Backlight heat dissipation structure

Abstract

The utility model discloses a backlight heat dissipation structure which comprises a bottom plate, the bottom plate comprises a back portion, side portions and a top portion, the edge of the back portion is continuously bent inwards to form the side portions and the top portion, and a containing cavity of a U-shaped structure is defined by the side portions, the top portion and the back portion. The backlight FPC is fixed on the back part in a bonding manner; the LED is electrically connected with the backlight FPC, the side, facing the top, of the LED is provided with a black heat conduction film, the black heat conduction film is bonded with the shading glue, the bottom plate is bent inwards to form the containing cavity of the U-shaped structure, the heat dissipation area of the bottom plate is effectively increased, the black heat conduction film is attached to the shading glue, and therefore the heat dissipation effect of the LED is effectively improved. And the heat conduction from the LED lamp to the bottom plate is accelerated, so that the effect of accelerating heat dissipation is achieved, the heating of the mobile phone is reduced in the long-time use process of the mobile phone, and the competitiveness of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of backlight module heat dissipation, in particular to a backlight heat dissipation structure. Background Art

[0002] In recent years, liquid crystal display devices have been increasingly widely used in various fields, among which electronic products with display functions such as laptop computers, mobile phones, televisions, and tablet computers are indispensable in people's lives. In the backlight structure, LEDs will emit heat. If the heat cannot be emitted in time, it will affect the user experience and reduce the service life of the backlight module. For example, China's patent application No. 200920236936.9 discloses an LED backlight heat dissipation device, which includes a rectangular back plate composed of a bottom wall and a side wall formed by vertically extending from the edge of the bottom wall, a circuit board attached to a side of the side wall of the back plate close to the bottom wall by thermal conductive adhesive, and an LED light source electrically mounted on the circuit board. This technical solution extends the bottom wall vertically, transfers heat from the side wall of the back plate to the center of the back plate by thermal conductive adhesive, effectively utilizes the huge heat dissipation area of ​​the metal back plate, and solves the problem of waste heat generated by LEDs. For another example, China's patent application No. 201210168444.7 discloses a backlight module and a liquid crystal display device, the backlight module includes a light source, a light guide plate and a frame, the frame includes a back plate and side walls, the light guide plate is arranged on the back plate, the light source is arranged on the light incident surface side of the light guide plate, the light source includes a substrate and a light-emitting element, the substrate includes a light source setting area and a peripheral area located around the light source setting area, the light-emitting element is fixed to the light source setting area, the back plate includes an opening corresponding to the light-emitting element, the light-emitting element is arranged on the light incident surface side of the light guide plate through the opening, and the substrate is fixed to the side of the back plate away from the light guide plate, the backlight module also includes a heat-conducting layer, the heat-conducting layer is located between the back plate and the peripheral area of ​​the substrate, the backlight module facilitates heat dissipation of the light source.

[0003] However, the conventional mobile phone backlight structure has a single heat dissipation component and a small heat dissipation area, which results in slow heat conduction from the LED lamp on the backlight, affecting the user experience. Utility Model Content

[0004] In order to solve the deficiencies of the above-mentioned prior art, the utility model provides a backlight heat dissipation structure, which effectively increases the heat dissipation area of ​​the bottom plate by bending the bottom plate inward to form a U-shaped containing cavity, and utilizes the black thermal conductive film and the light-shielding adhesive to bond together to accelerate the conduction of heat from the LED lamp to the bottom plate, thereby achieving the effect of accelerating the heat dissipation. During the long-term use of the mobile phone, the heat generation of the mobile phone is reduced, thereby improving the competitiveness of the product.

[0005] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0006] A backlight heat dissipation structure, comprising: a bottom plate, the bottom plate comprising a back, a side and a top, the edge of the back is continuously bent inward to form the side and the top, and a U-shaped containing cavity is surrounded by the side, the top and the back;

[0007] A backlight FPC, wherein the backlight FPC is bonded and fixed on the back;

[0008] The LED is electrically connected to the backlight FPC, and a black heat-conducting film is provided on a side of the LED facing the top, and the black heat-conducting film is bonded with a light-shielding adhesive.

[0009] As a preferred embodiment of the backlight heat dissipation structure provided by the utility model, the back side of the base plate is provided with a reflective film, a light guide plate, a diffusion film, a lower brightening sheet, an upper brightening sheet and a light-shielding glue in sequence from right to left, and the LED is arranged on the side of the light guide plate.

[0010] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, the light-shielding glue is a black thermally conductive glue, and the bottom of the light-shielding glue is extended toward the bottom plate and continuously bent to be adhered to the back of the bottom plate.

[0011] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, the back side of the backlight FPC is bonded to the back through a thermally conductive adhesive layer.

[0012] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, the front side of the backlight FPC is bonded to the light guide plate by double-sided adhesive.

[0013] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, the bottom plate is made of metal.

[0014] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, the bottom plate is made of aluminum alloy.

[0015] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, a single-sided adhesive layer is attached to the outer side of the light-shielding adhesive.

[0016] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, the single-sided adhesive layer is a graphite sheet.

[0017] As a preferred implementation of the backlight heat dissipation structure provided by the utility model, the single-sided adhesive layer is wrapped along the side of the bottom plate to the side of the light guide plate close to the LED and is bonded to the light-shielding adhesive.

[0018] The utility model has the following beneficial effects:

[0019] 1. The backlight heat dissipation structure provided by the utility model effectively increases the heat dissipation area of ​​the bottom plate by bending the bottom plate inward to form a U-shaped containing cavity. A black heat-conductive film is provided above the LED and is bonded with a light-shielding adhesive to accelerate the conduction of heat from the LED lamp to the bottom plate, thereby achieving the effect of accelerating heat dissipation. During the long-term use of the mobile phone, the heat generation of the mobile phone is reduced, thereby improving the competitiveness of the product.

[0020] 2. The backlight heat dissipation structure provided by the utility model has a backlight FPC bonded to the back through a thermally conductive adhesive layer, and the thermally conductive adhesive layer is used to transfer the heat generated by the LED to the bottom plate, further improving the heat dissipation effect of the backlight structure.

[0021] 3. The backlight heat dissipation structure provided by the utility model adopts black thermal conductive glue as the front shading glue, and the bottom of the black thermal conductive glue is extended to wrap around the back of the backlight structure. After the heat generated by the LED is transferred to the bottom plate, the black thermal conductive glue is used to quickly dissipate the heat.

[0022] 4. The backlight heat dissipation structure provided by the utility model wraps a single-sided adhesive layer of a graphite sheet structure on the outside of the light-shielding adhesive, which further accelerates the heat transfer of the LED and improves the competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic diagram of the structure of the backlight heat dissipation structure provided by the utility model;

[0025] Figure 2 This is a schematic diagram of the overall structure of the backlight heat dissipation structure provided by the utility model;

[0026] Figure 3 A schematic diagram of a single-sided adhesive layer structure of a backlight heat dissipation structure provided by the utility model;

[0027] Figure 4 This is a schematic diagram of the connection between LED and backlight FPC in the backlight heat dissipation structure provided by the utility model.

[0028] The markings in the figure are as follows:

[0029] 1. Bottom plate; 101. Back; 102. Side; 103. Top; 2. Backlight FPC; 3. LED; 4. Double-sided adhesive; 5. Reflective film; 6. Light guide plate; 7. Diffusion film; 8. Lower brightness enhancement sheet; 9. Upper brightness enhancement sheet; 10. Shading adhesive; 11. Thermal conductive adhesive layer; 12. Single-sided adhesive layer; 13. Black thermal conductive film. Implementation

[0030] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example

[0034] like Figure 1 and Figure 4As shown, the utility model provides a backlight heat dissipation structure, comprising: a bottom plate 1, the bottom plate 1 comprising a back 101, a side 102 and a top 103, the edge of the back 101 is continuously bent inward to form the side 102 and the top 103, and a U-shaped containing cavity is formed between the side 102, the top 103 and the back 101;

[0035] A backlight FPC2, wherein the backlight FPC2 is bonded and fixed on the back 101;

[0036] LED3, the LED3 is electrically connected to the backlight FPC2, and a black thermal conductive film 13 is provided on the side of the LED3 facing the top, and the black thermal conductive film 13 is bonded with a light-shielding glue 10; and a reflective film 5, a light guide plate 6, a diffusion film 7, a lower brightness enhancement sheet 8, an upper brightness enhancement sheet 9 and a light-shielding glue 10 are provided on the back side of the base plate 1 from right to left, and the LED3 is arranged on the side of the light guide plate 6.

[0037] The base plate 1 is made of metal, which has high thermal conductivity. The base plate 1 can be made of iron or aluminum alloy. In this example, aluminum alloy is preferably used. Aluminum alloy has high strength and good heat dissipation effect, and has better performance than iron.

[0038] The present application effectively increases the heat dissipation area of ​​the bottom plate 1 by bending the bottom plate 1 inward to form a U-shaped containing cavity. A black thermal conductive film 13 is provided above the LED 3 and is bonded to the light-shielding adhesive 10 to accelerate the conduction of heat from the LED 3 to the bottom plate 1, thereby achieving the effect of accelerating heat dissipation. During the long-term use of the mobile phone, the heat generation of the mobile phone is reduced, thereby improving the competitiveness of the product.

[0039] In this embodiment, the light shielding glue 10 is a black heat conductive glue, and the bottom of the light shielding glue 10 is extended toward the bottom plate 1 and continuously bent and pasted to the back 101 of the bottom plate 1. The bottom of the light shielding glue 10 is extended and wrapped to the back 101 of the backlight structure, and then the heat generated by the LED 3 is quickly transferred to the bottom plate 1 by the light shielding glue 10 for dissipation.

[0040] In another preferred implementation of this embodiment, the black thermal conductive film 13 is black and bonded to the light shielding glue 10. The black thermal conductive film 13 is arranged in front of LED 3, which can better absorb the heat generated by LED 3. The black thermal conductive film 13 and the light shielding glue 10 are bonded to quickly dissipate the heat. Example

[0041] The backlight heat dissipation structure provided in Example 1 is further optimized. Specifically, Figure 2As shown, the back of the backlight FPC2 is bonded to the back 101 through a thermal conductive adhesive layer 11, and the front of the backlight FPC2 is bonded to the light guide plate 6 through a double-sided adhesive 4. The thermal conductive adhesive layer 11 covers the overlapped portion of the backlight FPC2 and the back 101. After the LED 3 generates heat after a long period of use, the heat is transferred to the thermal conductive adhesive layer 11, and the thermal conductive adhesive layer 11 then transfers the heat to the back 101, and then transfers it out. At the same time, the thermal conductive adhesive layer 11 can also bond and fix the backlight FPC2. The thermal conductive adhesive layer 11 is prepared by adding graphene material to the glue. At the same time, in order to improve the thermal conductivity effect, the double-sided adhesive 4 can also use black thermal conductive adhesive to cover the FPC2, and at the same time, the heat of the light guide plate 6 can be dissipated.

[0042] Through the above structural design, the backlight FPC2 is bonded to the back 101 through the thermal conductive adhesive layer 11, and the thermal conductive adhesive layer 11 is used to transfer the heat generated by the LED 3 to the back 101, further improving the heat dissipation effect of the backlight structure. Example

[0043] like Figure 3 As shown, a single-sided adhesive layer 12 is attached to the outer side of the light-shielding adhesive 10. In this embodiment, the single-sided adhesive layer 12 is preferably made of a graphite sheet. The high thermal conductivity of the graphite sheet is used to transfer the heat on the bottom plate 1, and at the same time, the single-sided adhesive layer 12 is wrapped along the side wall 102 of the bottom plate 1 to the back 101 of the backlight structure and covers the light-shielding adhesive 10 on the back 101.

[0044] Through the above-mentioned structural design, a single-sided adhesive layer 12 of a graphite sheet structure is wrapped on the outer side of the base plate 1. After the heat generated by the LED 3 is transferred to the base plate 1, the heat is quickly dissipated by the single-sided adhesive layer 12. At the same time, the single-sided adhesive layer 12 is wrapped to the back 101 of the backlight structure, covering the shading adhesive 10 on the back 101, thereby further accelerating the heat transfer of the LED and improving the product competitiveness.

[0045] The working principle of the backlight heat dissipation structure provided by the utility model is as follows: by bending the bottom plate 1 inward to form a U-shaped storage cavity, the heat dissipation area of ​​the bottom plate 1 is effectively increased, and the black heat-conducting film 13 is provided above the LED 3 and is bonded to the light-shielding adhesive 10 to accelerate the conduction of heat from the LED 3 to the bottom plate 1, thereby achieving the effect of accelerating heat dissipation. During the long-term use of the mobile phone, the heat generation of the mobile phone is reduced, and the competitiveness of the product is improved. The backlight FPC2 is bonded to the back 101 through the heat-conducting adhesive layer 11, and the heat generated by the LED 3 is transferred to the back 101 by the heat-conducting adhesive layer 11, further improving the heat dissipation effect of the backlight structure.

[0046] The front shading glue 10 is made of black heat-conducting glue, and the bottom of the shading glue 10 is extended to wrap around the back 101 of the backlight structure. After the heat generated by the LED 3 is transferred to the bottom plate 1, the heat is quickly dissipated by the shading glue 10. A single-sided glue layer 12 of a graphite sheet structure is wrapped around the outside of the shading glue 10, and the single-sided glue layer 12 is wrapped around the back 101 of the backlight structure, covering the shading glue 10 on the back 101, further accelerating the heat transfer of the LED 3 and improving the product competitiveness.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A backlight heat dissipation structure, characterized in that: include: A bottom plate (1), the bottom plate (1) comprising a back (101), a side portion (102) and a top portion (103), the edge of the back (101) being continuously bent inwards to form the side portion (102) and the top portion (103), and a U-shaped containing cavity being enclosed between the side portion (102), the top portion (103) and the back (101); A backlight FPC (2), wherein the backlight FPC (2) is adhesively fixed to the back (101); An LED (3), the LED (3) being electrically connected to the backlight FPC (2), and a black heat-conducting film (13) being provided on a side of the LED (3) facing the top, the black heat-conducting film (13) being bonded to a light-shielding adhesive (10).

2. The backlight heat dissipation structure according to claim 1, characterized in that: The back side of the bottom plate (1) is provided with a reflective film (5), a light guide plate (6), a diffusion film (7), a lower brightness enhancement sheet (8), an upper brightness enhancement sheet (9) and a light shielding adhesive (10) in sequence from right to left, and the LED (3) is arranged on the side of the light guide plate (6).

3. The backlight heat dissipation structure according to claim 2, characterized in that: The light-shielding glue (10) is a black heat-conducting glue, and the bottom of the light-shielding glue (10) is extended toward the bottom plate (1), continuously bent, and adhered to the back (101) of the bottom plate (1).

4. The backlight heat dissipation structure according to claim 1, characterized in that: The back side of the backlight FPC (2) is bonded to the back side (101) via a heat-conducting adhesive layer (11).

5. The backlight heat dissipation structure according to claim 1, characterized in that: The front side of the backlight FPC (2) is bonded to the light guide plate (6) via a double-sided adhesive (4).

6. The backlight heat dissipation structure according to claim 1, characterized in that: The bottom plate (1) is made of metal.

7. The backlight heat dissipation structure according to claim 1, characterized in that: The bottom plate (1) is made of aluminum alloy.

8. The backlight heat dissipation structure according to claim 2, characterized in that: A single-sided adhesive layer (12) is adhered to the outer side of the light-shielding adhesive (10).

9. The backlight heat dissipation structure according to claim 8, characterized in that: The single-sided adhesive layer (12) is a graphite sheet.

10. The backlight heat dissipation structure according to claim 9, characterized in that: The single-sided adhesive layer (12) is wrapped along the side (102) of the bottom plate (1) to a side of the light guide plate (6) close to the LED (2) and is bonded to the light shielding adhesive (10).

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