Sensing head assembly

Through the notched back-pressure tablet and the through-type induction hole of copper head, the problems of high packaging cost and reduced sensitivity are solved, and low-cost and high-sensitivity chip protection and detection effects are achieved.

CN222353226UActive Publication Date: 2025-01-14ZHONGSHAN SIWEI INFORMATION ENG
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Patent Information

Application Number
CN202421275157.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-04
Publication Date
2025-01-14
Estimated Expiration
2034-06-04

AI Technical Summary

Technical Problem

The prior art has high cost and reduced sensitivity when packaging induction chips, making it difficult to take into account both cost and sensitivity improvement.

Method used

The back-type pressing tablet with notch is used to extrude and fix the pressing tablet of the PCB board and the copper head, and combined with the through-type induction hole of the copper head, it realizes low-cost seal protection and high-sensitivity detection of the naked chip.

Benefits of technology

It realizes low-cost, effective chip protection and high sensitivity detection, reduces packaging costs, and maintains the original sensing capabilities of the chip.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a sensing head assembly, which comprises a PCB (printed circuit board), a sealing ring and a copper head with a concave ring, the PCB is provided with a chip, the copper head is provided with a through sensing hole corresponding to the chip, the sensing head assembly also comprises a pressing sheet for extruding and fixing the PCB, the sealing ring and the concave ring of the copper head, and the pressing sheet is a clip-shaped pressing sheet with a notch. The PCB with the chip can be positioned and fixed by utilizing the clip-shaped pressing sheet with the notch, and the PCB and the concave ring of the copper head are extruded into the pressing sheet, so that the chip can be sealed and protected without other measures.
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Description

Technical Field

[0001] The utility model relates to the field of automatic sensing, in particular to the field of sensor head components. Background Art

[0002] With the popularization of automation, sensors as automation sensing parts are widely used. There are many types of sensors, and the sensing elements used are also diverse. Generally, they need to maintain high sensitivity and need to be protected. In particular, when the sensing element is a chip, it needs to be packaged and protected to prevent it from being damaged.

[0003] However, there are also problems and room for improvement in packaging chips as sensing elements. The first is cost, which increases due to the packaging process. Second, when the chip is used as a sensing element, the sensitivity of the packaged chip will decrease compared to the bare chip.

[0004] Therefore, there is a demand for improving chips used as sensing elements while taking into account both cost and sensitivity. Utility Model Content

[0005] The utility model provides a sensor head component, which can realize effective protection of naked chips at low cost.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A sensor head assembly, comprising a PCB board, a sealing ring, and a copper head with a concave ring, which are sequentially attached, the PCB board is provided with a chip, and the copper head is provided with a through-type sensing hole corresponding to the chip;

[0008] It also includes a pressing sheet for pressing and fixing the PCB board, the sealing ring and the concave ring of the copper head, and the pressing sheet is a return-shaped pressing sheet with a notch.

[0009] Compared with the prior art, the beneficial effect of this case is that the case uses a notched return-shaped pressing sheet to position and fix the PCB board with the chip, and the concave ring of the PCB board and the copper head is squeezed into the pressing sheet, and the chip can be sealed and protected without other measures. At the same time, the copper head is provided with a through-type sensing hole corresponding to the chip, and there is no need to package the chip. Only the bare chip can be used directly, and high-sensitivity detection can be achieved at a low cost.

[0010] In some embodiments, a notch for installing a sealing ring is provided at the end of the copper head.

[0011] Preferably, the sealing ring is an O-ring.

[0012] In some embodiments, a protection notch for protecting the chip is provided in the notch of the copper head.

[0013] Preferably, the notch, the protection gap and the sensing hole are concentric holes.

[0014] Preferably, in order to facilitate disassembly and assembly, the pressing tablet is a through-type penetrating pressing tablet.

[0015] Preferably, the notches of the pressing sheet are symmetrically arranged in the middle on both sides to make the extrusion force more uniform.

[0016] In some embodiments, considering the connection between the sensor head assembly and other devices, a connecting thread is provided at the end of the copper head. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an overall schematic diagram of a sensor head assembly in this case;

[0018] Figure 2 This is an exploded view of a sensor head assembly in this case;

[0019] Figure 3 It is a chip-oriented front view of a sensor head assembly in this case;

[0020] Figure 4 It is a top view of a sensor head assembly in the present case in a pressed sheet assembly state;

[0021] Figure 5 is a cross-sectional view of a sensor head assembly in this case;

[0022] Figure 6 yes Figure 5 A partial enlarged view of point A in the middle. DETAILED DESCRIPTION

[0023] The features of the present invention and other related features are further described in detail below through embodiments to facilitate understanding by those skilled in the art:

[0024] The core of this case is the protection of the chip installed on the PCB. Chips are generally packaged, but when used as sensing elements, the sensing ability is better in the naked state. The chip involved in this case is also used as a sensing component, such as air pressure sensing. Of course, it can also be used in other sensing fields.

[0025] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the assembly of a sensor head assembly in this case. Figure 2 The PCB board 200 is provided with a chip 200 as a sensor. With the location of the chip 200 as the center, a protective member, a sealing ring 300 and a copper head 400 with a concave ring 410 are arranged in sequence. Figure 3At the same time, a through-type sensing hole 420 is provided at the position of the copper head 400 corresponding to the chip 200. For example, when the application scenario is air pressure sensing, the through-type sensing hole 420 can be connected with the external environment, and the through-type sensing hole 420 has a distance from the copper head 400, so it can serve as an effective protection channel for the chip 200.

[0026] Please refer to Figure 4 In this case, a sensor head assembly also includes a pressing piece 500 for squeezing and fixing the PCB board 100 and the concave ring 410 of the copper head 400. The pressing piece 500 is a circular pressing piece 500 with a notch 510. In order to facilitate disassembly and assembly, the pressing piece 500 is preferably a through-type penetrating pressing piece 500. Rigid materials can be used for the material so that the original shape can be maintained during squeezing. Preferably, the notches 510 of the pressing piece 500 are symmetrically arranged in the middle on both sides to make the squeezing force more uniform.

[0027] In this way, the present invention uses a circular pressing sheet 500 with a notch 510 to position and fix the PCB board 100 with the chip 200. The PCB board 100 and the concave ring 410 of the copper head 400 are squeezed into the pressing sheet 500, and the chip 200 can be sealed and protected without other measures.

[0028] At the same time, the copper head 400 is provided with a through-type sensing hole 420 corresponding to the chip 200, and there is no need to package the chip 200. Only the bare chip 200 can be used directly, and high-sensitivity detection can be achieved at a low cost.

[0029] As described above, the PCB board 100 and the copper head 400 can be squeezed to achieve a sealing effect, and the sealing ring 300 actually plays the role of squeezing force. Preferably, the sealing ring 300 can be an O-ring. Please refer to Figure 5 and Figure 6 , corresponding to the end of the copper head, there is a notch 430 for installing the sealing ring 300. The sealing ring 300 is compressed in the notch 430, which can play an effective positioning role.

[0030] Furthermore, a protective notch 440 is provided in the notch 430 to protect the chip 200, so as to prevent the chip 200 from being damaged during the extrusion operation. Preferably, the notch 430, the protective notch 440 and the sensing hole 420 are concentric holes. Of course, when the chip 200 is short enough, it will not be disturbed by this, but by adding the protective notch 440, the sensor head assembly of this case can be more adaptable to the selection of the chip 200.

[0031] Please refer to Figure 1 In some embodiments, considering the connection between the sensor head assembly and other devices, a connecting thread 450 is provided at the end of the copper head 400 .

[0032] As mentioned above, this case protects a sensor head assembly, and all technical solutions that are the same or similar to this case should be deemed to fall within the protection scope of this case.

Claims

1. A sensor head assembly, characterized in that It comprises a PCB board (100), a sealing ring (300), and a copper head (400) provided with a concave ring (410) which are sequentially attached to each other, the PCB board (100) being provided with a chip (200), and the copper head (400) being provided with a through-type sensing hole (420) corresponding to the chip (200); It also includes a pressing sheet (500) for pressing and fixing the PCB board (100), the sealing ring (300) and the concave ring (410) of the copper head (400), wherein the pressing sheet (500) is a return-shaped pressing sheet (500) with a notch.

2. A sensor head assembly as claimed in claim 1, characterized in that A notch (430) for mounting the sealing ring (300) is provided at the end of the copper head (400).

3. A sensor head assembly as claimed in claim 2, characterized in that A protection notch (440) for protecting the chip (200) is provided in the notch (430) of the copper head (400).

4. A sensor head assembly as claimed in claim 3, characterized in that The notch (430), the protection notch (440) and the sensing hole (420) are concentric holes.

5. A sensor head assembly as claimed in claim 1, characterized in that The sealing ring (300) is an O-ring.

6. A sensor head assembly as claimed in claim 1, characterized in that The tablet (500) is a through-type penetrating tablet (500).

7. A sensor head assembly as claimed in claim 1, characterized in that The notches (510) of the pressing sheet (500) are symmetrically arranged at the middle of the pressing sheet (500).

8. A sensor head assembly according to any one of claims 1 to 7, characterized in that The end of the copper head (400) is provided with a connecting thread (450).