Electronic chip wafer grinding device

Abstract

An electronic chip wafer grinding device comprises a machining table, a grinding groove is formed in the top of the machining table, a filter plate is installed in the grinding groove, a grinding piece is arranged above the filter plate, an equipment top plate is welded to the upper portion of the machining table through a support, a rotary disc is installed at the bottom of the equipment top plate, and a grinding motor is arranged above the rotary disc. The grinding motor is fixedly installed on the equipment top plate through bolts, a lifting air cylinder is installed below the rotating disc, the telescopic end of the lifting air cylinder is fixedly connected with a wafer suction cup, and the axis where the telescopic end of the lifting air cylinder is located is staggered with the vertical center line of the rotating disc. A wafer is adsorbed to the bottom of the wafer suction cup through the wafer suction cup and extends into the grinding groove through the lifting air cylinder to make contact with the grinding piece, the wafer is driven by the rotary disc to do circular motion along the vertical center line of the grinding piece, and grinding work of the wafer is achieved. And the wafer can be taken only by separating the wafer from the wafer sucking disc, so that the operation is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer grinding, in particular to an electronic chip wafer grinding device. Background Art

[0002] Wafer grinding is the process of grinding the surface of silicon wafers with abrasives of different particle sizes and hardness to remove surface defects and smooth the surface. In the process of semiconductor chip manufacturing, wafer grinding is widely used in various fields. It aims to improve the performance and reliability of semiconductor chips by removing defects on the surface of silicon wafers and smoothing the surface.

[0003] The patent specification with announcement number CN219882037U discloses an electronic chip wafer grinding device, including a base body, a grinding mechanism is fixedly connected to the upper end face of the base body on the rear side, the base body includes a base shell, a placement hole is opened in the middle of the rear side of the interior of the base shell, and a grinding box is movably connected to the upper end face of the placement hole, which is lowered to the inside of the grinding box through an electric telescopic rod, and the motor is started to rotate the electric telescopic rod so that the grinding head grinds the electronic chip wafer.

[0004] However, in the implementation of relevant technologies, it was found that the electronic chip wafer grinding device of the above-mentioned design has the following problems: in order to prevent the grinding liquid from being accurately poured into the wafer surface, the wafer is placed in a groove-shaped grinding box for grinding, but it is inconvenient to put the wafer into the deeper grinding box, and the wafer and the bottom of the grinding box are close to each other, which is inconvenient to take. In view of this, an electronic chip wafer grinding device is provided to overcome the above-mentioned defects. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes an electronic chip wafer grinding device.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an electronic chip wafer grinding device, comprising a processing table, a grinding groove is opened on the top of the processing table, and a filter plate is installed inside the grinding groove, a grinding sheet is arranged above the filter plate, an equipment top plate is welded above the processing table through a bracket, the grinding sheet is placed inside the grinding groove, the grinding groove is used to place grinding liquid, and the wafer surface can be ground after contacting the grinding sheet, a turntable is installed at the bottom of the equipment top plate, and a grinding motor is arranged above the turntable, and the grinding motor is fixed by bolts The turntable is fixedly installed on the top plate of the equipment, and a lifting cylinder is installed under the turntable, and the telescopic end of the lifting cylinder is fixedly connected to the wafer suction cup, and the axis of the telescopic end of the lifting cylinder is intersected with the vertical center line of the turntable. The wafer is adsorbed on the bottom of the wafer suction cup through the wafer suction cup, and extends into the grinding groove through the lifting cylinder to contact the grinding sheet in the grinding groove. Driven by the turntable, the wafer makes a circular motion along the vertical center line of the grinding sheet, thereby realizing the grinding of the wafer. Since the wafer is not directly placed in the grinding groove, you only need to separate the wafer and the wafer suction cup from each other when taking it.

[0007] As a further description of the above technical solution: a guide groove is provided on the inner wall of the grinding groove, and a cleaning rod is installed inside the guide groove, and the guide groove is used to limit the moving cleaning rod.

[0008] As a further description of the above technical solution: a cleaning brush is fixedly provided at the bottom of the cleaning rod, and a scraper is installed on one side of the cleaning brush. When the cleaning rod moves, it can drive the cleaning brush to move and remove impurities remaining on the grinding sheet.

[0009] As a further description of the above technical solution: the scraper and the grinding sheet are perpendicular to each other, and the bottom of the scraper is made of rubber material, and the scraper can scrape the grinding liquid on the grinding sheet onto the filter plate.

[0010] As a further description of the above technical solution: sliding parts are fixedly installed at both the front and rear ends of the cleaning rod, and a sliding screw is installed inside the sliding part through a screw nut. The sliding part can move on the sliding screw through the screw nut, thereby moving the cleaning rod.

[0011] As a further description of the above technical solution: one end of the sliding screw is connected to the output end of the screw motor, and the screw motor is fixedly installed on the right side of the processing table by bolts. The screw motor can drive the sliding screw to rotate, thereby moving the sliding part.

[0012] As a further description of the above technical solution: a circulation pipe is connected to one side of the grinding tank, and the end of the circulation pipe is connected to a grinding liquid storage box through a circulation pump, the output end of the grinding liquid storage box is connected to a grinding liquid nozzle, and one end of the circulation pipe connected to the grinding tank is located below the filter plate. The filtered grinding liquid can re-enter the grinding liquid storage box through the circulation pipe for recycling.

[0013] The utility model has the following beneficial effects:

[0014] The utility model designs an electronic chip wafer grinding device, which can adsorb the wafer to the bottom of the wafer suction cup by arranging the wafer suction cup, and drive the wafer to extend into the grinding groove by the lifting cylinder. The wafer moves in a circle along the vertical center line of the grinding sheet driven by the turntable, thereby contacting the grinding sheet in the grinding groove to realize the grinding of the wafer. Since the wafer is not directly placed in the grinding groove, it only needs to separate the wafer and the wafer suction cup from each other when taking it out, which is more convenient to operate.

[0015] The utility model discloses an electronic chip wafer grinding device. A cleaning rod which moves left and right is arranged in a grinding tank, so that impurities on the grinding sheet can be cleaned. Meanwhile, the grinding liquid in the grinding tank can be filtered by a filter plate and then re-enter the grinding liquid storage box through a circulation pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the turntable of the utility model;

[0018] Figure 3 This is a schematic diagram of the installation structure of the sliding member of the utility model;

[0019] Figure 4 for Figure 1 Enlarged view of point A in the middle.

[0020] Legend:

[0021] 1. Processing table; 2. Equipment top plate; 3. Grinding disc; 4. Screw motor; 5. Grinding tank; 6. Filter plate; 7. Guide groove; 8. Wafer suction cup; 9. Circulation pipe; 10. Grinding liquid storage box; 11. Cleaning rod; 12. Cleaning brush; 13. Scraper; 14. Grinding motor; 15. Turntable; 16. Lifting cylinder; 17. Sliding part; 18. Sliding screw. DETAILED DESCRIPTION

[0022] Reference Figure 1-4The utility model provides an electronic chip wafer grinding device: comprising a processing table 1, a grinding groove 5 is provided on the top of the processing table 1, and a filter plate 6 is installed inside the grinding groove 5, a grinding sheet 3 is arranged above the filter plate 6, a device top plate 2 is welded above the processing table 1 through a bracket, the grinding sheet 3 is placed inside the grinding groove 5, the grinding groove 5 is used to place the grinding liquid, and the wafer surface can be ground after contacting the grinding sheet 3, a turntable 15 is installed at the bottom of the device top plate 2, and a grinding motor 14 is arranged above the turntable 15, and the grinding motor 14 is fixedly installed on the device top plate 2 by bolts, and the turntable 15 is provided with a grinding motor 14. The grinding motor 14 is fixedly installed on the device top plate 2 by bolts. A lifting cylinder 16 is installed below the disk 15, and the telescopic end of the lifting cylinder 16 is fixedly connected to the wafer suction cup 8. The axis of the telescopic end of the lifting cylinder 16 is intersected with the vertical center line of the turntable 15. The wafer is adsorbed on the bottom of the wafer suction cup 8 through the wafer suction cup 8, and extends into the grinding groove 5 through the lifting cylinder 16 to contact the grinding sheet 3 in the grinding groove 5. Driven by the turntable 15, the wafer makes a circular motion along the vertical center line of the grinding sheet 3, thereby realizing the grinding of the wafer. Since the wafer is not directly placed in the grinding groove 5, it is only necessary to separate the wafer and the wafer suction cup 8 from each other when taking it.

[0023] During the specific implementation, the wafer is adsorbed on the bottom of the wafer suction cup 8, and the lifting cylinder 16 is started to drive the wafer into the grinding groove 5, and then the grinding motor 14 is started, and the turntable 15 at the output end of the grinding motor 14 rotates, so that the wafer is driven by the turntable 15 to make a circular motion along the vertical center line of the grinding sheet 3 and contact the grinding sheet 3 in the grinding groove 5 to achieve the grinding of the wafer. Since the wafer is not directly placed in the grinding groove 5, it only needs to separate the wafer and the wafer suction cup 8 from each other when taking it.

[0024] As a further implementation scheme of the above technical scheme: a guide groove 7 is opened on the inner wall of the grinding groove 5, and a cleaning rod 11 is installed inside the guide groove 7, and the guide groove 7 is used to limit the moving cleaning rod 11.

[0025] As a further implementation scheme of the above technical scheme: a cleaning brush 12 is fixedly provided at the bottom of the cleaning rod 11, and a scraper 13 is installed on one side of the cleaning brush 12. When the cleaning rod 11 moves, it can drive the cleaning brush 12 to move and remove impurities remaining on the grinding sheet 3.

[0026] As a further implementation scheme of the above technical scheme: the scraper 13 and the grinding sheet 3 are perpendicular to each other, and the bottom of the scraper 13 is made of rubber material, and the scraper 13 can scrape the grinding liquid on the grinding sheet 3 onto the filter plate 6.

[0027] As a further implementation scheme of the above technical scheme: sliding members 17 are fixedly installed at both the front and rear ends of the cleaning rod 11, and a sliding screw 18 is installed inside the sliding member 17 through a screw nut. The sliding member 17 can move on the sliding screw 18 through the screw nut, thereby moving the cleaning rod 11.

[0028] As a further implementation scheme of the above technical scheme: one end of the sliding screw 18 is connected to the output end of the screw motor 4, and the screw motor 4 is fixedly installed on the right side of the processing table 1 by bolts. The screw motor 4 can drive the sliding screw 18 to rotate, thereby moving the sliding member 17.

[0029] During specific implementation, after the wafer is ground, the wafer rises and moves away from the grinding groove 5, and the screw motor 4 is started. The transmission shaft of the screw motor 4 drives the sliding screw 18 to rotate, and the sliding member 17 slides under the action of the screw nut, thereby moving the cleaning rod 11. When the cleaning rod 11 moves, it can drive the cleaning brush 12 to move, and the impurities remaining on the grinding sheet 3 are removed. The scraper 13 on the left then scrapes the grinding liquid on the grinding sheet 3 onto the filter plate 6. After cleaning, the cleaning rod 11 is reset, and the cleaning brush 12 approaches the grinding sheet 3 first during each cleaning.

[0030] As a further implementation scheme of the above technical scheme: a circulation pipe 9 is connected to one side of the grinding tank 5, and the end of the circulation pipe 9 is connected to the grinding liquid storage tank 10 through a circulation pump, and the output end of the grinding liquid storage tank 10 is connected to a grinding liquid nozzle, and the end of the circulation pipe 9 connected to the grinding tank 5 is located below the filter plate 6, and the filtered grinding liquid can re-enter the grinding liquid storage tank 10 through the circulation pipe 9 for recycling.

[0031] During specific implementation, the circulation pump is started to scrape the grinding liquid onto the filter plate 6, and then enters the grinding liquid storage box 10 through the circulation pipe 9 after being filtered by the filter plate 6. The grinding liquid in the grinding liquid storage box 10 can be sprayed into the grinding tank 5 through the grinding liquid nozzle.

[0032] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An electronic chip wafer grinding device, comprising a processing table (1), a grinding groove (5) is provided on the top of the processing table (1), a filter plate (6) is installed inside the grinding groove (5), a grinding sheet (3) is arranged above the filter plate (6), and a device top plate (2) is welded above the processing table (1) through a bracket, characterized in that: A turntable (15) is installed at the bottom of the top plate (2) of the device, and a grinding motor (14) is arranged above the turntable (15). The grinding motor (14) is fixedly installed on the top plate (2) of the device by bolts. A lifting cylinder (16) is installed below the turntable (15), and the telescopic end of the lifting cylinder (16) is fixedly connected to a wafer suction cup (8). The axis of the telescopic end of the lifting cylinder (16) is staggered with the vertical center line of the turntable (15).

2. The electronic chip wafer grinding device according to claim 1, characterized in that: The inner wall of the grinding groove (5) is provided with a guide groove (7), and a cleaning rod (11) is installed inside the guide groove (7).

3. The electronic chip wafer grinding device according to claim 2, characterized in that: A cleaning brush (12) is fixedly provided at the bottom of the cleaning rod (11), and a scraper (13) is installed on one side of the cleaning brush (12).

4. The electronic chip wafer grinding device according to claim 3, characterized in that: The scraper (13) and the grinding sheet (3) are perpendicular to each other, and the bottom of the scraper (13) is made of rubber.

5. The electronic chip wafer grinding device according to claim 4, characterized in that: Sliding members (17) are fixedly mounted on both the front and rear ends of the cleaning rod (11), and a sliding screw (18) is mounted inside the sliding member (17) via a screw nut.

6. The electronic chip wafer grinding device according to claim 5, characterized in that: One end of the sliding screw (18) is connected to the output end of the screw motor (4), and the screw motor (4) is fixedly mounted on the right side of the processing table (1) by means of bolts.

7. The electronic chip wafer grinding device according to claim 1, characterized in that: A circulation pipe (9) is connected to one side of the grinding tank (5), and the end of the circulation pipe (9) is connected to a grinding liquid storage box (10) via a circulation pump, and the output end of the grinding liquid storage box (10) is connected to a grinding liquid nozzle, and one end of the circulation pipe (9) connected to the grinding tank (5) is located below the filter plate (6).

Images