Radiator and electrical equipment

Abstract

The utility model discloses a radiator and electrical equipment, and belongs to the technical field of heat dissipation. In the radiator, a substrate is used for being mounted on electrical equipment and is provided with a mounting position; the uniform temperature plate is mounted at the mounting position and is used for mounting a power module; the plurality of heat transfer pieces are communicated with the uniform temperature plate, and a phase change medium circulates in the heat transfer pieces; the first fin set comprises a plurality of first fins which are stacked and arranged at intervals and is provided with heat conduction holes, and the heat conduction holes are matched with the heat transfer piece. Through the structural design that the vapor chamber is installed on the substrate, the vapor chamber, the heat transfer piece and the first fin set are assembled, the problem that the vapor chamber and the heat transfer piece are difficult to be directly installed in electrical equipment is solved, a better temperature equalization effect is achieved through the efficient heat transfer capacity of the heat transfer piece, the radiator can transfer heat in the three-dimensional direction, and the heat dissipation efficiency is improved. The cooling capacity of the whole radiator is improved, and meanwhile the influence on the overall structure and size of the radiator is reduced as much as possible.

Description

Technical Field

[0001] The present application belongs to the field of heat dissipation technology, and in particular, relates to a radiator and an electrical device. Background Art

[0002] As the power of electronic devices continues to increase, high-power semiconductor devices are being used more and more widely. The heat generated by the devices during operation has increased significantly. The ever-increasing heat flux density has also put forward higher requirements on the heat dissipation solutions of the devices. In related technologies, electronic devices use vapor chambers or heat pipes for heat dissipation. However, traditional vapor chambers and heat pipes can only conduct heat in one or two dimensions, and their heat dissipation capacity is far from enough for high-power devices. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a radiator and an electrical device, which solves the problem that the temperature averaging plate combined with the heat transfer element is difficult to be directly installed into the electrical device, and uses the efficient heat transfer capacity of the heat transfer element to achieve a better temperature averaging effect, while improving the heat dissipation capacity of the entire radiator, reducing the impact on the overall structure and size of the radiator. .

[0004] In a first aspect, the present application provides a heat sink, comprising:

[0005] A base plate, the base plate is used to be installed on the electrical equipment and is provided with a mounting position;

[0006] A temperature averaging plate, which is installed at the installation position and is used to install the power module;

[0007] A plurality of heat transfer elements, wherein the plurality of heat transfer elements are connected to the temperature homogenizing plate and have a phase change medium flowing therein;

[0008] The first fin group includes a plurality of first fins which are stacked and spaced apart and have heat conduction holes, and the heat conduction holes cooperate with the heat transfer element.

[0009] According to the radiator of the present application, the assembly of the temperature equalizing plate, the heat transfer element and the first fin group is realized through the structural design of the above-mentioned temperature equalizing plate installed on the substrate, which solves the problem that the temperature equalizing plate combined with the heat transfer element is difficult to be directly installed into the electrical equipment. The efficient heat transfer capacity of the heat transfer element is used to achieve a better temperature equalization effect, so that the radiator can transfer heat in three dimensions, while improving the heat dissipation capacity of the entire radiator, while minimizing the impact on the overall structure and size of the radiator.

[0010] According to an embodiment of the present application, there are multiple installation positions, and the temperature averaging plates include multiple temperature averaging plates, which are installed in the multiple installation positions one by one, and each of the temperature averaging plates is connected to the multiple heat transfer elements.

[0011] According to an embodiment of the present application, the substrate includes an assembly portion and a heat dissipation portion which are connected to each other, the mounting position is arranged on the assembly portion, and the heat dissipation portion is provided with a second fin group.

[0012] According to an embodiment of the present application, a fin stacking direction of the first fin group is perpendicular to a fin stacking direction of the second fin group, and an air duct of the first fin group is connected to an air duct of the second fin group.

[0013] According to an embodiment of the present application, the heat transfer element includes a first type of heat transfer element and a second type of heat transfer element, and the length of the first type of heat transfer element is greater than the length of the second type of heat transfer element; the first fin group includes a first type of fin group and a second type of fin group, the first type of fin group is arranged between the second type of fin group and the substrate, the first type of fin group is provided with a first type of heat conductive hole and a second type of heat conductive hole, the second type of fin group is provided with a third type of heat conductive hole, the first type of heat transfer element passes through the first type of heat conductive hole and the third type of heat conductive hole, and the second type of heat transfer element passes through the second type of heat conductive hole.

[0014] According to an embodiment of the present application, the heat transfer element is in a tubular or plate shape.

[0015] According to an embodiment of the present application, when the heat transfer element is in a plate shape, the heat conduction hole is in a strip shape; or, both ends of the heat conduction hole extend to both sides of the first fin group and are open, adjacent first fins are connected by bending portions, and multiple bending portions are staggered.

[0016] According to an embodiment of the present application, the substrate is sealed and connected to the temperature homogenizing plate.

[0017] According to an embodiment of the present application, the substrate is provided with a first opening, the mounting position is located on the surface of the substrate and surrounds the first opening, and the temperature homogenizing plate is attached to the surface of the substrate.

[0018] According to an embodiment of the present application, the temperature equalizing plate is attached to the surface of the substrate on the side away from the first fin group, and the heat transfer element passes through the first opening; or, the temperature equalizing plate is attached to the surface of the substrate on the side close to the first fin group.

[0019] According to an embodiment of the present application, the substrate is provided with a mounting groove, and the temperature equalizing plate is installed on the bottom wall of the mounting groove.

[0020] According to an embodiment of the present application, a first opening is provided on the bottom wall of the mounting groove, and the first opening is spaced apart from the side walls of the mounting groove in all directions.

[0021] According to an embodiment of the present application, the notch of the installation slot faces a side away from the first fin group, and the heat transfer element passes through the first opening; or, the notch of the installation slot faces a side close to the first fin group.

[0022] According to one embodiment of the present application, with the notch of the mounting groove facing the side close to the first fin group, one side of the mounting groove is open on the side of the substrate, and the side walls on the other sides of the mounting groove are provided with inwardly protruding support plates, and the support plates are spaced apart from the bottom wall of the mounting groove, and the temperature equalizing plate is installed between the bottom wall of the mounting groove and the support plate.

[0023] According to one embodiment of the present application, the heat sink further includes:

[0024] The cover plate is connected to the base plate and used to block the mounting groove when the notch of the mounting groove faces the side away from the first fin group. The cover plate is provided with a second opening, and the second opening is arranged opposite to the first opening.

[0025] According to an embodiment of the present application, the installation groove faces a side away from the first fin group, and a avoidance hole is provided on the bottom wall of the installation groove, and the heat transfer element passes through the avoidance hole.

[0026] In a second aspect, the present application provides an electrical device, the electrical device comprising:

[0027] A radiator as any one of the above;

[0028] A box body, wherein the radiator is installed in the box body through the substrate;

[0029] A power module is mounted on a temperature averaging plate of the radiator.

[0030] According to the electrical equipment of the present application, the assembly of the temperature equalizing plate, the heat transfer element and the first fin group is realized through the setting of the above-mentioned radiator, and the efficient heat transfer capacity of the heat transfer element is utilized to achieve a better temperature equalization effect, so that the radiator can transfer heat in three-dimensional directions, while improving the heat dissipation capacity of the entire radiator, the impact on the overall structure and size of the radiator is minimized as much as possible.

[0031] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0033] Figure 1 This is one of the structural exploded diagrams of the radiator provided in the embodiment of the present application;

[0034] Figure 2 This is the second structural explosion diagram of the radiator provided in the embodiment of the present application;

[0035] Figure 3 This is the third structural explosion diagram of the radiator provided in the embodiment of the present application;

[0036] Figure 4 This is the fourth structural explosion diagram of the radiator provided in the embodiment of the present application;

[0037] Figure 5 This is the fifth structural explosion diagram of the radiator provided in the embodiment of the present application;

[0038] Figure 6 This is the sixth structural explosion diagram of the radiator provided in the embodiment of the present application;

[0039] Figure 7 yes Figure 6 A partial structural schematic diagram of the first fin group in FIG.

[0040] Figure 8 This is the seventh structural explosion diagram of the radiator provided in the embodiment of the present application;

[0041] Fig. 9 This is the eighth structural explosion diagram of the radiator provided in the embodiment of the present application;

[0042] Fig.10 This is the ninth structural exploded diagram of the radiator provided in the embodiment of the present application;

[0043] Fig.11 This is the tenth structural explosion diagram of the radiator provided in the embodiment of the present application;

[0044] Fig.12 This is the eleventh structural explosion diagram of the radiator provided in the embodiment of the present application;

[0045] Fig.13 This is the twelfth structural explosion diagram of the radiator provided in the embodiment of the present application;

[0046] Fig.14 This is the thirteenth structural explosion diagram of the radiator provided in the embodiment of the present application;

[0047] Fig.15 It is one of the structural schematic diagrams of the electrical equipment provided in the embodiment of the present application;

[0048] Fig.16 This is the second structural schematic diagram of the electrical equipment provided in the embodiment of the present application.

[0049] Reference numerals:

[0050] Electrical equipment 10;

[0051] Radiator 100, temperature averaging plate 120, second fin set 150, sealing member 170;

[0052] Base plate 110, mounting position 111, assembly portion 112, heat dissipation portion 113, first opening 114, mounting groove 115, support plate 116, avoidance hole 117;

[0053] Heat transfer element 130, first type heat transfer element 131, second type heat transfer element 132;

[0054] A first fin group 140, a heat conducting hole 141, a first type of fin group 142, a first type of heat conducting hole 143, a second type of heat conducting hole 144, a second type of fin group 145, a third type of heat conducting hole 146, a bending portion 147, and a first fin 148;

[0055] Cover plate 160, second opening 161;

[0056] Box body 200 and power module 300 . DETAILED DESCRIPTION

[0057] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0058] The present application discloses a heat sink 100 .

[0059] Reference below Figure 1-Figure 16 A heat sink 100 according to an embodiment of the present application is described.

[0060] In some embodiments, Figure 1-Figure 6 and Figure 8-Figure 14 As shown, the heat sink 100 includes: a base plate 110 , a temperature-averaging plate 120 , a first fin group 140 and a plurality of heat transfer elements 130 .

[0061] The substrate 110 is used to be installed on the electrical device 10, and the substrate 110 is provided with a mounting position 111; the temperature averaging plate 120 is installed on the mounting position 111, and the temperature averaging plate 120 is used to install the power module 300; a plurality of heat transfer elements 130 are connected to the temperature averaging plate 120, and a phase change medium flows inside; the first fin group 140 includes a plurality of first fins 148 stacked and spaced apart, and the first fin group 140 has a heat conduction hole 141, and the heat conduction hole 141 cooperates with the heat transfer element 130.

[0062] The connection method between the temperature plate 120 and the substrate 110 may include, but is not limited to, welding, bonding, bolt connection or interference fit, etc., which are not limited here. For example, in some embodiments, Figure 2-Figure 6 and Figure 8-Figure 14 As shown, the connection between the temperature homogenizing plate 120 and the base plate 110 is bolted.

[0063] The stacking direction of the plurality of first fins 148 may be consistent with the extension direction of the heat transfer element 130 , the heat transfer element 130 may pass through the heat conductive hole 141 , and the heat transfer element 130 may contact the inner wall of the heat conductive hole 141 to achieve heat exchange between the heat transfer element 130 and the first fin group 140 through the heat conductive hole 141 .

[0064] The heat transfer element 130 may be provided in plurality, where a plurality means two or more. For example, in some embodiments, the heat transfer element 130 may be provided in 30 pieces; in other embodiments, Figure 5-Figure 6 As shown, three heat transfer elements 130 may be provided.

[0065] The shape of the heat conducting hole 141 may include but is not limited to a circle, a square or a triangle, etc., which is not limited here.

[0066] In actual implementation, Figure 1-Figure 6 and Figure 8-Figure 14 As shown, the power module 300 of the electrical device 10 can be installed on the temperature averaging plate 120, the first fin group 140 and the plurality of heat transfer members 130 can be installed on the substrate 110 through the temperature averaging plate 120, the temperature averaging plate 120, the first fin group 140 and the plurality of heat transfer members 130 can be installed on the electrical device 10 through the substrate 110, when the electrical device 10 is in operation, the power module 300 will emit a large amount of heat, based on the power module 300 being installed on the temperature averaging plate 120, the low-temperature liquid phase change medium in the temperature averaging plate 120 can The heat emitted by the power module 300 is absorbed, thereby heating up and evaporating to become a high-temperature gaseous phase-change medium. The high-temperature gaseous phase-change medium can flow into multiple heat transfer elements 130 respectively. The multiple heat transfer elements 130 can transfer the heat to the first fin group 140 through the heat conduction holes 141. The first fin group 140 can dissipate the heat by air cooling. At this time, the high-temperature gaseous phase-change medium releases heat and condenses to become a low-temperature liquid phase-change medium. The low-temperature liquid phase-change medium can flow back to the temperature homogenizing plate 120 to enter the next thermal cycle.

[0067] The heat sink 100 provided in the embodiment of the present application realizes the assembly of the temperature averaging plate 120, the heat transfer element 130 and the first fin group 140 through the structural design of the above-mentioned temperature averaging plate 120 installed on the substrate 110, solves the problem that the temperature averaging plate 120 combined with the heat transfer element 130 is difficult to be directly installed into the electrical equipment 10, and utilizes the efficient heat transfer capability of the heat transfer element 130 to achieve a better temperature equalization effect, so that the heat sink 100 can transfer heat in three dimensions, while improving the heat dissipation capability of the entire heat sink 100, the impact on the overall structure and size of the heat sink 100 is minimized as much as possible.

[0068] In some embodiments, Figure 2-Figure 3 As shown, there may be multiple installation positions 111 , and multiple temperature averaging plates 120 may be included. Multiple temperature averaging plates 120 may be installed in multiple installation positions 111 in a one-to-one correspondence, and each temperature averaging plate 120 may be connected to multiple heat transfer elements 130 .

[0069] Wherein, a plurality is 2 or more, for example, in some embodiments, such as Figure 2-Figure 3 As shown, there may be three installation positions 111 , and three temperature averaging plates 120 . The three temperature averaging plates 120 may be installed in the three installation positions 111 in a one-to-one correspondence.

[0070] The multiple installation positions 111 may be arranged separately. Specifically, the multiple installation positions 111 may be arranged side by side, or the multiple installation positions 111 may be arranged in a staggered manner, which is not limited here.

[0071] The heat sink 100 provided in the embodiment of the present application has a structural design of installing multiple temperature averaging plates 120 on the above-mentioned single substrate 110, so that multiple temperature averaging plates 120, multiple heat transfer elements 130 and multiple first fin groups 140 can be installed in the electrical device 10 with only one substrate 110. For electrical devices 10 with higher power, multiple temperature averaging plates 120 can quickly dissipate the heat accumulated inside the device, further improving the heat exchange capacity of the entire heat sink 100, meeting the heat dissipation requirements of high-power devices, and thus significantly increasing the usage width of the entire heat sink 100.

[0072] In some embodiments, Figure 3 As shown, the substrate 110 may include a mounting portion 112 and a heat dissipation portion 113 connected to each other, the mounting position 111 may be disposed on the mounting portion 112 , and the heat dissipation portion 113 may be provided with a second fin set 150 .

[0073] In this embodiment, the temperature equalizing plate 120 can be installed on the assembly part 112 through the mounting position 111, and the second fin group 150 can be set on the heat dissipation part 113 by integrated molding or other methods. The heat can be dissipated by air cooling through the first fin group 140. At the same time, the heat can also be transferred from the temperature equalizing plate 120 to the substrate 110, and the heat transferred to the substrate 110 can be dissipated through the second fin group 150.

[0074] The radiator 100 provided in the embodiment of the present application, through the setting of the above-mentioned second fin group 150, combined with the setting of the first fin group 140, provides multiple heat transfer paths for heat dissipation, further enhances the heat diffusion capacity in the three-dimensional direction, directly increases the contact area between the radiator 100 and the external air, thereby optimizing the heat dissipation effect.

[0075] In some embodiments, Figure 3 As shown, the fin stacking direction of the first fin group 140 may be perpendicular to the fin stacking direction of the second fin group 150 , and the air duct of the first fin group 140 may be connected to the air duct of the second fin group 150 .

[0076] In this embodiment, if Figure 3 As shown, a plurality of first fins 148 can be stacked and spaced apart along a first direction, a plurality of second fins can be stacked and spaced apart along a second direction, the first direction can be perpendicular to the second direction, and the air duct of the first fin group 140 can be connected to the air duct of the second fin group 150, and external air can flow between the air duct of the first fin group 140 and the air duct of the second fin group 150.

[0077] In other embodiments, multiple first fins 148 can be stacked and spaced apart along a first direction, multiple second fins can be stacked and spaced apart along a second direction, the first direction can be parallel to the second direction, and the air duct of the first fin group 140 can be connected to the air duct of the second fin group 150, and external air can circulate between the air duct of the first fin group 140 and the air duct of the second fin group 150.

[0078] The radiator 100 provided in the embodiment of the present application, through the air duct arrangement of the above-mentioned first fin group 140 and the second fin group 150, allows external air to circulate between the air duct of the first fin group 140 and the air duct of the second fin group 150, thereby reducing the wind resistance during heat exchange between the external air and the first fin group 140 and the second fin group 150, accelerating the speed of air circulation, and thus improving the heat exchange efficiency.

[0079] In some embodiments, Figure 4As shown, the heat transfer element 130 may include a first type of heat transfer element 131 and a second type of heat transfer element 132, and the length of the first type of heat transfer element 131 may be greater than the length of the second type of heat transfer element 132; the first fin group 140 may include a first type of fin group 142 and a second type of fin group 145, the first type of fin group 142 may be arranged between the second type of fin group 145 and the substrate 110, the first type of fin group 142 may be provided with a first type of heat conductive hole 143 and a second type of heat conductive hole 144, the second type of fin group 145 may be provided with a third type of heat conductive hole 146, the first type of heat transfer element 131 may pass through the first type of heat conductive hole 143 and the third type of heat conductive hole 146, and the second type of heat transfer element 132 may pass through the second type of heat conductive hole 144.

[0080] In this embodiment, if Figure 4 As shown, the fin area of ​​the first type of fin group 142 can be greater than the fin area of ​​the second type of fin group 145. Based on the fact that the second type of fin group 145 is located on the side of the first type of fin group 142 away from the temperature equilibrium plate 120, the longer first type of heat transfer element 131 can penetrate both the first type of fin group 142 and the second type of fin group 145 at the same time, and the shorter second type of heat transfer element 132 can penetrate the first type of fin group 142. The first type of heat transfer element 131 can be located in the middle part of the temperature equilibrium plate 120, and the second type of heat transfer element 132 can be located at the edge part of the temperature equilibrium plate 120.

[0081] The medium flow cross-sectional areas or arrangement densities of the first type of heat transfer elements 131 and the second type of heat transfer elements 132 may be different, which is not limited here.

[0082] The heat sink 100 provided in the embodiment of the present application realizes the coordination of heat transfer elements 130 of different lengths and fin groups of different sizes through the arrangement of the above-mentioned first-type heat transfer elements 131, the second-type heat transfer elements 132, the first-type fin group 142, the second-type fin group 145, the first-type heat conductive holes 143, the second-type heat conductive holes 144 and the third-type heat conductive holes 146, so that the heat transfer area of ​​the heat transfer element 130 in the high-temperature concentrated area is larger than the heat transfer area in other areas, thereby realizing targeted heat dissipation according to the temperature division area.

[0083] In some embodiments, Figure 1-Figure 6 and Figure 8-Figure 14 As shown, the heat transfer element 130 may be in a tube shape or a plate shape.

[0084] For example, in some embodiments, Figure 1-Figure 4 and Figure 8-Figure 14 As shown, the heat transfer element 130 may be tubular, and correspondingly, the shape of the heat conduction hole 141 may be circular.

[0085] For example, in other embodiments, Figure 5-Figure 6As shown, the heat transfer element 130 may be in a plate shape, and correspondingly, the shape of the heat conduction hole 141 may be in a strip shape.

[0086] The radiator 100 provided in the embodiment of the present application, through the shape design of the above-mentioned heat transfer element 130, can select heat transfer elements 130 of different structures for manufacturing according to actual needs, thereby increasing the flexibility of the entire radiator 100 during production, and utilizing the heat pipe structure or the heat plate structure to expand the circulation area of ​​the phase change medium, thereby comprehensively enhancing the heat dissipation capacity of the radiator 100 in terms of structural design.

[0087] In some embodiments, Figure 5-Figure 7 As shown, when the heat transfer element 130 is in the shape of a plate, the heat conducting hole 141 can be in the shape of an elongated strip; or, both ends of the heat conducting hole 141 can extend to both sides of the first fin group 140 and be openly arranged, and adjacent first fins 148 can be connected by a bending portion 147, and multiple bending portions 147 can be arranged in a staggered manner.

[0088] In some embodiments, Figure 5 As shown, when the heat transfer element 130 is in plate shape, the heat conduction hole 141 can be in strip shape. Specifically, the heat transfer element 130 does not penetrate the large surface of the first fins 148 in the first fin group 140 as a whole, and the side wall of the heat conduction hole 141 is not open to the outside.

[0089] In other embodiments, Figure 6-Figure 7 As shown, in the case where the heat transfer element 130 is in a plate shape, the two ends of the heat conduction hole 141 can extend to the two sides of the first fin group 140 and be open. Specifically, the heat transfer element 130 as a whole passes through the large surface of multiple first fins 148 in the first fin group 140, and the two ends of the heat conduction hole 141 are open to the outside. At this time, the first fin group 140 is cut by the heat transfer element 130 into multiple small fin groups that are separated and arranged, and a bending portion 147 is provided between two adjacent first fins 148 in each small fin group. The bending portion 147 can be bent at a right angle relative to the first fin 148, and the multiple bending portions 147 are not distributed in a straight line in the thickness direction of the first fin 148.

[0090] The heat sink 100 provided in the embodiment of the present application increases the heat exchange area between the first fin group 140 and the heat transfer element 130 through the structural design of the above-mentioned heat conduction holes 141 and the first fin group 140, improves the heat exchange efficiency between the first fin group 140 and the heat transfer element 130, and reduces the number of spare parts used to fix the first fin group 140 and the heat transfer element 130, thereby saving material costs and improving production efficiency.

[0091] In some embodiments, Figure 1-Figure 6 and Figure 8-Figure 14 As shown, the substrate 110 and the temperature homogenizing plate 120 may be sealed and connected.

[0092] The connection method between the temperature homogenizing plate 120 and the substrate 110 may include, but is not limited to, welding, bonding, bolt connection, or interference fit, etc., which is not limited here.

[0093] For example, Figure 2-Figure 6 and Figure 8-Figure 14 As shown, when the connection between the temperature homogenizing plate 120 and the substrate 110 is bolted, a sealing member 170 may be provided between the substrate 110 and the temperature homogenizing plate 120 .

[0094] When the connection between the temperature evaporating plate 120 and the substrate 110 is performed by welding, there is no need to provide a sealing member 170 between the substrate 110 and the temperature evaporating plate 120 .

[0095] When the connection between the temperature evaporating plate 120 and the substrate 110 is by bonding, there is no need to provide a sealing member 170 between the substrate 110 and the temperature evaporating plate 120 .

[0096] When the connection between the temperature evaporating plate 120 and the substrate 110 is interference fit, a sealing member 170 may be disposed between the substrate 110 and the temperature evaporating plate 120 .

[0097] The sealing member 170 may include but is not limited to a sealing ring, a sealing gasket, a sealant or a soft filler, etc., which is not limited here.

[0098] The heat sink 100 provided in the embodiment of the present application, through the design of the sealed connection between the above-mentioned substrate 110 and the temperature equalizing plate 120, can choose whether to introduce the seal 170 according to different actual connection methods, so as to prevent impurities in the external environment from entering the electrical device 10 through the gap between the substrate 110 and the temperature equalizing plate 120, thereby improving the waterproof and dustproof capabilities to meet the protection level requirements of the electrical device 10, thereby extending the service life of the entire electrical device 10.

[0099] In some embodiments, Figure 8-Figure 9 As shown, the substrate 110 may be provided with a first opening 114 , the mounting position 111 may be located on the surface of the substrate 110 and surround the first opening 114 , and the temperature homogenizing plate 120 may be attached to the surface of the substrate 110 .

[0100] In this embodiment, if Figure 8-Figure 9 As shown, the contact surface between the temperature plate 120 and the substrate 110 is the surface of the substrate 110 , and the contact surface between the temperature plate 120 and the substrate 110 surrounds the first opening 114 . The temperature plate 120 can be attached to any side of the substrate 110 , and the seal 170 can be set around the first opening 114 .

[0101] The heat sink 100 provided in the embodiment of the present application simplifies the overall structure of the substrate 110 through the structural design of the above-mentioned mounting position 111 and the first opening 114, and requires less modification to the existing structure of the substrate 110, thereby achieving an overall miniaturized design and a lightweight design while reducing the difficulty of processing.

[0102] In some embodiments, Figure 8-Figure 9 As shown, the temperature plate 120 can be attached to the surface of the substrate 110 on the side away from the first fin group 140, and the heat transfer element 130 can pass through the first opening 114; or, the temperature plate 120 can be attached to the surface of the substrate 110 on the side close to the first fin group 140.

[0103] In some embodiments, Figure 8 As shown, the temperature equalizing plate 120 can be attached to the surface of the substrate 110 away from the first fin group 140, the substrate 110 can avoid multiple heat transfer components 130 through the first opening 114, and the sealing component 170 can be arranged on the periphery of the first opening 114 away from the first fin group 140.

[0104] In other embodiments, Fig. 9 As shown, the temperature equalizing plate 120 can be attached to the surface of the substrate 110 on the side close to the first fin group 140. At this time, the temperature equalizing plate 120 and the heat transfer element 130 are both located on the side of the substrate 110 away from the first fin group 140. The substrate 110 can avoid the power module through the first opening 114, that is, the power module can be installed on the temperature equalizing plate 120 through the first opening 114, and the sealing element 170 can be arranged on the periphery of the first opening 114 on the side close to the first fin group 140.

[0105] The heat sink 100 provided in the embodiment of the present application is designed with the above-mentioned bonding method of the temperature equalizing plate 120 and the substrate 110, so that when the substrate 110 is provided with a first opening 114, the temperature equalizing plate 120 can be bonded to any side of the substrate 110, without changing the structure of the substrate 110 according to different schemes. Without affecting the existing structure, the diversity and flexibility of the assembly of the temperature equalizing plate 120 and the substrate 110 are increased.

[0106] In some embodiments, Figure 10-Figure 14 As shown, the substrate 110 may be provided with a mounting groove 115 , and the temperature homogenizing plate 120 may be installed on the bottom wall of the mounting groove 115 .

[0107] In this embodiment, if Figure 10-Figure 14As shown, the temperature equalizing plate 120 can be embedded in the substrate 110 through the mounting groove 115. The mounting groove 115 can be set on any side of the substrate 110. The contact surface between the temperature equalizing plate 120 and the substrate 110 can be the bottom wall and side wall of the mounting groove 115. The mounting position 111 can be the bottom wall of the mounting groove 115. The sealing member 170 can be set on the bottom wall of the mounting groove 115.

[0108] The heat sink 100 provided in the embodiment of the present application realizes that the temperature equalizing plate 120 is embedded in the substrate 110 through the installation groove 115 through the setting of the above-mentioned installation groove 115. The overall structure is simple and the functional divisions are clear. At the same time, compared with the direct bonding method, the overall thickness of the temperature equalizing plate 120 and the substrate 110 is reduced after assembly, thereby reducing the volume of the heat sink 100, which is beneficial to the spatial layout, and directly increases the contact area between the temperature equalizing plate 120 and the substrate 110, thereby significantly improving the heat transfer efficiency between the temperature equalizing plate 120 and the substrate 110.

[0109] In some embodiments, Figure 10-13 As shown, the bottom wall of the mounting groove 115 may be provided with a first opening 114 , and the first opening 114 may be spaced apart from the side walls of the mounting groove 115 in all directions.

[0110] like Figure 10-13 As shown, the size of the first opening 114 can be smaller than the slot size of the mounting slot 115, and the projection of the mounting slot 115 on the substrate 110 can cover the projection of the first opening 114 on the substrate 110, so that a step surface is formed between the first opening 114 and the mounting slot 115. When the temperature equalizing plate 120 is installed in the mounting slot 115, the edges of the temperature equalizing plate 120 can overlap the step surface. When the connection method between the temperature equalizing plate 120 and the substrate 110 is a bolt connection, a threaded hole can be set on the step surface.

[0111] The heat sink 100 provided in the embodiment of the present application, through the setting of the above-mentioned first opening 114, allows the temperature equalizing plate 120 to overlap the step surface formed by the installation groove 115 and the first opening 114, thereby enhancing the reliability of the installation of the temperature equalizing plate 120 and simplifying the overall structure of the substrate 110. The modification effort on the existing structure of the substrate 110 is relatively small, thereby achieving an overall miniaturized design and a lightweight design.

[0112] In some embodiments, Figure 10-13 As shown, the notch of the installation slot 115 may face the side away from the first fin set 140 , and the heat transfer element 130 may pass through the first opening 114 ; or, the notch of the installation slot 115 may face the side close to the first fin set 140 .

[0113] In some embodiments, Fig.10 and Fig.13As shown, the slot of the mounting slot 115 can face the side away from the first fin group 140, the substrate 110 can avoid multiple heat transfer components 130 through the first opening 114, and the sealing component 170 can be arranged on the bottom wall of the mounting slot 115 and located on the periphery of the side of the first opening 114 away from the first fin group 140.

[0114] In other embodiments, Figure 11-Figure 12 As shown, the notch of the mounting groove 115 can be oriented toward a side close to the first fin group 140, and the substrate 110 can avoid the power module through the first opening 114, that is, the power module can be installed on the temperature equalizing plate 120 through the first opening 114, and the seal 170 can be arranged on the bottom wall of the mounting groove 115, and located on the periphery of the first opening 114 close to the first fin group 140.

[0115] The heat sink 100 provided in the embodiment of the present application is designed with the above-mentioned arrangement of the mounting groove 115, so that when the substrate 110 is provided with a first opening 114, the notch of the mounting groove 115 can be oriented toward any side of the substrate 110, without changing the structure of the substrate 110 according to different schemes. Without affecting the existing structure, the diversity and flexibility of the assembly of the temperature equalizing plate 120 and the substrate 110 are increased.

[0116] In some embodiments, Fig.12 As shown, when the notch of the mounting groove 115 faces the side close to the first fin group 140, one side of the mounting groove 115 can be open on the side of the substrate 110, and the side walls on the other sides of the mounting groove 115 can be provided with a support plate 116 protruding inward, and the support plate 116 can be spaced apart from the bottom wall of the mounting groove 115, and the temperature equalizing plate 120 can be installed between the bottom wall of the mounting groove 115 and the support plate 116.

[0117] In this embodiment, if Fig.12 As shown, one side of the mounting groove 115 can be open on the side of the substrate 110, and the side walls of the other three sides of the mounting groove 115 can be provided with a support plate 116 protruding inward, so that the substrate 110 and the temperature averaging plate 120 can form a drawer structure, and the temperature averaging plate 120 can be pushed in from the open side of the mounting groove 115, and the temperature averaging plate 120 can also be pulled out from the open side of the mounting groove 115. When the connection between the temperature averaging plate 120 and the substrate 110 is a bolt connection, threaded holes can be set on the bottom wall of the mounting groove 115 and the support plate 116, and the seal 170 can be set on the bottom wall of the mounting groove 115.

[0118] The heat sink 100 provided in the embodiment of the present application, through the arrangement of the above-mentioned support plate 116, forms a limiting effect on the temperature equalizing plate 120 at the notch of the mounting groove 115, so that the temperature equalizing plate 120 can enter and exit the mounting groove 115 from the open side of the mounting groove 115 by pushing and pulling, thereby reducing the difficulty of assembly, thereby improving the processing efficiency of the entire heat sink 100, and further improving the stability of the connection between the temperature equalizing plate 120 and the substrate 110.

[0119] In some embodiments, Fig.13 As shown, the heat sink 100 may further include a cover plate 160 .

[0120] When the notch of the mounting groove 115 faces the side away from the first fin group 140 , the cover plate 160 can be connected to the base plate 110 , the cover plate 160 can be used to block the mounting groove 115 , and the cover plate 160 can be provided with a second opening 161 , and the second opening 161 can be arranged opposite to the first opening 114 .

[0121] The cover plate 160 and the base plate 110 may be detachably connected. Specifically, the connection method between the cover plate 160 and the base plate 110 may include but is not limited to bolt connection, snap connection or pin connection, etc., which is not limited here.

[0122] In this embodiment, if Fig.13 As shown, the notch of the mounting groove 115 can be oriented toward a side away from the first fin group 140, and a receiving cavity can be defined between the cover plate 160 and the substrate 110, and the temperature averaging plate 120 can be installed in the receiving cavity. The substrate 110 can avoid the plurality of heat transfer members 130 through the first opening 114, and the power module can be installed on the temperature averaging plate 120 through the second opening 161 of the cover plate 160. When the connection between the temperature averaging plate 120 and the substrate 110 is bolted, the cover plate 160 and the temperature averaging plate 120 are connected. Both the temperature plate 120 and the base plate 110 may be provided with threaded holes, and the threaded connecting parts may penetrate the threaded holes of the cover plate 160, the threaded holes of the temperature averaging plate 120 and the threaded holes of the base plate 110, thereby simultaneously realizing a detachable connection between the cover plate 160 and the temperature averaging plate 120, and a sealing member 170 may be provided between the temperature averaging plate 120 and the cover plate 160 and between the temperature averaging plate 120 and the base plate 110. In other words, a sealing member 170 may be provided on the bottom wall of the mounting groove 115 and the support plate 116.

[0123] The heat sink 100 provided in the embodiment of the present application realizes that the temperature averaging plate 120 is clamped between the cover plate 160 and the substrate 110 through the arrangement of the above-mentioned cover plate 160, so that the installation groove 115 forms a accommodating cavity for installing the temperature averaging plate 120 under the sealing action of the cover plate 160, and the threaded connector can simultaneously connect the cover plate 160, the temperature averaging plate 120 and the substrate 110, thereby reducing the use of spare parts, saving material costs, and increasing the number of sealing components 170, further improving the waterproof and dustproof capabilities to meet the protection level requirements of the electrical device 10, thereby extending the service life of the entire electrical device 10.

[0124] In some embodiments, Fig.14 As shown, the installation groove 115 may face the side away from the first fin group 140 , and the bottom wall of the installation groove 115 may be provided with an avoidance hole 117 , and the heat transfer element 130 may pass through the avoidance hole 117 .

[0125] When the heat transfer element 130 is in a tubular shape, the avoidance hole 117 may be circular; when the heat transfer element 130 is in a plate shape, the avoidance hole 117 may be in a strip shape.

[0126] In this embodiment, if Fig.14 As shown, the temperature equalizing plate 120 can be embedded in the side of the substrate 110 facing away from the first fin group 140 through the mounting groove 115, the contact surface between the temperature equalizing plate 120 and the substrate 110 can be the bottom wall and side wall of the mounting groove 115, the mounting position 111 can be the bottom wall of the mounting groove 115, the sealing member 170 can be arranged on the bottom wall of the mounting groove 115, and the multiple heat transfer members 130 correspond one by one to the multiple avoidance holes 117.

[0127] The heat sink 100 provided in the embodiment of the present application, through the setting of the above-mentioned avoidance holes 117, directly increases the contact area between the temperature equalizing plate 120 and the substrate 110 compared to the design of large-area perforations on the bottom wall of the mounting groove 115, thereby significantly improving the heat transfer efficiency between the temperature equalizing plate 120 and the substrate 110, and further comprehensively optimizing the heat dissipation capacity of the entire heat sink 100.

[0128] The present application also discloses an electrical device 10 .

[0129] In some embodiments, Figure 15-16 As shown, the electrical device 10 includes: a housing 200, a power module 300 and a heat sink 100 as described above.

[0130] The heat sink 100 is installed in the housing 200 via the substrate 110 ; the power module 300 is installed on the temperature averaging plate 120 of the heat sink 100 .

[0131] like Figure 15-16As shown, the heat transfer element 130 and the first fin group 140 of the radiator 100 can face the outside of the box body 200. When the substrate 110 is provided with a second fin group 150, the second fin group 150 can face the outside of the box body 200. The substrate 110 can be installed on the box body 200 by bolting or other means. The power module can be installed on the temperature plate 120 by bolting or other means. The electrical equipment 10 also includes multiple heating devices and multiple fans. The multiple heating devices can be installed in the box body 200 near the radiator 100. The multiple fans can be installed in at least one of the inside and outside of the box body 200. When a fan is provided outside the box body 200, the fan can blow or suck air toward the first fin group 140 and the second fin group 150 to accelerate the heat dissipation rate.

[0132] It should be noted that the electrical device 10 may be an electric power conversion device. Specifically, the electrical device 10 may include but is not limited to a converter, an inverter or a transformer, etc., which is not limited here.

[0133] The electrical device 10 provided in the embodiment of the present application realizes the assembly of the temperature equalizing plate 120, the heat transfer element 130 and the first fin group 140 through the setting of the above-mentioned heat sink 100, and utilizes the efficient heat transfer capability of the heat transfer element 130 to achieve a better temperature equalization effect, so that the heat sink 100 can transfer heat in three-dimensional directions, while improving the heat dissipation capability of the entire heat sink 100, the impact on the overall structure and size of the heat sink 100 is minimized as much as possible.

[0134] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0135] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0136] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0137] In the description of the present application, “plurality” means two or more.

[0138] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0139] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0140] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0141] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A radiator, characterized in that: include: A base plate, the base plate is used to be installed on the electrical equipment and is provided with a mounting position; A temperature averaging plate, which is installed at the installation position and is used to install the power module; A plurality of heat transfer elements, wherein the plurality of heat transfer elements are connected to the temperature homogenizing plate and have a phase change medium flowing therein; The first fin group includes a plurality of first fins which are stacked and spaced apart and have heat conduction holes, and the heat conduction holes cooperate with the heat transfer element.

2. The heat sink according to claim 1, characterized in that: There are multiple installation positions, and the temperature averaging plates include multiple ones. The multiple temperature averaging plates are installed in the multiple installation positions one by one, and each of the temperature averaging plates is connected to the multiple heat transfer elements.

3. The heat sink according to claim 1, characterized in that: The base plate comprises a mounting portion and a heat dissipation portion which are connected to each other. The mounting position is arranged on the mounting portion, and the heat dissipation portion is provided with a second fin group.

4. The heat sink according to claim 3, characterized in that: The fin stacking direction of the first fin group is perpendicular to the fin stacking direction of the second fin group, and the air duct of the first fin group is communicated with the air duct of the second fin group.

5. The heat sink according to claim 1, characterized in that The heat transfer element includes a first type of heat transfer element and a second type of heat transfer element, and the length of the first type of heat transfer element is greater than the length of the second type of heat transfer element; the first fin group includes a first type of fin group and a second type of fin group, the first type of fin group is arranged between the second type of fin group and the substrate, the first type of fin group is provided with a first type of heat conductive hole and a second type of heat conductive hole, the second type of fin group is provided with a third type of heat conductive hole, the first type of heat transfer element passes through the first type of heat conductive hole and the third type of heat conductive hole, and the second type of heat transfer element passes through the second type of heat conductive hole.

6. The heat sink according to claim 1, characterized in that The heat transfer element is in a tube shape or a plate shape.

7. The heat sink according to claim 6, characterized in that When the heat transfer element is in the form of a plate, The heat conducting hole is in the shape of an elongated strip; or, Two ends of the heat conduction hole extend to two sides of the first fin group and are openly arranged. Adjacent first fins are connected via bending portions, and a plurality of the bending portions are arranged in a staggered manner.

8. The heat sink according to claim 1, characterized in that The substrate is sealed and connected to the temperature homogenizing plate.

9. The radiator according to any one of claims 1 to 8, characterized in that: The substrate is provided with a first opening, the mounting position is located on the surface of the substrate and surrounds the first opening, and the temperature averaging plate is attached to the surface of the substrate.

10. The heat sink according to claim 9, characterized in that The temperature equalizing plate is attached to the surface of the substrate on the side away from the first fin group, and the heat transfer element passes through the first opening; or, The temperature equalizing plate is attached to a surface of the substrate on a side close to the first fin group.

11. The radiator according to any one of claims 1 to 8, characterized in that: The base plate is provided with a mounting groove, and the temperature equalizing plate is mounted on the bottom wall of the mounting groove.

12. The heat sink according to claim 11, characterized in that The bottom wall of the mounting groove is provided with a first opening, and the first opening is spaced apart from the side walls of the mounting groove in all directions.

13. The heat sink according to claim 12, characterized in that The notch of the mounting slot faces a side away from the first fin group, and the heat transfer element passes through the first opening; or, The notch of the mounting slot faces a side close to the first fin group.

14. The heat sink according to claim 13, characterized in that When the notch of the mounting groove faces the side close to the first fin group, one side of the mounting groove is open on the side of the substrate, and the side walls on the other sides of the mounting groove are provided with inwardly protruding support plates, and the support plates are spaced apart from the bottom wall of the mounting groove, and the temperature equalizing plate is installed between the bottom wall of the mounting groove and the support plates.

15. The heat sink according to claim 13, characterized in that Also includes: The cover plate is connected to the base plate and used to block the mounting groove when the notch of the mounting groove faces the side away from the first fin group. The cover plate is provided with a second opening, and the second opening is arranged opposite to the first opening.

16. The heat sink according to claim 11, characterized in that The installation groove faces a side away from the first fin group, and a avoidance hole is provided on the bottom wall of the installation groove, and the heat transfer element passes through the avoidance hole.

17. An electrical device, characterized in that: include: The radiator according to any one of claims 1 to 16; A box body, wherein the radiator is installed in the box body through the substrate; A power module is mounted on a temperature averaging plate of the radiator.

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