Airflow heating structure for atomization device and atomization device

Abstract

The utility model provides an airflow heating structure for an atomization device and the atomization device, the airflow heating structure comprises a heating body and a conductive connector, the heating body comprises a resistor body, an insulator and a conductor which are sequentially stacked, a conductive layer is arranged on the peripheral side of the resistor body, and the conductive connector is arranged on the conductive layer. The conductive layer and the conductor are respectively used for being electrically connected with a power supply, the heating body is provided with a plurality of airflow holes, and the airflow holes penetrate through the resistor body, the insulator and the conductor; the two ends of the conductive connector are used for being electrically connected with the resistor body and the conductor respectively. The resistor is used for heating along the axial direction of the aerosol generating substrate, so that the aerosol generating substrate is uniformly heated, the heating is realized in a resistance heating mode, the structure is simple, the manufacturing cost is reduced, the heating power can be conveniently adjusted in a limited space due to the stacked heating bodies, the operability of temperature control is improved, and the service life of the aerosol generating substrate is prolonged. And through the arrangement of the insulator and the electric conductor, the electric conduction requirement can be met, and the resistor body can be protected.

Description

Technical Field

[0001] The present application relates to the technical field of electronic atomization, and more specifically to an airflow heating structure for an atomization device and an atomization device. Background Art

[0002] Currently, an atomization device generally includes a heating structure and a power supply component. The heating structure is generally electrically connected to the power supply component, and the power supply component is used to provide electrical energy to the heating structure. The heating structure ultimately converts the electrical energy provided by the power supply component into thermal energy, thereby heating and atomizing the aerosol-forming matrix, so that the aerosol-forming matrix forms an aerosol that can be inhaled by the user.

[0003] Among them, one existing heating method is to set a heating and heat-conducting structure on the outside of the aerosol-forming matrix, and heat and bake the aerosol-forming matrix by conducting heat from the periphery to the middle. There is a long energy transfer process from the heating structure to the aerosol-forming matrix, and the heating efficiency is low. At the same time, using this method, it is very easy to cause the peripheral aerosol-forming matrix to be overheated and produce a burnt smell, affecting the user's experience. Another heating method is electromagnetic induction heating. The structure of this method is relatively complex, the manufacturing cost is high, and when using electromagnetic induction heating, the operation of changing the temperature range is relatively complicated. Based on the limited use space of the atomization device, the operable range of temperature control is small. Utility Model Content

[0004] The present application provides an airflow heating structure for an atomizing device and an atomizing device, which utilizes resistance heating and has a simple structure and is easy to operate.

[0005] The present application provides an airflow heating structure for an atomization device, comprising: a heating element, the heating element comprising a resistor, an insulator and a conductor stacked in sequence, a conductive layer being arranged on the periphery of the resistor, the conductive layer and the conductor being respectively used for being electrically connected to a power source, the heating element having a plurality of airflow holes, the airflow holes penetrating the resistor, the insulator and the conductor; and a conductive connector, the two ends of the conductive connector being respectively used for being electrically connected to the resistor and the conductor.

[0006] In one embodiment, a heat-conducting tube is further included, wherein the heat-conducting tube has a first end and a second end that are arranged opposite to each other, wherein the first end is used for inserting the aerosol-forming matrix, and the space inside the heat-conducting tube forms an installation cavity, wherein the installation cavity is used for installing the aerosol-forming matrix, and the heating element is arranged at the second end.

[0007] In one embodiment, one end of the conductive connector extends from any one of the air flow holes to be electrically connected to the resistor, and the other end extends to be electrically connected to the conductor.

[0008] In one embodiment, one end of the conductive connector extends from the centrally located air flow hole to be electrically connected to the resistor, and the other end extends to be electrically connected to the conductor.

[0009] In one embodiment, the resistor, the insulator and the conductor are stacked in sequence from the second end to the first end.

[0010] In one embodiment, a protective body is further included, and the protective body is arranged on a side of the resistor body facing away from the insulator.

[0011] In one embodiment, the resistor body includes a plurality of resistor substrate layers, the plurality of resistor substrate layers are stacked in a direction parallel to the direction from the first end to the second end, and the conductive layer is disposed on the circumference of the plurality of resistor substrate layers.

[0012] In one embodiment, the resistor body further includes a plurality of insulating substrate layers, and the insulating substrate layer is provided between two adjacent resistor substrate layers, so that the two adjacent resistor substrates are insulated from each other.

[0013] In one embodiment, it further includes a first lead and a second lead, wherein the first lead is electrically connected to the conductive layer, and the second lead is electrically connected to the conductor, so as to realize the electrical connection between the resistor and the power supply.

[0014] The present application also provides an atomization device, comprising: a shell assembly, the shell assembly having an installation cavity; the airflow heating structure for the atomization device as described above, the heat conduction pipe being arranged in the installation cavity; and a heat insulation pipe, which is sleeved on the outside of the airflow heating structure for the atomization device to block the heat conduction generated by the airflow heating structure.

[0015] According to the airflow heating structure for the atomization device in the above embodiment, it includes a heating element and a conductive connector. The heating element includes a resistor, an insulator and a conductor. The resistor is used to heat the airflow passing through the airflow hole to form a hot airflow. The hot airflow heats the aerosol-forming matrix from the axial direction, so that it is evenly heated, ensuring the taste of the user. Heating is achieved by resistive heating, which has a simple structure and is easy to prepare, and can reduce the production cost. In addition, since the stacked heating elements are convenient for adjusting the heating power through the setting of different layers in a limited space, the operability of the temperature control range is improved. Through the setting of the insulator and the conductor, both the conductivity requirements can be met and the protection of the resistor can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural explosion diagram of an airflow heating structure in an embodiment;

[0017] Figure 2A schematic cross-sectional view of an airflow heating structure in an embodiment;

[0018] Figure 3 This is a schematic diagram of the structure of a heating element in an embodiment;

[0019] Figure 4 A schematic diagram of the structure of a resistor substrate in an embodiment;

[0020] Figure 5 It is a structural schematic diagram of a heating element in another embodiment;

[0021] Figure 6 This is a schematic diagram of the structure of a heating element in another embodiment;

[0022] Figure 7 It is a structural schematic diagram of an atomization device;

[0023] Figure 8 It is a schematic diagram of the cross-sectional structure of the atomization device.

[0024] Among them: 1000, air flow heating structure; 1100, heat pipe; 1110, first end; 1120, second end; 1130, installation cavity; 1200, heating element; 1210, resistor; 1211, conductive layer; 1212, resistor layer; 1213, first resistor substrate layer; 1214, second resistor substrate layer; 1215, third resistor substrate layer; 1216, first insulating substrate layer; 1217, second insulating substrate layer; 1220, insulator; 1230, conductor; 1240, protective body; 1250, air flow hole; 1300, conductive connector; 1400, first lead; 1500, second lead; 2000, aerosol forming matrix; 3000, shell assembly; 4000, insulation tube. DETAILED DESCRIPTION

[0025] The present application is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0026] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations, and the operation steps involved in each embodiment can also be replaced or adjusted in a sequence in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a certain embodiment and do not mean that the composition and / or sequence are necessary.

[0027] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0028] One common heating structure of atomizing device is to set a heating and heat-conducting structure on the outside of the aerosol-forming matrix 2000, and heat and bake the aerosol-forming matrix 2000 by heat conduction from the periphery to the middle. There is a long energy transfer process from the heating structure to the aerosol-forming matrix 2000, and the heating efficiency is low. At the same time, using this method, it is very easy to cause the peripheral aerosol-forming matrix 2000 to be overheated and produce a burnt smell, affecting the user's experience. Another heating method is electromagnetic induction heating. The structure of this method is relatively complex and the manufacturing cost is high. When using electromagnetic induction heating, the operation of changing the temperature range is relatively complicated. Based on the limited use space of the atomizing device, the operable range of temperature control is small. In order to solve the above-mentioned problems of low heat conduction efficiency from the periphery to the middle and poor taste, as well as the problems of complex structure, high cost and small operable space for temperature control using electromagnetic heating, the present application provides the following solution.

[0029] refer to Figure 1-6 The present application provides an airflow heating structure 1000 for an atomizing device, comprising a heat conducting pipe 1100, a heating element 1200 and a conductive connector 1300, wherein the heat conducting pipe 1100 has a first end 1110 and a second end 1120 arranged opposite to each other, wherein the first end 1110 is configured to be used for installing an aerosol forming substrate 2000, the heating element 1200 is arranged at the second end 1120, and the heating element 1200 comprises a plurality of conductive connecting elements 1300 and a plurality of conductive connecting elements 1300, wherein the plurality of conductive connecting elements 1300 are stacked in sequence along a direction parallel to the first end 1110 to the second end 1120. A resistor 1210, an insulator 1220 and a conductor 1230 are provided, and a first conductive layer 1211 is provided on the peripheral side of the resistor 1210. The first conductive layer 1211 and the conductor 1230 are respectively used for electrically connecting to a power source. The heating element 1200 has a plurality of air flow holes 1250, and the air flow holes 1250 penetrate the resistor 1210, the insulator 1220 and the conductor 1230. Two ends of the conductive connector 1300 are respectively used for electrically connecting to the resistor 1210 and the conductor 1230.

[0030] The airflow heating structure 1000 in the above embodiment is adopted, and the aerosol-forming matrix 2000 and the heating element 1200 are respectively arranged at the two ends of the heat-conducting tube 1100. After the heating element 1200 heats the airflow to form a hot airflow, the hot airflow flows in the direction from the second end 1120 to the first end 1110, and heats the aerosol-forming matrix 2000 during the circulation process, that is, the aerosol-forming matrix 2000 is heated along the axial direction, so that the cross-section of the aerosol-forming matrix 2000 is evenly heated, and the aerosol substrates located on the same cross-section are heated by the hot airflow simultaneously, and the outer aerosol substrate will not produce a burnt smell due to uneven heating. The aerosol substrate in the middle has not yet reached the temperature for forming an aerosol, thereby affecting the taste and improving the user's experience. At the same time, using hot air flow for heating can shorten the energy transfer process and improve the heating efficiency. The resistor 1210, the insulator 1220 and the conductor 1230 formed by tape cast lamination are used as the heating element 1200. The technology of tape cast lamination is mature, the manufacturing process is simple and convenient, and the cost can be reduced. At the same time, the temperature range can be regulated by improving the resistor 1210, such as adjusting the thickness of the resistor 1210 (the dimension in the direction parallel to the first end 1110 to the second end 1120) and adjusting the conductive material of the resistor 1210. The operating space is large, and the adjustment of the resistor 1210 is more convenient and more applicable within the limited working space of the atomization device.

[0031] The aerosol-forming matrix includes a matrix section, an airway section and a suction section. The matrix section is arranged close to the heating element and is completely arranged in the installation cavity 1130 of the heat pipe 1100. During the conduction of the hot air flow, part of the heat can also be transferred to the heat pipe 1100. The heat pipe 1100 transfers the heat from the circumferential direction to the aerosol-forming matrix, thereby forming a heating method along the axial and circumferential directions, which can improve the heating efficiency.

[0032] In order to make the air flow smoother, multiple air flow holes 1250 are arranged through the direction parallel to the first end 1110 to the second end 1120, and the multiple air flow holes 1250 are symmetrically arranged around the air flow hole 1250 located in the center, so that the air flow is uniform, and the air flow passing through the cross-section of the aerosol forming matrix 2000 is uniform.

[0033] One end of the conductive connector 1300 extends from any of the air flow holes 1250 to be electrically connected to the resistor 1210 , and the other end extends to be electrically connected to the conductor 1230 , so as to achieve connection between the resistor 1210 and a power source.

[0034] refer to Figure 2 and 3One end of the conductive connector 1300 extends from the centrally located airflow hole 1250 to be electrically connected to the resistor 1210, and the other end extends to be electrically connected to the conductor 1230, so that the current path on the entire resistor 1210 is consistent, so that the resistor 1210 is evenly heated on the cross section of the resistor 1210, so that a hot air flow with uniform temperature is formed, thereby achieving uniform heating of the aerosol-forming substrate 2000.

[0035] refer to Figure 4 In the direction from the second end 1120 to the first end 1110, the resistor 1210, the insulator 1220 and the conductor 1230 are stacked in sequence, that is, the resistor 1210 is arranged relatively far away from the aerosol forming matrix 2000, thereby lengthening the path of the airflow, extending the heating distance, and improving the heating efficiency.

[0036] Since the resistor 1210 may be damaged when it is directly connected to other structures inside the atomization device, a protective body 1240 is further included. The protective body 1240 is disposed on a side of the resistor 1210 facing away from the insulator 1220 .

[0037] refer to Figure 5 The resistor body 1210 includes a plurality of resistor substrate layers, which are stacked in a direction parallel to the direction from the first end 1110 to the second end 1120, and the peripheral sides of the plurality of resistor substrate layers are all provided with a conductive layer 1211. For example, the resistor body 1210 includes a first resistor substrate layer 1213, a second resistor substrate layer 1214, and a third resistor substrate layer 1215, which are stacked in sequence.

[0038] By setting up multiple resistor substrate layers, the resistance value in the entire heating circuit can be adjusted, thereby adjusting the heating temperature in the entire heating circuit to adapt to different temperature requirements. The heating distance can also be further lengthened and the heating efficiency can be improved by setting up multiple resistor electrode layers.

[0039] refer to Figure 6 The resistor body 1210 further includes a plurality of insulating substrate layers, and an insulating substrate layer is provided between two adjacent resistor substrate layers to insulate the two adjacent resistor substrates from each other. By providing an insulating substrate layer between the plurality of resistor substrate layers, the heating distance can also be lengthened. For example, the first insulating substrate layer 1216 and the second insulating substrate layer 1217 are included, and the first resistor substrate layer 1213, the first insulating substrate layer 1216, the second resistor substrate layer 1214 and the second insulating substrate layer 1217 are stacked in sequence.

[0040] The resistor substrate layer, the insulating substrate layer, the conductor 1230 and the insulator 1220 can all be formed by setting different metal coatings on the ceramic sheet. For example, the resistor substrate layer includes a ceramic sheet and a resistor layer 1212 set on the ceramic sheet. The resistor layer 1212 is formed by coating a resistor paste on the ceramic sheet. The insulating substrate layer and the insulator 1220 are both made of ceramic sheets. The conductor 1230 includes a ceramic sheet and a first metal conductive layer 1211. The first metal conductive layer 1211 is formed by coating a conductive paste on the ceramic sheet. In order to improve the conductive performance, the first metal conductive layer 1211 is set on the surface of the ceramic sheet away from the insulator 1220 and on the peripheral side of the ceramic sheet. The conductive layer 1211 on the peripheral side of the resistor substrate layer is also formed by coating a conductive paste. The conductive paste can be one of gold, silver, copper, molybdenum, tungsten, platinum, palladium, etc. or an alloy composed of at least two materials.

[0041] Furthermore, the resistance layer 1212 is arranged on a side of the resistor 1210 close to the insulator 1220 . The insulator 1220 is arranged to insulate the resistor 1210 from the conductor 1230 . The protector 1240 can protect the resistor 1212 from the side facing away from the insulator 1220 .

[0042] The above-mentioned conductive connector 1300 can be a lead or a metal column (such as a copper column). At the same time, in order to ensure the conductive effect, the conductive connector 1300 includes a lead and a second metal conductive layer 1211 or a metal column and a second metal conductive layer 1211. The second metal conductive layer 1211 is arranged in the air flow hole 1250 and is electrically connected to the lead or the metal column. The second metal conductive layer 1211 is also formed by coating a conductive paste.

[0043] The thickness of the resistor substrate layer ranges from 10um to 300um, which can improve the capacity utilization while ensuring the heating effect.

[0044] In one embodiment, a first lead 1400 and a second lead 1500 are further included. The first lead 1400 is electrically connected to the conductive layer 1211 , and the second lead 1500 is electrically connected to the conductor 1230 , so as to realize the electrical connection between the resistor 1210 and the power supply.

[0045] In order to electrically connect the first lead 1400 and the second lead 1500 to the power supply, two mounting holes are provided on the heat pipe 1100 in a direction perpendicular to the direction from the first end 1110 to the second end 1120. The first lead 1400 and the second lead 1500 pass through the mounting holes respectively and are connected to the heating circuit.

[0046] Accordingly, reference Figure 7 and 8The present application also provides an atomizing device, including a housing assembly 3000, the above-mentioned airflow heating structure 1000 for the atomizing device, and a heat insulation tube 4000. The housing assembly 3000 has an installation cavity 1130. The heat conduction tube 1100 is arranged in the installation cavity 1130 and sleeved on the outside of the airflow heating structure 1000 for the atomizing device to block the heat conduction generated by the airflow heating structure 1000. The atomizing device also includes a power supply and a control component, which are arranged in the housing assembly 3000. The power supply is used to provide the airflow heating structure 1000 with the power required for operation, and the control component is used to control and adjust the power of the power supply to achieve the adjustment and control of different temperatures in the airflow heating structure 1000.

[0047] The above specific examples are used to illustrate the present application, which is only used to help understand the present application and is not intended to limit the present application. For technicians in the technical field to which the present application belongs, they can also make some simple deductions, deformations or substitutions based on the ideas of the present application.

Claims

1. An airflow heating structure for an atomizing device, characterized in that: include: A heating element, the heating element comprising a resistor, an insulator and a conductor stacked in sequence, a conductive layer being arranged around the resistor, the conductive layer and the conductor being respectively used to be electrically connected to a power source, the heating element having a plurality of air flow holes, the air flow holes penetrating the resistor, the insulator and the conductor; and a conductive connector, wherein two ends of the conductive connector are respectively used to electrically connect to the resistor and the conductor.

2. The airflow heating structure for an atomizing device according to claim 1, characterized in that: It also includes a heat-conducting tube, which has a first end and a second end arranged opposite to each other, the first end is used for inserting the aerosol-forming matrix, the space inside the heat-conducting tube forms an installation cavity, the installation cavity is used to install the aerosol-forming matrix, and the heating element is arranged at the second end.

3. The airflow heating structure for an atomizing device according to claim 1, characterized in that: One end of the conductive connector extends from any one of the air flow holes to be electrically connected to the resistor, and the other end extends to be electrically connected to the conductor.

4. The airflow heating structure for an atomizing device according to claim 1 or 3, characterized in that: One end of the conductive connecting body extends from the centrally located air flow hole to be electrically connected to the resistor, and the other end extends to be electrically connected to the conductor.

5. The airflow heating structure for an atomizing device according to claim 2, characterized in that: The resistor, the insulator, and the conductor are stacked in sequence from the second end to the first end.

6. The airflow heating structure for an atomizing device according to claim 1, characterized in that: It also includes a protection body, which is arranged on a side of the resistor body facing away from the insulator.

7. The airflow heating structure for an atomizing device according to claim 2, characterized in that: The resistor body includes a plurality of resistor substrate layers, the plurality of resistor substrate layers are stacked in parallel with a direction from the first end to the second end, and the conductive layer is disposed on the peripheral sides of the plurality of resistor substrate layers.

8. The airflow heating structure for an atomizing device according to claim 7, characterized in that: The resistor body further comprises a plurality of insulating substrate layers, wherein each insulating substrate layer is arranged between two adjacent resistor substrate layers, so that the two adjacent resistor substrate layers are insulated from each other.

9. The airflow heating structure for an atomizing device according to claim 1, characterized in that: It also includes a first lead and a second lead, wherein the first lead is electrically connected to the conductive layer, and the second lead is electrically connected to the conductor, for realizing electrical connection between the resistor and the power supply.

10. An atomizing device, characterized in that: include: A housing assembly having a mounting cavity; The airflow heating structure for an atomizing device according to any one of claims 1 to 9, wherein the heat conducting pipe is arranged in the mounting cavity; and a heat-insulating tube, which is sleeved on the outside of the airflow heating structure for the atomizing device and is used to block the heat conduction generated by the airflow heating structure.

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