Semiconductor component dispensing device

Abstract

The utility model relates to the technical field of semiconductor component production, and discloses a semiconductor component dispensing device which comprises a supporting plate, an adjusting mechanism is arranged on one side of the supporting plate and comprises a positioning plate, the positioning plate is fixedly connected with the supporting plate, a first electric push rod is fixedly installed at the bottom of the positioning plate, and a second electric push rod is fixedly installed at the bottom of the first electric push rod. An adjusting plate is fixedly mounted at the output end of the first electric push rod, a stepping motor is fixedly mounted on one side of an inner cavity of the adjusting plate, a one-way threaded rod is fixedly mounted on an output shaft of the stepping motor, an adjusting screw block is in threaded connection with the surface of the one-way threaded rod, and a fixing frame is fixedly mounted at the bottom of the adjusting screw block. According to the glue dispensing device, the glue dispensing mechanism is arranged, glue can be discharged quantitatively, waste caused by excessive glue extrusion is avoided, the adjusting mechanism is arranged, the position and height of the glue dispensing head can be adjusted, glue dispensing is convenient, the stability is good, shaking is avoided, and the precision is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor component production, in particular to a semiconductor component dispensing device. Background Art

[0002] Semiconductor components are a type of electronic devices that are often used in electronic equipment. When they are installed, they are sometimes glued to corresponding parts to improve the fixation stability. Existing semiconductor component dispensing devices can dispense glue on the dispensing surfaces of semiconductor components in different orientations. However, after adjusting the height of the dispensing mechanism, the connection position between the dispensing mechanism and the glue delivery pipeline will change, which will cause the end of the glue delivery pipeline to change accordingly. If the glue delivery pipeline as a whole has been fixed, the connection stability between the glue delivery pipeline and the dispensing mechanism will be reduced.

[0003] Chinese patent CN220091928U discloses a semiconductor component dispensing device, including a U-shaped frame, an electric cylinder is fixedly installed on the top of the U-shaped frame, a barrel is fixedly installed on the power output end of the bottom of the electric cylinder through the U-shaped frame, an adjusting screw is installed on the bottom surface of the barrel through a reserved threaded hole, a glue nozzle is fixedly installed on the bottom of the adjusting screw, a shaping hose is fixedly installed on the feeding end of the glue nozzle, a quantitative pump is fixedly installed on the top of one side of the U-shaped frame, the adjusting screw can be rotated to adjust the height of the glue nozzle, and in this process, personnel can manually change the shape of the shaping hose, so that the end of the shaping hose connected to the glue delivery pipeline is still in the initial position, thereby avoiding the change of the position of the glue delivery pipeline due to the rotation of the glue delivery nozzle, so as to ensure the connection stability between the glue delivery nozzle and the glue delivery pipeline, and is suitable for being widely promoted and used. The glue dispenser is generally used in conjunction with a production line. The device is not convenient for adjusting the dispensing position and is not convenient for quantitative glue delivery.

[0004] Therefore, those skilled in the art provide a semiconductor component dispensing device to solve the problems raised in the above background technology. Utility Model Content

[0005] In order to improve the problem that the existing semiconductor component dispensing device is inconvenient to adjust the dispensing position and is inconvenient to dispense glue quantitatively, the utility model provides a semiconductor component dispensing device.

[0006] The utility model provides a semiconductor component dispensing device, which adopts the following technical solutions:

[0007] A semiconductor component dispensing device, comprising a support plate, an adjustment mechanism is arranged on one side of the support plate, the adjustment mechanism comprises a positioning plate, the positioning plate is fixedly connected to the support plate, a first electric push rod is fixedly installed on the bottom of the positioning plate, an adjustment plate is fixedly installed on the output end of the first electric push rod, a stepper motor is fixedly installed on one side of the inner cavity of the adjustment plate, a one-way threaded rod is fixedly installed on the output shaft of the stepper motor, an adjustment screw block is threadedly connected to the surface of the one-way threaded rod, and a fixing frame is fixedly installed on the bottom of the adjustment screw block;

[0008] A glue dispensing mechanism is provided on the back side of the adjusting plate, and the glue dispensing mechanism includes a glue box, which is fixedly connected to the adjusting plate, a second electric push rod is fixedly installed on the bottom of the inner cavity of the glue box, a piston plate is fixedly installed on the output end of the second electric push rod, a glue outlet hose is connected to the top of the glue box, the other end of the glue outlet hose is connected to a glue dispensing head, and the glue dispensing head is fixedly connected to the fixing frame.

[0009] By adopting the above technical solution, the position of the dispensing head can be adjusted by setting an adjustment mechanism, which makes dispensing convenient, has good stability, avoids shaking, and has high precision. By setting a dispensing mechanism, quantitative dispensing can be performed to avoid glue waste.

[0010] Optionally, a locating bearing is fixedly installed on the other side of the inner cavity of the adjustment plate, and the locating bearing is rotatably connected to the one-way threaded rod.

[0011] By adopting the above technical solution, the positioning bearing positions the other end of the one-way threaded rod, making the one-way threaded rod more stable.

[0012] Optionally, a guide slider is fixedly mounted on one side of the adjustment plate, and a guide groove for use with the guide slider is provided in the inner cavity of the support plate.

[0013] By adopting the above technical solution, the guide sliding block and the guide sliding groove are used in conjunction with each other to guide the adjustment plate, so that the adjustment plate is more stable when moving.

[0014] Optionally, a guide block is fixedly mounted on the top of the adjusting screw block, and a guide groove is provided in the inner cavity of the adjusting plate.

[0015] By adopting the above technical solution, the guide block and the guide groove are used in combination to guide the adjusting screw block, so that the adjusting screw block is more stable when moving.

[0016] Optionally, an inspection door is movably connected to the back of the glue box via a hinge, and a locking buckle is provided on the other side of the inspection door.

[0017] By adopting the above technical solution, the inspection door can be opened by opening the locking buckle, making it convenient to maintain the second electric push rod.

[0018] Optionally, the top of the glue box is connected to a glue adding hose, and the top of the glue adding hose is provided with a screw cap.

[0019] By adopting the above technical solution, the screw cap can be opened and glue can be added into the glue box through the glue adding hose.

[0020] Optionally, a mounting plate is fixedly mounted on the other side of the support plate, and a mounting hole is provided in the inner cavity of the mounting plate.

[0021] By adopting the above technical solution, the device can be fixed at the required position of the production line by inserting bolts into the mounting holes.

[0022] Optionally, a remote controller is arranged on the front side of the support plate, and a protective film is arranged on the surface of the remote controller.

[0023] By adopting the above technical solution, the remote controller makes it convenient for the staff to control the switches of various electrical appliances.

[0024] In summary, the utility model has the following beneficial effects:

[0025] 1. The utility model sets a dispensing mechanism to control the extension of the second electric push rod to push the piston plate upward, so that the glue in the glue box can be sent out along the glue outlet hose, and then the glue is discharged from the dispensing head, so as to perform quantitative dispensing and avoid waste caused by excessive glue squeezing out. By setting an adjustment mechanism, the position and height of the dispensing head can be adjusted, which is convenient for dispensing, and has good stability, avoids shaking, and has high accuracy.

[0026] 2. The utility model positions the other end of the one-way threaded rod by setting a positioning bearing, so that the one-way threaded rod is more stable. The guide slider is used in conjunction with the guide slot to guide the adjustment plate, so that the adjustment plate is more stable when moving. The guide block is used in conjunction with the guide slot to guide the adjustment screw block, so that the adjustment screw block is more stable when moving. The inspection door can be opened by opening the locking buckle, which is convenient for maintenance of the second electric push rod. The rotary cover can be opened to add glue to the glue box through the glue hose, and the bolt can be inserted into the installation hole to fix the device at the required position of the production line. The remote controller facilitates the staff to control the switches of various electrical appliances. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of the utility model.

[0028] Figure 2 It is a schematic diagram of the bottom structure of the utility model.

[0029] Figure 3 This utility model Figure 2 Enlarged structural diagram at A in the middle.

[0030] Figure 4 It is a schematic diagram of the back structure of the utility model.

[0031] Figure 5 It is a schematic diagram of the internal structure of the glue box of the utility model.

[0032] Description of reference numerals:

[0033] 1. Support plate; 2. Adjustment mechanism; 201. Positioning plate; 202. First electric push rod; 203. Adjustment plate; 204. Stepper motor; 205. One-way threaded rod; 206. Adjustment screw block; 207. Fixed bracket; 3. Glue dispensing mechanism; 301. Glue box; 302. Glue adding hose; 303. Inspection door; 304. Second electric push rod; 305. Piston plate; 306. Glue outlet hose; 307. Glue dispensing head; 4. Mounting plate. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-5 This application is described in further detail.

[0035] Embodiment 1:

[0036] Please refer to Figure 1-4 A semiconductor component dispensing device comprises a support plate 1, an adjusting mechanism 2 is arranged on one side of the support plate 1, the adjusting mechanism 2 comprises a positioning plate 201, the positioning plate 201 is fixedly connected to the support plate 1, a first electric push rod 202 is fixedly installed at the bottom of the positioning plate 201, an adjusting plate 203 is fixedly installed at the output end of the first electric push rod 202, a guide slider is fixedly installed on one side of the adjusting plate 203, a guide slide groove used in conjunction with the guide slider is provided in the inner cavity of the support plate 1, a positioning bearing is fixedly installed on the other side of the inner cavity of the adjusting plate 203, and the positioning bearing rotates with the one-way threaded rod 205. Dynamic connection, a stepper motor 204 is fixedly installed on one side of the inner cavity of the adjustment plate 203, and a one-way threaded rod 205 is fixedly installed on the output shaft of the stepper motor 204. The surface of the one-way threaded rod 205 is threadedly connected with an adjusting screw block 206, and a guide block is fixedly installed on the top of the adjusting screw block 206. The inner cavity of the adjustment plate 203 is provided with a guide groove, and the bottom of the adjusting screw block 206 is fixedly installed with a fixing frame 207. The other side of the support plate 1 is fixedly installed with a mounting plate 4, and the inner cavity of the mounting plate 4 is provided with a mounting hole. A remote controller is arranged on the front of the support plate 1, and a protective film is arranged on the surface of the remote controller.

[0037] In this embodiment: by setting up the adjustment mechanism 2, the position of the dispensing head 307 can be adjusted, which is convenient for dispensing, and has good stability, avoids shaking, and has high precision. The positioning bearing positions the other end of the one-way threaded rod 205, making the one-way threaded rod 205 more stable. The guide slider is used in conjunction with the guide groove to guide the adjustment plate 203, so that the adjustment plate 203 is more stable when moving. The guide block is used in conjunction with the guide groove to guide the adjustment screw block 206, so that the adjustment screw block 206 is more stable when moving. The device can be fixed at the required position of the production line by inserting bolts into the mounting hole. The remote controller facilitates the staff to control the switches of various electrical appliances.

[0038] Embodiment 2:

[0039] Reference Figure 1-5 A glue dispensing mechanism 3 is provided on the back of the adjusting plate 203, and the glue dispensing mechanism 3 includes a glue box 301, which is fixedly connected to the adjusting plate 203. An inspection door 303 is movably connected to the back of the glue box 301 through a hinge, and a locking buckle is provided on the other side of the inspection door 303. A glue adding hose 302 is connected to the top of the glue box 301, and a screw cap is provided on the top of the glue adding hose 302. A second electric push rod 304 is fixedly installed at the bottom of the inner cavity of the glue box 301, and a piston plate 305 is fixedly installed at the output end of the second electric push rod 304. A glue outlet hose 306 is connected to the top of the glue box 301, and the other end of the glue outlet hose 306 is connected to a glue dispensing head 307, and the glue dispensing head 307 is fixedly connected to the fixed frame 207.

[0040] In this embodiment: by setting up a dispensing mechanism 3, quantitative dispensing can be performed to avoid glue waste. The inspection door 303 can be opened by opening the locking buckle to facilitate maintenance of the second electric push rod 304. The rotary cover can be opened to add glue to the glue box 301 through the glue adding hose 302.

[0041] The implementation principle of the utility model is as follows: when in use, bolts are inserted into the mounting plate 4 to fix the device on the production line for convenient glue dispensing; by controlling the first electric push rod 202 to extend, the adjustment plate 203 can be pushed to move downward as a whole, so that the height of the glue dispensing head 307 can be adjusted; the stepping motor 204 is controlled to drive the one-way threaded rod 205 to rotate, the one-way threaded rod 205 drives the adjusting screw block 206 to move rightward, the adjusting screw block 206 drives the fixing frame 207 to move rightward, so that the glue dispensing head 307 can be driven to move rightward; conversely, the fixing frame 207 is controlled to reverse, so that the glue dispensing head 307 can be driven to move leftward, so that the glue dispensing position can be adjusted; the second electric push rod 304 is controlled to extend to push the piston plate 305 to move upward, so that the glue in the glue box 301 can be sent out along the glue discharge hose 306, and then the glue is discharged by the glue dispensing head 307, so as to perform quantitative glue dispensing.

[0042] The above are all preferred embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A semiconductor component dispensing device, comprising a support plate (1), characterized in that: An adjustment mechanism (2) is provided on one side of the support plate (1), and the adjustment mechanism (2) comprises a positioning plate (201), the positioning plate (201) is fixedly connected to the support plate (1), a first electric push rod (202) is fixedly installed at the bottom of the positioning plate (201), an adjustment plate (203) is fixedly installed at the output end of the first electric push rod (202), a stepping motor (204) is fixedly installed on one side of the inner cavity of the adjustment plate (203), a one-way threaded rod (205) is fixedly installed on the output shaft of the stepping motor (204), an adjustment screw block (206) is threadedly connected to the surface of the one-way threaded rod (205), and a fixing frame (207) is fixedly installed at the bottom of the adjustment screw block (206); A glue dispensing mechanism (3) is arranged on the back of the adjusting plate (203), and the glue dispensing mechanism (3) comprises a glue box (301). The glue box (301) is fixedly connected to the adjusting plate (203), a second electric push rod (304) is fixedly installed at the bottom of the inner cavity of the glue box (301), a piston plate (305) is fixedly installed at the output end of the second electric push rod (304), a glue outlet hose (306) is connected to the top of the glue box (301), the other end of the glue outlet hose (306) is connected to a glue dispensing head (307), and the glue dispensing head (307) is fixedly connected to the fixing frame (207).

2. A semiconductor component dispensing device according to claim 1, characterized in that: A positioning bearing is fixedly installed on the other side of the inner cavity of the adjustment plate (203), and the positioning bearing is rotationally connected to the one-way threaded rod (205).

3. A semiconductor component dispensing device according to claim 1, characterized in that: A guide sliding block is fixedly mounted on one side of the adjustment plate (203), and a guide sliding groove for use in conjunction with the guide sliding block is provided in the inner cavity of the support plate (1).

4. The semiconductor component dispensing device according to claim 1, characterized in that: A guide block is fixedly mounted on the top of the adjusting screw block (206), and a guide groove is provided in the inner cavity of the adjusting plate (203).

5. The semiconductor component dispensing device according to claim 1, characterized in that: The back of the glue box (301) is movably connected to an inspection door (303) via a hinge, and a locking buckle is provided on the other side of the inspection door (303).

6. The semiconductor component dispensing device according to claim 1, characterized in that: The top of the glue box (301) is connected to a glue adding tube (302), and the top of the glue adding tube (302) is provided with a screw cap.

7. The semiconductor component dispensing device according to claim 1, characterized in that: A mounting plate (4) is fixedly mounted on the other side of the support plate (1), and a mounting hole is provided in the inner cavity of the mounting plate (4).

8. The semiconductor component dispensing device according to claim 1, characterized in that: A remote controller is arranged on the front side of the support plate (1), and a protective film is arranged on the surface of the remote controller.

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