp 414, and the push roller 413 is separated from the upper and lower surfaces of the circuit board. Finally, when the circuit board is completed with copper plating, the push roller 413 pushes the circuit board out of the right clamping plate opening 411a of the clamping frame 411 again and falls on the unloading assembly 50 for unloading. The second sliding bar 412 that can slide up and down to drive the push roller 413 to adjust the spacing is more convenient for pushing circuit boards of different thicknesses.

[0027] The push roller 413 is provided with a plurality of water guide grooves 413a, and the plurality of water guide grooves 413a are evenly distributed on the outer surface of the push roller 413. The outer opening size of the card plate mouth 411a is larger than the inner opening size. The copper plating component 40 also includes a cover plate 43, and the cover plate 43 is installed on the upper end of a plurality of second sliding bars 412. When the clamp 41 drives the circuit board to be completely immersed in the copper plating liquid, the push roller 413 separated from the surface of the circuit board can rotate in a circle, thereby driving the copper plating liquid to flow on the surface of the circuit board, thereby improving the efficiency and effect of the copper plating process. The large opening on the outer side of the card plate mouth 411a is more convenient for alignment with the circuit board, and the cover plate 43 can reduce the volatilization or sputtering of the copper plating liquid, and at the same time can also reduce the pollution of the copper plating liquid by the outside world.

[0028] The deviation correction assembly 30 includes a sliding frame 31, a lifting rod 32, a gripping plate suction cup 33 and an alignment camera 34. The sliding frame 31 stands on the workbench 10. The upper end of the lifting rod 32 is mounted on the sliding frame 31. The lifting rod 32 can slide forward and backward and can also rotate flexibly. The gripping plate suction cup 33 is mounted on the lower end of the lifting rod 32. The alignment camera 34 is mounted on one side of the sliding frame 31. The alignment camera 34 can capture the placement state of the circuit board on the loading assembly 20 and submit it to the computer for analysis and processing. If the circuit board is tilted or offset, the lifting rod 32 and the gripping plate suction cup 33 will grab it and re-place it to keep it normal.

[0029] The high-efficiency horizontal copper deposition device 100 for a circuit board further includes an ultrasonic generator 60, which is installed at the bottom of the copper deposition tank 12. The ultrasonic generator 60 can break the bubbles generated in the copper deposition solution through ultrasonic vibration, thereby preventing a large number of bubbles in the copper deposition solution from affecting the copper deposition processing effect.

[0030] To sum up, the beneficial effects of the utility model of a high-efficiency horizontal copper plating device 100 for a circuit board are: by designing the loading and unloading components 50 to cooperate with the copper plating components 40 to realize automatic loading and unloading of the circuit board, the copper plating efficiency of the circuit board can be greatly improved, the labor intensity of the operators can be reduced, and the copper plating processing level of the circuit board can be greatly improved; the pushing roller 413 with the water guide groove 413a can stir the flow of the copper plating liquid, thereby promoting the copper plating reaction efficiency and effect of the circuit board; the correction component 30 can adjust the position of the circuit board on the loading component 20 to avoid the circuit board being tilted during the transmission process and resulting in the inability to load and unload automatically; the ultrasonic generator 60 can oscillate to eliminate bubbles in the copper plating liquid to avoid affecting the effect of the copper plating processing; the utility model is highly practical and has a strong promotion significance.

[0031] The above-mentioned embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A highly efficient horizontal copper deposition device for a circuit board, characterized in that: It includes a workbench, a feeding component, a correction component, a copper deposition component and a discharge component. The upper ends of the workbench are respectively provided with mounting grooves on both sides. The feeding component and the discharge component are respectively installed in the mounting grooves on the left and right sides. The correction component is installed on the workbench and is located above the feeding component. The upper end of the workbench is also provided with a copper deposition groove with an upper opening. The copper deposition groove is located between the two mounting grooves, and a plurality of lifting rails are provided in the copper deposition groove. The copper deposition component is installed on the lifting rails and can be movably lifted and lowered. The copper deposition component includes a plurality of clamps and a first sliding bar. The plurality of clamps are stacked in sequence from bottom to top, and the plurality of the first sliding bars are arranged on the outside of the plurality of clamps and fix the plurality of clamps; the clamps include a clamping plate frame, a plurality of second sliding bars, a pushing roller and a fixing clamp; the clamping plate frame is hollowed out from top to bottom, and has card openings on both sides, and the plurality of the second sliding bars are respectively installed on the inner side of the clamping plate frame and can be movably raised and lowered, and the two ends of the plurality of the pushing rollers are respectively engaged with the second sliding bars on both sides, the plurality of the pushing rollers are arranged at intervals and can be movably rotated, and the plurality of the fixing clamps are respectively installed in the two card openings of the clamping plate frame.

2. The high-efficiency horizontal copper deposition device for a circuit board as claimed in claim 1, characterized in that: The push roller is provided with a plurality of water guide grooves, and the plurality of water guide grooves are evenly distributed on the outer side surface of the push roller.

3. The high-efficiency horizontal copper deposition device for a circuit board as claimed in claim 1, characterized in that: The outer opening size of the clamping plate opening is larger than the inner opening size.

4. The high-efficiency horizontal copper deposition device for a circuit board as claimed in claim 1, characterized in that: The copper sinking assembly also includes a cover plate, which is installed on the upper ends of the second sliding bars.

5. The high-efficiency horizontal copper deposition device for a circuit board as claimed in claim 1, characterized in that: The loading assembly and the unloading assembly both include two groups of conveying rollers and a conveying belt. The two ends of the conveying rollers are engaged with the two sides of the mounting groove and can be movably rotated. The conveying belt is sleeved on the conveying rollers and can be driven to rotate by the conveying rollers.

6. The high-efficiency horizontal copper deposition device for a circuit board as claimed in claim 1, characterized in that: The correction component includes a sliding frame, a lifting rod, a grab plate suction cup and an alignment camera. The sliding frame is placed on a workbench. The upper end of the lifting rod is mounted on the sliding frame. The lifting rod can slide back and forth and can also rotate movably. The grab plate suction cup is mounted on the lower end of the lifting rod, and the alignment camera is mounted on one side of the sliding frame.

7. The high-efficiency horizontal copper deposition device for a circuit board as claimed in claim 1, characterized in that: The invention also comprises an ultrasonic generator, which is installed at the bottom of the copper sinking tank.

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