Semiconductor device storage pipe transfer system

Abstract

The utility model provides a semiconductor device storage pipe transfer system which comprises a bottom plate, and a discharging pipe is arranged at the upper end of the bottom plate. A pair of limiting plates are arranged at the upper end and the lower end of the top face of the bottom plate, sliding grooves perpendicular to the top face of the bottom plate are formed in the opposite sides of the two limiting plates, a through hole is formed in the bottom of the limiting plate at the upper end of the bottom plate, a jacking device is arranged on the outer side of the limiting plate at the lower end of the bottom plate, a jacking rod of the jacking device is aligned to the through hole, and a jacking block is arranged at the front end of the jacking rod. A pushing rod is arranged on one side of the top face of the bottom plate, a rotating plate is hinged to the front end of the pushing rod, and the bottom face of the rotating plate is in sliding contact with the top face of the bottom plate. When the rotating plate moves to the position below the sliding groove, the material storage pipe making contact with the top face of the rotating plate is aligned with the through hole. The top face of the rotating plate is lower than the top face of the material pushing rod, and the height difference between the top face of the rotating plate and the top face of the material pushing rod is smaller than or equal to the thickness of a single material storage pipe. According to the scheme, the material storage pipe in butt joint with the discharging pipe can be automatically replaced, the material storage pipe containing the semiconductor device can be automatically discharged, and the overall structure is simpler.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor device packaging devices, in particular to a semiconductor device storage tube transfer system. Background Art

[0002] After the single semiconductor device is tested, qualified products are usually packaged in a long storage tube. During packaging, the discharge tube connected to the end of the testing equipment outputs the semiconductor devices one by one. The outlet of the discharge tube is usually tilted downward. After the storage tube is aligned with the outlet of the discharge tube, the semiconductor device will automatically fall into the storage tube. When the storage tube is loaded with a predetermined number of semiconductor devices, the storage tube is replaced.

[0003] The existing device generally includes a stacking mechanism for stacking storage tubes, a pushing mechanism for taking out the semiconductor devices, a feeding mechanism for feeding empty storage tubes, and a taking mechanism for taking out the storage tubes on the pushing mechanism. Although the existing device can achieve the purpose of automatically replacing the storage tubes, the overall structure of the device is relatively complicated. Utility Model Content

[0004] To solve the deficiencies of the prior art, the utility model provides a semiconductor device storage tube transfer system, which can automatically replace the storage tube connected to the discharge tube and automatically discharge the storage tube containing semiconductor devices, and has a simpler overall structure.

[0005] In order to achieve the purpose of this utility model, the following scheme is proposed:

[0006] A semiconductor device storage tube transfer system includes: a bottom plate, the top surface of which is an inclined structure, a discharge tube is arranged at the upper end of the bottom plate, the discharge tube has the same inclination angle as the top surface of the bottom plate, and the upper end of the discharge tube is used to connect a detection device.

[0007] A pair of limit plates parallel to each other and perpendicular to the top surface of the bottom plate are provided at the upper and lower ends of the top surface of the bottom plate, and a slide groove perpendicular to the top surface of the bottom plate is provided on the opposite side of the two limit plates for stacking storage tubes, and a through hole is provided at the bottom of the limit plate at the upper end of the bottom plate, and the inner hole contour is larger than the cross-sectional contour of the storage tube, and a jacking device is provided on the outer side of the limit plate at the lower end of the bottom plate, and its push rod is aligned with the through hole, and a push block is provided at the front end of the push rod, and the push block passes through the limit plate at the lower end of the bottom plate.

[0008] A push rod is provided on one side of the top surface of the bottom plate, which is arranged at the movable end of a telescopic device. The movable end of the telescopic device is arranged to move along the directions of both sides of the bottom plate. A rotating plate is hinged at the front end of the push rod, and the axis of the hinge is parallel to the discharge pipe. The bottom surface of the rotating plate is in sliding contact with the top surface of the bottom plate; when the rotating plate moves to the bottom of the slide groove, the storage tube in contact with the top surface of the rotating plate is aligned with the through hole; the top surface of the rotating plate is lower than the top surface of the push rod, and the height difference between the top surface of the rotating plate and the top surface of the push rod is less than or equal to the thickness of a single storage tube.

[0009] The beneficial effect of the utility model is that the overall structure of the scheme is simpler. The scheme uses a rotating plate hinged at the front end of the push rod to transfer the storage tube, and uses the bottom plate to support the rotating plate. When the rotating plate moves to the outside of the bottom plate, the rotating plate will automatically swing downward under the action of gravity, thereby achieving the purpose of automatically discharging the storage tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0011] Figure 1 Shown is a schematic diagram of the overall structure of the present application.

[0012] Figure 2 A partial schematic diagram is shown when the rotating plate receives the storage tube.

[0013] Figure 3 A partial schematic diagram is shown when the storage pipe and the discharge pipe are connected.

[0014] Figure 4 A schematic diagram showing the state of the rotating plate when discharging the material storage tube.

[0015] Markings in the figure: bottom plate -1, collecting trough -11, discharge pipe -2, limit plate -3, slide groove -31, through hole -32, storage pipe -4, lifting device -5, top block -51, push rod -6, rotating plate -61, connecting rod -62, telescopic device -7, clamping block -8, clamping groove -81, clamping device -82. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings, but the embodiments described in the utility model are only part of the embodiments of the utility model, rather than all the embodiments.

[0017] like Figure 1 , Figure 3As shown, a semiconductor device storage tube transfer system includes: a base plate 1, whose top surface is an inclined structure, a discharge tube 2 is provided at the upper end of the base plate 1, the discharge tube 2 has the same inclination angle as the top surface of the base plate 1, and the upper end of the discharge tube 2 is used to connect the detection equipment.

[0018] A pair of limit plates 3 parallel to each other and perpendicular to the top surface of the bottom plate 1 are provided at the upper and lower ends of the top surface of the bottom plate 1, and a slide groove 31 perpendicular to the top surface of the bottom plate 1 is opened on the opposite side of the two limit plates 3 for stacking storage tubes 4, and a through hole 32 is opened at the bottom of the limit plate 3 at the upper end of the bottom plate 1, and its inner hole contour is larger than the cross-sectional contour of the storage tube 4, which is used to pass the storage tube at the bottom of the slide groove 31, and a lifting device 5 is provided on the outer side of the limit plate 3 at the lower end of the bottom plate 1, and its push rod is aligned with the through hole 32, and a top block 51 is provided at the front end of the push rod, and the top block 51 passes through the limit plate 3 at the lower end of the bottom plate 1.

[0019] A push rod 6 is provided on one side of the top surface of the bottom plate 1, which is arranged at the movable end of a telescopic device 7. The movable end of the telescopic device 7 is arranged to move along the directions of both sides of the bottom plate 1. A rotating plate 61 is hinged at the front end of the push rod 6. The axis of the hinge is parallel to the discharge pipe 2. The bottom surface of the rotating plate 61 is in sliding contact with the top surface of the bottom plate 1; when the rotating plate 61 moves to below the slide groove 31, the storage tube 4 in contact with the top surface of the rotating plate 61 is aligned with the through hole 32; the top surface of the rotating plate 61 is lower than the top surface of the push rod 6, and the height difference between the top surface of the rotating plate 61 and the top surface of the push rod 6 is less than or equal to the thickness of a single storage tube 4.

[0020] like Figures 1 to 4 As shown, when in use, first, the rotating plate 61 is moved between the chutes 31 by using the telescopic device 7, and the empty storage tubes 4 are stacked in a single row in the chutes 31, and the storage tubes 4 at the bottom of the chutes 31 will automatically fall on the top surface of the rotating plate 61. Figure 3 As shown, the lifting device 5 is started, and the lifting block 51 is used to push the storage tube 4 in contact with the rotating plate 61 to move toward the discharge tube 2. The front end of the storage tube 4 will pass through the through hole 32 until the inlet end of the storage tube 4 is docked with the outlet end of the discharge tube 2. At this point, the storage tube 4 can be used to receive the semiconductor devices that automatically fall from the discharge tube 2. After the material receiving work is completed, the lifting device 5 is used to retract the lifting block 51. Under the action of gravity, the storage tube 4 containing the semiconductor devices will automatically slide to the lower end of the bottom plate 1 until the storage tube 4 is aligned with the storage tube 4 stacked in the chute 31. Figure 4As shown, the push rod 6 is then pushed toward the rotating plate 61 by the telescopic device 7, so that the rotating plate 61 and the storage tube 4 in contact therewith are pushed toward the side of the bottom plate 1. In this process, the push rod 6 will be supported from below the stacked storage tube 4. When the rotating plate 61 moves to the outside of the bottom plate 1, the rotating plate 61 will lose the support of the top surface of the bottom plate 1. Under the action of gravity, the rotating plate 61 will rotate, so that the storage tube 4 on its top will automatically fall down, so as to achieve the purpose of automatically discharging the storage tube 4, reducing the setting of the material taking mechanism. After the discharge is completed, the push rod 6 is retracted by the telescopic device 7, and the rotating plate 61 will be supported on the bottom plate 1 again. When the rotating plate 61 moves between the two chutes 31 again, the storage tube 4 at the bottom of the chutes 31 will automatically fall on the rotating plate 61. Then, the top block 51 is used again to push the storage tube 4 to align with the discharge tube 2, so that the semiconductor devices can be collected again.

[0021] Preferably, Figure 1 , Figure 3 As shown, a clamping block 8 is provided on the outer side of the limit plate 3 located at the upper end of the bottom plate 1, and is movable along the direction of the slide groove 31. A clamping groove 81 is provided in the direction of the top surface of the bottom plate 1 to limit the storage tube 4. The clamping block 8 is provided at the lower end of a movable rod of a clamping device 82. When the top block 51 pushes the storage tube 4 to align with the discharge tube 2, the clamping device 82 drives the clamping block 8 to move toward the bottom plate 1, and the storage tube 4 is clamped by the clamping groove 81, so that the relative position accuracy between the storage tube 4 and the discharge tube 2 can be more accurately guaranteed.

[0022] Preferably, the pressing device 82, the lifting device 5 and the telescopic device 7 are cylinders or linear motors.

[0023] Preferably, Figure 1 As shown, the outer wall of the bottom plate 1 on one side corresponding to the rotating plate 61 is provided with a collecting groove 11 for collecting the material storage tube 4 discharged from the rotating plate 61 .

[0024] Preferably, Figure 1 As shown, two push rods 6 are provided in parallel, and a rotating plate 61 is provided at the front end of each push rod 6, so that the rotating plate 61 can be set narrower to reduce the contact area between the rotating plate 61 and the storage tube 4 and reduce friction, thereby facilitating the storage tube 4 to automatically move to the lower end of the bottom plate 1 after receiving the material and ensuring the support stability of the storage tube 4 through the two rotating plates 61. The ends of the two push rods 6 are arranged on the same connecting rod 62, and the connecting rod 62 is connected to the movable end of the telescopic device 7.

[0025] Preferably, Figure 1As shown, a blocker 9 is provided on the discharge pipe 2 for blocking the semiconductor devices inside the discharge pipe 2. The blocker 9 can be activated during the process of replacing the storage tube 4 to block the semiconductor devices in the storage tube 2 to prevent the semiconductor devices from falling out. The blocker 9 is a telescopic cylinder with a movable rod passing through the discharge pipe 2. When blocking the semiconductor devices, the movable rod of the blocker 9 passes through the discharge pipe 2.

[0026] The above is only a preferred embodiment of the utility model, and does not mean that it is the only one or limit the utility model. Those skilled in the art should understand that various changes or equivalent replacements made to the utility model without departing from the scope of the utility model are within the scope of protection of the utility model.

Claims

1. A semiconductor device stock tube transfer system, comprising: The bottom plate (1) has an inclined top surface, a discharge pipe (2) is provided at the upper end of the bottom plate (1), the discharge pipe (2) and the top surface of the bottom plate (1) have the same inclination angle, and the upper end of the discharge pipe (2) is used to connect a detection device, characterized in that; A pair of limiting plates (3) are provided at the upper and lower ends of the top surface of the bottom plate (1), which are parallel to each other and perpendicular to the top surface of the bottom plate (1); a slide groove (31) perpendicular to the top surface of the bottom plate (1) is provided on opposite sides of the two limiting plates (3), which is used to stack the storage tube (4); a through hole (32) is provided at the bottom of the limiting plate (3) at the upper end of the bottom plate (1); the inner hole profile of the limiting plate (3) is larger than the cross-sectional profile of the storage tube (4); a lifting device (5) is provided on the outer side of the limiting plate (3) at the lower end of the bottom plate (1); the lifting rod of the limiting plate (3) is aligned with the through hole (32); and a lifting block (51) is provided at the front end of the lifting rod; the lifting block (51) passes through the limiting plate (3) at the lower end of the bottom plate (1); A push rod (6) is provided on one side of the top surface of the bottom plate (1), and the push rod (6) is provided at the movable end of a telescopic device (7). The movable end of the telescopic device (7) is arranged to move along the directions of both sides of the bottom plate (1). A rotating plate (61) is hinged at the front end of the push rod (6). The axis of the hinge is parallel to the discharge pipe (2). The bottom surface of the rotating plate (61) is in sliding contact with the top surface of the bottom plate (1). When the rotating plate (61) moves to below the slide groove (31), the storage pipe (4) in contact with the top surface of the rotating plate (61) is aligned with the through hole (32). The top surface of the rotating plate (61) is lower than the top surface of the push rod (6), and the height difference between the top surface of the rotating plate (61) and the top surface of the push rod (6) is less than or equal to the thickness of a single storage pipe (4).

2. A semiconductor device stock tube transfer system according to claim 1, characterized in that: A clamping block (8) is provided on the outer side of the limiting plate (3) at the upper end of the bottom plate (1), and is arranged to move along the direction of the slide groove (31). The clamping block (8) is provided with a clamping groove (81) in the direction toward the top surface of the bottom plate (1) for limiting the material storage tube (4). The clamping block (8) is arranged at the lower end of a movable rod of a clamping device (82).

3. A semiconductor device stock tube transfer system according to claim 2, characterized in that: The pressing device (82), the lifting device (5) and the telescopic device (7) are cylinders or linear motors.

4. A semiconductor device stock tube transfer system according to claim 1, characterized in that: A collecting groove (11) is provided on the outer wall of the bottom plate (1) on a side corresponding to the rotating plate (61) material.

5. A semiconductor device stock tube transfer system according to claim 1, characterized in that: Two push rods (6) are provided in parallel, and a rotating plate (61) is provided at the front end of each push rod (6). The ends of the two push rods (6) are provided on the same connecting rod (62), and the connecting rod (62) is connected to the movable end of the telescopic device (7).

6. A semiconductor device stock tube transfer system according to claim 1, characterized in that: A blocker (9) is provided on the discharge pipe (2) and is used to block the semiconductor device inside the discharge pipe (2).

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