Laser module

Abstract

The utility model relates to the technical field of photoelectricity, and provides a laser module, which comprises a high-thermal-conductivity heat sink provided with a circuit layer; the metal coating is arranged on the high-heat-conduction heat sink and between the circuit layers; the laser chip is mounted on the high-thermal-conductivity heat sink and performs heat conduction on the high-thermal-conductivity heat sink through the metal coating; the metal connecting wire is used for electrically connecting the laser chip and the circuit layer; the optical element covers the laser chip. According to the utility model, the speed of heat transfer from the laser chip to the high-thermal-conductivity heat sink is increased through the metal coating, rapid cooling and heat dissipation of the laser chip are realized through the high-thermal-conductivity heat sink, the heat dissipation speed of the edge-emitting laser chip is increased, the service life of the edge-emitting laser chip is prolonged, and therefore, a laser with higher power can be carried, and the service life of the edge-emitting laser chip is prolonged. The laser is enabled to maintain good stability and accuracy in a high-power state, and the use experience of a user is improved.

Description

Technical Field

[0001] The utility model relates to the field of optoelectronic technology, in particular to a laser module. Background Art

[0002] With the rapid development of optoelectronic technology, edge emitting lasers (EEL) are increasingly used in communication, sensing, medical treatment, scientific research and other fields. As the core component, the performance of EEL laser module directly affects the stability and reliability of the entire system. Therefore, the research and optimization of EEL laser module has become an important topic in the current optoelectronic technology field.

[0003] Traditional laser modules mainly rely on coaxial packaging (TO packaging) technology to package chips. Although this technology meets the basic needs of lasers to a certain extent, in practical applications, the size and heat dissipation capacity of coaxial packaging technology are limited, which limits the luminous power and stability of the laser. In addition, the matching problem between the coaxial packaging and the laser tube can easily lead to a decrease in beam quality and unstable performance. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a laser module with high heat dissipation performance and long service life.

[0005] In order to solve the above problems, the utility model provides the following technical solutions:

[0006] A laser module, comprising:

[0007] High thermal conductivity heat sink with circuit layer;

[0008] A metal plating layer, disposed on the high thermal conductivity heat sink and between the circuit layers;

[0009] The laser chip is mounted on the high thermal conductivity heat sink and conducts heat to the high thermal conductivity heat sink through the metal plating layer;

[0010] A metal connecting wire, used to electrically connect the laser chip and the circuit layer;

[0011] An optical element covers the laser chip.

[0012] In one embodiment, the circuit layer includes a positive electrode region and a negative electrode region, and the laser chip is connected to the positive electrode region and the negative electrode region through the metal connecting wire.

[0013] In one embodiment, the metal coating extends from one end of the high thermal conductivity heat sink to the other end along a first direction;

[0014] The positive electrode region and the negative electrode region are arranged on both sides of the metal plating layer along the second direction;

[0015] The first direction is perpendicular to the second direction.

[0016] In one embodiment, the number of the laser chips is in the range of 1 to n, and the bottom ends of the 1 to n laser chips are all in contact with a side of the metal coating away from the high thermal conductivity heat sink.

[0017] In one embodiment, 1 to n laser chips are electrically connected to the positive electrode region and the negative electrode region through metal connecting wires to form a series circuit;

[0018] Or 1 to n laser chips are electrically connected to the positive electrode region and the negative electrode region through metal connecting wires to form a parallel circuit.

[0019] In one embodiment, the optical element covers a side of the laser chip facing away from the metal coating layer.

[0020] In one embodiment, the laser chip is an EEL laser chip.

[0021] In one embodiment, the optical element comprises quartz glass.

[0022] In one embodiment, the laser module further includes a laser, the high thermal conductivity heat sink is installed on the upper end of the laser, and the laser chip is electrically connected to the laser to control the operation of the laser.

[0023] In one embodiment, the laser module further includes a temperature monitoring element, wherein the temperature control element is electrically connected to the laser chip and the laser, and is disposed on the laser and faces one side of the laser chip.

[0024] The beneficial effects of the utility model are as follows: the heat transfer speed from the laser chip to the high thermal conductivity heat sink is improved through the metal plating, and the rapid cooling and heat dissipation of the laser chip is achieved through the high thermal conductivity heat sink, thereby improving the heat dissipation speed and service life of the edge-emitting laser chip, so that a higher power laser can be carried, which enables the laser to maintain good stability and accuracy in a high-power state, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of a first embodiment of a laser module of the utility model;

[0026] Figure 2 This is a schematic structural diagram of a second embodiment of a laser module of the utility model;

[0027] Figure 3This is a side sectional view of a third embodiment of a laser module of the utility model.

[0028] Reference numerals:

[0029] 100. Laser module; 110. High thermal conductivity heat sink; 111. Metal coating; 112. EEL laser chip; 113. Metal connecting wire; 114. Optical glass; 121. Circuit layer; 131. Positive electrode area; 132. Negative electrode area; 115. Temperature monitoring element; 120. EEL edge-emitting laser. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] For the convenience of describing the first direction and the second direction in the embodiment of the present application, the first direction is the left-right direction in the drawings, and the second direction is the up-down direction in the drawings. The x-axis arrow direction is referred to as the "right" direction in the following text, and the y-axis arrow direction is referred to as the "up" direction in the following text, which is not limited to the actual application of the present application.

[0033] Please refer to Figure 1-3As shown, this embodiment provides a laser module 100, which includes: a high thermal conductivity heat sink 110, a metal coating 111, a laser chip and a metal connecting wire and an optical element, wherein the laser chip is an EEL laser chip 112, and the optical element is an optical glass 114; further, the high thermal conductivity heat sink 110 has a circuit layer 121 for welding the metal connecting wire 113, and one end of the metal connecting wire 113 can be welded to the circuit layer 121 by welding, and the other end is connected to the EEL laser chip 112, so as to realize The EEL laser chip 112 is powered on, and the metal coating 111 is arranged in the center of the high thermal conductivity heat sink 110 and between the circuit layers 121, so that the EEL laser chip 112 can be configured to fit with the metal coating 111 by setting the bottom end thereof, thereby achieving heat conduction to the high thermal conductivity heat sink 110 through the metal coating 111, and optical glass 114 is used to cover the side of the EEL laser chip 112 away from the metal coating 111, thereby sealing the EEL laser chip 112, thereby completing the packaging of the EEL laser chip 112.

[0034] Specifically, Figure 1-2 As shown, the circuit layer includes a positive electrode region 131 and a negative electrode region 132, and the EEL laser chip 112 is connected to the positive electrode region 131 and the negative electrode region 132 using a metal connecting wire 113 so as to realize the power supply to the EEL laser chip 112; and, in this embodiment, the metal coating 111 extends from one end of the high thermal conductivity heat sink 110 to the other end along a first direction, and the positive electrode region 131 and the negative electrode region 132 are arranged on both sides of the metal coating 111 along a second direction. This structure facilitates the EEL laser chip 112 installed on the high thermal conductivity heat sink 110 to be connected to the positive electrode region 131 and the negative electrode region 132.

[0035] In some embodiments, the number of EEL laser chips 112 is one, while in other embodiments, the number of EEL laser chips 112 is two, and the bottom end of one or two EEL laser chips 112 is in contact with the side of the metal coating 111 away from the high thermal conductivity heat sink 110. The purpose of this structure is to allow the heat of the EEL laser chip 112 to be quickly transferred to the high thermal conductivity heat sink 110 through the metal coating 111. The metal coating 111 can accelerate the heat conduction speed of the EEL laser chip 112. In addition, the metal coating 111 contains at least one metal element. Optionally, the metal coating 111 in this embodiment is set as a gold-tin plated film layer (AUSn). In some other embodiments, it can also be set as a plated film formed by at least one of the metal elements such as CU, Ni, AU, Sn, etc. The metal coating 111 (especially corrosion-resistant metals such as nickel and gold) can provide a layer of protection to prevent the circuit layer and the EEL laser chip 112 from being corroded by oxygen, moisture and other corrosive substances in the environment, which helps to extend the service life of the EEL laser chip 112.

[0036] In some embodiments, two EEL laser chips 112 are mounted on the high thermal conductivity heat sink 110, and the two EEL laser chips 112 are electrically connected to the positive electrode region 131 and the negative electrode region 132 through the metal connection wire 113 to form a parallel circuit. In other embodiments, Figure 2As shown, two EEL laser chips 112 are electrically connected to the positive electrode region 131 and the negative electrode region 132 through metal connecting wires 113 to form a series circuit; in other embodiments, different numbers of EEL laser chips 112 can also be provided to achieve the required reliability and stability; and the advantage of connecting multiple EEL laser chips 112 in parallel is that the current will be divided among the multiple EEL laser chips 112, so that each EEL laser chip 112 bears a smaller current load, which helps to reduce the heat generated by the EEL laser chip 112, and if one of the EEL laser chips 112 fails, the other EEL laser chips 112 can still continue to work, thereby improving the fault tolerance and reliability of the system. In addition, when multiple EEL laser chips 112 are configured as the same type, the workload of the EEL laser chip 112 can be evenly distributed, which can improve the efficiency of the entire system and thus speed up the processing speed; and the advantage of connecting multiple EEL laser chips 112 in series is that the voltages of multiple EEL chips will be superimposed, so that if the rated voltage of a single EEL laser chip 112 is low, but the required total voltage is high, it can be achieved by connecting multiple EEL laser chips 112 in series, which helps to reduce the requirements for power supply, and in some specific application scenarios of the EEL laser chip 112, multiple EEL laser chips 112 need to be connected in a specific way to achieve a specific function, and series connection may be necessary to achieve these functions.

[0037] Preferably, the main feature of the high thermal conductivity heat sink 110 is that it has extremely high thermal conductivity and can effectively guide and transfer heat from an EEL laser chip 112; it is usually set to a high thermal conductivity material, such as diamond (CVD diamond), aluminum nitride (AlN), silicon carbide (SiC) or a metal composite material. In the laser module 100 in this embodiment, one of the above materials is selected - aluminum nitride (AlN). AlN is a ceramic material with excellent thermal conductivity (about 230W / (m·K)) and a low thermal expansion coefficient (4.5×10-6 / ℃). In addition, AlN also has good dielectric properties, mechanical properties and optical transmission characteristics, and is therefore widely used in substrates and packaging materials for high-power integrated circuits. By using aluminum nitride (AlN) material to make a micro heat sink, the circuit layer of the high thermal conductivity heat sink 110 has an extremely high thermal conductivity, and can be widely used to reduce the temperature of the electronic chip in the laser module 100 of the laser module, and improve the stability and performance of the EEL laser chip 112 in the laser module 100.

[0038] Preferably, the metal connecting wire is made of gold, which has excellent conductivity, good chemical stability, is not easy to oxidize, and has good resistance to electromigration.

[0039] Preferably, the optical glass is quartz glass, which has good thermal conductivity and can effectively dissipate the heat generated by the chip. Quartz glass has high spectral transmittance and will not be damaged by radiation (other glasses will darken after being exposed to radiation). In addition, it can resist corrosion from various chemicals and has high adhesion and good adhesion to other materials. It can be tightly combined with other EEL laser chips 112 to ensure the firmness and sealing of the package.

[0040] Preferably, Figure 3 As shown, the laser module 100 also includes a temperature monitoring element 115. The temperature control element 115 is electrically connected to the EEL laser chip 112 and the laser 120. The temperature monitoring element 115 is arranged on the laser 120 and is located on one side of the EEL laser chip 112, so that the temperature control element 115 can face one side of the EEL laser chip 112 to monitor the temperature of the EEL laser chip 112. Optionally, the temperature monitoring element 115 uses a temperature sensor to monitor and remind the temperature of the EEL laser chip 112, which is not elaborated here.

[0041] like Figure 3 As shown, the laser module 100 also includes a laser. The laser in this embodiment is an EEL edge-emitting laser 120 (full name Edge-Emitting Laser, also known as Edge-Emitting Diode (EED) or Fabry-Perot Laser Diode, which is an edge-emitting semiconductor laser. It uses semiconductor materials such as GaAs, etc., and activates the active area by current injection to make electrons and holes recombine, thereby releasing photons. These photons are emitted from the edge of the laser to form a laser beam). A high thermal conductivity heat sink 110 is installed on the upper end of the EEL edge-emitting laser 120, and an EEL laser chip 112 is electrically connected to the EEL edge-emitting laser 120 to control the operation of the EEL edge-emitting laser 120, which can improve the working performance of the EEL edge-emitting laser 120, make the power of the EEL edge-emitting laser higher, make the matching scheme more flexible, have good reliability, and long service life.

[0042] In summary, the utility model provides a laser module, which improves the heat transfer speed of the laser chip to the high thermal conductivity heat sink through metal plating, and realizes rapid cooling and heat dissipation of the laser chip through the high thermal conductivity heat sink, thereby improving the heat dissipation speed and service life of the edge-emitting laser chip, so that it can carry a higher power laser, enable the laser to maintain good stability and accuracy in a high-power state, and improve the user experience.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A laser module, characterized in that: include: High thermal conductivity heat sink with circuit layer; A metal plating layer, disposed on the high thermal conductivity heat sink and between the circuit layers; The laser chip is mounted on the high thermal conductivity heat sink and conducts heat to the high thermal conductivity heat sink through the metal plating layer; A metal connecting wire, used to electrically connect the laser chip and the circuit layer; An optical element covers the laser chip.

2. A laser module according to claim 1, characterized in that: The circuit layer includes a positive electrode region and a negative electrode region, and the laser chip is connected to the positive electrode region and the negative electrode region through the metal connecting wire.

3. A laser module according to claim 2, characterized in that: The metal plating layer extends from one end of the high thermal conductivity heat sink to the other end along a first direction; The positive electrode region and the negative electrode region are arranged on both sides of the metal plating layer along the second direction; The first direction is perpendicular to the second direction.

4. A laser module according to claim 2, characterized in that: The number of the laser chips is in the range of 1 to n, and the bottom ends of the 1 to n laser chips are all in contact with the side of the metal coating away from the high thermal conductivity heat sink.

5. A laser module according to claim 4, characterized in that: 1 to n laser chips are electrically connected to the positive electrode region and the negative electrode region through metal connecting wires to form a series circuit; Or 1 to n laser chips are electrically connected to the positive electrode region and the negative electrode region through metal connecting wires to form a parallel circuit.

6. A laser module according to claim 1, characterized in that: The optical element covers a side of the laser chip away from the metal coating.

7. A laser module according to claim 1, characterized in that: The laser chip is an EEL laser chip.

8. A laser module according to claim 1, characterized in that: The optical element includes quartz glass.

9. A laser module according to claim 1, characterized in that: The laser module also includes a laser, the high thermal conductivity heat sink is installed on the upper end of the laser, and the laser chip is electrically connected to the laser to control the operation of the laser.

10. A laser module according to claim 9, characterized in that: The laser module further comprises a temperature monitoring element, which is electrically connected to the laser chip and the laser and is arranged on the laser and faces one side of the laser chip.

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