Material clamping device for wafer detection
By introducing buffer mechanism and limit blocks into the wafer detection fixture, adjusting the fixture spacing and clamping force, the damage problem in wafer flip tests of different thicknesses is solved, and the detection efficiency and safety are improved.
Patent Information
- Application Number
- CN202420222034.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-29
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-01-29
AI Technical Summary
The existing wafer detection fixtures are prone to wafer damage during wafer flip testing of different thicknesses, and the detection efficiency is low due to the mismatch of fixture sizes.
A fixture including an upper clamp, a lower clamp and a buffer mechanism is designed. The buffer mechanism consists of a fixture, a buffer rod, an elastic member, an upper limit block and a lower limit block, through the cooperation of the elastic member and the limit block. , adjust the spacing of the fixture and clamping force to avoid damage to the wafer during flipping.
It effectively reduces the damage rate of wafers in flip tests, improves detection efficiency, and achieves rapid disassembly and assembly and replacement through the limit blocks of the triangular structure, reducing production costs.
Smart Images
Figure CN222355117U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a material clamping device for wafer detection. Background Art
[0002] In the semiconductor manufacturing process, each station needs to be macroscopically inspected for abnormalities after the process is completed. If a single-size fixture is used on the machine, when the wafer is flipped for inspection, wafers of different thicknesses will be damaged to varying degrees due to the different ways and magnitudes of force applied to the fixture.
[0003] For thinner wafers, the wafer will rock back and forth during the wafer flipping process, which can easily cause cracks in the stress-bearing area at the edge of the wafer; for thicker wafers, the clamp will squeeze the edge, causing the risk of crushing injuries.
[0004] In order to reduce the damage to the wafer during the flip test, the thickness and warping degree of the wafers being tested on the actual production line are not fixed. One specification corresponds to a detection form of a fixture. It is necessary to replace the fixture of different sizes each time according to the different wafer size parameters, which will greatly reduce the detection efficiency.
[0005] Therefore, the existing clamping device has the problem of damaging the wafer when performing flipping test on wafers of different thicknesses. Utility Model Content
[0006] The utility model aims to provide a wafer inspection clamping device, which can meet the clamping requirements of wafers with different thicknesses and reduce the wafer damage rate to a certain extent during the flip test process.
[0007] In order to achieve the above-mentioned utility model object, the utility model provides a wafer inspection clamping device, including a plurality of clamps;
[0008] The clamp comprises an upper material clamp, a lower material clamp, and a buffer mechanism, wherein the buffer mechanism is located between the upper material clamp and the lower material clamp;
[0009] The buffer mechanism includes a fixing member, a buffer rod, and an elastic member; the fixing member is connected to the upper clamping member, the fixing member is vertically provided with a through hole, the buffer rod passes through the through hole, and the top of the buffer rod is connected to the top of the fixing member through the elastic member;
[0010] The side of the buffer rod is telescopically provided with an upper limit block and a lower limit block, wherein the upper limit block is located above the lower limit block; the top edge of the upper limit block is a downwardly inclined bevel, and the bottom edge of the lower limit block is an upwardly inclined bevel;
[0011] The fixing member is respectively provided with an upper limit slot and a lower limit slot, the position and shape of the upper limit slot are matched with the position and shape of the upper limit block, and the position and shape of the lower limit slot are matched with the position and shape of the lower limit block.
[0012] Preferably, the top of the fixing member is connected to a cover plate via a fastener, and the elastic member is located between the cover plate and the buffer rod.
[0013] Preferably, upper limit blocks and lower limit blocks are provided on both sides of the buffer rod, a first spring and a second spring are provided inside the buffer rod, the two upper limit blocks are connected by the first spring, and the two lower limit blocks are connected by the second spring.
[0014] As a further improvement of the utility model, an upper clamping block is provided at the end of the upper clamping piece, and a lower clamping block is provided at the end of the lower clamping piece; the upper clamping block and the lower clamping block are both polyurethane clamping blocks.
[0015] As a further improvement of the utility model, the lower clamping member is provided with a positioning groove, and the bottom of the fixing member is located in the positioning groove.
[0016] As a further improvement of the utility model, it comprises four said clamps, and the four said clamps are arranged in a circular array.
[0017] The utility model is a wafer inspection clamping device, the side of the wafer is clamped by a plurality of clamps, and the upper clamp and the lower clamp are opened and closed by an external driving device. The wafer is clamped between the upper clamp and the lower clamp, and the upper clamp and the lower clamp generate relative pressure on the surface of the wafer. The elastic member can be a spring, and the elastic member plays a buffering role. When the wafer is extremely thin, the upper clamp presses the wafer downward to reduce the shaking of the wafer during the flipping process. At the same time, the elastic part stretches, the lower limit block retracts into the buffer rod along the through hole, and the bottom edge of the upper limit block clamps the upper limit groove to play a limiting role, avoiding that the relative clamping force of the upper clamp and the lower clamp is too large, which may damage the wafer surface; when the wafer is extremely thick, the distance between the upper clamp and the lower clamp becomes larger, the elastic part contracts, the upper limit block retracts into the buffer rod along the through hole, and the top edge of the lower limit block clamps the lower limit groove to play a limiting role, avoiding that the wafer is subjected to excessive force at a single point, which may cause damage to the wafer surface.
[0018] Compared with the prior art, the wafer inspection clamping device of the utility model has the following advantages:
[0019] (1) Low manufacturing cost. The clamping force of the upper and lower clamping parts is buffered by the buffer rod and the elastic part, limiting the pressure of the upper and lower clamping parts on the wafer, preventing the wafer from being crushed during clamping, flipping, and testing. At the same time, it ensures that the wafer is clamped tightly to avoid shaking when the wafer is flipped, causing cracks;
[0020] (2) The retractable upper and lower limit blocks of the triangular structure can not only play a limiting role, but also cooperate with the sleeve of corresponding size to retract the upper and lower limit blocks into the buffer rod at the same time, thereby realizing the rapid disassembly and replacement of consumables such as the buffer rod and the limit blocks. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 This is a schematic structural diagram of a wafer inspection clamping device of the utility model;
[0022] Figure 2 It is a schematic diagram of a four-point clamping structure;
[0023] Figure 3 It is a schematic diagram of the buffer mechanism structure when the wafer thickness is thin;
[0024] Figure 4 It is a schematic diagram of the buffer mechanism structure when the wafer thickness is thick;
[0025] Figure 5 It is a schematic diagram of the connection structure of the upper limit block and the lower limit block. DETAILED DESCRIPTION
[0026] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.
[0027] like Figure 2 As shown, a wafer inspection clamping device of the utility model includes a plurality of clamps 1;
[0028] like Figure 1 As shown, the clamp 1 includes an upper material clamp 2, a lower material clamp 3, and a buffer mechanism 4, and the buffer mechanism 4 is located between the upper material clamp 2 and the lower material clamp 3;
[0029] like Figure 3-4 As shown, the buffer mechanism 4 includes a fixing member 41, a buffer rod 42, and an elastic member 43;
[0030] The fixing member 41 is connected to the upper clamping member 2, and a through hole 411 is vertically provided on the fixing member 41. The buffer rod 42 passes through the through hole 411, and the top of the buffer rod 42 is connected to the top of the fixing member 41 through the elastic member 43;
[0031] The top of the fixing member 41 is connected with a cover plate 44 through a fastener 441, and the elastic member 43 is located between the cover plate 44 and the buffer rod 42. The fastener 441 can be a screw, and a threaded hole is opened on the top of the fixing member 41, and the screw detachably fixes the cover plate 44 to the top of the fixing member 41 through the threaded hole. By screwing the screw, the cover plate 44 can be quickly disassembled, so that the elastic member 43 and the buffer rod 42 can be replaced.
[0032] like Figure 5 As shown, the side of the buffer rod 42 is telescopically provided with an upper limit block 45 and a lower limit block 46, and the upper limit block 45 is located above the lower limit block 46; the top edge of the upper limit block 45 is a downwardly inclined bevel, and the bottom edge of the lower limit block 46 is an upwardly inclined bevel;
[0033] The side of the buffer rod 42 may be grooved, and the upper limit block 45 and the lower limit block 46 may be connected to the grooves respectively by spring members, so as to realize the extension and retraction of the upper limit block 45 and the lower limit block 46 in the grooves.
[0034] The fixing member 41 is provided with an upper limit slot 412 and a lower limit slot 413, respectively. The position and shape of the upper limit slot 412 match the position and shape of the upper limit block 45, and the position and shape of the lower limit slot 413 match the position and shape of the lower limit block 46. The upper limit block 45 is telescoped in the buffer rod 42 along the upper limit slot 412, and the lower limit block 46 is telescoped in the buffer rod 42 along the lower limit slot 413.
[0035] Preferably, both sides of the buffer rod 42 are provided with an upper limit block 45 and a lower limit block 46, and the buffer rod 42 is provided with a first spring 47 and a second spring 48, and the two upper limit blocks 45 are connected by the first spring 47, and the two lower limit blocks 46 are connected by the second spring 48. Compared with the unilateral limit mode, the limit blocks are synchronously extended and retracted by the corresponding springs, which enhances the positioning effect of the limit blocks and prevents the buffer rod 42 from deflecting to one side. When replacing the elastic member 43 and the buffer rod 42, the lower limit block 46 can be kept in a contracted state by extending a sleeve (not shown) into the gap between the buffer rod 42 and the through hole 411, and the buffer rod 42 and the sleeve (not shown) are pushed in the direction of the spring 43 to shrink the upper limit block 45 into the groove of the buffer rod 42, and the buffer rod 42 and the sleeve (not shown) are further pushed in the direction of the spring 43, so that the elastic member 43 and the buffer rod 42 can be disassembled. Similarly, the elastic member 43 and the buffer rod 42 can be arranged in the through hole 411 of the buffer rod 42 by means of a sleeve (not shown), and the upper limit block 45 and the lower limit block 46 can be arranged in the upper limit groove 412 and the lower limit groove 413 respectively in a one-to-one correspondence.
[0036] An upper clamping block 21 is provided at the end of the upper clamping piece 2, and a lower clamping block 31 is provided at the end of the lower clamping piece 3; the upper clamping block 21 and the lower clamping block 31 are both polyurethane clamping blocks, and the polyurethane material is relatively soft. The wafer 5 is clamped between the upper clamping block 21 and the lower clamping block 31, and the upper clamping block 21 and the lower clamping block 31 are in direct contact with the surface of the wafer 5. The polyurethane clamping blocks made of relatively soft material can reduce the scratches on the wafer 5 caused by the upper clamping piece 2 and the lower clamping piece 3 to a certain extent.
[0037] The utility model provides a wafer inspection clamping device, such as Figure 1 As shown, the side of the wafer 5 is clamped by a plurality of clamps 1, and the upper clamp 2 and the lower clamp 3 are opened and closed by an external driving device. The wafer 5 is clamped between the upper clamp 2 and the lower clamp 3, and the upper clamp 2 and the lower clamp 3 exert relative pressure on the surface of the wafer. The elastic member 43 can be a spring, and the elastic member 43 plays a buffering role. When the thickness of the clamped wafer 5 is extremely thin, such as Figure 3 As shown, when the upper clamping member 2 presses the wafer 5 downward, the shaking of the wafer 5 during the flipping process is reduced, and at the same time the elastic member 43 is stretched, the lower limit block 46 is retracted into the buffer rod 42 along the through hole 411, and the bottom edge of the upper limit block 45 is clamped in the upper limit groove 412, which plays a limiting role to prevent the relative clamping force of the upper clamping member 2 and the lower clamping member 3 from being too large, thereby crushing the surface of the wafer 5; when the thickness of the wafer 5 is extremely thick, the distance between the upper clamping member 2 and the lower clamping member 3 becomes larger, such as Figure 4 As shown, the elastic member 43 contracts, the upper limit block 45 retracts into the buffer rod 42 along the through hole 411, and the top edge of the lower limit block 46 clamps the lower limit groove 413 to play a limiting role, thereby preventing the wafer from being subjected to excessive force at a single point and causing damage to the wafer surface.
[0038] Since the fixing member 41 is only connected to the upper clamping member 2, the fixing member 41 and the buffer rod 42 extending therefrom are only in contact with the lower clamping member 3, when the upper clamping member 2 and the lower clamping member 3 are repeatedly opened and closed, the buffer mechanism 4 is prone to positional deviation from the clamping member 3, affecting the buffering effect on the upper clamping member 2 and the lower clamping member 3. The lower clamping member 3 is provided with a positioning groove 32, and the bottom of the fixing member 41 is located in the positioning groove 32. The fixing member 41 and the buffer rod 42 extending therefrom can be positioned in the positioning groove 32 to avoid misalignment of the buffer mechanism 4 and the lower clamping member 3.
[0039] The utility model provides a wafer inspection clamping device, comprising four clamps 1, such as Figure 2As shown, four clamps 1 are arranged in a circular array. The edge of the wafer 5 is clamped by four clamps 1 at the same time. During the inspection of the wafer 5, the wafer 5 needs to be flipped. The four-point clamping structure makes the force of the four clamps 1 on the wafer 5 in a dynamic balance state, reducing the shaking degree of the wafer 5 during the flipping process, and reducing the damage to the wafer 5 to a certain extent. Compared with the two-point or three-point clamping structure, the clamping effect of the four clamps 1 is more stable.
[0040] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.
Claims
1. A wafer inspection clamping device, characterized in that: Includes several clamps; The clamp comprises an upper material clamp, a lower material clamp, and a buffer mechanism, wherein the buffer mechanism is located between the upper material clamp and the lower material clamp; The buffer mechanism includes a fixing member, a buffer rod, and an elastic member; the fixing member is connected to the upper clamping member, the fixing member is vertically provided with a through hole, the buffer rod passes through the through hole, and the top of the buffer rod is connected to the top of the fixing member through the elastic member; The side of the buffer rod is telescopically provided with an upper limit block and a lower limit block, wherein the upper limit block is located above the lower limit block; the top edge of the upper limit block is a downwardly inclined bevel, and the bottom edge of the lower limit block is an upwardly inclined bevel; The fixing member is respectively provided with an upper limit slot and a lower limit slot, the position and shape of the upper limit slot are matched with the position and shape of the upper limit block, and the position and shape of the lower limit slot are matched with the position and shape of the lower limit block.
2. A wafer inspection clamping device as claimed in claim 1, characterized in that: The top of the fixing member is connected with a cover plate through a fastener, and the elastic member is located between the cover plate and the buffer rod.
3. A wafer inspection clamping device as claimed in claim 1, characterized in that: An upper limit block and a lower limit block are provided on both sides of the buffer rod. A first spring and a second spring are provided in the buffer rod. The two upper limit blocks are connected by the first spring, and the two lower limit blocks are connected by the second spring.
4. A wafer inspection clamping device as claimed in claim 1, characterized in that: An upper clamping block is disposed at the end of the upper clamping piece, and a lower clamping block is disposed at the end of the lower clamping piece; both the upper clamping block and the lower clamping block are polyurethane clamping blocks.
5. The wafer inspection clamping device according to claim 1, characterized in that: The lower clamping piece is provided with a positioning groove, and the bottom of the fixing piece is located in the positioning groove.
6. A wafer inspection clamping device as claimed in claim 1, characterized in that: The device comprises four clamps, which are arranged in a circular array.