Wafer scribing mechanism

Abstract

The utility model provides a wafer scribing mechanism. The wafer scribing mechanism comprises a base, a first supporting seat, a second supporting seat, a mounting cross beam and a scribing part, the first supporting seat and the second supporting seat are mounted on the base; two ends of the mounting beam are respectively mounted on the first supporting seat and the second supporting seat; a first guide rail and a second guide rail are arranged on the upper surface of the mounting beam; the scribing part comprises a mounting plate, a translation driving module, a lifting driving module and a scribing knife assembly, the mounting plate is slidably connected to the first guide rail and the second guide rail and connected with the translation driving module, and the translation driving module is used for driving the mounting plate to slide along the first guide rail and the second guide rail; the lifting driving module is mounted on the mounting plate and used for driving the dicing blade assembly to ascend and descend. According to the wafer scribing mechanism provided by the invention, the first guide rail and the second guide rail are mounted on the upper surface of the mounting cross beam, and the deformation generated after the first guide rail and the second guide rail are pressed is consistent, so that the influence on the scribing height and the scribing angle of the blade of the scribing knife assembly is greatly reduced.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and more specifically to a wafer dicing mechanism. Background Art

[0002] During the chip production process, a dicing machine is needed to slice the wafer to divide the wafer into individual chips.

[0003] A conventional dicing machine includes a wafer carrier and a dicing mechanism located above. The dicing mechanism usually includes a vertical mounting plate, two horizontal guide rails are arranged on the same side of the vertical mounting plate, and two dicing parts are installed on the two horizontal guide rails through sliders.

[0004] In actual dicing production, since the dicing unit is relatively heavy, the slider is affected by the gravity of the dicing unit, which easily causes different deformations of the upper and lower guide rails, thereby affecting the dicing height and dicing angle of the blade of the dicing unit, thereby affecting the wafer cutting accuracy. As the equipment runs, the accuracy impact will become greater and greater. In addition, the dicing unit includes a blade and a drive unit. The blade is installed on the guide rail through the drive unit and the slider. The drive unit causes a relatively large vertical height difference between the blade and the guide rail. When the mounting surface of the upper and lower guide rails produces an allowable error in the lateral direction or the upper and lower guide rails produce a deviation in the lateral direction due to deformation, the vertical angle of the blade will be magnified, thereby affecting the wafer cutting accuracy. Utility Model Content

[0005] In view of the above problems existing in the traditional dicing machine, the present application provides a wafer dicing mechanism, and its detailed technical solution is as follows:

[0006] A wafer slicing mechanism comprises a base, a first support base, a second support base, a mounting beam and a slicing part, wherein: the first support base and the second support base are installed on the base at intervals along a first horizontal direction, and an avoidance space for avoiding a wafer bearing mechanism is formed between the first support base and the second support base; one end of the mounting beam is fixedly installed on the first support base, and the second end of the mounting beam is fixedly installed on the second support base, and the upper surface of the mounting beam is provided with a first guide rail and a second guide rail extending along the first horizontal direction; the slicing part comprises a mounting plate, a translation drive module, a lifting drive module and a slicing knife assembly, wherein: the mounting plate is slidably connected to the first guide rail and the second guide rail, and is connected to the driving end of the translation drive module arranged on the mounting beam, the translation drive module is used to drive the mounting plate to slide along the first guide rail and the second guide rail; the lifting drive module is installed on the mounting plate, the slicing knife assembly is connected to the driving end of the lifting drive module, and the lifting drive module is used to drive the slicing knife assembly to rise and fall.

[0007] The wafer dicing mechanism provided by the present application has a first guide rail and a second guide rail supporting the dicing blade assembly installed on the upper surface of the mounting crossbeam, so that the loads borne by the first guide rail and the second guide rail are equivalent, and therefore, the deformations produced by the first guide rail and the second guide rail after being compressed are basically the same, thereby greatly reducing the influence on the dicing height and dicing angle of the blade of the dicing blade assembly. In addition, since the first guide rail and the second guide rail are installed on the same horizontal plane, there will be no lateral deviation between the first guide rail and the second guide rail, thereby not amplifying the vertical angle error of the blade, and can reduce the distance between the mounting plane of the first guide rail and the second guide rail and the wafer supporting platform below, thereby reducing the error caused to the dicing blade assembly by the machining error of the mounting plane of the first guide rail and the second guide rail.

[0008] In some embodiments, the base includes an integrally formed mounting portion, a first side support portion, and a second side support portion, wherein: a mounting groove for mounting a wafer supporting mechanism is provided in the middle portion of the mounting portion along a second horizontal direction, the mounting groove is located below the avoidance space, and the second horizontal direction is perpendicular to the first horizontal direction; the first side support portion and the second side support portion are symmetrically arranged on both sides of the mounting portion along the first horizontal direction; the first support seat is arranged on the first side support portion, and the second support seat is arranged on the second side support portion.

[0009] By configuring the base to include an integrally formed mounting portion, a first side support portion, and a second side support portion, the first support seat and the second support seat can be symmetrically mounted on the base, thereby improving the symmetry, structural stability, and anti-deformation capability of the wafer dicing mechanism, and ultimately improving the dicing accuracy. By providing a mounting groove on the mounting portion, the installation of the wafer bearing mechanism is facilitated, and the wafer bearing mechanism is located in the middle of the base.

[0010] In some embodiments, the first support seat and the second support seat have the same structure, a rectangular mounting groove is opened on the side wall of the first support seat, a first mounting hole is set at the bottom of the mounting groove and extends vertically to the lower surface of the first support seat, a second mounting hole corresponding to the first mounting hole is set on the base, and the first support seat is fixed to the base by bolts passing through the first mounting hole and the second mounting hole.

[0011] It facilitates the disassembly and assembly of the first support seat and the second support seat, and ensures the connection strength between the first support seat, the second support seat and the base. The design of the rectangular mounting groove facilitates the release of the mechanical stress generated by the bolts during installation, thereby improving the deformation resistance of the first support seat and the second support seat.

[0012] In some embodiments, the translation drive module is located between the first guide rail and the second guide rail, and the translation drive module includes a first motor, a first screw rod and a first screw rod nut, wherein the first screw rod is connected to the driving end of the first motor and extends along the first horizontal direction, the first screw rod nut is threaded on the first screw rod and fixed to the bottom of the mounting plate, and when the first motor drives the first screw rod to rotate, it drives the first screw rod nut and the mounting plate to translate along the screw rod.

[0013] A translation driving module with a simple structure and stable driving is provided to ensure stable translation of a mounting plate along a first horizontal direction.

[0014] In some embodiments, the lifting drive module includes a mounting block, a lifting drive member and a connecting plate, wherein: the mounting block is mounted on the mounting plate, the upper end of the connecting plate is slidably mounted on the mounting block and is connected to the driving end of the lifting drive member arranged on the mounting block; the dicing knife assembly is mounted at the lower end of the connecting plate.

[0015] By setting the lifting drive module, the lifting drive module can be stably installed on the mounting plate, and a stable connection between the dicing knife assembly and the lifting drive module is achieved.

[0016] In some embodiments, the lifting drive module further includes a third guide rail and a fourth guide rail vertically mounted on the mounting block, and the upper end of the connecting plate is slidably mounted on the third guide rail and the fourth guide rail via four sliding blocks symmetrically arranged in pairs.

[0017] The sliding connection stability between the connecting plate and the mounting block is improved to ensure that the connecting plate can be stably lifted and lowered in the vertical direction.

[0018] In some embodiments, the connecting plate includes an upper connecting plate and a lower connecting plate. The upper connecting plate is slidably mounted on the mounting block and connected to a driving end of a lifting drive member disposed on the mounting block. The upper end of the lower connecting plate is fixedly connected to the upper connecting plate, and the lower end of the lower connecting plate is fixedly connected to a fixed end of the dicing knife assembly.

[0019] The connection plate is set as a split structure consisting of an upper connection plate and a lower connection plate, which facilitates the processing of the connection plate and reduces the processing difficulty. In addition, the upper and lower connection plates can be made of different materials, and the lower connection plate can be made of a material with a low thermal expansion coefficient to avoid the lower connection plate from significantly expanding and deforming due to heat during the dicing process, thereby affecting the dicing accuracy.

[0020] In some embodiments, the lifting drive component includes a second motor, a second screw rod and a second screw rod nut, wherein the second screw rod is connected to the driving end of the second motor and extends in the vertical direction, the second screw rod nut is screwed on the second screw rod and fixed to the upper end of the connecting plate, and when the second motor drives the second screw rod to rotate, it drives the second screw rod nut and the connecting plate to rise and fall along the second screw rod.

[0021] A lifting drive component with a simple structure and stable driving is provided to ensure stable lifting of the connecting plate.

[0022] In some embodiments, the dicing knife assembly includes a blade drive motor and a blade, wherein the blade drive motor is connected to the lower end of the connecting plate, the blade is connected to the driving end of the blade drive motor, and the blade drive motor is used to drive the blade to rotate in a vertical plane.

[0023] After the wafer is fixed to the wafer carrier, the translation drive module and the lifting drive module cooperate to drive the dicing blade assembly to translate and lift, so that the blade abuts against the side of the wafer. Then, the translation drive module drives the blade to translate along the dicing groove on the wafer, and at the same time, the blade drive motor drives the blade to rotate at high speed in the vertical plane, thereby dicing the wafer.

[0024] In some embodiments, the dicing knife assembly is located on a first side of the mounting block, and a counterweight mechanism is disposed on a second side of the mounting block opposite to the first side.

[0025] This ensures that the weight borne by both sides of the mounting block is equal, further improving the structural symmetry and stability of the wafer dicing mechanism of the present application.

[0026] In some embodiments, the dicing parts are arranged into two groups, and the dicing knife assemblies of the two groups of dicing parts are arranged symmetrically.

[0027] The two groups of dicing units perform dicing simultaneously or alternately, which improves the dicing efficiency. The dicing blade components of the two groups of dicing units are symmetrically arranged, which further improves the structural symmetry and stability of the wafer dicing mechanism of the present application.

[0028] In some embodiments, the first support base, the second support base and the mounting crossbeam are all integrally formed rectangular parallelepiped castings.

[0029] On the one hand, it facilitates the processing and forming of the first support seat, the second support seat and the mounting crossbeam. On the other hand, it improves the structural strength and anti-deformation ability of the first support seat, the second support seat and the mounting crossbeam. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of the three-dimensional structure of the wafer dicing mechanism in the embodiment of the present application;

[0031] Figure 2 Schematic diagram of the top view of the wafer dicing mechanism in the embodiment of the present application;

[0032] Figure 3 Schematic diagram of the side view structure of the wafer dicing mechanism in the embodiment of the present application;

[0033] Figures 1 to 3 Included:

[0034] Base 1: mounting portion 11, first side support portion 12, second side support portion 13, mounting groove 14;

[0035] First support seat 2: mounting groove 21, bolt 22;

[0036] The second support seat 3;

[0037] Install beam 4;

[0038] Slicing section 5:

[0039] Mounting plate 50, translation drive module 51, lifting drive module 52, dicing blade assembly 53, mounting block 521, lifting drive member 522, connecting plate 523, upper connecting plate 524, lower connecting plate 525, third guide rail 526, fourth guide rail 527, slider 528, blade drive motor 531, blade 532;

[0040] First guide rail 6;

[0041] Second guide rail 7. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] like Figures 1 to 3 As shown, the wafer dicing mechanism in the embodiment of the present application includes a base 1, a first support base 2, a second support base 3, a mounting beam 4 and a dicing unit 5, wherein:

[0044] The first support base 2 and the second support base 3 are arranged along a first horizontal direction (eg Figure 1 and Figure 2 The first support seat 2 and the second support seat 3 are installed on the base 1 at intervals (in the X-axis direction), and an escape space for escaping the wafer carrying mechanism is formed between the first support seat 2 and the second support seat 3.

[0045] One end of the mounting beam 4 is fixedly mounted on the first support seat 2 , and the second end of the mounting beam 4 is fixedly mounted on the second support seat 3 . The upper surface of the mounting beam 4 is provided with a first guide rail 6 and a second guide rail 7 extending along a first horizontal direction.

[0046] The dicing unit 5 includes a mounting plate 50, a translation drive module 51, a lifting drive module 52 and a dicing blade assembly 53, wherein: the mounting plate 50 is slidably connected to the first guide rail 6 and the second guide rail 7, and is connected to the driving end of the translation drive module 51 disposed on the mounting crossbeam 4, and the translation drive module 51 is used to drive the mounting plate 50 to slide along the first guide rail 6 and the second guide rail 7. The lifting drive module 52 is mounted on the mounting plate 50, and the dicing blade assembly 53 is connected to the driving end of the lifting drive module 52, and the lifting drive module 52 is used to drive the dicing blade assembly 53 to rise and fall.

[0047] In the wafer dicing mechanism in the embodiment of the present application, the first guide rail 6 and the second guide rail 7 supporting the dicing blade assembly 53 are installed on the upper surface of the mounting crossbeam 4, that is, the first guide rail 6 and the second guide rail 7 are on the same horizontal plane. In this way, the loads borne by the first guide rail 6 and the second guide rail 7 are equivalent, so the deformations produced by the first guide rail 6 and the second guide rail 7 after being compressed are basically the same, so that the influence on the dicing height and dicing angle of the blade of the dicing blade assembly 53 is greatly reduced. In addition, since the first guide rail 6 and the second guide rail 7 are installed on the same horizontal plane, there will be no lateral deviation between the first guide rail 6 and the second guide rail 7, so the vertical angle error of the blade will not be magnified. Moreover, compared with the vertical installation of the first guide rail 6 and the second guide rail 7, the horizontal installation of the first guide rail 6 and the second guide rail 7 shortens the distance between the first guide rail and the second guide rail and the wafer, reduces the error caused by the machining error of the installation plane of the first guide rail and the second guide rail magnified by the arm length, and improves the dicing accuracy.

[0048] In addition, the wafer dicing mechanism in the embodiment of the present application, the support structure composed of the base 1, the first support seat 2, the second support seat 3 and the mounting beam 4 has good symmetry and high support strength, so that its deformation resistance is very good, and ultimately improves the dicing accuracy of the blade of the dicing part.

[0049] In order to facilitate the processing and forming of the first support seat 2, the second support seat 3 and the mounting beam 4, and to further enhance their structural strength and deformation resistance, optionally, the first support seat 2, the second support seat 3 and the mounting beam 4 are all integrally formed rectangular castings.

[0050] Optionally, the base 1 includes an integrally formed mounting portion 11, a first side support portion 12, and a second side support portion 13, wherein: the middle portion of the mounting portion 11 is along the second horizontal direction (eg Figure 1 and Figure 2 A mounting groove 14 for mounting a wafer carrier mechanism is provided in the second horizontal direction (in the Y-axis direction in FIG. 1 ), and the mounting groove 14 is located below the avoidance space, and the second horizontal direction is perpendicular to the first horizontal direction. The first side support portion 12 and the second side support portion 13 are symmetrically arranged on both sides of the mounting portion 11 along the first horizontal direction. The first support seat 2 is arranged on the first side support portion 12, and the second support seat 3 is arranged on the second side support portion 13.

[0051] By configuring the base 1 to include an integrally formed mounting portion 11, a first side support portion 12, and a second side support portion 13, the first support seat 12 and the second support seat 23 can be symmetrically mounted on the base 1, thereby improving the symmetry, structural stability, and anti-deformation capability of the wafer dicing mechanism, and ultimately improving the dicing accuracy. By providing a mounting groove 14 on the mounting portion 11, the installation of the wafer bearing mechanism is facilitated, and the wafer bearing mechanism is located in the middle of the base.

[0052] Optionally, the first support seat 2 and the second support seat 3 have the same structure. Taking the first support seat 2 as an example, a rectangular mounting groove 21 is provided on its side wall, a first mounting hole extending vertically to the lower surface of the first support seat 1 is provided at the bottom of the mounting groove 21, a second mounting hole corresponding to the first mounting hole is provided on the base 1, and the first support seat 2 is fixed to the base via bolts 22 penetrating the first mounting hole and the second mounting hole.

[0053] Such a configuration facilitates the disassembly and assembly of the first support seat 2 and the second support seat 3, and ensures the connection strength between the first support seat 2, the second support seat 3 and the base. In addition, the design of the rectangular mounting groove facilitates the release of the mechanical stress generated by the bolts during installation, thereby improving the deformation resistance of the first support seat and the second support seat.

[0054] like Figure 1 and Figure 2 As shown, optionally, the translation drive module 51 is located between the first guide rail 6 and the second guide rail 7, and the translation drive module 51 includes a first motor, a first screw and a first screw nut, wherein the first screw is connected to the driving end of the first motor and extends along the first horizontal direction, the first screw nut is screwed on the first screw and fixed to the bottom of the mounting plate, and the first motor drives the first screw to rotate, driving the first screw nut and the mounting plate 50 to translate along the screw. Of course, the translation drive module 51 can also adopt other known structures of linear drive modules that can drive the mounting plate 50 to translate along the first horizontal direction.

[0055] like Figure 1 As shown, optionally, the lifting drive module 52 includes a mounting block 521, a lifting drive member 522 and a connecting plate 523, wherein: the mounting block 521 is mounted on the mounting plate 50, and the upper end of the connecting plate 523 is slidably mounted on the mounting block 521 and connected to the driving end of the lifting drive member 522 disposed on the mounting block 521. The dicing knife assembly 53 is mounted at the lower end of the connecting plate 523.

[0056] By configuring the lifting drive module 52 , the lifting drive module 52 can be stably mounted on the mounting plate 50 , and a stable connection between the dicing knife assembly 53 and the lifting drive module 52 is achieved.

[0057] like Figure 1 As shown, optionally, the lifting drive module 52 further includes a third guide rail 526 and a fourth guide rail 527 vertically mounted on the mounting block 521, and the upper end of the connecting plate 523 is slidably mounted on the third guide rail 526 and the fourth guide rail 527 through four sliders 528 symmetrically arranged in pairs. Such an arrangement can improve the sliding connection stability between the connecting plate 523 and the mounting block 521, and ensure that the connecting plate 523 is stably lifted and lowered in the vertical direction.

[0058] like Figure 1 As shown, optionally, the connecting plate 523 includes an upper connecting plate 524 and a lower connecting plate 525, wherein the upper connecting plate 524 is slidably mounted on the mounting block 521 and connected to a driving end of a lifting drive member 522 disposed on the mounting block 521, the upper end of the lower connecting plate 525 is fixedly connected to the upper connecting plate 523, and the lower end of the lower connecting plate 525 is fixedly connected to a fixed end of the slicing knife assembly 53.

[0059] The connection plate 523 is configured as a split structure consisting of an upper connection plate 524 and a lower connection plate 525, which facilitates the processing of the connection plate 523 and reduces the processing difficulty of the connection plate 523. In addition, the upper connection plate 524 and the lower connection plate 525 can be made of different materials, such as the lower connection plate 525 can be made of a material with a low thermal expansion coefficient, thereby preventing the lower connection plate 525 from significantly expanding and deforming due to heat during the dicing process, thereby affecting the dicing accuracy.

[0060] Optionally, the lifting drive member 522 includes a second motor, a second screw and a second screw nut, wherein the second screw is connected to the driving end of the second motor and extends in the vertical direction, the second screw nut is screwed on the second screw and fixed to the upper end of the connecting plate 523, and the second motor drives the second screw to rotate to drive the second screw nut and the connecting plate 523 to rise and fall along the second screw. Of course, the lifting drive member 522 can also adopt other known structures of linear drive modules capable of lifting and falling the connecting plate 523.

[0061] like Figure 1 As shown, optionally, the slicing knife assembly 53 includes a blade drive motor 531 and a blade 532, wherein the blade drive motor 531 is connected to the lower end of the connecting plate 523, and the blade 532 is connected to the driving end of the blade drive motor 531, and the blade drive motor 531 is used to drive the blade 532 to rotate in a vertical plane.

[0062] The dicing process of the wafer dicing mechanism in the embodiment of the present application is as follows: after the wafer is fixed to the wafer carrying mechanism, the translation drive module 51 and the lifting drive module 52 cooperate to drive the dicing blade assembly 53 to translate and lift, so that the blade 532 of the dicing blade assembly 53 moves to a predetermined dicing position. Subsequently, the blade drive motor 531 drives the blade 532 to rotate at high speed in the vertical plane. At the same time, the wafer carrying mechanism adjusts the angle of the wafer, and then drives the wafer to move along the predetermined dicing direction. During the movement of the wafer, the blade 532 dices the wafer along the predetermined dicing route on the wafer.

[0063] As 1 and Figure 2As shown, optionally, the dicing blade assembly 53 is located on a first side (such as the front side) of the mounting block 521, and a counterweight mechanism is provided on a second side (such as the rear side) of the mounting block 521 opposite to the first side. In this way, the weights borne by both sides of the mounting block 521 are equal, further improving the structural symmetry and stability of the wafer dicing mechanism in the embodiment of the present application, and ultimately improving the dicing accuracy of the dicing blade assembly 53.

[0064] like Figure 1 As shown, optionally, the dicing unit 5 is arranged in two groups, and the dicing blade assemblies 53 of the two groups of dicing units 5 are symmetrically arranged. The two groups of dicing units 5 perform dicing simultaneously or alternately, thereby improving the dicing efficiency. The dicing blade assemblies 52 of the two groups of dicing units 5 are symmetrically arranged, further improving the structural symmetry and stability of the wafer dicing mechanism of the embodiment of the present application.

[0065] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A wafer dicing mechanism, characterized in that: The wafer dicing mechanism comprises a base, a first supporting seat, a second supporting seat, a mounting beam and a dicing unit, wherein: The first support seat and the second support seat are installed on the base at intervals along a first horizontal direction, and an escape space for escaping the wafer bearing mechanism is formed between the first support seat and the second support seat; One end of the mounting crossbeam is fixedly mounted on the first support seat, and the second end of the mounting crossbeam is fixedly mounted on the second support seat, and the upper surface of the mounting crossbeam is provided with a first guide rail and a second guide rail extending along the first horizontal direction; The dicing part includes a mounting plate, a translation drive module, a lifting drive module and a dicing knife assembly, wherein: the mounting plate is slidably connected to the first guide rail and the second guide rail, and is connected to the driving end of the translation drive module arranged on the mounting crossbeam, and the translation drive module is used to drive the mounting plate to slide along the first guide rail and the second guide rail; The lifting drive module is installed on the mounting plate, the dicing knife assembly is connected to the driving end of the lifting drive module, and the lifting drive module is used to drive the dicing knife assembly to lift.

2. The wafer dicing mechanism according to claim 1, characterized in that: The base comprises an integrally formed mounting portion, a first side support portion and a second side support portion, wherein: A mounting groove for mounting a wafer carrying mechanism is provided in the middle of the mounting portion along a second horizontal direction, the mounting groove is located below the avoidance space, and the second horizontal direction is perpendicular to the first horizontal direction; The first side support portion and the second side support portion are symmetrically arranged on both sides of the mounting portion along the first horizontal direction; The first support seat is arranged on the first side support portion, and the second support seat is arranged on the second side support portion.

3. The wafer dicing mechanism according to claim 1, characterized in that: The first support seat and the second support seat have the same structure. A rectangular mounting groove is provided on the side wall of the first support seat. A first mounting hole is provided at the bottom of the mounting groove and extends vertically to the lower surface of the first support seat. A second mounting hole corresponding to the first mounting hole is provided on the base. The first support seat is fixed to the base by bolts passing through the first mounting hole and the second mounting hole.

4. The wafer dicing mechanism according to claim 1, characterized in that: The translation drive module is located between the first guide rail and the second guide rail, and the translation drive module includes a first motor, a first screw rod and a first screw rod nut, wherein the first screw rod is connected to the driving end of the first motor and extends along the first horizontal direction, the first screw rod nut is screwed on the first screw rod and fixed on the bottom of the mounting plate, and when the first motor drives the first screw rod to rotate, it drives the first screw rod nut and the mounting plate to translate along the screw rod.

5. The wafer dicing mechanism according to claim 1, characterized in that: The lifting drive module includes a mounting block, a lifting drive member and a connecting plate, wherein: The mounting block is mounted on the mounting plate, and the upper end of the connecting plate is slidably mounted on the mounting block and connected to the driving end of the lifting driving member arranged on the mounting block; The dicing knife assembly is installed at the lower end of the connecting plate.

6. The wafer dicing mechanism according to claim 5, characterized in that: The lifting drive module also includes a third guide rail and a fourth guide rail vertically mounted on the mounting block, and the upper end of the connecting plate is slidably mounted on the third guide rail and the fourth guide rail via four sliding blocks symmetrically arranged in pairs.

7. The wafer dicing mechanism according to claim 5, characterized in that: The connecting plate includes an upper connecting plate and a lower connecting plate. The upper connecting plate is slidably mounted on the mounting block and connected to the driving end of the lifting drive member arranged on the mounting block. The upper end of the lower connecting plate is fixedly connected to the upper connecting plate, and the lower end of the lower connecting plate is fixedly connected to the fixed end of the dicing knife assembly.

8. The wafer dicing mechanism according to claim 5, characterized in that: The lifting drive component includes a second motor, a second screw rod and a second screw rod nut, wherein the second screw rod is connected to the driving end of the second motor and extends in the vertical direction, the second screw rod nut is screwed on the second screw rod and fixed at the upper end of the connecting plate, and when the second motor drives the second screw rod to rotate, it drives the second screw rod nut and the connecting plate to rise and fall along the second screw rod.

9. The wafer scribing mechanism according to claim 5, characterized in that: The dicing knife assembly includes a blade drive motor and a blade, wherein the blade drive motor is connected to the lower end of the connecting plate, the blade is connected to the driving end of the blade drive motor, and the blade drive motor is used to drive the blade to rotate in a vertical plane.

10. The wafer dicing mechanism according to claim 5, characterized in that: The dicing knife assembly is located on a first side of the mounting block, and a counterweight mechanism is provided on a second side of the mounting block opposite to the first side.

11. The wafer scribing mechanism according to claim 1, wherein: The dicing parts are arranged in two groups, and the dicing knife assemblies of the two groups of dicing parts are arranged symmetrically.

12. The wafer dicing mechanism according to claim 1, wherein: The first support seat, the second support seat and the mounting crossbeam are all integrally formed rectangular parallelepiped castings.

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