Grinding device for indium phosphide single crystal processing

Abstract

The utility model discloses a grinding device for indium phosphide single crystal processing, relates to the technical field of indium phosphide single crystal grinding, and aims to solve the problems of poor grinding continuity, time and labor waste and low grinding efficiency caused by the fact that materials need to be taken and discharged when the existing indium phosphide single crystals are ground and are discharged and fed in a shutdown state. A first variable frequency motor is arranged at the upper end of the base; the rotating disc is arranged at the output end of the first variable frequency motor, rotating arms are arranged on the periphery of the rotating disc, the rotating arms and the rotating disc are welded and fixed, and a mounting disc is arranged at one end of each rotating arm; the rotating frames are arranged on the surface of one side of the mounting disc, rotating grooves are formed in the surfaces of one ends of the rotating arms, the rotating frames are inserted into the rotating grooves, limiting plug pins are arranged on one sides of the rotating grooves, the number of the rotating frames and the number of the rotating arms are both four, and round heads are arranged in the limiting plug pins. A square inserting plate is arranged at one end of the round head.

Description

Technical Field

[0001] The utility model relates to the technical field of indium phosphide single crystal grinding, in particular to a grinding device used for indium phosphide single crystal processing. Background Art

[0002] Indium phosphide is an inorganic compound, a silver-gray single crystal, very slightly soluble in inorganic acids, mainly used as a semiconductor material for optical fiber communication technology, and requires surface grinding during processing;

[0003] For example, the Chinese patent with announcement number CN112975736A (a method for grinding an indium phosphide wafer): comprises the following steps: placing the indium phosphide wafer in a first cleaning agent for cleaning, and then rinsing it; placing the indium phosphide wafer in a grinder for the first grinding, the mass percentage of the first grinding liquid is: 25% to 30% CA15 aluminum oxide, 1% to 2% dispersant, 1% to 2% first grinding oil, 66% to 73% deionized water; cleaning the indium phosphide wafer for the second time; grinding the indium phosphide wafer for the second time, the mass percentage of the second grinding liquid is: 35% to 45% CA12 aluminum oxide, 5% to 6% dispersant, 5% to 6% second grinding oil, 43% to 55% deionized water; and finally washing it for the third time. The present invention solves the problem of slight scratches that may occur in the grinding process of indium phosphide wafers in the prior art, increases the flatness of the surface of the indium phosphide wafer, and is easier to clean during the corrosion process.

[0004] However, the existing indium phosphide single crystal grinding requires the material to be taken out and loaded in a stopped state, the grinding continuity is poor, time-consuming and labor-intensive, and the grinding efficiency is low; therefore, it does not meet the existing needs. In this regard, we propose a grinding device for indium phosphide single crystal processing. Utility Model Content

[0005] The purpose of the utility model is to provide a grinding device for indium phosphide single crystal processing, so as to solve the problem proposed in the above-mentioned background technology that the existing indium phosphide single crystal grinding needs to take out the material, and the material is unloaded and loaded in the shutdown state, the grinding continuity is poor, and it is time-consuming and labor-intensive, resulting in low grinding efficiency.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: A grinding device for processing an indium phosphide single crystal comprises: a base, wherein a first variable frequency motor is arranged at the upper end of the base;

[0007] Also includes:

[0008] A rotating disk, which is arranged at the output end of the first variable frequency motor, wherein rotating arms are arranged around the rotating disk, and the rotating arms are welded and fixed to the rotating disk, and a mounting disk is arranged at one end of the rotating arm;

[0009] A rotating frame is arranged on one side surface of the mounting plate, a rotating groove is arranged on one end surface of the rotating arm, and the rotating frame is inserted into the rotating groove, a limiting latch is arranged on one side of the rotating groove, and the rotating frame and the rotating arm are both provided with four.

[0010] Preferably, a round head is provided inside the limit latch, a square plug plate is provided at one end of the round head, and the square plug plate passes through the rotating arm and the rotating frame.

[0011] Preferably, a fixing bolt is provided at the front end of the round head, a bolt groove is provided at one end of the square plug plate, and one end of the fixing bolt passes through the round head and is threadedly connected to the bolt groove.

[0012] Preferably, a mounting groove is provided on the upper surface of the mounting plate, and the mounting groove and the mounting plate are an integral structure.

[0013] Preferably, a material receiving box is provided on one side of the first variable frequency motor, and the material receiving box is placed on the base.

[0014] Preferably, an electric push rod is provided on the other side of the first variable frequency motor, a connecting frame is provided on the upper end of the electric push rod, a second variable frequency motor is provided at one end of the connecting frame, and a grinding disc is provided at the output end of the second variable frequency motor.

[0015] Preferably, push rod mounting seats are provided at both ends of the electric push rod, and the two ends of the electric push rod are respectively fixed to the base and the connecting frame through external bolts of the push rod mounting seats.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. The utility model provides rotating arms around the rotating disk, and provides a mounting disk at one end of the rotating arm. After one indium phosphide single crystal is ground, the mounting disk is driven to rotate by the first variable frequency motor, and the next mounting disk is rotated to the lower end of the grinding disk for grinding. When the ground mounting disk rotates to the top of the material receiving box, the limit latch is pulled out, and the mounting disk loses its supporting force and falls into the material receiving box. The mounting disk has a buffering effect on the indium phosphide single crystal, thereby preventing the indium phosphide single crystal from falling and being damaged. At the same time, it is also convenient to separate the indium phosphide single crystal from the mounting disk without manual removal. Then, the rotating frame of the separated mounting disk is inserted into the rotating groove, and the square plug plate runs through the rotating arm and the rotating frame, so that the mounting disk is fixed. The whole operation does not hinder the grinding of the indium phosphide single crystal, and solves the problem that the existing indium phosphide single crystal grinding needs to take the material and unload the material, and the material is unloaded and loaded in the shutdown state, the grinding continuity is poor, time-consuming and labor-intensive, and the grinding efficiency is low.

[0018] 2. By setting a fixing bolt at the front end of the round head, one end of the fixing bolt passes through the round head and is threadedly connected to the bolt groove to achieve the fixation of the round head and the square plug plate. The square plug plate supports the installation plate for a long time, and the surface is easily deformed and needs to be replaced regularly. By fixing with the fixing bolt, the round head and the square plug plate can be separated and replaced independently, thereby reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the top view of the rotating disk of the utility model;

[0021] Figure 3 This is a schematic diagram of the limit latch structure of the utility model;

[0022] Figure 4 This is a schematic diagram of the disassembly structure of the round head and the square plug board of the utility model;

[0023] In the figure: 1. base; 2. first variable frequency motor; 3. rotating disk; 4. rotating arm; 5. mounting disk; 6. material receiving box; 7. second variable frequency motor; 8. grinding disk; 9. connecting frame; 10. electric push rod; 11. push rod mounting seat; 12. mounting slot; 13. limit latch; 14. rotating frame; 15. rotating slot; 16. round head; 17. square plug plate; 18. fixing bolt; 19. bolt slot. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] See also Figure 1-4 The utility model provides an embodiment: a grinding device for processing an indium phosphide single crystal, comprising: a base 1, a first variable frequency motor 2 is arranged at the upper end of the base 1;

[0026] Also includes:

[0027] A rotating disk 3 is arranged at the output end of the first variable frequency motor 2. Rotating arms 4 are arranged around the rotating disk 3. The rotating arms 4 are welded and fixed to the rotating disk 3. A mounting disk 5 is arranged at one end of the rotating arm 4.

[0028] The rotating frame 14 is arranged on one side surface of the mounting plate 5, and a rotating groove 15 is arranged on one end surface of the rotating arm 4, and the rotating frame 14 is inserted into the rotating groove 15, and a limiting latch 13 is arranged on one side of the rotating groove 15, and the rotating frame 14 and the rotating arm 4 are both provided with four.

[0029] The surface of the indium phosphide single crystal is ground. After grinding, the first variable frequency motor 2 drives the mounting plate 5 to rotate, and the next mounting plate 5 is rotated to the lower end of the grinding plate 8 for grinding. When the ground mounting plate 5 is rotated to the top of the material receiving box 6, the limit pin 13 is pulled out, and the mounting plate 5 loses its supporting force and falls into the inside of the material receiving box 6, and then the mounting plate 5 is re-fixed. The whole operation does not hinder the grinding of the indium phosphide single crystal.

[0030] See also Figure 2 , 3 A round head 16 is provided inside the limit latch 13, and a square plug plate 17 is provided at one end of the round head 16, and the square plug plate 17 passes through the rotating arm 4 and the rotating frame 14, and the rotating frame 14 of the separated mounting plate 5 is inserted into the rotating groove 15, and the square plug plate 17 passes through the rotating arm 4 and the rotating frame 14, so as to fix the mounting plate 5.

[0031] See also Figure 4 A fixing bolt 18 is provided at the front end of the round head 16, a bolt groove 19 is provided at one end of the square plug plate 17, and one end of the fixing bolt 18 passes through the round head 16 and is threadedly connected to the bolt groove 19, so that the round head 16 and the square plug plate 17 can be separated and replaced independently.

[0032] See also Figure 1 , 2 The upper surface of the mounting plate 5 is provided with a mounting groove 12, and the mounting groove 12 and the mounting plate 5 are an integrated structure for placing the indium phosphide single crystal.

[0033] See also Figure 1 A material receiving box 6 is provided on one side of the first variable frequency motor 2, and the material receiving box 6 is placed on the base 1 to receive the ground indium phosphide single crystal.

[0034] See also Figure 1 An electric push rod 10 is arranged on the other side of the first variable frequency motor 2, a connecting frame 9 is arranged on the upper end of the electric push rod 10, a second variable frequency motor 7 is arranged on one end of the connecting frame 9, a grinding disc 8 is arranged on the output end of the second variable frequency motor 7, and the electric push rod 10 is used to drive the grinding disc 8 to move up and down, which is suitable for indium phosphide single crystals of different thicknesses, and then the second variable frequency motor 7 is used to drive the grinding disc 8 to rotate to grind the surface of the indium phosphide single crystal.

[0035] See also Figure 1 Both ends of the electric push rod 10 are provided with push rod mounting seats 11, and the two ends of the electric push rod 10 are respectively fixed to the base 1 and the connecting frame 9 through external bolts of the push rod mounting seats 11.

[0036] Working principle: When in use, place the indium phosphide single crystal inside the mounting plate 5, use the first variable frequency motor 2 to drive the rotating plate 3 to rotate, so that the rotating arm 4 drives the mounting plate 5 to rotate and move to the lower end of the grinding plate 8, and use the electric push rod 10 to drive the grinding plate 8 to move up and down, which is suitable for indium phosphide single crystals of different thicknesses, and then use the second variable frequency motor 7 to drive the grinding plate 8 to rotate, and grind the surface of the indium phosphide single crystal. After grinding, rely on the first variable frequency motor 2 to drive the mounting plate 5 to rotate, and rotate the next mounting plate 5 to the lower end of the grinding plate 8 for grinding. Grinding, when the ground mounting disc 5 rotates to the top of the material receiving box 6, the limit pin 13 is pulled out, and the mounting disc 5 loses its supporting force and falls into the material receiving box 6, relying on the mounting disc 5 to buffer the indium phosphide single crystal, avoiding the indium phosphide single crystal from falling and being damaged, and also facilitating the separation of the indium phosphide single crystal from the mounting disc 5 without manual picking, and then the rotating frame 14 of the separated mounting disc 5 is inserted into the rotating groove 15, and the square plug plate 17 passes through the rotating arm 4 and the rotating frame 14, so as to fix the mounting disc 5, and the whole operation does not hinder the grinding of the indium phosphide single crystal.

[0037] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A grinding device for processing an indium phosphide single crystal, comprising a base (1), wherein a first variable frequency motor (2) is arranged at the upper end of the base (1); Features: Also includes: A rotating disk (3) is arranged at the output end of the first variable frequency motor (2), rotating arms (4) are arranged around the rotating disk (3), and the rotating arms (4) are welded and fixed to the rotating disk (3), and a mounting disk (5) is arranged at one end of the rotating arm (4); A rotating frame (14) is arranged on a side surface of the mounting plate (5); a rotating groove (15) is arranged on one end surface of the rotating arm (4); the rotating frame (14) is inserted into the rotating groove (15); a limiting latch (13) is arranged on one side of the rotating groove (15); and the rotating frame (14) and the rotating arm (4) are both provided with four limiting latches.

2. The grinding device for processing indium phosphide single crystal according to claim 1, characterized in that: A round head (16) is arranged inside the limit latch (13), a square plug plate (17) is arranged at one end of the round head (16), and the square plug plate (17) passes through the rotating arm (4) and the rotating frame (14).

3. The grinding device for processing indium phosphide single crystal according to claim 2, characterized in that: A fixing bolt (18) is arranged at the front end of the round head (16), a bolt groove (19) is arranged at one end of the square plug plate (17), and one end of the fixing bolt (18) passes through the round head (16) and is threadedly connected to the bolt groove (19).

4. The grinding device for processing indium phosphide single crystal according to claim 1, characterized in that: The upper surface of the mounting plate (5) is provided with a mounting groove (12), and the mounting groove (12) and the mounting plate (5) are an integral structure.

5. The grinding device for processing indium phosphide single crystal according to claim 1, characterized in that: A material receiving box (6) is provided on one side of the first variable frequency motor (2), and the material receiving box (6) is placed on the base (1).

6. The grinding device for processing indium phosphide single crystal according to claim 1, characterized in that: An electric push rod (10) is arranged on the other side of the first variable frequency motor (2), a connecting frame (9) is arranged on the upper end of the electric push rod (10), a second variable frequency motor (7) is arranged on one end of the connecting frame (9), and a grinding disc (8) is arranged on the output end of the second variable frequency motor (7).

7. The grinding device for processing indium phosphide single crystal according to claim 6, characterized in that: Both ends of the electric push rod (10) are provided with push rod mounting seats (11), and the two ends of the electric push rod (10) are respectively fixed to the base (1) and the connecting frame (9) through external bolts of the push rod mounting seats (11).

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