Radiator assembly and power equipment

By setting up a liquid replenishing tube in the evaporator to replenish the medium, the problem of bubbles affecting heat dissipation in the thermosiphon heat dissipation method is solved, the heat dissipation effect of the evaporator is improved, and the cooling performance of the heat source is improved.

CN222339863UActive Publication Date: 2025-01-10SUNGROW POWER SUPPLY CO LTD
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Patent Information

Application Number
CN202421102215.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-17
Publication Date
2025-01-10
Estimated Expiration
2034-05-17

AI Technical Summary

Technical Problem

In the existing thermosiphon heat dissipation method, gasification of the medium below the evaporator causes bubbles to rise, affecting the content and temperature of the medium above the evaporator, reducing the heat dissipation effect, and resulting in insufficient heat dissipation of the heat source.

Method used

A radiator assembly is designed. By setting a liquid replenishment tube in the evaporator, the medium in the evaporator is increased, the medium temperature is reduced, and the heat dissipation effect of the evaporator is improved. The component includes an evaporator and a condenser. The condenser is in communication with the evaporator and the liquid replenishing tube is connected to the condenser and the evaporator. It is used to replenish the medium in the evaporator, reduce the medium temperature and improve the heat dissipation effect.

Benefits of technology

By increasing the liquid replenishment of the liquid replenishment tube on the medium in the evaporator, the temperature of the working fluid above the evaporator is reduced, the heat dissipation effect of the evaporator is improved, the cooling performance of the heat source is improved, and the impact of bubbles on heat dissipation is reduced.

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Abstract

The utility model discloses a radiator assembly and power equipment, the radiator assembly comprises an evaporator and a condenser, and the evaporator is used for exchanging heat with a heat source; the condenser is communicated with the evaporator and can dissipate heat of the working medium subjected to heat exchange of the evaporator and enable the working medium subjected to heat dissipation to flow back to the evaporator; one end of the liquid supplementing pipe is communicated with the condenser, and the other end of the liquid supplementing pipe is communicated with the evaporator. The liquid supplementing pipe is additionally arranged to supplement liquid to the position in the evaporator, so that the temperature of a medium in the evaporator is reduced, the temperature of the working medium above the evaporator is reduced, and the heat dissipation effect of the evaporator is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to a radiator assembly and a power device. Background Art

[0002] Existing power devices have heat sources, and components in the heat source generate a large amount of heat during operation, forming a heat source.

[0003] In order to ensure the normal use of the heat source, it is necessary to dissipate the heat from the heat source. Existing commonly used and efficient heat dissipation solutions include thermal siphon heat dissipation and liquid cooling heat dissipation.

[0004] Among them, the principle of the thermal siphon heat dissipation method is that the low-temperature liquid working medium in the evaporator will become a gaseous working medium after absorbing the heat from the heat source. The gaseous working medium enters the condenser through the outlet channel. After the gaseous working medium is cooled in the condenser, it will return to the evaporator through the inlet channel as a low-temperature liquid working medium to dissipate heat from the heat source.

[0005] The existing heat source is arranged along the height direction of the evaporator. During the cooling process of the heat source, the medium in the lower part of the evaporator is vaporized after heat exchange with the lower heat source. The bubbles generated after vaporization will rise and affect the content of the medium above the evaporator, thus affecting the heat dissipation of the upper heat source by the medium above the evaporator; in addition, bubbles are usually generated at the position where the evaporator and the heat source are attached. When the bubbles generated on the lower wall of the evaporator float upward along the inner wall of the evaporator, if the bubbles move to the position on the upper wall of the evaporator that is attached to the heat source, the heat exchange effect between the medium in the evaporator and the heat source will be reduced.

[0006] In addition, after the medium in the lower part of the evaporator is heated, heat exchange will occur with the medium above, affecting the temperature of the medium above, further affecting the heat dissipation along the heat source above, and affecting the use of the heat source module.

[0007] Therefore, how to provide a radiator assembly to improve the heat dissipation effect of the evaporator is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0008] In view of this, the present invention provides a radiator assembly to improve the heat dissipation effect of the evaporator. In addition, the present invention also provides a power device having the radiator assembly.

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] A radiator assembly comprising:

[0011] An evaporator and a condenser, wherein the evaporator is used to perform heat exchange with a heat source; the condenser is connected to the evaporator and can dissipate heat from the working fluid after heat exchange in the evaporator and return the dissipated working fluid to the evaporator;

[0012] A liquid replenishing tube, one end of which is connected to the condenser, and the other end of which is connected to the evaporator.

[0013] Preferably, in the above-mentioned radiator assembly, the evaporator comprises a first side plate and a second side plate, the first side plate and the second side plate are opposite to each other, and the first side plate is used to fit with the heat source;

[0014] The liquid infusion tube is connected to the first side plate and / or the second side plate.

[0015] Preferably, in the above-mentioned radiator assembly, the evaporator has a liquid replenishing port for communicating with the liquid replenishing pipe;

[0016] The liquid replenishing port is opened at the edge of the projection of the heat source on the evaporator in a direction perpendicular to the height direction of the evaporator;

[0017] And / or, the liquid replenishing port is opened within the projection of the heat source along a direction perpendicular to the height direction of the evaporator.

[0018] Preferably, in the above radiator assembly, a plurality of the liquid replenishing ports are arranged along the height direction of the evaporator.

[0019] And / or, a plurality of the liquid replenishing ports are arranged along a direction perpendicular to the height direction of the evaporator.

[0020] Preferably, in the above-mentioned radiator assembly, there are multiple liquid replenishing tubes, and each of the liquid replenishing tubes is connected to at least one of the liquid replenishing ports;

[0021] Alternatively, there is one infusion tube, and the infusion tube is connected to at least two of the infusion ports.

[0022] Preferably, in the above-mentioned radiator assembly, a plurality of heat sources are arranged along the height direction and / or width direction of the first side plate;

[0023] The fluid replenishing port is located between adjacent heat sources.

[0024] Preferably, in the above-mentioned radiator assembly, the inner wall of the first side plate is a stepped surface and / or a sloped surface.

[0025] Preferably, in the above-mentioned radiator assembly, the inner wall of the first side plate is provided with a guide member,

[0026] And the inner wall of the first side plate is at least one of a plane, an inclined surface and a step surface.

[0027] Preferably, in the above-mentioned radiator assembly, the guide member is arranged perpendicularly to the height direction of the evaporator, and / or the guide member is arranged obliquely to the height direction of the evaporator;

[0028] When the guide member is arranged in an inclined manner with respect to the height direction of the evaporator, the guide member is inclined in a direction away from the inner wall of the first side plate along the direction from the bottom end to the top end of the evaporator.

[0029] A power device comprises a cabinet, a heat source module arranged in the cabinet and a radiator assembly for dissipating heat from the heat source module, wherein the radiator assembly is any one of the radiator assemblies described above.

[0030] A radiator assembly is disclosed in an embodiment of the present invention. A liquid replenishing pipe is added to replenish liquid at a position inside the evaporator, thereby reducing the temperature of the medium in the evaporator, which is beneficial to reducing the temperature of the working fluid above the evaporator and improving the heat dissipation effect of the evaporator. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 It is a schematic diagram of the structure of the power device disclosed in the embodiment of the present invention;

[0033] Figure 2 for Figure 1 Sectional view in the AA direction;

[0034] Figure 3 It is a front view of a first structure of a radiator assembly disclosed in an embodiment of the present invention;

[0035] Figure 4 It is a front view of the evaporator when the heat source modules disclosed in the embodiment of the present invention are arranged in a single layer;

[0036] Figure 5 for Figure 4 Side view of

[0037] Figure 6 It is a front view of the evaporator when the heat source modules disclosed in the embodiment of the present invention are arranged in multiple layers;

[0038] Figure 7 for Figure 6 Side view of

[0039] Figure 8 The disclosed embodiment of the present invention Figure 1 A cross-sectional view of another structure in the AA direction;

[0040] Fig. 9 It is a front view of another structure of the radiator assembly disclosed in the embodiment of the present invention;

[0041] Fig.10 It is a front view of a first solution of the evaporator when the heat source modules disclosed in the embodiment of the present invention are arranged in a single layer;

[0042] Fig.11 for Fig.10 Side view of

[0043] Fig.12 It is a front view of the second solution of the evaporator when the heat source modules disclosed in the embodiment of the present invention are arranged in a single layer;

[0044] Fig.13 for Fig.12 A side view of a first structure;

[0045] Fig.14 for Fig.12 A side view of a second structure;

[0046] Fig.15 for Fig.12 A side view of the third structure;

[0047] Fig.16 for Fig.12 A side view of a fourth structure;

[0048] Fig.17 for Fig.12 A side view of a fifth structure;

[0049] Fig.18 for Fig.12 A side view of a sixth structure;

[0050] Fig.19 for Fig.12 A side view of the seventh structure;

[0051] Fig. 20 for Fig.12 A side view of an eighth structure;

[0052] Fig.21 It is a front view of a first solution of the evaporator when the heat source modules disclosed in the embodiment of the present invention are arranged in multiple layers;

[0053] Fig. 22 for Fig.21 A side view of a first structure;

[0054] Fig.23 for Fig.21 A side view of a second structure;

[0055] Fig.24 for Fig.21 A side view of the third structure;

[0056] Fig.25 for Fig.21 A side view of a fourth structure;

[0057] Fig.26 It is a front view of the second solution of the evaporator when the heat source modules disclosed in the embodiment of the present invention are arranged in multiple layers;

[0058] Fig. 27 for Fig.26 A side view of a first structure;

[0059] Fig.28 The front view of the third solution of the evaporator when the heat source modules disclosed in the embodiment of the present invention are arranged in multiple layers

[0060] Fig.29 for Fig.28 A side view of a first structure;

[0061] Fig.30 for Fig.28 A side view of a second structure;

[0062] Fig.31 for Fig.28 A side view of the third structure;

[0063] Fig.32 for Fig.28 A side view of a fourth structure;

[0064] Fig.33 for Fig.28 A side view of a fifth structure;

[0065] Fig.34 for Fig.28 A side view of a sixth structure;

[0066] Fig.35 for Fig.28 Side view of the seventh structure. DETAILED DESCRIPTION

[0067] The invention discloses a radiator assembly to improve the heat dissipation effect of an evaporator. In addition, the invention also discloses a power device having the radiator assembly.

[0068] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0070] like Figure 1 and Figure 2 The power device shown includes: a chassis 1 , a heat dissipation channel 2 , a fan 3 , a heat source 4 and a heat sink assembly 5 .

[0071] The chassis 1 is the outer shell of the power device, which is used to protect the internal components of the power device and serve as the installation base of the internal components and external structures. The shape and size of the chassis 1 are not specifically limited here. In addition, the power device includes but is not limited to an inverter.

[0072] The heat dissipation channel 2 is installed on the outside of the chassis 1 and is divided into a first channel 21 and a second channel 22, wherein the fan 3 is arranged in the first channel 21, and an air inlet 211 and an air outlet 212 are respectively arranged on the opposite sides of the first channel 21. The fan 3 is arranged between the air inlet 211 and the air outlet 212, and is used to blow the incoming air from the air inlet to the air outlet 212.

[0073] An air exchange port 221 is provided on the side wall of the second channel 22 , so as to connect the second channel 22 with the outside through the air exchange port 221 .

[0074] In some embodiments, the first channel 21 and the second channel 22 are sealed and isolated from each other.

[0075] The heat source 4 is a heating element in the chassis 1, and includes but is not limited to a structure that generates heat during operation. The heat source 4 includes each wafer in the power device, for example, one wafer can be used as a heat source; usually, one device can contain more than one wafer.

[0076] Combination Figure 2 and Figure 3 As shown, the radiator assembly 5 includes: a condenser 51 , an evaporator 52 (or a cold plate), an inlet channel 53 and an outlet channel 54 , and a heat dissipating medium circulating inside the radiator assembly 5 .

[0077] The condenser 51 is located in the first channel 21 . In some embodiments, the condenser 51 is located between the fan 3 and the air outlet 212 , and the fan 3 is used to dissipate heat from the condenser 51 .

[0078] The evaporator 52 is located in the second channel 22 and is arranged in close contact with the chassis 1. In some embodiments, the evaporator 52 is opposite to the heat source 4, for example, the heat source 4 is welded, bonded, or embedded on the surface of the evaporator 52 through an intermediate layer; or directly welded, bonded, or embedded on the surface of the evaporator 52. The area where the evaporator 52 is in close contact with the chassis 1 is larger than the area where the heat source 4 is in close contact with the chassis 1. Optionally, the evaporator 52 is arranged along the Figure 2 The projection in the middle horizontal direction on the heat source 4 completely blocks the heat source 4.

[0079] In some embodiments, one end of the inlet channel 53 is connected to the bottom end of the condenser 51, and the other end is connected to the bottom end of the evaporator 52; one end of the outlet channel 54 is connected to the top end of the evaporator 52, and the other end is connected to the condenser 51. The connection position of the inlet channel 53 and the outlet channel 54 in the evaporator 52 can be set according to different needs, and no matter where the inlet channel 53 and the outlet channel 54 are located in the evaporator 52, they are within the protection range.

[0080] It should be noted that the bottom and top ends of the condenser 51 are the two ends in the height direction of the condenser 51, and the bottom and top ends of the evaporator 52 are the two ends in the height direction of the evaporator 52. The direction of the condenser 51 is the same as the height direction of the evaporator 52 and is defined as the first direction. This description is referred to in this article.

[0081] In some embodiments, when the power device is placed normally, the height of the condenser 51 is higher than the height of the evaporator 52 , and the height direction of the power device when placed normally is the first direction.

[0082] During the process of heat dissipation of the heat source 4 by the radiator assembly 5, the low-temperature liquid working medium in the evaporator 52 absorbs the heat of the heat source 4 and turns into a gaseous working medium. The gaseous working medium enters the condenser 51 through the outlet channel 54. The fan 3 dissipates heat to the condenser 51, so that the gaseous working medium is cooled in the condenser 51 and turns into a low-temperature liquid working medium, and flows back to the evaporator 52 through the inlet channel 53, dissipating the heat to the heat source 4, thereby realizing circulating cooling of the working medium.

[0083] In practical applications, such as when a phase change heat sink or a cold plate is used for heat dissipation, the container used to hold the liquid coolant in the phase change heat sink and the cold plate used in conventional liquid cooling can be referred to as an evaporator. In the embodiments of the present invention, the evaporator is used to refer to the container used to hold the liquid coolant. In practical applications, the evaporator is usually a hollow plate-like structure. Figure 2 and Figure 3As shown, in order to reduce the thickness of the power changing device in the horizontal direction, the evaporator is usually placed vertically. In practical applications, it can also be placed tilted, such as with the upper end of the evaporator facing Figure 2 The center line of the evaporator is moved closer to the left or right direction, thereby causing the extension direction of the center line of the evaporator to deviate from the horizontal direction; Figure 4 As shown, it has two left and right planes with larger areas, namely the first side panel 521 and the second side panel 522. Usually, the heat source 4 is arranged on the outer surface of one or more of the side panels. The embodiment of the present invention takes the heat source 4 arranged on the outer surface of the first side panel as an example for explanation. In addition, the evaporator can also have other shapes besides rectangular plates. For example, the shape of the plane with larger area is circular, square, elliptical or special-shaped. Similarly, the overall shape of the evaporator is not necessarily plate-shaped, for example, it can be spherical. Or one of the first side panel and the second side panel has an overall shape composed of a plane, an inclined surface, or an arc surface. Or, the outer surface of one of the first side panel and the second side panel is a plane formed by splicing multiple planes. The embodiment of the present invention only takes Figure 4 The rectangular plate-shaped evaporator shown is used as an example for explanation.

[0084] It should be noted that the radiator assembly 5 in this article includes but is not limited to a thermosyphon radiator.

[0085] Combination Figures 4 to 7 As shown, the heat source 4 in some embodiments includes a single layer arrangement or a multi-layer arrangement.

[0086] in, Figure 4 and Figure 5 The single-layer arrangement in the embodiment is that a plurality of heat sources 4 are arranged in the second direction of the chassis 1, wherein the second direction intersects with the first direction. In some embodiments, the first direction is perpendicular to the second direction.

[0087] In some embodiments, the heat source 4 includes: a shell 41 and a heat source 42. One or more heat sources 42 may be arranged in the shell 41, and these heat sources 42 may be arranged in multiple layers along the first direction, or in multiple layers along the second direction. In practical applications, in order to improve the power density of the device, the heat source 4 may also be arranged in multiple columns in the second direction, and further, the heat sources in the same column may be staggered along the second direction, for example, similar to the distribution of dark or light blocks in a chess board, thereby increasing the center distance between adjacent heat sources 4 to avoid mutual interference and improve the heat dissipation effect and electromagnetic stability.

[0088] It should be noted that the heat source 42 includes but is not limited to a wafer, and may also be a capacitor, a resistor or an inductor, or a power electronic module formed by a packaged wafer, such as a diode, a triode, a MOS tube or an iGBT.

[0089] Figure 6 and Figure 7When the heat sources 4 disclosed in the disclosure are arranged in multiple layers, the heat sources 4 are arranged in multiple layers in the first direction of the chassis 1, wherein multiple heat sources 4 can be arranged in each layer.

[0090] It should be noted that the above-mentioned evaporator 52 can cool all the heat sources 4 at the same time. In an optional embodiment, the projections of all the heat sources 4 on the evaporator 52 along the horizontal direction completely fall into the evaporator 52.

[0091] In some embodiments, all heat sources 4 are located between the inlet channel 53 and the outlet channel 54 .

[0092] The number of the inlet channels 53 and the outlet channels 54 can be set according to different needs, and the horizontal heights of all the inlet channels 53 and all the outlet channels 54 are the same.

[0093] Since the heat source 4 is arranged in multiple layers or each heat source 4 has multiple layers of heat sources 42, during the cooling process of the heat source by the radiator assembly 5, the medium in the lower part of the evaporator 52 is vaporized after heat exchange with the heat source below. The bubbles generated after vaporization will rise and affect the content of the medium above the evaporator 52, thereby affecting the heat dissipation of the heat source 42 above the heat source 4 by the medium above the evaporator 52; in addition, bubbles are usually generated at the position where the evaporator 52 and the heat source 4 are in contact. When the bubbles generated on the wall below the evaporator 52 float upward along the inner wall of the evaporator 52, if the bubbles move to the position on the wall above the evaporator 52 that is in contact with the heat source 4, the heat exchange effect between the medium in the evaporator 52 and the heat source 4 will be reduced.

[0094] In addition, after the medium at the bottom of the evaporator 52 is heated, it will exchange heat with the medium above, affecting the temperature of the medium above, further affecting the heat dissipation of the heat source 42 above along the first direction, causing a temperature difference between the heat sources 42 at the upper and lower positions, affecting the use of the heat source.

[0095] Based on the above problems, Figure 8 and Fig. 9 The heat sink assembly 5 shown in the figure can alleviate the temperature difference between the heat sources 42 at the upper and lower positions.

[0096] like Figure 8 and Fig. 9 As shown, the radiator assembly 5 includes: a condenser 51 , an evaporator 52 (or a cold plate), an inlet channel 53 , an outlet channel 54 , a liquid replenishing pipe 55 , and a heat dissipating medium circulating inside the radiator assembly 5 .

[0097] The arrangement and connection relationship of the condenser 51, the evaporator 52 (or the cold plate), the inlet channel 53 and the outlet channel 54 can be seen in Figure 2 and Figure 3The description about the radiator assembly 5 will not be repeated here.

[0098] One end of the infusion tube 55 is connected to the condenser 51, or is connected to the inlet channel 53, so as to realize the connection between the infusion tube 55 and the condenser 51. The other end of the infusion tube 55 is connected to the middle position of the evaporator 52, and the connection position between the infusion tube 55 and the evaporator 52 can be set according to different needs. For example, the infusion tube 55 can be set at different heights on the first side plate, and the infusion tube 55 can also be set on the second side plate; the infusion tube 55 is usually set near the heat source 4, for example, above, below, on the left side, or on the right side of the heat source 4, and of course, it can also be set on the second side plate at a position directly facing the heat source 4.

[0099] In the present application, a liquid replenishing tube 55 is added to replenish the middle position of the evaporator 52 in the first direction, thereby reducing the temperature of the medium in the middle position and above the evaporator 52, which is beneficial for the evaporator 52 to cool the heat source 42 above.

[0100] The above content explains the relationship between the components of the radiator assembly. Figures 10 to 35 The structure of the evaporator 52 will be described in detail.

[0101] Referring to the accompanying drawings, the evaporator 52 includes a first side plate 521 and a second side plate 522, wherein the first side plate 521 and the second side plate 522 are arranged opposite to each other, and the first side plate 521 is divided into a first area (not shown in the figure) and a second area (not shown in the figure) along the height direction, the height of the first area is higher than that of the second area, and the first area corresponds to at least one heat source 4; a first vertical line on the inner wall of the first area at a position opposite to the center of the heat source 4 does not coincide with a second vertical line on the inner wall of the second area toward the vertex of the second side plate 522, and the first vertical line and the second vertical line are both along the height direction of the evaporator.

[0102] It should be emphasized that the vertical line referred to in the embodiment of the present invention refers to a straight line pointing to the center of the earth or parallel to the direction of gravity. The position on the inner wall of the first area relative to the center of the heat source 4 can be: Figure 5 The projected area of ​​the heat source 4 on the left side shown, or the area where the inner wall temperature of the first area increases after the heat of the heat source 4 is conducted to the first area; or the area pre-divided for carrying the heat source 4, and the distance from the center of the projection of the heat source 4 on the inner wall of the evaporator is within a set distance range.

[0103] The first side plate 521 in the present application is opposite to the heat source 4, including but not limited to being fitted and connected to the heat source 4. Since the outer wall of the first side plate 521 is opposite to the heat source 4, bubbles will be generated at the heat source of the inner wall of the first side plate 521. If the bubbles move upward along the inner wall of the first side plate 521, the heat exchange effect of the inner wall above the first side plate 521 will be affected.

[0104] Based on this, in the present application, the first side plate 521 is divided into a first area and a second area along the height direction, the first area is higher than the second area, and the first area corresponds to at least one heat source, and the first vertical line of the position on the inner wall of the first area opposite to the center of the heat source 4 does not coincide with the second vertical line on the inner wall of the second area toward the vertex of the second side plate 522, so that the position on the inner wall of the first side plate 521 opposite to the center of the heat source 4 in the first area and the outermost point of the second area are not in the same plane. Therefore, the bubbles generated in the second area have a reduced probability of moving to the position opposite to the heat source 4 in the first area during the process of floating upward in the vertical direction, thereby improving the heat exchange effect between the first area and the heat source.

[0105] It should be noted that, since the first area in the present application is higher than the second area, it can be understood that the first area is the upper section of the evaporator involved in the content of the present application, and the second area is the lower section of the evaporator involved in the content of the present application. In practical applications, a heat source 4 can also be set on the outer surface corresponding to the second area of ​​the evaporator in one or more embodiments of the present invention, and the method of setting the heat source 4 is the same or similar to the method described above.

[0106] In some embodiments, the first vertical line is located between the second side plate 522 and the second vertical line, or the second vertical line is located between the second side plate 522 and the first vertical line. Simply put, the first area can be outward relative to the second area, or the first area can be inward relative to the second area. Taking the surface of the second side plate 522 as a plane as an example, the first area is far away from the second side plate 522 relative to the second area, or the first area is close to the second side plate 522 relative to the second area.

[0107] When the first area is inward relative to the second area, since the first area squeezes the working medium inward, the bubbles will grow larger and break and become smaller during the upward movement, and the influence of the tiny bubbles on the density of the upper layer will be reduced, especially when the path of the bubble movement is longer, the bubbles will gradually disappear. Therefore, the influence of the bubbles can be reduced and the heat exchange effect between the medium in the evaporator 52 and the heat source 4 can be improved.

[0108] In order to realize that the first area is inward relative to the second area, the inner wall of the first area and / or the inner wall of the second area can be set to be non-coplanar, and the way to achieve non-coplanarity includes but is not limited to setting the wall thickness of the first side plate 521 to be different or setting the first side plate 521 to a step structure.

[0109] like Fig.11 , Figures 13 to 16 , Figures 21 to 31 In the illustrated embodiments, different wall thicknesses or a step structure are used to achieve the non-coplanarity between the first region and the second region of the first side plate 521 .

[0110] In some embodiments, the inner wall of the first region may be an inclined surface or a stepped surface; and / or the inner wall of the second region may be an inclined surface or a stepped surface, so that the inner wall of the first region and the inner wall of the second region do not overlap.

[0111] By setting the inner wall of the first area and / or the second area as a step surface, or setting the inner wall of the first area and / or the second area as a slope, the probability of bubbles sticking along the inner wall of the first side plate 521 during the floating process can be reduced, thereby improving the heat exchange efficiency between the working fluid in the first area and the heat source 4.

[0112] The following is a detailed description of the specific implementation method provided in conjunction with the accompanying drawings.

[0113] In some embodiments, the wall thickness of the first region and / or the second region may decrease from the second region to the first region, and the inner wall of the first side plate 521 may form an inclined surface or a stepped surface. By reducing the wall thickness, the inner wall of the first side plate 521 may form a stepped surface or an inclined surface. When the bubbles in the first region and / or the second region float upward in the height direction, they will move away from the inner wall surface above the first side plate 521, thereby reducing the number of bubbles on the inner wall and improving the heat exchange effect of the inner wall.

[0114] It can be understood that, along the direction from the second region to the first region, the wall thickness of the first region and the second region both decreases, or, along the direction from the second region to the first region, the wall thickness of the first region or the second region decreases.

[0115] like Fig.15 and Fig.16 and Fig.30 as well as Fig.31 As shown, the method of reducing the wall thickness of the first area and the second area includes but is not limited to that the wall thickness of the first side plate 521 gradually decreases along the direction from the second area to the first area, and the inner wall of the first side plate 521 forms an inclined surface. The inclination angle of the inclined surface can be set according to different needs. In practical applications, the inner walls of the first area and the second area corresponding to the inner walls in contact with the cooling medium can be located on the same inclined surface, which is easier to process; or they can be located on different inclined surfaces. For example, the upper ends of the inner wall of the first area and the inner wall of the second area both extend toward the second side plate, and the inner walls of the two are two parallel planes. Such a setting can avoid the lateral size of the evaporator being too large due to the excessive thickness of some areas of the first side plate. Of course, in practical applications, the planes where the inner walls of the two are located are not necessarily strictly parallel, and there can also be a certain deviation. Ideally, the slopes of the two should be positive or negative, or the inner walls of the two should be vertical planes.

[0116] in, Fig.15 and Fig.30The manner in which the wall thickness of the first side plate 521 gradually decreases from the second area to the first area includes but is not limited to: the first area is above the straight line where the infusion tube 55 is located, and the second area is below the straight line where the infusion tube 55 is located; and Fig.16 and Fig.31 The first area and the second area are inclined surfaces respectively, including but not limited to: the first area is above the straight line where the infusion tube 55 is located, and the second area is below the straight line where the infusion tube 55 is located.

[0117] like Figures 11 to 14 , Fig. 22 , Figure 27 to Figure 29 As shown, the wall thickness of the first area of ​​the inner wall of the first side plate 521 is smaller than the wall thickness of the second area of ​​the inner wall of the first side plate 521, so that there is a relative lateral displacement difference between the inner wall of the first area and the inner wall of the second area, thereby forming a step surface, so that the inner wall of the first area and the inner wall of the second area do not overlap.

[0118] It can be understood that Fig.11 , Fig.13 , Fig. 22 The first area in the figure may be the portion above the straight line where the infusion tube 55 is located, and the second area may be the portion below the straight line where the infusion tube 55 is located; Fig.14 The first area is the position above the boss of the first side plate 521, and the second area is the boss and the position below the boss; Fig. 27 and Fig.29 The first area in the figure may be a position above the step surface of the first side plate 521, and the second area may be an area below the step surface. It can be understood that the wall thickness of the first area is smaller than the wall thickness of the second area.

[0119] Figure 23 to Figure 25 As shown, the first region protrudes relative to the second region in a direction away from the second side plate 522, and the inner wall of the first region and the second region form a step surface.

[0120] The first area is the portion of the first side plate 521 that protrudes outward from the upper position, and all positions below the first area include but are not limited to the protruding positions.

[0121] It should be noted that the above only discloses some exemplary shapes of the first side plate 521. Those skilled in the art will appreciate that, based on the above disclosure, the shape of the inner wall of the first side plate 521 can be changed according to different needs. Fig.25 In the figure, the leftward protrusion on the first side plate below the infusion tube 55 is part of the second area, the area on the first side plate above the infusion tube 55 is the first area, and the first area and the second area serve as part or all of the inner wall of the first side plate.

[0122] As long as the first area and the second area are not coplanar, they are all within the scope of protection. This article will not list them one by one, but they are all within the scope of protection.

[0123] In addition, by setting the wall thickness of the first area of ​​the first side plate 521 to be smaller than the wall thickness of the second area, the wall thickness between the second area of ​​the first side plate 521 and the heat source 4 can be increased, thereby reducing the effect of heat exchange with the heat source 42 below; the wall thickness between the first area of ​​the first side plate 521 and the heat source 4 is reduced, thereby increasing the effect of heat exchange with the heat source 42 above, and then reducing the temperature difference between the heat source 42 below and the heat source 42 above.

[0124] In addition, if Figures 17 to 20 as well as Figure 32 to Figure 35 As shown, in some embodiments, a guide member 523 can also be provided on the inner wall of the first side plate 521 to guide the vaporized working fluid below in a direction away from the first side plate 521, thereby reducing the influence of bubbles generated in the second area on the first area of ​​the first side plate 521, reducing the temperature difference between the lower heat source 42 and the upper heat source 42, and ensuring the heat exchange effect of the first area.

[0125] It should be noted that the inner wall of the first area and / or the inner wall of the second area in this article has a guide member 523; when the guide member 523 is located on the inner wall of the first area, the guide member 523 forms a part of the inner wall of the first area; when the guide member is located on the inner wall of the second area, the guide member 523 forms a part of the inner wall of the second area, and the vertex of the guide member 523 of the second area is the vertex on the inner wall of the second area facing the second side plate 522.

[0126] The guide member 523 is arranged perpendicular to the first vertical line or arranged at an angle to the first vertical line. In some embodiments, the guide member 523 is a structure protruding from the straight part of the inner wall of the first side plate 521 , and the guide member 523 is perpendicular or inclined to the straight part of the inner wall of the first side plate 521 .

[0127] The inclination angle and inclination mode of the guide member can be set according to different needs and are all within the protection range. It should be noted that in some embodiments, the radiator assembly 5 can select at least one of the guide member 523, the improvement of the evaporator and the liquid replenishment pipe 55 to solve the problem of poor heat exchange effect with the heat source.

[0128] like Fig.10 and Fig.11 In the illustrated embodiment, the heat source 4 is arranged in a single layer and is arranged in plurality along the second direction. The evaporator 52 has a plurality of infusion ports 551 connected to the infusion tube. In some embodiments, the infusion tube 55 corresponds one-to-one to the infusion ports 551 , or a plurality of infusion ports 551 correspond to one infusion tube 55 .

[0129] It should be noted that the evaporator 52 is provided with a plurality of liquid replenishing ports 551 along the first direction, and the liquid replenishing ports 551 are located beside the heat source 4 , including but not limited to being located at the center of the heat source 4 along the first direction.

[0130] The liquid replenishing port 551 is disposed beside the heat source 4 , which can facilitate the installation and arrangement of the liquid replenishing pipe 55 on the evaporator 52 .

[0131] like Fig.12 and Fig.13 In the illustrated embodiment, the liquid replenishing port 551 is arranged opposite to the heat source 4 , that is, the projection of the liquid replenishing port 551 along the second direction falls into the heat source 4 .

[0132] In some embodiments, the evaporator 52 is a box structure, and includes a first side plate 521 close to the heat source 4 and a second side plate 522 opposite to the first side plate 521 .

[0133] The liquid replenishing port 551 is provided on the first side plate 521 and / or the second side plate 522. The arrangement of the liquid replenishing port 551 can be set according to different needs and are all within the protection range. The inlet channel 53 and the outlet channel 54 include but are not limited to being connected with the second side plate 522, and can also be connected with the first side plate 521. The connection position of the inlet channel 53 and the outlet channel 54 can be set according to the spatial position of the evaporator 52, as long as the position where the installation can be achieved is within the protection range.

[0134] When the liquid replenishing port 551 is disposed beside the heat source 4 , the liquid replenishing port 551 may be opened on the first side plate 521 . When the liquid replenishing port 551 is opposite to the heat source 4 , the liquid replenishing port 551 may be opened on the second side plate 522 .

[0135] It should be noted that the above arrangement of the liquid infusion port 551 may be adopted in other embodiments.

[0136] Fig.11 and Fig.13 In the direction from the second area to the first area of ​​the evaporator 52, the wall thickness of the first side plate 521 decreases.

[0137] In some embodiments, the first side plate 521 includes but is not limited to the inner side of the first side plate 521 being a stepped surface. The first side plate 521 has a thick wall including but is not limited to having three sections of different sizes. From the top to the bottom of the evaporator 52, it includes the first section, the second section and the third section in sequence, wherein the thickness of the first section is less than the thickness of the middle section, and the thickness of the middle section is less than the thickness of the third section.

[0138] The thickness of the first section, the second section and the third section and the length along the first direction can be set according to different needs and are all within the protection range.

[0139] The thickness of the first section near the top end of the evaporator 52 is greater than the thickness of the middle section, and the thickness of the middle section is greater than the thickness of the third section near the bottom end of the evaporator 52 .

[0140] In order to achieve different wall thicknesses in the first area and the second area of ​​the first side plate 521, other methods may be used in some embodiments, such as Fig.15 and Fig.16 In the illustrated embodiment, the inner side of the first side plate 521 includes a gradually expanding section that gradually expands from the first area to the second area of ​​the evaporator 52 .

[0141] The position and length of the gradually expanding section of the first side plate 521 can be set according to different needs, and the gradually expanding taper of the first side plate 521 can also be set according to different heat dissipation requirements.

[0142] Fig.15 The gradually expanding section is located in the middle position of the first side plate 521 in the first direction, the length along the first direction is the length of the heat source 4 along the first direction, and the gradually expanding section is opposite to the heat source 4.

[0143] Fig.16 A groove is provided on the gradually expanding section in the middle, and the opening position of the groove includes but is not limited to the edge of the infusion port 551 connected to the infusion tube 55. The size, opening position and number of the groove can be set according to different needs, and are all within the protection range.

[0144] like Figures 17 to 20 As shown, a guide member 523 is disposed on the inner side of the first side plate 521 .

[0145] The guide member 523 includes but is not limited to an inclined plate, and the inclined direction of the inclined plate is from the bottom end to the top end of the evaporator 52, and is inclined in the direction away from the first side plate 521, so as to guide the working fluid vaporized after heat exchange at the bottom of the evaporator 52 in the direction away from the first side plate 521.

[0146] In some embodiments, a plurality of heat sources 42 are integrated in the heat source 4 , the heat sources 42 are arranged along a first direction, and the guide member 523 is located between adjacent heat sources 42 arranged along the first direction.

[0147] Along the first direction, the guide member 523 is located between adjacent fluid infusion ports 551 that are in communication with the fluid infusion tube 55. The size and inclination angle of the guide member 523 can be set according to different needs and are within the protection range.

[0148] like Fig.18 and Fig.19 In the illustrated embodiment, along the first direction, the length of the guide member 523 gradually decreases from the bottom end to the top end of the evaporator 52. In an optional embodiment, the inclination angles of the guide member 523 may be the same or different.

[0149] Fig. 20 The guide member 523 is a plate member, and the side surface of the guide member 523 close to the bottom end of the evaporator 52 is a guide surface, and the guide surface is smoothly guided from the first side plate 521 to the second side plate 522 to the top end of the evaporator 52.

[0150] The above embodiment is based on the description of the wall thickness of the first side plate 521, the arrangement of the liquid infusion tube 55 and the arrangement of the guide member 523 when the heat source 4 is arranged in a single layer. Figures 21 to 35 When the heat source 4 is arranged in multiple layers, the wall thickness of the first side plate 521, the arrangement of the liquid infusion tube 55, and the arrangement of the guide member 523 are described.

[0151] like Fig.21 In the illustrated embodiment, the heat source 4 is arranged in two layers along the first direction, which is included but not limited to two layers in the present application, and may also be arranged in three layers or more. When arranging other numbers of layers, the wall thickness of the first side plate 521 of the radiator assembly 5, the setting of the infusion tube 55, and the arrangement of the guide member 523 may be referred to the description below and will not be repeated herein.

[0152] It should be noted that, a layer of heat source 42 or multiple layers of heat source 42 may be arranged in the heat source 4 along the first direction.

[0153] like Fig.21 As shown, the evaporator 52 has a plurality of liquid infusion ports 551 connected to the liquid infusion tubes. In some embodiments, the liquid infusion tubes 55 correspond one to one with the liquid infusion ports 551 , or a plurality of liquid infusion ports 551 correspond to one liquid infusion tube 55 .

[0154] It should be noted that the evaporator 52 is arranged with a plurality of liquid replenishing ports 551 along the first direction, and the liquid replenishing ports 551 are located between adjacent heat sources 4 arranged along the first direction, including but not limited to being located at the center position of the heat source 4 along the first direction.

[0155] like Fig.26 In the illustrated embodiment, the refill port 551 may also be disposed beside the heat source 4, which may facilitate the installation and arrangement of the refill pipe 55 on the evaporator 52. In some embodiments, the refill port 551 is distributed between adjacent heat sources 4 arranged along the second direction. By disposing the refill port 551 between adjacent heat sources 4 in the second direction, the temperature difference above and below the refill port 551 may be improved. It can be understood that after the working fluid below exchanges heat with the heat source 4, the temperature of the working fluid increases, and after the temperature of the working fluid increases, the working fluid will exchange heat with the working fluid above, which will increase the temperature of the working fluid above and reduce the heat absorption effect of the working fluid above. Based on this, disposing the refill port 551 between the heat sources 4 may reduce the temperature at the connection between the working fluid below and the working fluid above, thereby alleviating the influence of the working fluid below on the temperature of the working fluid above.

[0156] The distance between the liquid replenishing port 551 and the heat source 4 can be set according to different needs and is within the protection range.

[0157] like Fig.28 In the illustrated embodiment, the liquid replenishing port 551 is located directly opposite to the heat source 4 , that is, the projection of the liquid replenishing port 551 along the second direction falls into the heat source 4 .

[0158] The opening position of the liquid replenishing port 551 can be set according to different needs. Preferably, the liquid replenishing port is opened in the middle position of the evaporator 52 along the first direction to reduce the temperature of the working fluid in the middle position inside the evaporator 52, reduce the influence of the working fluid at the bottom of the evaporator 52 on the working fluid at the top, and thereby reduce the temperature difference between the upper and lower heat sources 42.

[0159] Combination Figure 22 to Figure 24 , Fig.26 and Fig. 27 as well as Fig.28 and Fig.29 As shown, in some embodiments, the evaporator 52 is a box structure, and includes a first side plate 521 close to the heat source 4 and a second side plate 522 opposite to the first side plate 521 .

[0160] The liquid inlet 551 is provided on the first side plate 521 and / or the second side plate 522. The arrangement of the liquid inlet 551 can be set according to different needs and is within the protection range.

[0161] When the liquid inlet 551 is disposed beside the heat source 4, the liquid inlet 551 can be disposed on the first side plate 521. When the liquid inlet 551 is opposite to the heat source 4, the liquid inlet 551 can be disposed on the second side plate 522. Of course, it is not necessary to dispose the liquid inlet 551 on the first side plate 521 or the second side plate according to the position of the heat source 4.

[0162] It should be noted that the arrangement of the above-mentioned liquid inlet 551 may be adopted in the other embodiments mentioned above.

[0163] The wall thickness of the first side plate 521 is described below with reference to the accompanying drawings.

[0164] Fig. 22 , Fig. 27 and Fig.29 In the illustrated embodiment, the inner side surface of the first side plate 521 is a stepped surface, and includes a first section and a second section in sequence from the top to the bottom of the evaporator 52, wherein the thickness of the first section is less than the thickness of the second section. It can be understood that the first section is the first area, and the second section is the second area.

[0165] The lengths of the first section and the second section along the first direction can be set according to different needs. In some embodiments, the first section is opposite to the upper heat source 4, and the second section is opposite to the lower heat source 4. When multiple layers of heat sources 4 are arranged along the first direction, the inner wall of the first side plate 521 can be set to multiple sections, and the thickness increases sequentially from the top end to the bottom end of the evaporator 52.

[0166] The thickness of the first section and the second section can be set according to different needs and is not specifically limited here.

[0167] In order to achieve different wall thicknesses in the first area and the second area of ​​the first side plate 521, other methods may be used in some embodiments, such as Fig.15 and Fig.16 In the illustrated embodiment, the inner side of the first side plate 521 includes a gradually expanding section that gradually expands from the top end to the bottom end of the evaporator 52 .

[0168] The position and length of the gradually expanding section of the first side plate 521 can be set according to different needs, and the gradually expanding taper of the first side plate 521 can also be set according to different heat dissipation requirements.

[0169] Fig.30 In the illustrated embodiment, the gradually expanding section is located in the middle of the first side plate 521 in the first direction, the length along the first direction is the length of the heat source 4 along the first direction, and the gradually expanding section is opposite to the heat source 4.

[0170] Fig.31 In the illustrated embodiment, there are multiple gradually expanding sections arranged along the first direction, and they are arranged one-to-one corresponding to the heat sources 4 .

[0171] Fig.23 In some embodiments, the first region of the first side plate 521 protrudes in a direction away from the second side plate 522 relative to the second region.

[0172] Fig.24 In the illustrated embodiment, the first side plate 521 includes a protruding section that protrudes in a direction away from the second side plate 522 , so that the first side plate 521 forms a U-shaped structure.

[0173] Fig.32 In the illustrated embodiment, a guide member 523 is provided on the inner side of the first side plate 521. The guide member 523 includes but is not limited to an inclined plate, and the inclined direction of the inclined plate is from the bottom end to the top end of the evaporator 52, and is inclined in a direction away from the first side plate 521, so as to guide the bubbles generated after the heat exchange in the lower part of the evaporator 52 in a direction away from the first side plate 521.

[0174] The heat sources 4 are arranged in multiple layers along the first direction, and the guide members 523 are arranged between adjacent heat sources 4 arranged along the first direction. Exemplarily, the guide member 523 may be located above a position relative to the center of any heat source among the heat sources 4, and the guide member 523 is used to guide the bubbles generated by the heat source on the inner wall of the first side plate 521; if the guide member 523 is located below a position relative to the center of the heat source, it may guide the bubbles generated by the heat source located below the heat source.

[0175] Similarly, the guide member 523 may also be arranged along the second direction on the inner wall of the first side plate 521 opposite to the heat source 4 .

[0176] Fig.33 In the illustrated embodiment, a guide member 523 is disposed inside the first side plate 521, and a plurality of guide members 523 are disposed along the first direction. In some embodiments, the length of the guide member 523 located in the middle is greater than the lengths of the guide members 523 on both sides.

[0177] Fig.19 In the illustrated embodiment, a guide member 523 is disposed on the inner wall of the first side plate 521 . There are two guide members 523 along the first direction, and the length of the upper guide member 523 is shorter than the length of the lower guide member 523 .

[0178] Fig.34 In the illustrated embodiment, a guide member 523 is disposed on the inner wall of the first side plate 521 . The guide member 523 serves as a part of the inner wall of the second region. The vertex of the guide member 523 is the vertex on the inner wall of the second region facing the second side plate 522 .

[0179] Fig.35 In the illustrated embodiment, a guide member 523 is disposed on the inner wall of the first side plate 521 . There are multiple guide members 523 along the first direction, and at least one guide member 523 is arranged obliquely, while the remaining guide members 523 are arranged perpendicular to the first direction.

[0180] In an optional embodiment, the inclination angles of the multiple guide members 523 may be the same or different; the lengths of the multiple guide members 523 may be the same or different. The inventors have found that when two or more guide members 523 are of equal length, the bubble leaves the end of the guide member 523 away from the first side plate 521, i.e. Fig.32After reaching the left end of the guide member 523 shown in the figure, the bubbles derived from the upper and lower guide members will overlap with each other, thereby forming an air curtain area with very low density in the area above the end of the uppermost guide member among the above-mentioned multiple guide members 523. The air curtain area will have a negative impact on the rightward flow of the coolant on the left side. In addition, it will also increase the flow trend of the coolant at the upper heat source of the uppermost guide member toward the air curtain area, thereby reducing the cooling effect at the upper heat source. In the preferred scheme, the simulation results show that the unequal length effect is better.

[0181] It should be noted that the length of the guide member 523 herein refers to the distance from one end of the guide member 523 connected to the first side plate 521 to the other end.

[0182] In addition, the present application also discloses a power device, including a cabinet, a heat source arranged in the cabinet, and a radiator assembly for dissipating heat from the heat source, wherein the radiator assembly is the radiator assembly disclosed in the above-mentioned embodiment. Therefore, the power device having the radiator assembly also has all the above-mentioned technical effects, which will not be repeated here one by one.

[0183] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0184] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A radiator assembly, characterized in that: include: an evaporator and a condenser, wherein the evaporator is used to exchange heat with a heat source; The condenser is connected to the evaporator and can dissipate heat from the working fluid after heat exchange in the evaporator and return the dissipated working fluid to the evaporator; A liquid replenishing tube, one end of which is connected to the condenser, and the other end of which is connected to the evaporator.

2. The heat sink assembly according to claim 1, characterized in that The evaporator comprises a first side plate and a second side plate, the first side plate and the second side plate are opposite to each other, and the first side plate is used to be attached to the heat source; The liquid infusion tube is connected to the first side plate and / or the second side plate.

3. The heat sink assembly according to claim 2, characterized in that The evaporator has a liquid replenishing port for communicating with the liquid replenishing pipe; The liquid replenishing port is opened at the edge of the projection of the heat source on the evaporator in a direction perpendicular to the height direction of the evaporator; And / or, the liquid replenishing port is opened within the projection of the heat source along a direction perpendicular to the height direction of the evaporator.

4. The heat sink assembly according to claim 3, characterized in that The liquid replenishing port is arranged in a plurality along the height direction of the evaporator. And / or, a plurality of the liquid replenishing ports are arranged along a direction perpendicular to the height direction of the evaporator.

5. The heat sink assembly according to claim 4, characterized in that There are multiple infusion tubes, and each of the infusion tubes is connected to at least one infusion port; Alternatively, there is one infusion tube, and the infusion tube is connected to at least two of the infusion ports.

6. The heat sink assembly according to claim 3, characterized in that The heat sources are arranged in plurality along the height direction and / or width direction of the first side plate; The fluid replenishing port is located between adjacent heat sources.

7. The radiator assembly according to any one of claims 2 to 6, characterized in that: The inner wall of the first side plate is a step surface and / or an inclined surface.

8. The radiator assembly according to any one of claims 2 to 6, characterized in that: The inner wall of the first side plate is provided with a guide member, And the inner wall of the first side plate is at least one of a plane, an inclined surface and a step surface.

9. The heat sink assembly according to claim 8, characterized in that The guide member is arranged perpendicularly to the height direction of the evaporator, and / or the guide member is arranged obliquely to the height direction of the evaporator; When the guide member is arranged obliquely in the height direction of the evaporator, the guide member is inclined in a direction away from the inner wall of the first side plate along the direction from the bottom end to the top end of the evaporator.

10. A power device, comprising a cabinet, a heat source disposed in the cabinet, and a heat sink assembly for dissipating heat from the heat source, characterized in that: The radiator assembly is the radiator assembly according to any one of claims 1 to 9.