Chip feeding equipment and chip testing system

Abstract

The utility model provides a chip feeding device and a chip testing system, and relates to the technical field of semiconductor testing. The adsorption assembly is used for adsorbing the tested chip on the conveying assembly, a cantilever of the feeding assembly is provided with a first position for bearing the tested chip adsorbed by the adsorption assembly and a second position for placing the tested chip on the chip testing equipment, and the cantilever is controlled to rotate so as to be switched between the first position and the second position. According to the technical scheme, the tested chip can be carried to the chip testing equipment through rotation of the cantilever, and compared with a moving mode in the prior art, a plurality of sliding rails do not need to be arranged, so that the structure is simplified, and the arrangement space is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a chip loading device and a chip testing system. Background Art

[0002] As electronic products require electronic components to have good performance and reliability, it is necessary to perform electrical performance testing on chips.

[0003] Existing testing equipment mainly includes chip loading equipment, chip testing equipment and chip unloading equipment, so as to realize the automatic testing of chips. After the chip under test enters the chip loading equipment, it is necessary to move the chip under test from the chip loading equipment to the chip testing equipment to perform performance testing on the chip under test. Therefore, it is necessary to set a transport device on the chip loading equipment and the chip unloading equipment respectively to realize the transport of the chip under test. However, the transport device in the prior art has a complex structure and occupies a large space, so it is urgent to design a transport device with a simple structure and small space. Utility Model Content

[0004] One purpose of the utility model is to provide a chip loading device to solve the technical problems in the prior art that the chip handling device has a complex structure and occupies a large space.

[0005] A further purpose of the utility model is to separate the chip under test from the blue film.

[0006] Another object of the present invention is to provide a chip testing system having the chip loading device.

[0007] In particular, the utility model provides a chip loading device, comprising:

[0008] Mounting table;

[0009] A conveying assembly, mounted on the mounting platform, for conveying the chip under test;

[0010] An adsorption component, mounted on the mounting platform, and used for adsorbing the chip to be tested on the conveying component;

[0011] The loading assembly includes a cantilever, wherein the cantilever has a first position for receiving the chip under test adsorbed by the adsorption assembly and a second position for placing the chip under test on the chip testing device. The cantilever is configured to rotate in a controlled manner to switch between the first position and the second position, thereby transporting the chip under test adsorbed by the adsorption assembly to the chip testing device.

[0012] Optionally, an air channel for adsorbing the chip under test is provided inside the cantilever, and the air channel is connected to a vacuum pumping device so that the chip under test is adsorbed through the air channel when the vacuum pumping device is evacuated.

[0013] Optionally, the feeding assembly further comprises:

[0014] A driving member is connected to the cantilever, and the driving member is configured to drive the cantilever to rotate along a first plane in a controlled manner, wherein the first plane is perpendicular to a horizontal plane.

[0015] Optionally, the chip under test has a first surface;

[0016] The cantilever is configured to switch the first surface of the chip under test from facing upward to facing downward during the process of switching from the first position to the second position.

[0017] Optionally, it also includes:

[0018] The first sliding component is arranged on the top of the conveying component and connected with the adsorption component, and is used for driving the adsorption component to move so that the adsorption component adsorbs the chip under test and transports the chip under test to the cantilever.

[0019] Optionally, the conveying assembly comprises:

[0020] A pair of slide rails, mounted on the mounting platform and extending in a horizontal direction;

[0021] The carrier platform is used to carry the wafer. Both ends of the carrier platform are slidably connected to corresponding slide rails respectively, and the carrier platform is configured to slide driven by the pair of slide rails to transport the wafer to a third position. The third position is located at the bottom of the adsorption component. The wafer includes at least one chip to be tested.

[0022] Optionally, it also includes:

[0023] A film stripping assembly is mounted on the mounting platform, and is configured to separate the chip under test on the wafer from the blue film when the carrier platform slides to the top thereof following the pair of slide rails.

[0024] Optionally, the film stripping assembly comprises:

[0025] An ejector cap having at least one through hole at the top, and the ejector cap is configured to move vertically in a controlled manner;

[0026] At least one ejector pin is located inside the ejector pin cap, each ejector pin corresponds to one of the through holes, and the ejector pin is configured to pass through the ejector pin cap from the corresponding through hole when the ejector pin cap moves downward to lift up the chip under test, thereby allowing the chip under test to detach from the blue film.

[0027] Optionally, it also includes:

[0028] A heating component is arranged at the bottom of the mounting platform. The heating component is configured to heat the bottom of the wafer on the carrier when the carrier follows the pair of slide rails to slide to the fourth position, so that the chip under test is separated from the blue film of the wafer.

[0029] Optionally, the carrying platform includes:

[0030] Mounting plate;

[0031] A limiting component is detachably mounted on the mounting plate and is used to limit the wafer.

[0032] Optionally, it also includes:

[0033] A robot arm is slidably mounted on the mounting platform, and the robot arm is configured to grab the wafer in the wafer loading device and slide in a controlled manner to transport the wafer to the limiting component.

[0034] In particular, the utility model also provides a chip testing system, comprising:

[0035] Chip loading equipment as described above;

[0036] A chip testing device is arranged at one side of the chip loading device, and is used to receive the chip under test carried by the cantilever of the chip loading device, and perform a performance test on the chip under test;

[0037] The chip unloading device is arranged on a side of the chip testing device away from the chip loading device, and is used for receiving the chip to be tested carried by the chip testing device and unloading the chip.

[0038] According to the solution of the utility model, the adsorption component is used to adsorb the chip under test on the conveying component, and the cantilever of the loading component has a first position for carrying the chip under test adsorbed by the adsorption component and a second position for placing the chip under test on the chip testing device. The cantilever is configured to rotate in a controlled manner to switch between the first position and the second position. The above technical solution can transport the chip under test to the chip testing device through the rotation of the cantilever. Compared with the mobile method used in the prior art, it does not need to set up multiple slide rails, thereby simplifying the structure and saving layout space.

[0039] Furthermore, the chip loading equipment of the utility model includes a demolding assembly installed on a mounting table. The demolding assembly is configured to separate the chip under test on the wafer from the blue film when the supporting table slides to its top following a pair of slide rails, so that the adsorption assembly can easily adsorb the chip under test.

[0040] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0042] Figure 1 is a schematic structural diagram of a chip loading device according to an embodiment of the utility model at one angle;

[0043] Figure 2 is a schematic structural diagram of a chip loading device according to an embodiment of the utility model from another angle;

[0044] Figure 3 It is a schematic structural diagram of a chip loading device according to an embodiment of the utility model, excluding a wafer loading device and a chip feeding component at one angle;

[0045] Figure 4 It is a schematic structural diagram from another angle of a chip loading device according to an embodiment of the utility model without a wafer loading device and a chip feeding component;

[0046] Figure 5 is a schematic enlarged diagram of an adsorption component in a chip loading device according to an embodiment of the utility model;

[0047] Figure 6 is a schematic structural diagram of a feeding assembly according to an embodiment of the utility model;

[0048] Figure 7 is a schematic structural diagram of a film stripping assembly according to an embodiment of the utility model;

[0049] Figure 8 is a schematic cross-sectional view of a film stripping assembly according to an embodiment of the utility model;

[0050] Fig. 9 It is a schematic enlarged diagram of a manipulator, a film stripping assembly and a cantilever in a chip loading device according to an embodiment of the utility model;

[0051] Fig.10 It is a schematic enlarged diagram of a limiting component and a mounting plate in a chip loading device according to an embodiment of the utility model;

[0052] Fig.11 It is a schematic connection block diagram of a chip testing system according to an embodiment of the utility model.

[0053] Reference numerals:

[0054] 1000-chip testing system, 100-chip loading equipment, 200-wafer, 210-steel ring, 300-chip testing equipment, 400-chip unloading equipment, 10-mounting table, 20-transportation component, 30-loading component, 40-adsorption component, 50-first sliding component, 60-demolding component, 70-wafer loading device, 90-heating component, 21-a pair of slide rails, 22-carrying table, 23-waste tray, 24- Limiting component, 241-pressing plate, 242-supporting plate, 25-mounting plate, 26-chip feeding assembly, 31-cantilever, 32-driving member, 41-nozzle, 61-second sliding assembly, 62-motor, 63-end face cam, 64-roller, 65-slider, 66-thimble cap, 67-thimble, 661-through hole, 71-carrying plate, 72-limiting block, 81-manipulator, 82-third sliding assembly, 91-air outlet. DETAILED DESCRIPTION

[0055] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0056] In the description of the present invention, it is necessary to understand that the terms "upper" and "lower" etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0057] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0058] Unless otherwise clearly specified and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present utility model according to the specific circumstances.

[0059] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0060] Figure 1 is a schematic structural diagram of a chip loading device 100 according to an embodiment of the present invention at one angle. Figure 2 is a schematic structural diagram of a chip loading device 100 according to an embodiment of the present invention from another angle. Figure 3 FIG. 1 is a schematic structural diagram of a chip loading device 100 according to an embodiment of the present invention, with the wafer loading device 70 and the chip feeding assembly 26 removed from one angle. Figure 4 FIG. 1 is a schematic structural diagram of a chip loading device 100 according to an embodiment of the present invention, with the wafer loading device 70 and the chip feeding assembly 26 removed from another angle. Figure 5 is a schematic enlarged diagram of an adsorption component 40 in a chip loading device 100 according to an embodiment of the present utility model. Figure 6 is a schematic structural diagram of a feeding assembly 30 according to an embodiment of the utility model. Figures 1 to 6As shown, in this embodiment, the chip loading device 100 includes a mounting table 10, a conveying component 20, an adsorption component 40 and a loading component 30. The conveying component 20 is mounted on the mounting table 10, and is used to transport the chip under test. The adsorption component 40 is mounted on the mounting table 10, and is used to adsorb the chip under test on the conveying component 20. The loading component 30 includes a cantilever 31, and the cantilever 31 has a first position for receiving the chip under test adsorbed by the adsorption component 40 and a second position for placing the chip under test on the chip testing device. The cantilever 31 is configured to rotate in a controlled manner to switch between the first position and the second position, so as to transport the chip under test adsorbed by the adsorption component 40 to the chip testing device.

[0061] In this embodiment, the chip to be tested can be transported to the chip testing device by rotating the cantilever 31. Compared with the moving method adopted in the prior art, it is not necessary to set up multiple slide rails, thereby simplifying the structure and saving layout space.

[0062] In this embodiment, an air channel for adsorbing the chip under test is provided inside the cantilever 31, and the air channel is connected to the vacuum pumping device so that the chip under test is adsorbed through the air channel when the vacuum pumping device is evacuated. Here, the air channel has an air port, and the adsorption component 40 can place the adsorbed chip under test at the air port.

[0063] In this embodiment, the loading assembly 30 further includes a driving member 32 connected to the cantilever 31, and the driving member 32 is configured to drive the cantilever 31 to rotate along a first plane in a controlled manner, and the first plane is perpendicular to the horizontal plane. In other words, the cantilever 31 rotates along a vertical plane, so it is necessary to adsorb the chip under test through the air channel to prevent the chip under test from falling off the cantilever 31 during the rotation of the cantilever 31. In some specific embodiments, the driving member 32 is a motor, and the cantilever 31 is connected to the output shaft of the motor. The rotation of the output shaft of the motor drives the cantilever 31 to rotate, see Figure 6 .

[0064] In this embodiment, the chip under test has a first surface. The cantilever 31 is configured to switch the first surface of the chip under test from facing upward to facing downward during the process of switching from the first position to the second position. That is to say, the cantilever 31 turns over the chip under test during the rotation. Here, the first surface is the functional surface of the chip under test. When the cantilever 31 is located in the first position, the functional surface of the chip under test faces upward, and when the cantilever 31 is located in the second position, the functional surface of the chip under test faces downward. The adsorption component 40 adsorbs the functional surface of the chip under test, and directly places the chip under test on the cantilever 31 so that the functional surface of the chip under test faces upward. Here, the adsorption component 40 has a suction nozzle 41 for adsorbing the chip under test.

[0065] See also Figure 6 When the cantilever 31 is located at the first position, the cantilever 31 is in a position extending in the horizontal direction, such as Figure 5 As shown in A, the air port of the airway faces upward to absorb the chip under test, and the adsorption component 40 places the chip under test at the air port from above the cantilever 31. The cantilever 31 is rotated 180° clockwise and is located in the second position, as shown in FIG. Figure 5 As shown at B in the figure, at this time, the air outlet of the airway faces downward, and the chip under test flips 180 degrees. The chip testing equipment is provided with a receiving tray below B to carry the chip under test adsorbed by the cantilever 31.

[0066] In some specific embodiments, the chip loading device 100 further includes a first sliding assembly 50, which is disposed on the top of the conveying assembly 20 and connected to the adsorption assembly 40, and is used to drive the adsorption assembly 40 to move, so that the adsorption assembly 40 adsorbs the chip under test and transports the chip under test to the cantilever 31. Here, the first sliding assembly 50 has a first slide rail extending along the X direction and a second slide rail extending along the Z direction, and the second slide rail is connected to the first slide rail. The first slide rail and the second slide rail are configured to drive the adsorption assembly 40 to slide along the X direction and the Z direction, so as to slide to the top of the cantilever 31 and place the chip under test on the cantilever 31.

[0067] In some specific embodiments, the first sliding assembly 50 also includes a third sliding rail extending along the Z direction, the third sliding rail is connected to the first sliding rail and arranged side by side with the second sliding rail, and the third sliding rail is connected to the driving member 32 to drive the cantilever 31 to slide along the X direction and the Z direction.

[0068] In some embodiments, the conveying assembly 20 includes a pair of slide rails 21 and a carrier 22. The pair of slide rails 21 are mounted on the mounting platform 10 and extend in the horizontal direction. The carrier 22 is used to carry the wafer 200. Both ends of the carrier 22 are slidably connected to the corresponding slide rails 21, and are configured to slide under the drive of the pair of slide rails 21 to transport the wafer 200 to the third position. The third position is located at the bottom of the adsorption assembly 40. The wafer 200 includes at least one chip to be tested. Here, the pair of slide rails 21 extend along the Y direction to drive the carrier 22 to slide along the Y direction.

[0069] Figure 7 is a schematic structural diagram of a film stripping assembly 60 according to an embodiment of the utility model. Figure 8 FIG. 6 is a schematic cross-sectional view of a film stripping assembly 60 according to an embodiment of the present invention. Figures 7 and 8 As shown, and see Figures 1 to 4 In some specific embodiments, the chip loading device 100 also includes a demolding assembly 60, which is installed on the mounting table 10. The demolding assembly 60 is configured to separate the chip under test on the wafer 200 from the blue film when the carrier table 22 follows a pair of slide rails 21 to slide to the top thereof, so that the adsorption assembly 40 can easily adsorb the chip under test.

[0070] In some specific embodiments, the film stripping assembly 60 includes a pin cap 66 and at least one pin 67, the top of the pin cap 66 has at least one through hole 661, and the pin cap 66 is configured to move vertically in a controlled manner. The pins 67 are located inside the pin cap 66, each pin 67 corresponds to a through hole 661, and the pins 67 are configured to pass through the pin cap 66 from the corresponding through hole 661 when the pin cap 66 moves downward to lift the chip under test, so that the chip under test is separated from the blue film. Here, the film stripping assembly 60 also includes a motor 62, an end cam 63, a roller 64 and a slider 65, wherein the roller 64 is connected to the pin cap 66, the pin cap 66 is slidably connected to the slider 65, the end cam 63 is connected to the motor 62, and has an inclined surface, and the end cam 63 is configured to rotate under the drive of the motor 62, so that the roller 64 rolls along the inclined surface, thereby driving the pin cap 66 to move up and down along the slider 65. In this embodiment, the end face cam 63 cooperates with the roller 64 to enable the ejector cap 66 to move smoothly along the Z direction.

[0071] In some specific embodiments, a suction port for adsorbing the blue film is provided on the top of the ejector cap 66. When the ejector cap 66 moves to a position in contact with the blue film, the blue film is first adsorbed through the suction port, and then the ejector cap 66 moves downward, so that the ejector pin 67 protrudes from the ejector cap 66, thereby lifting the chip under test.

[0072] See also Figure 4 and Figure 7 In some specific embodiments, the chip loading device 100 further includes a second sliding assembly 61, which is mounted at the bottom of the mounting platform 10 and connected to the film stripping assembly 60 to drive the film stripping assembly 60 to move vertically, thereby enabling the film stripping assembly 60 to move vertically.

[0073] See also Figure 3 In some specific embodiments, the chip loading device 100 further includes a heating component 90 disposed at the bottom of the mounting platform 10. The heating component 90 is configured to heat the bottom of the wafer 200 on the carrier 22 when the carrier 22 follows a pair of slide rails 21 to slide to the fourth position, so that the chip under test is separated from the blue film of the wafer 200. Here, the third position and the fourth position are both in the Y direction, and the fourth position is located upstream of the third position, that is, the carrier 22 first reaches the fourth position, is heated at the fourth position, and then continues to move to the third position, and performs film removal at the third position. Here, the heating component 90 has an outlet 91 for outputting hot air.

[0074] In this embodiment, there are visual inspection components at the third position and the fourth position for inspecting scratches on the chip under inspection.

[0075] Fig. 9FIG. 1 is a schematic enlarged view of the robot 81, the film stripping assembly 60 and the cantilever 31 in the chip loading device 100 according to an embodiment of the present invention. Fig. 9 As shown, and see Figure 2 In this embodiment, the chip loading device 100 further includes a manipulator 81, which is slidably mounted on the mounting table 10. The manipulator 81 is configured to grab the wafer 200 in the wafer loading device 70 and slide in a controlled manner to transport the wafer 200 to the position limiting component 24. The chip loading device 100 further includes a third sliding assembly 82, which is mounted on the mounting table 10 and is consistent with the extension direction of the pair of slide rails 21, that is, extending along the Y direction. The manipulator 81 is mounted on the third sliding assembly 82 to move along the Y direction. A wafer loading device 70 is mounted on one side of the chip loading device 100. The manipulator 81 can move to the wafer loading device 70 along the Y direction to grab the wafer 200, and move along the Y direction, thereby driving the wafer 200 to move to the carrier 22 to complete the loading of the wafer 200.

[0076] In a preferred embodiment, the chip loading device 100 further includes a chip feeding assembly 26 mounted on the mounting table 10, and the chip feeding assembly 26 is used to transport the chip under test, so as to transport the chip under test to the vicinity of the adsorption assembly 40, so that the adsorption assembly 40 can adsorb the chip under test on the chip feeding assembly 26 and transport the chip under test to the cantilever 31. It can be understood that there are two loading methods in this embodiment, one is wafer 200 loading, and the other is chip loading. The adsorption assembly 40 can adsorb the chip on the wafer 200, and can also adsorb the chip directly transported from the chip feeding assembly 26. The chip under test transported from the chip feeding assembly 26 does not need to pass through the heating assembly 90 and the demolding assembly 60, and the adsorption assembly 40 can directly adsorb it. The wafer 200 transported from the wafer loading device 70 needs to be heated and demolded, and then the adsorption assembly 40 can adsorb the chip under test on the wafer 200. Here, the chip feeding assembly 26 is installed beside a pair of slide rails 21. This embodiment is compatible with two feeding methods, making feeding more convenient and more universal.

[0077] The wafer loading device 70 includes a carrier plate 71 for carrying a material frame, and the material frame has stacked wafers 200. Two groups of limit block groups are provided on the carrier plate 71, and each group of limit block groups includes a plurality of limit blocks 72 for limiting the material frame. The carrier plate 71 can be driven to move vertically to adjust the height of the material frame. The limit blocks 72 of each group of limit block groups are used to limit a material frame of a certain size, and material frames of different sizes are used to place wafers 200 of different sizes, so that the wafer loading device 70 can be compatible with material frames of different sizes, and two different sizes of wafers 200 can be loaded without disassembling the wafer loading device 70. The robot 81 grabs the wafer 200 from the material frame.

[0078] Fig.10 FIG. 2 is a schematic enlarged view of the limiting component 24 and the mounting plate 25 in the chip loading device 100 according to an embodiment of the present invention. Fig.10 As shown, in some specific embodiments, the carrier 22 includes a mounting plate 25 and a limiting component 24, the mounting plate 25 has a mounting groove, and the limiting component 24 is detachably mounted on the mounting plate 25 for limiting the position of the wafer 200. The limiting component 24 includes two support plates 242 and two pressure plates 241, and two mounting grooves are provided on the mounting plate 25, each support plate 242 corresponds to a pressure plate 241, and is installed in a mounting groove, and each pressure plate 241 is installed above the corresponding support plate 242. A limiting space for limiting the position of the wafer 200 is formed between the support plate 242 and the corresponding pressure plate 241. The pressure plate 241 is semi-arc-shaped, and the two pressure plates 241 are arranged at intervals and form a ring together.

[0079] In a preferred embodiment, at least one mounting hole for placing a magnet is provided in the mounting groove, and a magnetic plate adsorbed by the magnet is provided at the bottom of the support plate 242, so that the limiting component 24 can be detachably mounted on the mounting plate 25 through the adsorption of the magnetic plate and the magnet. This embodiment realizes the detachability of the limiting component 24 and the mounting plate 25, so that limiting components 24 of different sizes can be replaced to limit wafers 200 of different sizes. Here, each size of the limiting component 24 limits a wafer 200 of a certain size, that is, each limiting component 24 corresponds to a material frame of a certain size.

[0080] See also Fig.10 In this embodiment, the two pressing plates 241 are spaced apart by a preset distance, and the preset distance is greater than the width of the manipulator 81, so that after the manipulator 81 grabs the steel ring 210 of the wafer 200, it moves along the Y direction to drive the wafer 200 to move directly from the side of the carrier 22 to between the support plate 242 and the pressing plate 241, so as to achieve the position limiting of the wafer 200. This embodiment can achieve the position limiting of the wafer 200 while the wafer 200 is being transported, simplifies the structure and omits the loading step. Here, the manipulator 81 grabs the steel ring 210 of the wafer 200. The pressing plate 241 is mounted on the top of the mounting plate 25 by bolts. When disassembling the limiting component 24, first remove the pressing plate 241 from the mounting plate 25, and then remove the supporting plate 242 from the mounting plate 25. Since the supporting plate 242 is mounted on the mounting plate 25 by magnetic attraction, it is convenient to replace and the speed is fast.

[0081] In some specific embodiments, at least one waste tray 23 is installed on the side of the carrier 22. When the visual inspection component detects that the chip under test is scratched or contaminated, the scratched or contaminated chip under test can be transferred to the waste tray 23 through the adsorption component 40. It does not need to be tested by the chip testing equipment 300, thus saving testing resources.

[0082] Fig.11 FIG. 1 is a schematic connection block diagram of a chip testing system 1000 according to an embodiment of the present invention. Fig.11 As shown, this embodiment also provides a chip testing system 1000, and the chip testing system 1000 includes the chip loading device 100, the chip testing device 300 and the chip unloading device 400 of any of the above embodiments. The chip loading device 100 is not described in detail here. The chip testing device 300 is arranged on one side of the chip loading device 100, and the chip testing device 300 is used to receive the chip under test transported by the cantilever 31 of the chip loading device 100, and perform performance tests on the chip under test. The chip unloading device 400 is arranged on the side of the chip testing device 300 away from the chip loading device 100, and is used to receive the chip under test transported by the chip testing device 300 and unload it.

[0083] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A chip loading device, characterized in that: include: Mounting table; A conveying assembly, mounted on the mounting platform, for conveying the chip under test; An adsorption component, mounted on the mounting platform, and used for adsorbing the chip to be tested on the conveying component; The loading assembly includes a cantilever, wherein the cantilever has a first position for receiving the chip under test adsorbed by the adsorption assembly and a second position for placing the chip under test on the chip testing device. The cantilever is configured to rotate in a controlled manner to switch between the first position and the second position, thereby transporting the chip under test adsorbed by the adsorption assembly to the chip testing device.

2. The chip loading device according to claim 1, characterized in that: An air channel for adsorbing the chip under test is provided inside the cantilever, and the air channel is connected to a vacuum pumping device so that the chip under test can be adsorbed through the air channel when the vacuum pumping device is evacuated.

3. The chip loading device according to claim 2, characterized in that: The feeding assembly also includes: A driving member is connected to the cantilever, and the driving member is configured to drive the cantilever to rotate along a first plane in a controlled manner, wherein the first plane is perpendicular to a horizontal plane.

4. The chip loading device according to claim 3, characterized in that: The chip under test has a first surface; The cantilever is configured to switch the first surface of the chip under test from facing upward to facing downward during the process of switching from the first position to the second position.

5. The chip loading device according to claim 1, characterized in that: Also includes: The first sliding component is arranged on the top of the conveying component and connected with the adsorption component, and is used for driving the adsorption component to move so that the adsorption component adsorbs the chip under test and transports the chip under test to the cantilever.

6. The chip loading device according to claim 1, characterized in that: The conveying assembly comprises: A pair of slide rails, mounted on the mounting platform and extending in a horizontal direction; The carrier platform is used to carry the wafer. Both ends of the carrier platform are slidably connected to corresponding slide rails respectively, and the carrier platform is configured to slide driven by the pair of slide rails to transport the wafer to a third position. The third position is located at the bottom of the adsorption component. The wafer includes at least one chip to be tested.

7. The chip loading device according to claim 6, characterized in that: Also includes: A film stripping assembly is mounted on the mounting platform, and is configured to separate the chip under test on the wafer from the blue film when the carrier platform slides to the top thereof following the pair of slide rails.

8. The chip loading device according to claim 7, characterized in that: The film stripping assembly comprises: An ejector cap having at least one through hole at the top, and the ejector cap is configured to move vertically in a controlled manner; At least one ejector pin is located inside the ejector pin cap, each ejector pin corresponds to one of the through holes, and the ejector pin is configured to pass through the ejector pin cap from the corresponding through hole when the ejector pin cap moves downward to lift up the chip under test, thereby allowing the chip under test to detach from the blue film.

9. The chip loading device according to claim 6, characterized in that: Also includes: A heating component is arranged at the bottom of the mounting platform. The heating component is configured to heat the bottom of the wafer on the carrier when the carrier follows the pair of slide rails to slide to the fourth position, so that the chip under test is separated from the blue film of the wafer.

10. The chip loading device according to claim 6, characterized in that: The carrying platform comprises: Mounting plate; A limiting component is detachably mounted on the mounting plate and is used to limit the wafer.

11. The chip loading device according to claim 10, characterized in that: Also includes: A robot arm is slidably mounted on the mounting platform, and the robot arm is configured to grab the wafer in the wafer loading device and slide in a controlled manner to transport the wafer to the limiting component.

12. A chip testing system, characterized in that: include: The chip loading device according to any one of claims 1 to 11; A chip testing device is arranged at one side of the chip loading device, and is used to receive the chip under test carried by the cantilever of the chip loading device, and perform a performance test on the chip under test; The chip unloading device is arranged on a side of the chip testing device away from the chip loading device, and is used for receiving the chip to be tested carried by the chip testing device and unloading the chip.

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