Optocoupler packaging support

Abstract

The utility model discloses an optocoupler packaging support, which relates to the technical field of semiconductor packaging and comprises a support body, a plastic sheath, a heat dissipation mechanism and a packaging unit. The plastic outer skin is arranged on the outer surface of the support body, filter paper is laid on the top of the plastic outer skin, a heat dissipation box is fixedly connected to the bottom of the inner wall of the support body, an air inlet groove is formed in the top of the heat dissipation box, and nozzles are formed in the bottom of the heat dissipation box and the bottom of the support body. The heat dissipation mechanism is fixedly arranged at the bottom of the inner wall of the heat dissipation box and used for dissipating heat of the optocoupler in work. By applying voltage to the two piezoelectric ceramics, the two metal sheets connected with the piezoelectric ceramics are periodically, synchronously and reversely deformed, so that under the arrangement of the air inlet groove and the nozzle, the working cycle of air injection and air suction is completed, the bottom of the support is cooled, the heat dissipation performance is improved, meanwhile, the structure is simple, and the cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to an optical coupling packaging bracket. Background Art

[0002] Optocoupler packaging refers to the assembly and packaging of the chip, pins and other necessary components of the optocoupler device (i.e., photocoupler) to protect the chip and provide a stable electrical connection. The main purpose of optocoupler packaging is to ensure that the optocoupler device can work stably under various environmental conditions, while having a long service life and high reliability.

[0003] In the prior art, the possibility of optical coupling failure or failure during automobile use is reduced by improving the packaging structure and process, thereby improving its reliability. Application No.: 202223234806.6 discloses a high-stability photoelectric coupler. By designing the photoelectric coupler carrier bracket and the packaging body structure, the bonding degree between the packaging body and the carrier bracket is improved, and the airtightness of the photoelectric coupler is improved.

[0004] However, when the device is in use, it is not easy to dissipate heat for the optocoupler, which leads to excessive temperature. The optocoupler may be damaged due to overheating, resulting in performance degradation or complete failure, thus affecting the operation of the device.

[0005] Based on this, an optocoupler packaging bracket is now provided to eliminate the disadvantages of the existing device. Utility Model Content

[0006] The utility model aims to provide an optical coupling packaging bracket to solve the problems in the background technology.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] An optocoupler packaging bracket comprises a bracket body and a plastic outer skin, wherein the plastic outer skin is arranged on the outer surface of the bracket body, a filter paper is laid on the top of the plastic outer skin, a heat sink is fixedly connected to the bottom of the inner wall of the bracket body, an air inlet groove is provided on the top of the heat sink, and nozzles are provided at the bottom of the heat sink and the bottom of the bracket body;

[0009] It also includes a heat dissipation mechanism, which is fixedly arranged at the bottom of the inner wall of the heat dissipation box and is used to dissipate heat for the working optical coupler;

[0010] The packaging unit is fixedly arranged at the bottom of the bracket body and is used for packaging the optical coupler.

[0011] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:

[0012] In an optional solution: the heat dissipation mechanism includes two bases, both of which are fixedly arranged at the bottom of the inner wall of the heat dissipation box and located on both sides of the nozzle, a first metal sheet is arranged between the two bases, and a second metal sheet is arranged between the two bases and below the first metal sheet, the top of the first metal sheet is fixedly connected to a first piezoelectric ceramic, and the top of the second metal sheet is fixedly connected to a second piezoelectric ceramic.

[0013] In an optional solution: the packaging unit includes a packaging plate, the packaging plate is fixedly arranged at the bottom of the bracket body, the top of the packaging plate is fixedly connected to an optical coupling seat, and the top of the optical coupling seat is provided with a pin hole.

[0014] In an optional solution: the filter paper is made of wood fiber, which has good air permeability and filtering properties.

[0015] In an optional solution, the outer surface of the base is provided with two mounting grooves whose sizes match the sizes of the first metal sheet and the second metal sheet.

[0016] In an optional solution: the first metal sheet and the second metal sheet are both made of stainless steel, which has good flexibility and elasticity.

[0017] In an optional solution, an alternating voltage is applied to the connection terminals of the first piezoelectric ceramic, and a pulsed single-phase voltage is applied to the connection terminals of the second piezoelectric ceramic.

[0018] In an optional solution: a thermal conductive adhesive is applied at the connection between the optical coupling seat and the packaging board.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. The utility model applies voltage to two piezoelectric ceramics, so that the two metal sheets connected thereto undergo periodic synchronous reverse deformation, thereby completing the air injection and air intake working cycle under the setting of the air inlet groove and the nozzle, cooling the bottom of the bracket, improving the heat dissipation performance, and at the same time, the structure is simple and the cost is saved.

[0021] 2. The utility model facilitates the packaging of the optocoupler by providing the packaging plate and the optocoupler seat, making the packaging method simple and fast, and improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the utility model.

[0023] Figure 2 It is a schematic cross-sectional structural diagram of the support body in the utility model.

[0024] Figure 3It is a schematic cross-sectional structural diagram of the heat dissipation box in the utility model.

[0025] Figure 4 It is an enlarged structural schematic diagram of area A in the utility model.

[0026] Figure 5 This is a schematic diagram of the structure of area A in the utility model from another angle.

[0027] Figure 6 It is an enlarged structural schematic diagram of the packaging plate in the utility model.

[0028] Notes on the figure markings: 1. bracket body; 2. plastic cover; 3. filter paper; 4. heat sink; 5. air inlet groove; 6. nozzle; 7. base; 8. first metal sheet; 9. second metal sheet; 10. first piezoelectric ceramic; 11. second piezoelectric ceramic; 12. packaging board; 13. optocoupler seat; 14. pin hole. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0030] Example 1

[0031] In one embodiment, Figure 1-Figure 6 As shown, the optical coupler packaging bracket includes a bracket body 1, a plastic outer skin 2, a heat dissipation mechanism and a packaging unit; the plastic outer skin 2 is arranged on the outer surface of the bracket body 1, and a filter paper 3 is laid on the top of the plastic outer skin 2. A heat dissipation box 4 is fixedly connected to the bottom of the inner wall of the bracket body 1, and an air inlet groove 5 is opened on the top of the heat dissipation box 4. The bottom of the heat dissipation box 4 and the bottom of the bracket body 1 are both provided with nozzles 6: the heat dissipation mechanism is fixedly arranged at the bottom of the inner wall of the heat dissipation box 4, and is used to dissipate heat for the working optical coupler; the packaging unit is fixedly arranged at the bottom of the bracket body 1, and is used to package the optical coupler. The filter paper 3 is made of wood fiber, which has good air permeability and filtering characteristics. The setting of the filter paper 3 is convenient for improving the air suction effect of the device, and the setting of the nozzle 6 is convenient for the heat dissipation mechanism to spray air from the nozzle 6, thereby dissipating heat for the optical coupler;

[0032] In one embodiment, Figure 3-Figure 5As shown, the heat dissipation mechanism includes two bases 7, the two bases 7 are fixedly arranged at the bottom of the inner wall of the heat dissipation box 4 and are located on both sides of the nozzle 6, a first metal sheet 8 is arranged between the two bases 7, a second metal sheet 9 is arranged between the two bases 7 and below the first metal sheet 8, a first piezoelectric ceramic 10 is fixedly connected to the top of the first metal sheet 8, and a second piezoelectric ceramic 11 is fixedly connected to the top of the second metal sheet 9. Two mounting grooves whose sizes are matched with the first metal sheet 8 and the second metal sheet 9 are provided on the outer surface of the base 7 to facilitate the installation of the two metal sheets. The first metal sheet 8 and the second metal sheet 9 are both made of stainless steel and have good flexibility and elasticity. An alternating voltage is applied to the terminal of the ceramic 10, and a pulsed single-phase voltage is applied to the terminal of the second piezoelectric ceramic 11. When the first piezoelectric ceramic 10 is energized, the first piezoelectric ceramic 10 will deform, shorten and thicken, forcing the first metal sheet 8 to bend downward, and the second piezoelectric ceramic 11 will deform and elongate, and become thinner, driving the second metal sheet 9 to bend upward. When the voltage of the second piezoelectric ceramic 11 is reversed, the ceramic begins to deform in the reverse direction and continuously elongate, driving the first metal sheet 8 to arch upward. At this time, the second piezoelectric ceramic 11 is powered off and returns to normal. Therefore, when an alternating voltage is applied to the first piezoelectric ceramic 10 and a pulsed single-phase voltage is applied to the second piezoelectric ceramic 11, the device will periodically and synchronously deform in the reverse direction.

[0033] Example 2

[0034] In one embodiment, Figure 6 As shown, the packaging unit includes a packaging plate 12, which is fixedly arranged at the bottom of the bracket body 1, and an optocoupler seat 13 is fixedly connected to the top of the packaging plate 12. A pin hole 14 is opened on the top of the optocoupler seat 13. The setting of the packaging plate 12 facilitates the installation of the optocoupler seat 13, and the setting of the pin hole 14 facilitates the installation of the optocoupler. The connection between the optocoupler seat 13 and the pin hole 14 is coated with thermal conductive glue to enhance the thermal conductivity, thereby improving the heat dissipation effect.

[0035] The above embodiment discloses an optocoupler packaging bracket, wherein an alternating voltage is applied to the first piezoelectric ceramic 10 and a pulsed single-phase voltage is applied to the second piezoelectric ceramic 11, so that the first metal sheet 8 and the second metal sheet 9 are periodically and synchronously deformed in opposite directions. When the first metal sheet 8 bends downward, it pushes the air to increase the static pressure near the nozzle 6, forming an airflow ejected from the small hole. At the same time, the upper space continues to expand and the air pressure decreases, and air is sucked and filled from the air inlet groove 5 at the top. After the first metal sheet 8 is deformed into place, the voltage of the first piezoelectric ceramic 10 is reversed, and the first metal sheet 8 arches upward. As a result, a high-pressure area appears in the upper space and a low-pressure area appears in the lower side. Since the second piezoelectric ceramic 11 is powered off and blocks the nozzle 6, air cannot be inhaled from the nozzle 6. Therefore, the high-pressure area pushes the fresh air just inhaled to the vicinity of the nozzle 6, thereby completing a working cycle of jetting and inhaling. Therefore, the device can cool the bottom of the bracket by high-frequency pulse jetting, thereby improving the heat dissipation performance, having a simple structure and saving costs. The arrangement of the packaging plate 12 and the optical coupler seat 13 facilitates the packaging of the optical coupler, making the packaging method simple and fast, thereby improving the production efficiency.

[0036] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. Optocoupler package bracket, including: A support body (1) and a plastic outer skin (2), wherein the plastic outer skin (2) is arranged on the outer surface of the support body (1), a filter paper (3) is laid on the top of the plastic outer skin (2), a heat dissipation box (4) is fixedly connected to the bottom of the inner wall of the support body (1), an air inlet groove (5) is provided on the top of the heat dissipation box (4), and a nozzle (6) is provided on the bottom of the heat dissipation box (4) and the bottom of the support body (1); It is characterized in that it also comprises a heat dissipation mechanism, which is fixedly arranged at the bottom of the inner wall of the heat dissipation box (4) and is used to dissipate heat from the working optical coupler; A packaging unit, the packaging unit is fixedly arranged at the bottom of the bracket body (1) and is used to package the optical coupler.

2. The optical coupler package bracket according to claim 1, characterized in that: The heat dissipation mechanism comprises two bases (7), the two bases (7) are fixedly arranged at the bottom of the inner wall of the heat dissipation box (4) and are located on both sides of the nozzle (6), a first metal sheet (8) is arranged between the two bases (7), a second metal sheet (9) is arranged between the two bases (7) and below the first metal sheet (8), a first piezoelectric ceramic (10) is fixedly connected to the top of the first metal sheet (8), and a second piezoelectric ceramic (11) is fixedly connected to the top of the second metal sheet (9).

3. The optical coupler package bracket according to claim 2, characterized in that: The packaging unit comprises a packaging plate (12), the packaging plate (12) is fixedly arranged at the bottom of the bracket body (1), the top of the packaging plate (12) is fixedly connected to an optical coupling seat (13), and the top of the optical coupling seat (13) is provided with a pin hole (14).

4. The optical coupler package bracket according to claim 1, characterized in that: The filter paper (3) is made of wood fiber.

5. The optical coupler package bracket according to claim 2, characterized in that: The outer surface of the base (7) is provided with two mounting grooves whose sizes match the sizes of the first metal sheet (8) and the second metal sheet (9).

6. The optical coupler package bracket according to claim 2, characterized in that: The first metal sheet (8) and the second metal sheet (9) are both made of stainless steel.

7. The optical coupler package bracket according to claim 3, characterized in that: An alternating voltage is applied to the connection terminals of the first piezoelectric ceramic (10), and a pulsed single-phase voltage is applied to the connection terminals of the second piezoelectric ceramic (11).

8. The optical coupler package bracket according to claim 3, characterized in that: The connection between the optical coupling seat (13) and the pin hole (14) is coated with heat-conducting glue.

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