Semiconductor integrated circuit wide flat cable framework

Abstract

The utility model discloses a wide flat cable framework of a semiconductor integrated circuit, which comprises a framework body, a plurality of mounting holes are uniformly arranged on the periphery of the framework body, a chip mounting frame is welded in the middle of the upper side of the framework body, and positioning grooves are arranged on the periphery of the upper side in the chip mounting frame. Limiting strips are fixedly connected to the periphery of the bottom in the chip mounting frame, rubber sealing protruding strips are fixedly connected to the positions, located above the limiting strips, of the side wall of the chip mounting frame, a heat conduction block is fixedly connected to the outer side of the chip mounting frame, and cooling fins are fixedly connected to the rear side of the heat conduction block. Through the above structure, the rubber sealing convex strip abuts against the inner wall of the limiting strip to deform, thereby facilitating the realization of waterproof sealing performance, preventing moisture from permeating into the chip, facilitating the improvement of the sealing performance of the installation of the semiconductor chip, and achieving good safety.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a semiconductor integrated circuit wide wiring frame. Background Art

[0002] Lead frame is the chip carrier of integrated circuit. It is a key structural component that uses composite materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It acts as a bridge to connect with external wires. Lead frame is required in most semiconductor integrated blocks and is an important basic material in the electronic information industry.

[0003] Nowadays, most of the multi-leg semiconductor integrated circuit lead frames on the market have poor sealing and moisture-proof effects, resulting in a short service life. The pins are easily offset during installation and use, affecting the use effect. In addition, during operation, the overall heat dissipation effect is poor. Therefore, a semiconductor integrated circuit wide wire frame is proposed. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a semiconductor integrated circuit wide wiring frame, which solves the problems of poor sealing and heat dissipation effect.

[0005] The utility model also provides a semiconductor integrated circuit wide wiring frame as described above, comprising: a frame body, a plurality of mounting holes evenly arranged on the periphery of the frame body, a chip mounting frame welded to the middle position on the upper side of the frame body, positioning grooves arranged around the upper side of the chip mounting frame, a limiting strip fixedly connected to the bottom of the chip mounting frame, a rubber sealing convex strip fixedly connected to the side wall of the chip mounting frame above the limiting strip, a heat conducting block fixedly connected to the outer side of the chip mounting frame, and a heat sink fixedly connected to the rear side of the heat conducting block.

[0006] According to the semiconductor integrated circuit wide wiring frame, the limiting bar is arranged in a rectangular shape, and the chip is located in the middle of the limiting bar.

[0007] According to the semiconductor integrated circuit wide wiring frame, a protective plate is provided on the upper side of the chip mounting frame, and bumps matching the positioning grooves are provided on both sides of the protective plate.

[0008] According to the semiconductor integrated circuit wide cable frame, the protection plate is located on the upper side of the limiting strip, and is deformed by being squeezed by the rubber sealing convex strip on all sides.

[0009] According to the semiconductor integrated circuit wide wiring frame, the heat conductive block is a component made of heat conductive silicone grease material.

[0010] The utility model has the following beneficial effects:

[0011] 1. In the utility model, a rubber sealing convex strip is provided in the chip installation frame, and the rubber sealing convex strip is deformed by pressing against the inner wall of the limit strip, which is more conducive to achieving waterproof sealing than before, thereby preventing moisture from penetrating into the chip, and is conducive to improving the sealing of the installation of the semiconductor chip, and has good safety.

[0012] 2. In the utility model, a positioning groove is provided in the chip installation frame, so that the protective plate can be installed quickly. At the same time, the limit strip is used to support the protective plate to prevent the protective plate from squeezing the chip body. Compared with the past, it is easier to install quickly.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0015] Figure 1 This is a structural diagram of a semiconductor integrated circuit wide wiring frame of the utility model;

[0016] Figure 2 for Figure 1 A magnified view of the structure at center A;

[0017] Figure 3 for Figure 1 A magnified view of the structure at B in the middle;

[0018] Figure 4 The utility model is a structural diagram of a protective plate of a semiconductor integrated circuit wide wiring frame.

[0019] Legend:

[0020] 1. Frame body; 2. Mounting hole; 3. Chip mounting frame; 4. Heat sink; 5. Heat conducting block; 6. Positioning groove; 7. Limiting strip; 8. Rubber sealing convex strip; 9. Protective plate. DETAILED DESCRIPTION

[0021] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0022] Reference Figure 1-4The utility model embodiment is a semiconductor integrated circuit wide wiring frame, which includes a frame body 1, a plurality of mounting holes 2 are evenly arranged on the outer periphery of the frame body 1, a chip mounting frame 3 is welded to the middle position of the upper side of the frame body 1, positioning grooves 6 are arranged around the upper side of the chip mounting frame 3, a protective plate 9 is arranged on the upper side of the chip mounting frame 3, and bumps matching the positioning grooves 6 are arranged on both sides of the protective plate 9, and the protective plate 9 is conveniently installed through the positioning grooves 6;

[0023] The chip mounting frame 3 is fixedly connected with a limit strip 7 around the bottom thereof. The limit strip 7 is rectangular in shape, and the chip is located in the middle of the limit strip 7. The limit strip 7 is made of metal, which is convenient for transferring heat to the heat conducting block 5. The side wall of the chip mounting frame 3 above the limit strip 7 is fixedly connected with a rubber sealing convex strip 8. The protective plate 9 is located on the upper side of the limit strip 7, and is deformed by being squeezed by the rubber sealing convex strip 8 around it. The rubber sealing convex strip 8 is pressed against the inner wall of the limit strip 7 to achieve waterproof sealing, thereby preventing moisture from penetrating into the chip, which is beneficial to improving the sealing of the installation of the semiconductor chip and has good safety. The chip mounting frame 3 is fixedly connected with a heat conducting block 5 on the outside thereof. The heat conducting block 5 is a component made of thermally conductive silicone grease material, and a heat sink 4 is fixedly connected to the rear side of the heat conducting block 5.

[0024] Working principle: When in use, the chip is installed in the middle position of the limit strip 7 in the chip installation frame 3, so that the chip contacts the limit strip 7, which is convenient for transferring heat to the heat conductive block 5, and then dissipating heat through the heat sink 4, and then the protective plate 9 is installed on the upper side of the limit strip 7 through the positioning groove 6. At this time, the four sides of the limit strip 7 are pressed against the rubber sealing convex strip 8 and deformed. The rubber sealing convex strip 8 is pressed against the inner wall of the limit strip 7 to achieve waterproof sealing, thereby preventing moisture from penetrating into the chip, which is beneficial to improving the sealing of the installation of the semiconductor chip and has good safety.

[0025] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor integrated circuit wide wire frame, characterized in that: include: A frame body (1), wherein a plurality of mounting holes (2) are evenly arranged on the outer periphery of the frame body (1), a chip mounting frame (3) is welded at the middle position of the upper side of the frame body (1), positioning grooves (6) are arranged around the inner upper side of the chip mounting frame (3), a limiting strip (7) is fixedly connected around the inner bottom of the chip mounting frame (3), a rubber sealing convex strip (8) is fixedly connected to the side wall of the chip mounting frame (3) located above the limiting strip (7), a heat conducting block (5) is fixedly connected to the outer side of the chip mounting frame (3), and a heat sink (4) is fixedly connected to the rear side of the heat conducting block (5).

2. A semiconductor integrated circuit wide wire frame according to claim 1, characterized in that: The limiting strip (7) is arranged in a rectangular shape, and the chip is located in the middle of the limiting strip (7).

3. A semiconductor integrated circuit wide wire frame according to claim 2, characterized in that: A protective plate (9) is provided on the upper side of the chip mounting frame (3), and bumps matching the positioning grooves (6) are provided on both sides of the protective plate (9).

4. A semiconductor integrated circuit wide wire frame according to claim 3, characterized in that: The protective plate (9) is located on the upper side of the limiting strip (7) and is deformed by being squeezed by the rubber sealing convex strip (8) on all sides.

5. A semiconductor integrated circuit wide wire frame according to claim 4, characterized in that: The heat conducting block (5) is a component made of heat conducting silicone grease material.

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