Electronic component

Abstract

An electronic component is mainly characterized in that a plurality of conductive bumps are coated on a second side of a base material through a protective layer, and then a plurality of electronic components are combined on an adhesive tape of a carrier plate through the protective layer, so that each conductive bump can be coated by a protective layer of a water-soluble adhesive material and can be removed in a subsequent process. Therefore, even if the distance between the conductive bumps is reduced along with the miniaturization requirement, and the conductive bumps are not coated by the adhesive tape of the carrier plate, the problem of adhesive residue on the conductive bumps is avoided, so that the electronic component can be designed to meet the miniaturization requirement.

Description

Technical Field

[0001] The present application relates to a semiconductor packaging technology, and in particular to an electronic component that is conducive to miniaturization design. Background Art

[0002] With the rapid development of portable electronic products in recent years, various related products are gradually moving towards high density, high performance, light, thin, short and small trends. Various packaging processes are also being innovated to meet the requirements of lightness, thinness, shortness and high density.

[0003] Figures 1A to 1E It is a cross-sectional schematic diagram of a method for manufacturing a conventional electronic component 1 .

[0004] like Figure 1A As shown, an electronic body 10 and a circuit structure 13 disposed on the electronic body 10 are provided. A plurality of first conductive bumps 11 are formed on the electronic body 10, and the plurality of first conductive bumps 11 are coated with a first coating layer 12. A plurality of second conductive bumps 14 are formed on the circuit structure 13, and the plurality of second conductive bumps 14 are coated with a second coating layer 15. In the manufacturing process, the circuit structure 13, the second conductive bumps 14 and the second coating layer 15 are first manufactured on the electronic body 10, and then a first carrier 8 is disposed on the second coating layer 15, and then the first conductive bumps 11 and the first coating layer 12 are manufactured, and finally a second carrier 9 is disposed on the first coating layer 12.

[0005] like Figure 1B As shown, the first carrier 8 and the second cladding layer 15 are removed to expose the second conductive bump 14 .

[0006] like Figure 1C As shown, a singulation process is performed to obtain a plurality of electronic components 1 .

[0007] like Figure 1D As shown, the plurality of electronic components 1 are bonded to a tape 7 of a carrier tray by means of their second conductive bumps 14 .

[0008] like Figure 1E As shown, the second carrier 9 and the first coating layer 12 are removed.

[0009] However, in the conventional method of manufacturing the electronic component 1, the distance D between the second conductive bumps 14 becomes smaller as the demand for miniaturization increases, so that the adhesive material of the tape 7 cannot be filled between the second conductive bumps 14, and thus the tape 7 cannot cover the second conductive bumps 14, resulting in residual adhesive on the second conductive bumps 14 when the electronic component 1 is subsequently extracted, and even causing a problem of low process yield.

[0010] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Utility Model Content

[0011] In view of the various deficiencies of the above-mentioned prior art, the present application provides an electronic component, including: a substrate having a first side and a second side opposite to each other, and a plurality of first conductive bumps are formed on the first side of the substrate, and the plurality of first conductive bumps are coated with a first coating layer, and a plurality of second conductive bumps are formed on the second side of the substrate; and a protective layer is formed on the second side of the substrate to coat the plurality of second conductive bumps.

[0012] In the aforementioned electronic component, the substrate includes an electronic body and a circuit structure disposed on the electronic body, so that the first conductive bump and the first cladding layer are disposed on the electronic body, and the second conductive bump and the protective layer are disposed on the circuit structure.

[0013] In the aforementioned electronic component, the first conductive bump and the second conductive bump are metal pillars.

[0014] In the aforementioned electronic component, the first coating layer is an insulating material.

[0015] In the aforementioned electronic component, the material forming the protective layer is a water-soluble adhesive.

[0016] The present application also provides a method for manufacturing an electronic component, including: providing a substrate having a first side and a second side opposite to each other, and a plurality of first conductive bumps are formed on the first side of the substrate, and the plurality of first conductive bumps are coated with a first coating layer, and a plurality of second conductive bumps are formed on the second side of the substrate, and the plurality of second conductive bumps are coated with a second coating layer; removing the second coating layer to expose the plurality of second conductive bumps; forming a protective layer on the second side of the substrate, so that the protective layer coats the plurality of second conductive bumps; performing a singulation process to obtain a plurality of electronic components; and combining the plurality of electronic components with their protective layers on a tape of a carrier.

[0017] In the above-mentioned manufacturing method, the substrate includes an electronic body and a circuit structure disposed on the electronic body, so that the first conductive bump and the first cladding layer are disposed on the electronic body, and the second conductive bump and the second cladding layer are disposed on the circuit structure.

[0018] In the aforementioned manufacturing method, the first conductive bump and the second conductive bump are metal pillars.

[0019] In the aforementioned manufacturing method, the second coating layer is an adhesive material.

[0020] In the above-mentioned manufacturing method, the first coating layer is an insulating material.

[0021] In the aforementioned manufacturing method, the material forming the protective layer is a water-soluble adhesive.

[0022] The aforementioned manufacturing method further includes removing the protective layer by water washing after the electronic component is separated from the tape of the carrier.

[0023] As can be seen from the above, in the electronic component and its manufacturing method of the present application, the plurality of second conductive bumps are mainly covered by the protective layer, so that when the plurality of electronic components are combined on the carrier, each of the second conductive bumps can be covered by a protective layer such as a water-soluble adhesive and can be removed in a subsequent process. Therefore, compared with the prior art, even if the distance between each of the second conductive bumps becomes smaller with the demand for miniaturization, so that the tape of the carrier does not cover each of the second conductive bumps, the problem of residual adhesive forming on the second conductive bumps will not occur, which is beneficial for the electronic component of the present application to be designed towards the demand for miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figures 1A to 1E The cross-sectional view is a schematic diagram of a conventional method for manufacturing an electronic component.

[0025] FIG. 2A to FIG. 2F It is a cross-sectional schematic diagram of a method for manufacturing an electronic component of the present application.

[0026] FIG. 3A to FIG. 3B for Figure 2F A cross-sectional schematic diagram of the subsequent application of.

[0027] Description of Reference Numerals

[0028] 1,2 Electronic components

[0029] 10,20 Electronic Host

[0030] 11,21 First conductive bump

[0031] 12,22 First coating layer

[0032] 13,23 Line structure

[0033] 14,24 Second conductive bump

[0034] 15,25 Second coating layer

[0035] 2a Substrate

[0036] 20a First side

[0037] 20b Second side

[0038] 200 Conductive perforation

[0039] 230 Dielectric layer

[0040] 231 Line Layer

[0041] 26 Protective layer

[0042] 30 Package substrate

[0043] 31. Semiconductor Chip

[0044] 33 Conductive column

[0045] 6 Loading tray

[0046] 7. Tape

[0047] 8 First bearing member

[0048] 9 Second bearing member

[0049] D distance. DETAILED DESCRIPTION

[0050] The following describes the implementation methods of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0051] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical content disclosed in this application. At the same time, the terms such as "on", "first", "second", "one", etc. cited in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of this application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of this application without substantially changing the technical content.

[0052] FIG. 2A to FIG. 2F It is a cross-sectional schematic diagram of a method for manufacturing the electronic component 2 of the present application.

[0053] like Figure 2A As shown, a substrate 2a is provided, which has a first side 20a and a second side 20b opposite to each other, and a plurality of first conductive bumps 21 are formed on the first side 20a of the substrate 2a, and the plurality of first conductive bumps 21 are coated with a first coating layer 22, and a plurality of second conductive bumps 24 are formed on the second side 20b of the substrate 2a, and the plurality of second conductive bumps 24 are coated with a second coating layer 25.

[0054] The substrate 2 a includes an electronic body 20 and a circuit structure 23 disposed on the electronic body 20 , so that the first conductive bump 21 and the first cladding layer 22 are disposed on the electronic body 20 , and the second conductive bump 24 and the second cladding layer 25 are disposed on the circuit structure 23 .

[0055] In this embodiment, the electronic body 20 is a semiconductor chip, and a plurality of penetrating conductive vias 200 are formed therein, so that the conductive vias 200 are electrically connected to the plurality of first conductive bumps 21. For example, the conductive vias 200 are conductive through-silicon vias (TSVs).

[0056] Furthermore, the circuit structure 23 includes at least one dielectric layer 230 and a circuit layer 231 disposed on the dielectric layer 230, such as a circuit redistribution layer (RDL) specification, so that the circuit layer 231 is electrically connected to the plurality of second conductive bumps 24, wherein the outermost dielectric layer 230 can be used as a solder mask, and the outermost circuit layer 231 is exposed from the solder mask to serve as an electrical contact pad to combine the plurality of second conductive bumps 24. For example, the material forming the circuit layer 231 is copper, and the material forming the dielectric layer 230 is polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. or other dielectric materials.

[0057] In addition, in the manufacturing process, the circuit structure 23 and the component configuration thereon (the second conductive bump 24 and the second cladding layer 25) are first manufactured on the electronic body 20, and then the first carrier 8 is disposed on the second cladding layer 25, and then the first conductive bump 21 and the first cladding layer 22 are manufactured, and finally the second carrier 9 is disposed on the first cladding layer 22. For example, the first carrier 8 and the second carrier 9 are both temporary plate specifications and have no electrical properties.

[0058] The first conductive bump 21 and the second conductive bump 24 are metal pillars such as copper pillars, and the first cladding layer 22 is an insulating material such as a non-conductive film (NCF) or other insulating films, and the second cladding layer 25 is an adhesive material such as a tape.

[0059] like Figure 2B As shown, the first carrier 8 and the second cladding layer 25 are removed to expose the second conductive bump 24 .

[0060] like Figure 2CAs shown, a protection layer 26 is formed on the second side 20 b (or the circuit structure 23 ) of the substrate 2 a , so that the protection layer 26 covers the plurality of second conductive bumps 24 .

[0061] In this embodiment, the material forming the protection layer 26 is a water-soluble adhesive material, which flows into and fills the space between the second conductive bumps 24 , so that the protection layer 26 covers the second conductive bumps 24 .

[0062] like Figure 2D As shown, a singulation process is performed to obtain a plurality of electronic components 2 .

[0063] like Figure 2E As shown, the plurality of electronic components 2 are bonded to a tape 7 of a carrier 6 with their protective layers 26 .

[0064] like Figure 2F As shown, the second carrier 9 and the first coating layer 22 are removed.

[0065] Therefore, in the manufacturing method of the electronic component 2 of the present application, the protective layer 26 is mainly configured to cover the plurality of second conductive bumps 24 so that when the plurality of electronic components 2 are combined on the carrier 6, Figure 2E As shown, each of the second conductive bumps 24 is completely covered by the protective layer 26. Therefore, compared with the prior art, even if the distance D between each of the second conductive bumps 24 becomes smaller with the demand for miniaturization, resulting in the tape 7 not covering each of the second conductive bumps 24, each of the second conductive bumps 24 of the present application can be covered by the protective layer 26 to avoid the residual glue problem in the subsequent process.

[0066] In addition, in subsequent applications, such as FIG. 3A to FIG. 3B As shown, the electronic component 2 can be disposed on the package substrate 30 with its first side 20 a, and the first conductive bump 21 can be electrically connected to the package substrate 30 , and then the protective layer 26 on the second side 20 b can be removed by a water washing operation.

[0067] The packaging substrate 30 may be provided with a semiconductor chip 31 and / or a plurality of conductive pillars 33 as required for subsequent packaging and stacking operations.

[0068] The present application also provides an electronic component 2 , including: a substrate 2 a and a protective layer 26 .

[0069] The substrate 2a has a first side 20a and a second side 20b opposite to each other. A plurality of first conductive bumps 21 are formed on the first side 20a of the substrate 2a and coated with a first coating layer 22. A plurality of second conductive bumps 24 are formed on the second side 20b of the substrate 2a.

[0070] The protection layer 26 is formed on the second side 20 b of the substrate 2 a to cover the plurality of second conductive bumps 24 .

[0071] In one embodiment, the substrate 2 a includes an electronic body 20 and a circuit structure 23 disposed on the electronic body 20 , so that the first conductive bump 21 and the first cladding layer 22 are disposed on the electronic body 20 , and the second conductive bump 24 and the protection layer 26 are disposed on the circuit structure 23 .

[0072] In one embodiment, the first conductive bump 21 and the second conductive bump 24 are metal pillars.

[0073] In one embodiment, the first coating layer 22 is an insulating material.

[0074] In one embodiment, the material forming the protection layer 26 is a water-soluble adhesive.

[0075] In summary, the electronic component and its manufacturing method of the present application, by covering the periphery of the plurality of second conductive bumps with the protective layer, when the plurality of electronic components are combined on the carrier, each of the second conductive bumps can be covered by a protective layer such as a water-soluble adhesive material, and can be removed in a subsequent manufacturing process. Therefore, even if the distance between each of the second conductive bumps becomes smaller with the demand for miniaturization, so that the tape does not cover each of the second conductive bumps, the problem of residual adhesive forming on the second conductive bumps will not occur. Therefore, the electronic component of the present application can be designed towards the demand for miniaturization.

[0076] The above embodiments are only used to illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present application. Therefore, the scope of protection of the present application should be as listed in the claims.

Claims

1. An electronic component, characterized in that: include: A substrate having a first side and a second side opposite to each other, wherein a plurality of first conductive bumps are formed on the first side of the substrate and the plurality of first conductive bumps are coated with a first coating layer, and a plurality of second conductive bumps are formed on the second side of the substrate; and A protection layer is formed on the second side of the substrate to cover the plurality of second conductive bumps.

2. The electronic component according to claim 1, wherein: The substrate comprises an electronic body and a circuit structure arranged on the electronic body, so that the first conductive bump and the first cladding layer are arranged on the electronic body, and the second conductive bump and the protection layer are arranged on the circuit structure.

3. The electronic component according to claim 1, wherein: The first conductive bump and the second conductive bump are metal pillars.

4. The electronic component according to claim 1, wherein: The first coating layer is an insulating material.

5. The electronic component according to claim 1, wherein: The material forming the protective layer is a water-soluble adhesive.

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