Teflon side-by-side wire bonding mechanism

By designing the Teflon adhesive side-by-side wire mechanism, the adjustment mechanism and auxiliary mechanism are used to solve the problem of mold replacement caused by different thicknesses of wires, and the rapid wiring and parallelization of wires of different diameters is achieved, and processing efficiency is improved.

CN222354829UActive Publication Date: 2025-01-14JINTAIKE CABLE (JIANGXI PROVINCE) CO LTD
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Patent Information

Application Number
CN202421275839.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-05
Publication Date
2025-01-14
Estimated Expiration
2034-06-05

AI Technical Summary

Technical Problem

During the production process, different thicknesses of the wires lead to trouble disassembly and assemble the wires, which affects the processing efficiency. It is difficult for the prior art to quickly replace suitable wires to adapt to wires of different diameters.

Method used

A Teflon adhesive side-by-side wire mechanism is designed, including a processing table, a guide roller, an adjustment mechanism and an auxiliary mechanism. Through the adjustment mechanism, the guide mold can be freely replaced according to the diameter of the wire, and the guide mold is realized by using a limiting plate, a telescopic rod and a spring. Quick replacement and neatly arranged and juxtaposed wires with bolts and buckles.

Benefits of technology

It realizes fast wiring and parallelism of wires of different diameters, simplifies the mold replacement process, and improves processing efficiency and operation convenience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of Teflon, and discloses a Teflon wire bonding and arranging mechanism which comprises a machining table, the top of the machining table is rotationally connected with a first guide roller, the top of the machining table is rotationally connected with a second guide roller, and the top of the machining table is rotationally connected with a limiting roller. An adjusting mechanism is arranged on the machining table, the adjusting mechanism comprises a boss, the boss is fixedly installed at the top of the machining table, the inner wall of the boss is rotationally connected with a mold disc, according to the teflon side-by-side wire bonding mechanism, the limiting plate is pressed downwards, the limiting rod is made to be separated from the limiting hole, and at the moment, the mold disc can be rotated; the guide die with the required diameter is rotated to the position above the limiting rod, at the moment, the guide die can be matched with the limiting frame to arrange the electric wires, the guide die can be freely replaced according to the diameters of the electric wires, and the electric wires with different diameters can be arranged conveniently.
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Description

Technical Field

[0001] The utility model relates to the technical field of Teflon, in particular to a Teflon bonding and arranging wire mechanism. Background Art

[0002] Teflon is a fluorine coating based on polytetrafluoroethylene (PTFE) resin, which is the toughest fluoropolymer and can form a highly durable coating with excellent chemical resistance and can work continuously at 150°C.

[0003] Teflon is also used as the insulation of wires and is a Class C insulation material for wires and cables. Wires with Teflon as the insulation are sometimes glued together with glue on the surface of multiple groups of wires during the production process according to demand.

[0004] Before bonding, the Teflon insulation needs to be put through a wire arrangement device to neatly arrange multiple groups of cables to prevent the bonded cables from being uneven. However, the thickness of the wires is different. When arranging wires of different thicknesses, it is necessary to replace the appropriate wire arrangement mold according to the diameter of the wire. The wire arrangement mold is usually fixed to the wire arrangement device by multiple sets of bolts, which is very troublesome to disassemble and assemble, affecting the processing efficiency. Utility Model Content

[0005] The purpose of the utility model is to provide a Teflon wire bonding and arranging mechanism to solve the problems raised in the above background technology.

[0006] To achieve the above purpose, the utility model provides the following technical solutions: a Teflon bonding and arranging wire mechanism, comprising a processing table, the top of the processing table is rotatably connected to a first guide roller, the top of the processing table is rotatably connected to a second guide roller, the top of the processing table is rotatably connected to a limiting roller, and an adjustment mechanism is provided on the processing table. By providing the adjustment mechanism, the guide mold can be freely replaced according to the diameter of the wire, so as to facilitate the arrangement of wires with different diameters. The adjustment mechanism includes:

[0007] A boss, the boss is fixedly mounted on the top of the processing table, the inner wall of the boss is rotatably connected to a mold plate, a convex block is fixedly mounted on the side wall of the mold plate, a limiting hole is provided on the convex block, a guide die is fixedly mounted on the side wall of the convex block, a limiting frame is fixedly mounted on the side wall of the guide die, the wires can be arranged by setting the guide die in conjunction with the limiting frame, and multiple groups of convex blocks and guide dies can be driven to rotate by setting the mold plate;

[0008] A limit plate, wherein the limit plate is slidably connected to the side wall of the boss, a limit rod is fixedly installed on the upper surface of the limit plate, and the limit rod is fitted to the inner wall of the limit hole, and the convex block can be limited by setting the limit rod to cooperate with the limit hole;

[0009] A telescopic rod is fixedly mounted on the inner wall of the processing table, the top of the telescopic rod is fixedly mounted on the bottom of the limiting plate, and the outer wall of the telescopic rod is sleeved with a spring.

[0010] Preferably, one end of the spring is fixedly mounted on the bottom of the limit plate, and the other end of the spring is fixedly mounted on the inner wall of the processing table. By arranging the spring, the limit plate can be pushed upward to reset.

[0011] Preferably, seven groups of protrusions are provided, and guide dies are fixedly installed on the side walls of the seven groups of protrusions, and the sizes of the guide dies on two adjacent groups of protrusions are different. By providing seven groups of guide dies with different inner diameters, free switching can be conveniently performed according to the diameter of the wire.

[0012] Preferably, the inner wall radius of the limiting hole is equal to the outer wall radius of the limiting rod.

[0013] Preferably, the inner wall of the limit frame is provided with an auxiliary mechanism, and the auxiliary mechanism includes a buckle, and the buckle is slidably connected to the inner wall of the limit frame. By providing the buckle with a guide mold, the wires can be neatly merged inside the limit frame.

[0014] Preferably, the inner wall of the limiting frame is threadedly connected with a bolt, and the bolt passes through the limiting frame and is rotatably connected to the side wall of the buckle ring. The buckle ring can be driven to slide on the inner wall of the limiting frame by arranging the bolt.

[0015] Compared with the prior art, the utility model provides a Teflon bonding and arranging wire mechanism, which has the following beneficial effects:

[0016] 1. The Teflon sticky wire arrangement mechanism, the limit plate is pressed downward to make the limit rod disengage from the limit hole. At this time, the mold plate can be rotated to rotate the guide mold of the required diameter to the top of the limit rod. At this time, the guide mold can be used in conjunction with the limit frame to arrange the wires. The guide mold can be freely replaced according to the diameter of the wire, which is convenient for arranging wires of different diameters.

[0017] 2. The Teflon wire bonding and arranging mechanism rotates the bolt and uses the bolt to push the buckle ring to move the buckle ring toward the guide mold. The buckle ring cooperates with the guide mold to put multiple groups of wires together, which is convenient for subsequent bonding of the wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the overall structure of the boss of the utility model;

[0020] Figure 3 For this utility model Figure 2 Schematic diagram of the explosion structure;

[0021] Figure 4 This is a schematic diagram of the wiring arrangement state structure of the processing table of the utility model;

[0022] Figure 5 For this utility model Figure 1 A is an enlarged structural diagram of FIG.

[0023] In the figure: 1. processing table; 2. guide roller No. 1; 3. guide roller No. 2; 4. limit roller; 5. adjustment mechanism; 51. boss; 52. limit plate; 53. telescopic rod; 54. mold plate; 55. bump; 56. limit hole; 57. guide mold; 58. limit frame; 59. limit rod; 510. spring; 6. auxiliary mechanism; 61. buckle; 62. bolt. DETAILED DESCRIPTION

[0024] like Figure 1-Figure 5 As shown, the utility model provides a technical solution: a Teflon bonding and arranging wire mechanism, including a processing table 1, the top of the processing table 1 is rotatably connected to a No. 1 guide roller 2, the top of the processing table 1 is rotatably connected to a No. 2 guide roller 3, the top of the processing table 1 is rotatably connected to a limit roller 4, and during the processing of the wire, the wire is passed from the bottom of the No. 1 guide roller 2, then from the top of the No. 2 guide roller 3, then from the bottom of the limit roller 4, and penetrates into the interior of the limit frame 58, and an adjustment mechanism 5 is provided on the processing table 1. By setting the adjustment mechanism 5, the guide mold 57 can be freely replaced according to the diameter of the wire, so as to facilitate the arrangement of wires with different diameters.

[0025] The adjustment mechanism 5 includes a boss 51, a limit plate 52, a telescopic rod 53, a mold plate 54, a convex block 55, a limit hole 56, a guide mold 57, a limit frame 58, a limit rod 59, and a spring 510; the boss 51 is fixedly installed on the top of the processing table 1, and the inner wall of the boss 51 is rotatably connected to the mold plate 54. When the convex block 55 is separated from the limit of the limit rod 59, the mold plate 54 is rotated again, so that the mold plate 54 drives the multiple groups of convex blocks 55 and the guide mold 57 to rotate synchronously, and the guide mold 57 of the required diameter is rotated. The guide mold 57 can be freely replaced according to the diameter of the wire. The side wall of the mold plate 54 is fixedly installed with a protrusion 55, and a limiting hole 56 is provided on the protrusion 55. The side wall of the protrusion 55 is fixedly installed with a guide mold 57. The protrusion 55 is provided with seven groups. The side walls of the seven groups of protrusions 55 are all fixedly installed with a guide mold 57, and the sizes of the guide molds 57 on the two adjacent groups of protrusions 55 are different. The side wall of the guide mold 57 is fixedly installed with a limiting frame 58. Through the guide mold 57, the limiting hole 56 is provided. The frame 58 can arrange the wires neatly. The limit plate 52 is slidably connected to the side wall of the boss 51. The limit rod 59 is fixedly installed on the upper surface of the limit plate 52. The limit rod 59 fits the inner wall of the limit hole 56. The inner wall radius of the limit hole 56 is equal to the outer wall radius of the limit rod 59. The limit plate 52 is pressed downward to compress the telescopic rod 53 and the spring 510, and drive the limit rod 59 to move downward and fall off the limit hole 56. At this time, the convex block 55 falls off the limit of the limit rod 59, and the telescopic rod 53 is released. 3 is fixedly mounted on the inner wall of the processing table 1, the top of the telescopic rod 53 is fixedly mounted on the bottom of the limiting plate 52, the outer wall of the telescopic rod 53 is sleeved with a spring 510, one end of the spring 510 is fixedly mounted on the bottom of the limiting plate 52, and the other end of the spring 510 is fixedly mounted on the inner wall of the processing table 1, and then the limiting plate 52 is loosened, and the limiting plate 52 can be pushed upward with the elasticity of the spring 510, so that the limiting plate 52 drives the limiting rod 59 to enter the inside of the limiting hole 56, thereby completing the limiting of the protrusion 55.

[0026] The inner wall of the above-mentioned limit frame 58 is provided with an auxiliary mechanism 6, by which multiple groups of wires can be placed side by side, and the auxiliary mechanism 6 includes a buckle ring 61 and a bolt 62; the buckle ring 61 is slidably connected to the inner wall of the limit frame 58, and the inner wall of the limit frame 58 is threadedly connected with the bolt 62, and the bolt 62 penetrates the limit frame 58 and is rotatably connected to the side wall of the buckle ring 61. The bolt 62 is rotated, and the buckle ring 61 is pushed by the bolt 62 to move toward the guide mold 57, and the buckle ring 61 is used to cooperate with the guide mold 57 to merge the multiple groups of wires as a whole inside the limit frame 58.

[0027] Working principle: During the processing of the wire, the wire is passed through the bottom of the No. 1 guide roller 2, then through the top of the No. 2 guide roller 3, and then through the bottom of the limit roller 4, and then through the inside of the limit frame 58. At this time, the limit frame 58 and the guide mold 57 can be used to arrange the wires neatly, and then by rotating the bolt 62, the buckle 61 is pushed by the bolt 62 to move the buckle 61 toward the guide mold 57. The buckle 61 is used to cooperate with the guide mold 57 to put multiple groups of wires together, which is convenient for subsequent bonding. When it is necessary to replace the appropriate guide mold 57 according to the diameter of the wire, first press the limit plate 52 downward to compress the telescopic rod 53 and spring 510, and drive the limit rod 59 to move downward and fall off the limit hole 56. At this time, the protrusion 55 is separated from the limit of the limit rod 59, and then the mold plate 54 is rotated to make the mold plate 54 drive multiple groups of protrusions 55 and the guide mold 57 to rotate synchronously, and the guide mold 57 of the required diameter is rotated to the top of the limit rod 59, and then the limit plate 52 is loosened. With the elasticity of the spring 510, the limit plate 52 can be pushed upward, so that the limit plate 52 drives the limit rod 59 to enter the inside of the limit hole 56, thereby completing the limitation of the protrusion 55. At this time, the guide mold 57 on the side wall of the protrusion 55 can be used to arrange the wires, which is more convenient to use.

[0028] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A Teflon bonding and arranging wire mechanism, comprising a processing table (1), characterized in that: The top of the processing table (1) is rotatably connected to a first guide roller (2), the top of the processing table (1) is rotatably connected to a second guide roller (3), the top of the processing table (1) is rotatably connected to a limit roller (4), and an adjustment mechanism (5) is provided on the processing table (1), and the adjustment mechanism (5) comprises: A boss (51), the boss (51) is fixedly mounted on the top of the processing table (1), the inner wall of the boss (51) is rotatably connected to a mold plate (54), a convex block (55) is fixedly mounted on the side wall of the mold plate (54), a limiting hole (56) is provided on the convex block (55), a guide die (57) is fixedly mounted on the side wall of the convex block (55), and a limiting frame (58) is fixedly mounted on the side wall of the guide die (57); A limiting plate (52), wherein the limiting plate (52) is slidably connected to the side wall of the boss (51), a limiting rod (59) is fixedly mounted on the upper surface of the limiting plate (52), and the limiting rod (59) is attached to the inner wall of the limiting hole (56); A telescopic rod (53) is fixedly mounted on the inner wall of the processing table (1), the top of the telescopic rod (53) is fixedly mounted on the bottom of the limiting plate (52), and the outer wall of the telescopic rod (53) is sleeved with a spring (510).

2. A Teflon bonding and arranging wire mechanism according to claim 1, characterized in that: One end of the spring (510) is fixedly mounted on the bottom of the limiting plate (52), and the other end of the spring (510) is fixedly mounted on the inner wall of the processing table (1).

3. The Teflon bonding and arranging wire mechanism according to claim 1, characterized in that: Seven groups of protrusions (55) are provided, and guide molds (57) are fixedly installed on the side walls of the seven groups of protrusions (55), and the sizes of the guide molds (57) on two adjacent groups of protrusions (55) are different.

4. The Teflon bonding and arranging wire mechanism according to claim 1, characterized in that: The inner wall radius of the limiting hole (56) is equal to the outer wall radius of the limiting rod (59).

5. The Teflon bonding and arranging wire mechanism according to claim 1, characterized in that: The inner wall of the limiting frame (58) is provided with an auxiliary mechanism (6), and the auxiliary mechanism (6) comprises a buckle ring (61), and the buckle ring (61) is slidably connected to the inner wall of the limiting frame (58).

6. The Teflon bonding and arranging wire mechanism according to claim 5, characterized in that: The inner wall of the limiting frame (58) is threadedly connected with a bolt (62), and the bolt (62) passes through the limiting frame (58) and is rotatably connected to the side wall of the buckle (61).