Monocrystalline silicon wafer cleaning machine with controllable spraying pressure

Abstract

The utility model relates to a monocrystalline silicon wafer cleaning machine with controllable spraying pressure, which aims to solve the technical problem that the existing monocrystalline silicon wafer cleaning machine is poor in spraying and washing effect on monocrystalline silicon, and comprises a cleaning box for cleaning monocrystalline silicon wafers, and water conveying pipes are symmetrically arranged on two sides in the cleaning box. Corresponding spraying heads are arranged on the opposite sides of the two sets of water conveying pipes, pressure adjusting valves are arranged on the spraying heads, a water pump is arranged at the bottom of the cleaning box, the output end of the water pump communicates with the input ends of the water conveying pipes through guide pipes, and a conveying structure is arranged on the top of the cleaning box and arranged on the top edge of the cleaning box in a sleeving mode. A plurality of clamping structures are arranged on the conveying structure at equal intervals, each clamping structure comprises a clamping frame and a connecting rod, the top ends of the connecting rods are fixedly arranged on the conveying structure, the clamping frames are arranged at the bottom ends of the connecting rods, and the monocrystalline silicon wafer cleaning device can clean monocrystalline silicon wafers more thoroughly and is better in cleaning effect.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon wafer cleaning, in particular to a single crystal silicon wafer cleaning machine with controllable spray pressure. Background Art

[0002] Monocrystalline silicon wafer: A single crystal of silicon is a crystal with a basically complete lattice structure. It has different properties in different directions and is a good semiconductor material with a purity requirement of 99.9999% or even above 99.9999999%. It is used to manufacture semiconductor devices, solar cells, etc. It is made of high-purity polycrystalline silicon in a single crystal furnace. During the production and preparation process, monocrystalline silicon wafers need to be cleaned and degummed, and a monocrystalline silicon wafer cleaning machine is needed at this time.

[0003] The existing single crystal silicon wafer cleaning machine mainly drives the single crystal silicon wafer on the clamping frame to move through the transmission structure, and sprays and rinses the single crystal silicon wafer through the spray head during the displacement process. During this process, the single crystal silicon wafer is usually fixed, so the angle and position of the spray head for spraying and rinsing the single crystal silicon are relatively fixed, which has a poor cleaning effect on the single crystal silicon wafer and is prone to incomplete cleaning. In view of this, we propose a single crystal silicon wafer cleaning machine with controllable spray pressure. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art, meet actual needs, and provide a single crystal silicon wafer cleaning machine with controllable spray pressure to solve the technical problem that the current single crystal silicon wafer cleaning machine has poor spray flushing effect on single crystal silicon.

[0005] In order to achieve the purpose of the utility model, the technical solution adopted by the utility model is as follows: a single crystal silicon wafer cleaning machine with controllable spray pressure is designed, including a cleaning box for cleaning single crystal silicon wafers, water pipes are symmetrically arranged on both sides of the cleaning box, and corresponding spray heads are arranged on opposite sides of the two groups of water pipes, and pressure regulating valves are arranged on the spray heads, a water pump is arranged at the bottom of the cleaning box, and the output end of the water pump is connected with the input end of the water pipe through a conduit, a conveying structure is arranged at the top of the cleaning box, and the conveying structure is sleeved on the top edge of the cleaning box, and a plurality of groups of clamping structures are equidistantly arranged on the conveying structure, and the clamping structure includes a clamping frame and a connecting rod, the top end of the connecting rod is fixedly arranged on the conveying structure, and the clamping frame is arranged at the bottom end of the connecting rod;

[0006] The two groups of sprinkler heads on the water pipes are arranged in an offset manner and tilted opposite to each other, and the clamping frame is rotatably connected to the bottom end of the connecting rod through a bearing;

[0007] A push-up structure is arranged on the clamping structure, and a wedge block corresponding to the push-up structure is arranged on the inner top of the outlet end of the cleaning box.

[0008] Preferably, the pushing structure includes a pushing plate, which is arranged inside the clamping frame, a ring is arranged on the top of the pushing plate through a mounting rod, and the ring is sleeved on the connecting rod, two groups of second springs are symmetrically arranged between the bottom of the ring and the top of the clamping frame, a mounting ring is rotatably arranged on the top of the ring through a bearing, and two groups of pushing rods are symmetrically arranged on the top of the mounting ring.

[0009] Preferably, a positioning rod is arranged at the top end of the pushing rod facing one side of the connecting rod, a positioning groove corresponding to the positioning rod is arranged on the connecting rod, and one end of the positioning rod is located in the positioning groove.

[0010] Preferably, the top end of the push rod is arranged with an inclined surface corresponding to the wedge block, and the inclined surface of the wedge block and the push rod are symmetrically provided with a limiting groove.

[0011] Preferably, clamping plates are arranged on both sides of the clamping frame via a first spring, and clamping grooves are provided on opposite sides of the two groups of clamping plates.

[0012] Preferably, a mounting block is arranged at the bottom end of the clamping groove, and the top surface of the mounting block is arranged to be inclined downward, and the bottom surface of the mounting block is arranged to be inclined upward.

[0013] Preferably, limiting rods are arranged through both sides of the clamping frame, and one end of the limiting rod is fixedly connected to the clamping plate, and the first spring is sleeved on the limiting rod.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. In the utility model, the spray heads on the two groups of water pipes are arranged in a staggered manner and are tilted opposite to each other, and the clamping frame in the clamping structure is rotatably installed at the bottom end of the connecting rod. Therefore, in the process of the transmission structure driving the clamping frame to move inside the cleaning box, the clamping frame is rotated by the inclined flushing force of the spray heads on the two groups of water pipes, thereby realizing the rotational flushing of the single crystal silicon wafer in the clamping frame. Therefore, the utility model can clean the single crystal silicon wafer more thoroughly and achieve a better cleaning effect.

[0016] 2. A pushing structure is arranged on the clamping structure of the utility model, and a wedge block is arranged in the cleaning box. Therefore, when the conveying structure drives the clamping structure to move to the outlet end of the cleaning box, the inclined surface of the wedge block will squeeze and guide the pushing structure, thereby causing the pushing structure to move downward. Therefore, the cleaned single crystal silicon wafer can be directly pushed out from the clamping frame and fall off, thereby achieving the effect of automatic unloading and improving the convenience of using the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the water pipe layout of the utility model;

[0020] Figure 4 It is a schematic diagram of a wedge block of the utility model;

[0021] Figure 5 It is a schematic diagram of the clamping structure of the utility model.

[0022] In the figure: 1, cleaning box; 2, water pump; 3, water pipe; 301, sprinkler head; 302, pressure regulating valve; 4, transmission structure; 5, clamping structure; 6, wedge block; 601, limit groove; 7, clamping frame; 701, first spring; 702, clamping plate; 703, clamping groove; 704, limit rod; 705, mounting block; 8, connecting rod; 801, positioning groove; 9, jacking structure; 901, jacking plate; 902, mounting rod; 903, collar; 904, second spring; 905, mounting ring; 906, jacking rod; 907, positioning rod. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0024] In the embodiment: a single crystal silicon wafer cleaning machine with controllable spray pressure, see Figures 1 to 5 , comprising a cleaning box 1 for cleaning a single crystal silicon wafer, water pipes 3 are symmetrically arranged on both sides of the cleaning box 1, and corresponding spray heads 301 are arranged on opposite sides of the two groups of water pipes 3, and a pressure regulating valve 302 is arranged on the spray head 301, a water pump 2 is arranged at the bottom of the cleaning box 1, and the output end of the water pump 2 is connected to the input end of the water pipe 3 through a conduit, a conveying structure 4 is arranged on the top of the cleaning box 1, and the conveying structure 4 is sleeved on the top edge of the cleaning box 1, and a plurality of groups of clamping structures 5 are equidistantly arranged on the conveying structure 4, and the clamping structure 5 includes a clamping frame 7 and a connecting rod 8, the top end of the connecting rod 8 is fixedly arranged on the conveying structure 4, and the clamping frame 7 is arranged on the connecting rod 8. At the bottom end of the connecting rod 8, when cleaning the single crystal silicon wafer, the single crystal silicon wafer is clamped on the clamping frame 7, and then the conveying structure 4 is controlled to drive the clamping frame 7 to rotate. At the same time, the water pump 2 is controlled to convey water to the water pipe 3, and then the water source is sprayed out through the spray head 301. The water pressure can be adjusted through the spray head 301 to control the spray water pressure of the spray head 301, thereby controlling the pressure of spray cleaning of the single crystal silicon wafer. When the conveying structure 4 drives the clamping frame 7 to enter from the inlet end of the cleaning box 1 and then discharge from the outlet end of the cleaning box 1, the spray head 301 sprays water to the single crystal silicon wafer on the clamping frame 7, thereby completing the cleaning of the single crystal silicon wafer.

[0025] Specifically, clamping plates 702 are arranged on both sides of the clamping frame 7 through the first spring 701, and clamping grooves 703 are opened on opposite sides of the two groups of clamping plates 702. When clamping and fixing the single crystal silicon wafer, the single crystal silicon wafer is directly inserted between the clamping plates 702 on both sides of the clamping frame 7, and then with the cooperation of the first spring 701, the clamping grooves 703 of the two groups of clamping plates 702 are pushed to clamp and fix the single crystal silicon wafer.

[0026] Furthermore, a mounting block 705 is arranged at the bottom end of the clamping groove 703, and the top surface of the mounting block 705 is tilted downward, and the bottom surface of the mounting block 705 is tilted upward. The bottom tilted surface of the mounting block 705 facilitates the guiding of the single crystal silicon wafer clamp to be inserted between the two sets of clamping plates 702, and the top tilted surface of the mounting block 705 facilitates the guiding and discharge of the single crystal silicon wafer clamp after tilting.

[0027] Furthermore, a limiting rod 704 is arranged on both sides of the clamping frame 7, and one end of the limiting rod 704 is fixedly connected to the clamping plate 702, the first spring 701 is sleeved on the limiting rod 704, and the limiting rod 704 is used to limit the clamping plate 702.

[0028] In a specific embodiment, the spray heads 301 on the two groups of water pipes 3 are arranged in a staggered manner so as to be tilted in opposite directions. The clamping frame 7 is rotatably connected to the bottom end of the connecting rod 8 through a bearing. When the conveying structure 4 drives the clamping frame 7 to move inside the cleaning box 1, the clamping frame 7 is rotated by the tilted flushing force of the spray heads 301 on the two groups of water pipes 3, thereby realizing rotational flushing of the single crystal silicon wafers in the clamping frame 7, and the cleaning of the single crystal silicon wafers is more thorough and the cleaning effect is better.

[0029] In the utility model, a pushing structure 9 is arranged on the clamping structure 5, and a wedge block 6 corresponding to the pushing structure 9 is arranged on the inner top of the outlet end of the cleaning box 1. When the conveying structure 4 drives the clamping structure 5 to move to the outlet end of the cleaning box 1, the inclined surface of the wedge block 6 will squeeze and guide the pushing structure 9, so that the pushing structure 9 moves downward. Therefore, the cleaned single crystal silicon wafer can be directly ejected from the clamping frame 7 to make it fall off, thereby achieving the effect of automatic unloading and improving the convenience of using the device.

[0030] Specifically, the push structure 9 includes a push plate 901, which is arranged inside the clamping frame 7. A collar 903 is arranged on the top of the push plate 901 through a mounting rod 902. The collar 903 is sleeved on the connecting rod 8. Two groups of second springs 904 are symmetrically arranged between the bottom of the collar 903 and the top of the clamping frame 7. A mounting ring 905 is rotatably arranged on the top of the collar 903 through a bearing, and two groups of push rods 906 are symmetrically arranged on the top of the mounting ring 905. The push plate 901, the mounting rod 902 and the collar 903 form a frame structure. The frame structure is The second spring 904 is fixed on the clamping frame 7, and the ejector plate 901 will fit the bottom of the clamping frame 7, and the frame structure will rotate with the clamping frame 7. The ejector rod 906 can be positioned under the action of the mounting ring 905. When the clamping structure 5 moves to the wedge block 6, the inclined surface of the wedge block 6 will squeeze the ejector rod 906 downward, so that the ejector rod 906 drives the frame structure to move downward. At this time, the second spring 904 is in a compressed state, and then the ejector plate 901 will eject the cleaned single crystal silicon wafer in the clamping frame 7.

[0031] Furthermore, a positioning rod 907 is arranged at the top end of the pushing rod 906 facing the connecting rod 8, and a positioning groove 801 corresponding to the positioning rod 907 is arranged on the connecting rod 8, and one end of the positioning rod 907 is located in the positioning groove 801. With the cooperation of the positioning rod 907 and the positioning groove 801, the pushing rod 906 is ensured to be in a fixed state and will not rotate with the clamping frame 7. Therefore, it can be ensured that the inclined surface of the wedge block 6 can stably squeeze the pushing rod 906.

[0032] Furthermore, an inclined surface corresponding to the wedge block 6 is arranged at the top of the pushing rod 906, and a limiting groove 601 is symmetrically provided on the inclined surface of the wedge block 6 and the pushing rod 906. The inclined surface of the pushing rod 906 is convenient for cooperating with the inclination of the wedge block 6 to perform pressurization, and can more stably and smoothly squeeze the pushing rod 906 downward, and the limiting groove 601 is also used to ensure that the pushing rod 906 can stably descend along the inclined surface of the wedge block 6; the utility model solves the technical problem of poor spraying and flushing effect of single crystal silicon by the current single crystal silicon wafer cleaning machine through the cooperation of the oppositely inclined staggered spray heads 301 on the two groups of water pipes 3 and the rotatable clamping frame 7.

[0033] Working principle: When cleaning the single crystal silicon wafer, first, clamp the single crystal silicon wafer onto the clamping frame 7, then control the conveying structure 4 to drive the clamping frame 7 to rotate, and at the same time control the water pump 2 to convey the water source to the water pipe 3, and then the water source is sprayed out through the spray head 301, and the water pressure can be adjusted through the spray head 301 to control the spray water pressure of the spray head 301, thereby controlling the pressure of spray cleaning of the single crystal silicon wafer. When the conveying structure 4 drives the clamping frame 7 to enter from the inlet end of the cleaning box 1 and then discharge from the outlet end of the cleaning box 1, the spray head 301 sprays the water source to the single crystal silicon wafer on the clamping frame 7, thereby completing the cleaning of the single crystal silicon wafer;

[0034] Secondly, when the conveying structure 4 drives the clamping frame 7 to move inside the cleaning box 1, the clamping frame 7 is rotated by the inclined flushing force of the spray heads 301 on the two groups of water pipes 3, thereby realizing the rotation flushing of the single crystal silicon wafers in the clamping frame 7, and the cleaning of the single crystal silicon wafers is more thorough and the cleaning effect is better;

[0035] Finally, when the conveying structure 4 drives the clamping structure 5 to move to the outlet end of the cleaning box 1, the inclined surface of the wedge block 6 will squeeze and guide the pushing structure 9, thereby causing the pushing structure 9 to move downward. Therefore, the cleaned single crystal silicon wafer can be directly ejected from the clamping frame 7 and fall off, thereby achieving the effect of automatic unloading and improving the convenience of using the device.

[0036] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A single crystal silicon wafer cleaning machine with controllable spray pressure, characterized in that: The invention comprises a cleaning box (1) for cleaning single crystal silicon wafers, wherein water pipes (3) are symmetrically arranged on both sides of the cleaning box (1), and corresponding spray heads (301) are arranged on opposite sides of the two groups of water pipes (3), and a pressure regulating valve (302) is arranged on the spray head (301), a water pump (2) is arranged at the bottom of the cleaning box (1), and the output end of the water pump (2) is connected to the input end of the water pipe (3) through a conduit, a conveying structure (4) is arranged at the top of the cleaning box (1), and the conveying structure (4) is sleeved on the top edge of the cleaning box (1), and a plurality of groups of clamping structures (5) are equidistantly arranged on the conveying structure (4), and the clamping structure (5) comprises a clamping frame (7) and a connecting rod (8), the top end of the connecting rod (8) is fixedly arranged on the conveying structure (4), and the clamping frame (7) is arranged at the bottom end of the connecting rod (8); The spray heads (301) on the two groups of water pipes (3) are arranged in a staggered manner and tilted in opposite directions, and the clamping frame (7) is rotatably connected to the bottom end of the connecting rod (8) via a bearing; A push-up structure (9) is arranged on the clamping structure (5), and a wedge block (6) corresponding to the push-up structure (9) is arranged on the inner top of the outlet end of the cleaning box (1).

2. A single crystal silicon wafer cleaning machine with controllable spray pressure as claimed in claim 1, characterized in that: The pushing structure (9) comprises a pushing plate (901), wherein the pushing plate (901) is arranged inside the clamping frame (7), a collar (903) is arranged on the top of the pushing plate (901) via a mounting rod (902), and the collar (903) is sleeved on a connecting rod (8), two groups of second springs (904) are symmetrically arranged between the bottom of the collar (903) and the top of the clamping frame (7), a mounting ring (905) is rotatably arranged on the top of the collar (903) via a bearing, and two groups of pushing rods (906) are symmetrically arranged on the top of the mounting ring (905).

3. A single crystal silicon wafer cleaning machine with controllable spray pressure as claimed in claim 2, characterized in that: A positioning rod (907) is arranged at the top end of the push rod (906) facing one side of the connecting rod (8), a positioning groove (801) corresponding to the positioning rod (907) is arranged on the connecting rod (8), and one end of the positioning rod (907) is located in the positioning groove (801).

4. A single crystal silicon wafer cleaning machine with controllable spray pressure as claimed in claim 2, characterized in that: The top end of the push rod (906) is provided with an inclined surface corresponding to the wedge block (6), and the inclined surface of the wedge block (6) and the push rod (906) are symmetrically provided with a limiting groove (601).

5. The single crystal silicon wafer cleaning machine with controllable spray pressure as claimed in claim 1, characterized in that: Clamping plates (702) are arranged on both sides of the clamping frame (7) via a first spring (701), and clamping grooves (703) are provided on opposite sides of the two groups of clamping plates (702).

6. A single crystal silicon wafer cleaning machine with controllable spray pressure as claimed in claim 5, characterized in that: A mounting block (705) is arranged at the bottom end of the clamping groove (703), and the top surface of the mounting block (705) is arranged to be inclined downward, and the bottom surface of the mounting block (705) is arranged to be inclined upward.

7. The single crystal silicon wafer cleaning machine with controllable spray pressure as claimed in claim 5, characterized in that: Limiting rods (704) are arranged through both sides of the clamping frame (7), and one end of the limiting rod (704) is fixedly connected to the clamping plate (702), and the first spring (701) is sleeved on the limiting rod (704).

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