Noise reduction case of power amplifier

Abstract

The utility model relates to the technical field of power amplifiers, in particular to a noise reduction case of a power amplifier, which comprises a power amplifier body and a noise reduction case used for reducing noise of the power amplifier body, the noise reduction case comprises a protection case body, and a supporting assembly used for supporting the power amplifier body is arranged in the protection case body. According to the power amplifier, an additional mechanical structure is not needed, materials are not needed, the cost is low, the porous structure and the large surface area of the three-dimensional nanocellulose layer arranged in the protection box body are adopted, and therefore the power amplifier has the advantages that the structure is simple, the cost is low, and the application range is wide. A large amount of sound waves can be absorbed, and the efficient noise reduction effect is achieved; the single radiator is arranged at the bottom of the power amplifier body in the protection box body and matched with the net-shaped uniform-temperature heat-conducting medium base body, so that the temperature of the surface of power amplifier equipment is reduced, and operation of the equipment is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of power amplifiers, in particular to a noise reduction chassis of a power amplifier. Background Art

[0002] Power amplifiers are electronic devices that amplify audio signals, usually to amplify the sound of human voices, musical instruments or speakers to meet listening needs. They can operate in different voltage and frequency ranges, and usually have high input impedance and low output resistance to be compatible with various types of speakers and headphones.

[0003] A power amplifier with noise reduction function described in the prior art includes a box body, both sides of the box body are provided with through grooves, the inside of the through grooves is rotatably connected with a sound insulation mechanism, the sound insulation mechanism includes a fixed block, a rotating shaft, a first gear and a sound insulation block, the outside of the fixed block is fixedly connected with the rotating shaft, one end of the rotating shaft is fixedly connected with the first gear, and the outside of the fixed block is fixedly connected with the sound insulation block.

[0004] The above-mentioned power amplifier with noise reduction function, when in use, when the temperature of the power amplifier is high, the sound insulation mechanism is rotated to expose the inside of the box for heat dissipation. At this time, noise reduction cannot be performed. After the heat dissipation is completed, the sound insulation mechanism is rotated to close the box to perform noise reduction. The use is restricted and noise reduction cannot be performed for heat dissipation. A large amount of heat is generated when the power amplifier is working, which increases the temperature inside the chassis. At this time, if the sound insulation mechanism is opened for heat dissipation, the noise reduction effect will be destroyed, affecting the use of the equipment. In addition, this design requires additional mechanical structures and materials, and the cost is relatively high. Utility Model Content

[0005] The purpose of the utility model is to provide a noise reduction chassis for a power amplifier to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A noise reduction chassis for a power amplifier comprises a power amplifier body and a noise reduction chassis for reducing noise of the power amplifier body, the noise reduction chassis comprises a protective box body, an air inlet opening for ventilation is arranged at the lower front side of the protective box body, a supporting assembly for supporting the power amplifier body is arranged inside the protective box body, a heat dissipation assembly for dissipating heat from the power amplifier body is arranged at the bottom of the supporting assembly, and a noise reduction assembly for noise reduction is arranged inside the protective box body.

[0008] As a preferred solution of the utility model, the noise reduction component includes a three-dimensional nanocellulose layer, the three-dimensional nanocellulose layer is pasted on the inner wall of the noise reduction chassis, and the three-dimensional nanocellulose layer is detachable.

[0009] As a preferred solution of the utility model, the support components are symmetrically distributed on both sides of the noise reduction chassis, each of the support components includes a connecting plate connected to the inner walls on both sides of the noise reduction chassis, and a supporting cross plate is connected between the connecting plates. The power amplifier body is located on the top of the two connecting plates on the inner wall, and a heat dissipation channel is formed at the bottom of the power amplifier body between the connecting plates on both sides, and the heat dissipation channel is connected to the air inlet channel.

[0010] As a preferred solution of the utility model, the heat dissipation component includes a single-chip heat sink and a mesh-shaped uniform temperature heat-conducting medium matrix. The single-chip heat sink is located at the bottom of the power amplifier body at the heat dissipation channel, and the heat dissipation solution inside the single-chip heat sink is water-based.

[0011] As a preferred solution of the utility model, the mesh-shaped uniform temperature heat-conducting medium matrix is ​​located at the bottom of the power amplifier body with the supporting horizontal plate being the top.

[0012] As a preferred solution of the utility model, a cooling fan is arranged on the top of the noise reduction chassis, and the cooling fan is connected to the power supply equipment through a wire.

[0013] As a preferred solution of the utility model, dustproof nets are provided at the air inlet opening and the outside of the heat dissipation fan.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. In view of the problems raised in the background technology, the present application sets up a noise reduction chassis, which does not require additional mechanical structures and materials and has low cost. A three-dimensional nanocellulose layer is set on the inner wall of the protective box. The three-dimensional nanocellulose layer can absorb a large amount of sound waves due to its porous structure and large surface area, and provide a high sound damping coefficient, thereby achieving an efficient noise reduction effect;

[0016] 2. A heat dissipation channel is set at the bottom of the power amplifier body inside the protective box, and a single-chip radiator is set at the heat dissipation channel. The heat dissipation solution used inside the single-chip radiator is water-based. The water-based heat dissipation solution can effectively absorb and take away the heat generated by the chip during operation, prevent the chip from overheating and damage, and ensure the efficient and stable operation of the power amplifier. At the same time, the water-based solution also has the advantages of environmental protection, easy to use and clean, etc., providing reliable protection for modern electronic equipment;

[0017] 3. A mesh-shaped uniform temperature heat-conducting medium matrix is ​​arranged at the bottom of the power amplifier body on the top of the supporting horizontal plate on both sides of the heat dissipation channel. The mesh-shaped uniform temperature heat-conducting medium matrix has good thermal conductivity and can evenly dissipate heat to the surrounding environment while ensuring the normal operation of the power amplifier equipment, so as to reduce the surface temperature of the power amplifier equipment and discharge the heat in time through the single-chip heat sink and the cooling fan. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the internal support components of the protective box of the utility model;

[0020] Figure 3 This is a front view of the heat dissipation channel inside the protective box of the utility model, the single-chip radiator and the supporting cross plate position structure.

[0021] In the figure: 21, noise reduction chassis; 20, three-dimensional nanocellulose layer; 211, protective box; 212, air inlet channel; 3, connecting plate; 31, supporting cross plate; 33, heat dissipation channel; 4, single-chip radiator; 41, mesh uniform temperature heat conducting medium matrix. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention.

[0023] Example

[0024] See also Figure 1-3 The utility model provides a technical solution: a noise reduction chassis of a power amplifier, comprising a power amplifier body and a noise reduction chassis 21 for reducing the noise of the power amplifier body, the noise reduction chassis 21 comprising a protective box 211, an air inlet duct 212 for ventilation is arranged at the lower front side of the protective box 211, a supporting component for supporting the power amplifier body is arranged inside the protective box 211, a heat dissipation component for dissipating the heat of the power amplifier body is arranged at the bottom of the supporting component, and a noise reduction component for noise reduction is arranged inside the protective box 211; a heat dissipation fan is arranged on the top of the noise reduction chassis 21, and the heat dissipation fan is connected to the power supply equipment through a wire; dustproof nets are arranged on the outside of the air inlet duct 212 and the heat dissipation fan; the noise reduction component comprises a three-dimensional nanocellulose layer 20, the three-dimensional nanocellulose layer 20 is pasted on the inner wall of the noise reduction chassis 21, and the three-dimensional nanocellulose layer 20 is detachable.

[0025] It should be noted that, in this embodiment, the noise reduction chassis 21 is provided, no additional mechanical structure or material is required, and the cost is low. A three-dimensional nanocellulose layer 20 is provided on the inner wall of the protective box 211. The three-dimensional nanocellulose layer 20 can absorb a large amount of sound waves due to its porous structure and large surface area, and provide a high sound damping coefficient, thereby achieving an efficient noise reduction effect.

[0026] Furthermore, in terms of noise reduction, the three-dimensional nanocellulose layer 20 exhibits excellent performance. Due to its porous structure and large surface area, it can absorb a large amount of sound waves and provide a high acoustic damping coefficient, thereby achieving an efficient noise reduction effect. In addition, due to the unique properties of its material, the three-dimensional nanocellulose layer 20 also has strong tensile, compressive, tearing and chemical corrosion resistance, which makes it very important in the manufacture of some devices that require a higher level of protection, such as noise-canceling headphones, etc.

[0027] See also Figure 2 and 3 The support components are symmetrically distributed on both sides of the noise reduction chassis 21. Each support component includes a connecting plate 3 connected to the inner walls of the noise reduction chassis 21 on both sides. A supporting cross plate 31 is connected between the connecting plates 3. The power amplifier body is located on the top of the two connecting plates 3 on the inner wall. A heat dissipation channel 33 is formed at the bottom of the power amplifier body between the connecting plates 3 on both sides. The heat dissipation channel 33 is connected to the air inlet channel 212; the heat dissipation component includes a single-chip radiator 4 and a mesh-shaped uniform temperature heat-conducting medium matrix 41. The single-chip radiator 4 is located at the bottom of the power amplifier body at the heat dissipation channel 33, and the heat dissipation solution inside the single-chip radiator 4 is water-based; the mesh-shaped uniform temperature heat-conducting medium matrix 41 is located at the bottom of the power amplifier body at the top of the supporting cross plate 31.

[0028] It should be noted that, in this embodiment, a heat dissipation channel 33 is provided at the bottom of the power amplifier body inside the protective box 211, and a single-chip heat sink 4 is provided at the heat dissipation channel 33. The heat dissipation solution used inside the single-chip heat sink 4 is water-based. The water-based heat dissipation solution can effectively absorb and take away the heat generated by the chip during operation, prevent the chip from being damaged by overheating, and ensure the efficient and stable operation of the power amplifier. At the same time, the water-based solution also has the advantages of environmental protection, easy use and cleaning, etc., providing reliable protection for modern electronic equipment;

[0029] Furthermore, the air inlet 212, the heat dissipation channel 33, and the heat dissipation fan sequentially form a heat dissipation channel, and the water base inside the single-chip heat sink 4 absorbs and takes away the heat generated by the chip during operation, and discharges it through the heat dissipation fan;

[0030] Furthermore, a mesh-like uniform temperature heat-conducting medium matrix 41 is arranged at the bottom of the power amplifier body on the top of the supporting horizontal plate 31 on both sides of the heat dissipation channel 33. The mesh-like uniform temperature heat-conducting medium matrix 41 is formed of materials such as metal fibers, ceramic powders, carbon powders and graphene to form a mesh structure to improve the thermal conductivity efficiency. The application of the mesh-like uniform temperature heat-conducting medium matrix 41 ensures the stable operation of the equipment and extends its service life. The mesh-like uniform temperature heat-conducting medium matrix 41 has good thermal conductivity and can evenly dissipate heat to the surrounding environment while ensuring the normal operation of the power amplifier equipment, so as to reduce the surface temperature of the power amplifier equipment and discharge the heat in time through the single-chip heat sink 4 and the cooling fan.

[0031] The utility model workflow:

[0032] When in use, the porous structure and large surface area of ​​the three-dimensional nanocellulose layer 20 on the inner wall of the protective box 211 can absorb a large amount of sound waves and provide a high acoustic damping coefficient, thereby achieving an efficient noise reduction effect. A single-chip radiator 4 is arranged at the heat dissipation channel 33. The heat dissipation solution used inside the single-chip radiator 4 is water-based. The water-based heat dissipation solution can effectively absorb and take away the heat generated by the chip during operation, prevent the chip from being overheated and damaged, and ensure the efficient and stable operation of the power amplifier. The air inlet 212, the heat dissipation channel 33, and the heat dissipation fan sequentially form a fan heat channel. The water-based heat dissipation solution inside the single-chip radiator 4 absorbs and takes away the heat generated by the chip during operation and discharges it through the heat dissipation fan.

[0033] A mesh-like uniform temperature heat-conducting medium matrix 41 is arranged on the top of the supporting horizontal plate 31 on both sides of the heat dissipation channel 33 and the bottom of the power amplifier body. The mesh-like uniform temperature heat-conducting medium matrix 41 is formed of materials such as metal fiber, ceramic powder, carbon powder and graphene to form a mesh structure to improve the thermal conductivity efficiency. The application of the mesh-like uniform temperature heat-conducting medium matrix 41 ensures the stable operation of the equipment and extends its service life. The mesh-like uniform temperature heat-conducting medium matrix 41 has good thermal conductivity and can evenly dissipate heat to the surrounding environment while ensuring the normal operation of the power amplifier equipment, so as to reduce the temperature of the surface of the power amplifier equipment and discharge the heat in time through the single-chip heat sink 4 and the cooling fan.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A noise reduction chassis for a power amplifier, comprising a power amplifier body and a noise reduction chassis (21) for reducing noise of the power amplifier body, characterized in that: The noise reduction chassis (21) comprises a protective box (211), an air inlet opening (212) for ventilation is arranged at the lower front side of the protective box (211), a support component for supporting the power amplifier body is arranged inside the protective box (211), a heat dissipation component for dissipating heat from the power amplifier body is arranged at the bottom of the support component, and a noise reduction component for noise reduction is arranged inside the protective box (211).

2. The noise reduction chassis of a power amplifier according to claim 1, characterized in that: The noise reduction component comprises a three-dimensional nanocellulose layer (20), the three-dimensional nanocellulose layer (20) is adhered to the inner wall of the noise reduction chassis (21), and the three-dimensional nanocellulose layer (20) is detachable.

3. The noise reduction chassis of a power amplifier according to claim 1, characterized in that: The support components are symmetrically distributed on both sides of the noise reduction chassis (21), each of the support components comprises a connecting plate (3) connected to the inner walls on both sides of the noise reduction chassis (21), a supporting cross plate (31) is connected between the connecting plates (3), the power amplifier body is located on the top of the two connecting plates (3) on the inner wall, a heat dissipation channel (33) is formed at the bottom of the power amplifier body between the connecting plates (3) on both sides, and the heat dissipation channel (33) is connected to the air inlet channel (212).

4. The noise reduction chassis of a power amplifier according to claim 3, characterized in that: The heat dissipation component comprises a single-chip heat sink (4) and a mesh-shaped uniform temperature heat-conducting medium matrix (41); the single-chip heat sink (4) is located at the bottom of the power amplifier body at the heat dissipation channel (33); and the heat dissipation solution inside the single-chip heat sink (4) is water-based.

5. The noise reduction chassis of a power amplifier according to claim 4, characterized in that: The mesh-shaped uniform temperature heat-conducting medium matrix (41) is located at the top of the supporting horizontal plate (31) and at the bottom of the power amplifier body.

6. The noise reduction chassis of a power amplifier according to claim 1, characterized in that: A heat dissipation fan is arranged on the top of the noise reduction chassis (21), and the heat dissipation fan is connected to the power supply equipment via a wire.

7. The noise reduction chassis of a power amplifier according to claim 1, characterized in that: The air inlet channel opening (212) and the exterior of the heat dissipation fan are both provided with dustproof nets.

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