Testing device

Abstract

The utility model discloses a testing device, and relates to the technical field of semiconductors. The electric connector comprises a cylinder body, a conductive clamp and a pin, an accommodating cavity is arranged in the cylinder body, an accommodating hole is further arranged on the cylinder body, the conductive clamp is arranged in the accommodating cavity, and a mounting hole is arranged on the conductive clamp. And the contact pin penetrates through the mounting hole and the accommodating hole, and is electrically connected with the pin when the pin of the semiconductor module is inserted into the conductive clamp. Therefore, under the condition that the plurality of chips of the semiconductor module are tested respectively, the pins of the device can be inserted into the conductive clamps respectively, so that the performance test of the plurality of chips in a single device can be carried out respectively by bending the pins, the pins of the device can be prevented from being broken during the test, and the test efficiency is improved. The number of defective products of the device is reduced; and the product cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a testing device. Background Art

[0002] Discrete devices include semiconductor crystal diodes and semiconductor triodes. They are widely used in the power electronics industry. In the process of industrial electronic upgrading, in order to accommodate more transistors on the same chip area and realize more functions, the miniaturization of chips has received more and more attention.

[0003] However, as the chip is miniaturized, the electromagnetic field caused by the pins being too close affects the device parameters. For example, for a double-sealed diode, when testing two chips in the double-sealed diode, it is necessary to bend one pin of the other chip when testing one chip to avoid affecting the device parameters. Therefore, if the device pin is bent too many times or the angle is too large, the device pin may be broken, thereby increasing the number of defective devices. Utility Model Content

[0004] In view of the above problems, the present utility model is proposed to provide a testing device that overcomes the above problems or at least partially solves the above problems.

[0005] The utility model provides a testing device, which comprises:

[0006] A cylinder, wherein a receiving cavity is arranged in the cylinder, and a receiving hole is also arranged on the cylinder;

[0007] A conductive clip, which is disposed in the accommodating cavity and has a mounting hole;

[0008] The plug pin is inserted through the mounting hole and the receiving hole, and forms an electrical connection with the pin when the pin of the semiconductor module is inserted into the conductive clip.

[0009] An optional utility model content, the conductive clip forms a pressure contact with the cylinder.

[0010] An optional utility model content, the conductive clip includes an insertion portion, the mounting hole is opened at the bottom of the insertion portion, and the width of at least a portion of the insertion portion gradually narrows from close to the mounting hole to close to the pin.

[0011] An optional utility model content, the conductive clip also includes two guide parts, the two guide parts are arranged on the end of the insertion part close to the pin, wherein the distance between the two guide parts gradually increases from away from the pin to close to the pin.

[0012] An optional utility model content, the two guide parts form pressure contact with the cylinder respectively.

[0013] An optional utility model content, the conductive clip also includes two connecting parts, the two connecting parts are arranged on the end of the guide part away from the insertion part, wherein the two connecting parts respectively form a pressure contact with the cylinder.

[0014] An optional utility model content, the cylinder is made of insulating material.

[0015] An optional utility model content, the plug includes a limiting portion and a needle portion, the limiting portion is clamped in the conductive clip, and the needle portion passes through the mounting hole and the accommodating hole.

[0016] An optional utility model content, the limiting portion is a spherical limiting portion.

[0017] An optional utility model content, the middle area of ​​the needle part is a hollow structure.

[0018] Compared with the prior art, the utility model includes a cylinder, a conductive clip and a pin. A receiving cavity is provided in the cylinder, and a receiving hole is also provided on the cylinder. The conductive clip is provided in the receiving cavity, and a mounting hole is provided on the conductive clip. The pin passes through the mounting hole and the receiving hole, and when the pin of the semiconductor module is inserted into the conductive clip, it forms an electrical connection with the pin. Therefore, when testing multiple chips of the semiconductor module separately, the pins of the device can be respectively inserted into the conductive clip, so that the device can be tested by bending the pin, and the pin of the device can be prevented from being broken during the test, thereby reducing the number of defective devices and saving product costs.

[0019] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limitations of the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings.

[0021] In the attached picture:

[0022] Figure 1It is a schematic diagram of the cross-sectional structure of a testing device provided by an embodiment of the utility model;

[0023] Figure 2 It is a structural schematic diagram of a test device provided by an embodiment of the utility model being inserted into a semiconductor module;

[0024] Figure 3 This is a schematic diagram of a connection structure between a conductive clip and a plug pin provided by an embodiment of the utility model;

[0025] Figure 4 This is a schematic diagram of the structure of a conductive clip provided by an embodiment of the utility model;

[0026] Figure 5 It is a structural schematic diagram of another conductive clip provided by an embodiment of the utility model;

[0027] Figure 6 It is a structural schematic diagram of a plug pin provided in an embodiment of the utility model.

[0028] Figure numerals: 1. cylinder; 11. accommodating cavity; 12. accommodating hole; 2. conductive clip; 21. mounting hole; 22. insertion part; 23. guide part; 24. connecting part; 3. insertion pin; 31. limiting part; 32. needle part; 4. semiconductor module; 41. pin. DETAILED DESCRIPTION

[0029] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0030] Semiconductor discrete devices include semiconductor crystal diodes and semiconductor triodes. They are widely used in the power electronics industry. In addition, in the process of upgrading the electronicization of the industry, the miniaturization of chips has received more and more attention, which can accommodate more transistors on the same chip area, thereby realizing more functions.

[0031] However, as the chip is miniaturized, the electromagnetic field caused by the pins 41 being too close may affect the device parameters. For example, take the TO3PF-3L packaged power device (double-sealed diode) as an example. The TO-3PF package means that two chips are sealed together, and the middle pin 41 is a common pin 41. Therefore, when the electrical performance of the power device is tested, if the left chip is tested, the rightmost pin 41 of the device needs to be bent; if the right chip is tested, the leftmost pin 41 of the device needs to be bent, otherwise it will affect the electrical parameters of the device. However, if the device pin 41 is bent too many times or the angle is too large, the device pin 41 may be broken, thereby increasing the number of defective devices.

[0032] Therefore, the embodiment of the utility model discloses a test device, which may include a barrel 1, a conductive clip 2 and a pin 3, wherein a receiving cavity 11 is provided in the barrel 1, and a receiving hole 12 is also provided on the barrel 1, the conductive clip 2 is provided in the receiving cavity 11, and a mounting hole 21 is provided on the conductive clip 2. The pin 3 penetrates the mounting hole 21 and the receiving hole 12, and forms an electrical connection with the pin 41 when the pin 41 of the semiconductor module 4 is inserted into the conductive clip 2. In the case of testing multiple chips of the semiconductor module 4 separately, the pins 41 of the device can be respectively inserted into the conductive clip 2, so that the device test can be performed by bending the pin 3, and the device under test can be tested without bending the pin 41, which can avoid deformation of the device pin 41 and the pin 41 of the device being broken during the test, which affects the test of other parameters, thereby reducing the number of defective devices and saving product costs.

[0033] The test device disclosed in the embodiment of the utility model can be applied not only to the discrete devices, but also to other semiconductor modules 4 such as PIM (Power Integrated Module). The discrete devices described in the embodiment of the utility model do not limit the scenarios in which the test device is used.

[0034] Reference Figure 1-6 The present utility model provides a testing device, which may include a cylinder 1, a conductive clip 2 and a pin 3, wherein:

[0035] The barrel 1 is provided with a receiving cavity 11, and the barrel 1 is also provided with a receiving hole 12. The conductive clip 2 is provided in the receiving cavity 11, and the conductive clip 2 is provided with a mounting hole 21. The insertion pin 3 passes through the mounting hole 21 and the receiving hole 12, and when the pin 41 of the semiconductor module 4 is inserted into the conductive clip 2, the pin 3 forms an electrical connection with the pin 41.

[0036] In the embodiment of the utility model, a receiving cavity 11 may be provided in the cylinder 1, and the receiving cavity 11 is used to receive other components of the test device and is sleeved on the pin 41 of the semiconductor module 4. The cylinder 1 is also provided with a receiving hole 12, and the receiving hole 12 is used for the insertion pin 3 to be inserted outside the cylinder 1. The cross-sectional shape of the cylinder 1 may be circular, rectangular, etc. Those skilled in the art may determine the cross-sectional shape of the cylinder 1 according to actual design requirements, and no excessive restrictions are made here.

[0037] As a preferred embodiment, the cross-sectional shape of the barrel 1 can be circular. The conductive clip 2 is embedded in the accommodating cavity 11, and is used to form an electrical connection with the pin 41 of the semiconductor module 4 in the barrel 1. The conductive clip 2 clamps the pin 41 and forms an electrical connection with the pin 41 through the clamping portion between the conductive clip 2 and the pin 41.

[0038] The bottom of the conductive clip 2 may be provided with a mounting hole 21, and the mounting hole 21 is provided for the insertion pin 3 to pass through. After the insertion pin 3 passes through the mounting hole 21 and the receiving hole 12 in sequence, it extends to the outside of the cylinder 1. Moreover, when the pin 41 of the semiconductor module 4 is inserted into the conductive clip 2, the pin 41 is electrically connected to the conductive clip 2, and the conductive clip 2 is electrically connected to the insertion pin 3. Therefore, when the performance test of the semiconductor module 4 is required, a part of the insertion pin 3 extending outside the cylinder 1 can be bent for testing. This is equivalent to testing the device under test without bending the pin 41. That is, the pin 41 of the device under test is inserted into the conductive clip 2, and then the insertion pin 3 corresponding to the pin 41 that needs to be bent is bent. The testing device can avoid deformation of the device pin 41, and the pin 41 of the device is broken during testing, which affects the testing of other parameters, thereby reducing the number of defective devices and saving product costs.

[0039] During the assembly process of the test device, the pin 3 can be inserted into the mounting hole 21 in advance to connect the pin 3 to the conductive clip 2. Then the conductive clip 2 is installed in the accommodating cavity 11 of the barrel 1, and the pin 3 is inserted into the mounting hole 21 of the barrel 1, so that a part of the pin 3 is exposed outside the barrel 1, and the assembly of the test device is completed. In the case where the semiconductor module 4 needs to be tested, the pin 41 of the semiconductor module 4 is inserted into the conductive clip 2, so that the conductive clip 2 clamps the pin 41.

[0040] In some embodiments, the number of test devices that need to be installed when testing the semiconductor module 4 may be consistent with the number of pins 41 of the semiconductor module 4. For example, when the number of pins 41 of the semiconductor module 4 is 3, the number of test devices installed may be 3. In other embodiments, the number of test devices that need to be installed when testing the semiconductor module 4 may be consistent with the number of pins 41 that need to be bent on the semiconductor module 4. For example, when the number of pins 41 of the semiconductor module 4 is 3, considering that one of the pins 41 is a common pin 41, it does not need to be bent during the test. The test device may not need to be installed on the common pin 41, and thus, the number of test devices installed on the pin 41 of the semiconductor module 4 may be 2. The operator may determine the specific number of test devices based on actual conditions, and no excessive restrictions are made here.

[0041] In summary, the embodiment of the utility model discloses a testing device, which may include a cylinder 1, a conductive clip 2 and a pin 3. A receiving cavity 11 is provided in the cylinder 1, and a receiving hole 12 is also provided on the cylinder 1. The conductive clip 2 is provided in the receiving cavity 11, and a mounting hole 21 is provided on the conductive clip 2. The pin 3 passes through the mounting hole 21 and the receiving hole 12, and when the pin 41 of the semiconductor module 4 is inserted into the conductive clip 2, it forms an electrical connection with the pin 41. Therefore, when testing multiple chips of the semiconductor module 4 separately, the pins 41 of the device can be respectively inserted into the conductive clip 2, so that the device test can be performed by bending the pin 3, and the pin 41 of the device can be prevented from being broken during the test, thereby reducing the number of defective devices and saving product costs.

[0042] At the same time, if the same type of semiconductor module 4 is tested, the pins 3 on the test device can be bent in advance, so that the test device only needs to be repeatedly inserted into the pins 41 of different semiconductor modules 4, which can also greatly improve the testing efficiency of the semiconductor module 4.

[0043] In some embodiments, the conductive clip 2 and the cylinder 1 may be clearance-fitted; in other embodiments, the conductive clip 2 and the cylinder 1 may form a pressure contact; in still other embodiments, the conductive clip 2 may be freely placed in the cylinder 1. Those skilled in the art may determine the connection relationship between the conductive clip 2 and the cylinder 1 according to actual design requirements, and no further limitation is made here.

[0044] In a preferred embodiment of the utility model, the conductive clip 2 forms a pressure contact with the cylinder 1 .

[0045] In the embodiment of the utility model, the conductive clip 2 forms a pressure contact with the cylinder 1, that is, when the conductive clip 2 is installed in the accommodating cavity 11 of the cylinder 1, its outer end surface is deformed under the pressure of the inner wall of the cylinder 1. Thus, the conductive clip 2 can be positioned in the accommodating cavity 11. It is more convenient to insert the pin 41 of the semiconductor module 4 into the conductive clip 2. On the other hand, when the conductive clip 2 forms a pressure contact with the cylinder 1, the connection stability between the conductive clip 2 and the cylinder 1 can be improved without setting any fasteners.

[0046] An optional utility model embodiment, referring to Figure 1 , Figure 2 , Figure 3 as well as Figure 4 As shown, the conductive clip 2 may include an inserting portion 22 , the mounting hole 21 is opened at the bottom of the inserting portion 22 , and the width of at least a portion of the inserting portion 22 gradually narrows from close to the mounting hole 21 to close to the pin 41 .

[0047] In the embodiment of the utility model, the conductive clip 2 may be made of metal material, and may include an inserting portion 22, and the inserting portion 22 is used for inserting the semiconductor module 4. The mounting hole 21 is opened at the bottom of the inserting portion 22. Among them, the width of at least a part of the inserting portion 22 gradually narrows from the direction close to the mounting hole 21 to the direction close to the pin 41. It can be understood that at least a part of the inserting portion 22 may have a cross-sectional shape in the vertical direction that is narrow at the top and wide at the bottom, similar to a trapezoid. Therefore, there is enough space at the bottom of the inserting portion 22 to facilitate the insertion of the pin 3 and to limit the pin 3. The upper area of ​​the inserting portion 22 clamps the pin 41.

[0048] The trapezoidal shape formed for at least a portion of the insertion portion 22 may include the following types: first, a regular trapezoidal shape, that is, the upper and lower bases are arranged horizontally, and the side edges are straight lines; second, an irregular trapezoidal shape, the upper and lower bases are arranged horizontally, and the side edges are curved lines. Alternatively, the upper base is not arranged horizontally (it can also be understood as being arranged obliquely), and the side edges are straight lines. Alternatively, the upper base is not arranged horizontally, and the side edges are curved lines.

[0049] An optional utility model embodiment, referring to Figure 1 , Figure 2 , Figure 3 as well as Figure 4 As shown, the conductive clip 2 may further include two guide portions 23, which are arranged on the end of the insertion portion 22 close to the pin 41, wherein the distance between the two guide portions 23 gradually increases from away from the pin 3 to close to the pin 41.

[0050] In the embodiment of the utility model, the conductive clip 2 may further include two guide portions 23, and the two guide portions 23 are arranged on the end of the insertion portion 22 close to the pin 41. The arrangement of the guide portion 23 can facilitate the insertion of the pin 3 into the conductive clip 2, and also facilitate the insertion of the pin 41 of the semiconductor module 4 into the conductive clip 2. The distance between the two guide portions 23 gradually increases from the direction away from the pin 3 to the direction close to the pin 41, which can be understood as the cross-sectional shape of the two guide portions 23 in the vertical direction can be a trapezoidal shape with a wide top and a narrow bottom. Thus, a guiding inclined surface with an opening facing upward and a gradually increasing opening is formed by the two guide portions 23. As a result, it is more conducive to the assembly between the pin 41 and the conductive clip 2, and between the pin 3 and the conductive clip 2.

[0051] The trapezoid-like shapes formed by the two guide portions 23 may include the following types: first, a regular trapezoid, that is, the upper and lower bases are arranged horizontally, and the side edges are straight lines; second, an irregular trapezoid, the upper and lower bases are arranged horizontally, and the side edges are curved lines. Alternatively, the upper base is not arranged horizontally (it can also be understood as an inclined arrangement), and the side edges are straight lines. Alternatively, the upper base is not arranged horizontally, and the side edges are curved lines.

[0052] During the assembly of the test device, the pin 3 can be conveniently inserted into the conductive clip 2 and penetrate the mounting hole 21 through the upwardly opening guiding inclined surfaces formed by the two guide portions 23. During the performance test of the semiconductor module 4, the pin 41 of the semiconductor module 4 can be conveniently inserted into the conductive clip 2 through the upwardly opening guiding inclined surfaces formed by the two guide portions 23, so that the conductive clip 2 limits the pin 41.

[0053] In an optional embodiment of the utility model, the two guide portions 23 respectively form pressure contact with the cylinder body 1.

[0054] In the embodiment of the utility model, the two guide portions 23 respectively form pressure contact with the cylinder 1. That is to say, the ends of the two guide portions 23 that are away from each other are respectively in pressure contact with the cylinder 1 when the conductive clip 2 is assembled into the accommodating cavity 11. That is to say, when the conductive clip 2 is installed in the accommodating cavity 11 of the cylinder 1, the ends of the two guide portions 23 that are away from each other are deformed under the pressure of the inner wall of the cylinder 1. Thereby, the position of the conductive clip 2 can be limited in the accommodating cavity 11. It is more convenient for the pins 41 of the semiconductor module 4 to be inserted into the conductive clip 2. On the other hand, when the guide portion 23 forms pressure contact with the cylinder 1, the connection stability between the conductive clip 2 and the cylinder 1 can be improved without providing any fasteners.

[0055] An optional utility model embodiment, referring to Figure 5 As shown, the conductive clip 2 may further include two connecting portions 24 , which are disposed on the ends of the guide portion 23 away from the inserting portion 22 , wherein the two connecting portions 24 are in pressure contact with the cylinder 1 respectively.

[0056] In the embodiment of the utility model, the conductive clip 2 may further include two connecting parts 24, and the two connecting parts 24 are arranged on the end of the guide part 23 away from the insertion part 22, that is to say. Each connecting part 24 is extended and arranged on the end of the guide part 23 away from the insertion part 22. The two connecting parts 24 respectively form pressure contact with the cylinder 1, which can also be understood as the extension direction of the connecting part 24 on the end of the guide part 23 away from the insertion part 22 is extended outward (the two connecting parts 24 are away from each other). As a result, the ends of the two connecting parts 24 away from each other form pressure contact with the cylinder 1 respectively.

[0057] That is to say, when the conductive clip 2 is installed in the accommodating cavity 11 of the cylinder 1, the ends of the two connecting parts 24 that are away from each other are deformed under the pressure of the inner wall of the cylinder 1. Thus, the conductive clip 2 can be positioned in the accommodating cavity 11. It is more convenient to insert the pins 41 of the semiconductor module 4 into the conductive clip 2. On the other hand, when the connecting part 24 forms a pressure contact with the cylinder 1, the connection stability between the conductive clip 2 and the cylinder 1 can be improved without any fasteners.

[0058] In summary, the insertion portion 22, the guide portion 23 and the connecting portion 24 may be an integrated structure. The integrated structure may improve the connection stability between the insertion portion 22, the guide portion 23 and the connecting portion 24, that is, the structural stability of the conductive clip 2 may be improved. In some embodiments, the insertion portion 22, the guide portion 23 and the connecting portion 24 may be made of a metal material with good conductivity, for example, the metal material includes but is not limited to silver material and copper material. Those skilled in the art may select a specific metal material according to actual design requirements, and no excessive restrictions are made here.

[0059] In an optional embodiment of the utility model, the cylinder 1 is made of insulating material.

[0060] In the embodiment of the utility model, the barrel 1 is made of insulating material. Therefore, during the performance test of the semiconductor module 4, the pins 41 between two adjacent semiconductor modules 4 can be electrically insulated from each other, thereby preventing the electromagnetic field generated by the pins 41 being too close during the test from affecting the electrical parameters of the semiconductor module 4, resulting in a reduction in the accuracy of the test result of the semiconductor module 4.

[0061] In some embodiments, the insulating material may include but is not limited to insulating plastic, insulating rubber, glass fiber, etc. Among them, the insulating plastic may include polyvinyl chloride, polyethylene, and polypropylene, etc., which have excellent electrical insulation performance and mechanical strength. The insulating rubber may include silicone rubber and chloroprene rubber, etc., which have good electrical insulation performance and high temperature resistance. Glass fiber is an inorganic non-metallic material, which has excellent electrical insulation performance, high temperature resistance and mechanical strength.

[0062] Those skilled in the art can select specific insulating materials according to actual design requirements. For example, polyvinyl chloride can be selected to make the cylinder 1; for another example, polyethylene can be selected to make the cylinder 1; for another example, silicone rubber can be selected to make the cylinder 1, and no further limitation is given here.

[0063] An optional utility model embodiment, referring to Figure 3 and Figure 6 As shown, the plug pin 3 may include a limiting portion 31 and a needle portion 32 , the limiting portion 31 is snapped into the conductive clip 2 , and the needle portion 32 is arranged to pass through the mounting hole 21 and the accommodating hole 12 .

[0064] In the embodiment of the utility model, the plug pin 3 may include a limiting portion 31 and a needle portion 32, wherein the limiting portion 31 is snapped into the insertion portion 22 of the conductive clip 2. The width of at least a portion of the insertion portion 22 gradually narrows from the direction close to the mounting hole 21 to the direction close to the pin 41, which can be understood as at least a portion of the insertion portion 22 having a vertical cross-sectional shape that is narrow at the top and wide at the bottom, similar to a trapezoid. Thereby, there is enough space at the bottom of the insertion portion 22 to facilitate the insertion of the limiting portion 31 and the needle portion 32, and to limit the needle portion 32, and the needle portion 32 is provided to penetrate the mounting hole 21 and the receiving hole 12.

[0065] An optional utility model embodiment, referring to Figure 3 and Figure 6 As shown, the limiting portion 31 is a spherical limiting portion 31 .

[0066] In the embodiment of the utility model, the spherical stopper 31 can be understood as the stopper 31 being spherical, and correspondingly, the cross-sectional shape of the stopper 31 is circular. When the stopper 31 is a spherical stopper 31, its corresponding diameter can be larger than the diameter of the mounting hole 21. In addition, the narrowest width of the cross-sectional shape of the insertion portion 22 in the vertical direction is smaller than the width of the pin 41 of the semiconductor module 4.

[0067] Thus, the limiting portion 31 can form a guide slope with an upward opening and a gradually increasing opening through the two guide portions 23, and when moving into the insertion portion 22, that is, when plugged into the insertion portion 22 from above, the width of the guide slope gradually decreases. The limiting portion 31 squeezes the insertion portion 22 to expand outward and enters the insertion portion 22.

[0068] Furthermore, at least a portion of the insertion portion 22 may have a cross-sectional shape in the vertical direction that is narrow at the top and wide at the bottom, similar to a trapezoid. The width of the insertion portion 22 at the bottom position is greater than the diameter of the limiting portion 31. Thus, when the limiting portion 31 enters the lower area of ​​the insertion portion 22, as the width of the insertion portion 22 gradually increases, the pressure contact force between the limiting portion 31 and the insertion portion 22 gradually decreases. Thus, when the limiting portion 31 forms a surface contact with the mounting hole 21, the insertion portion 22 can limit the limiting portion 31 without deformation or with very little deformation. For example, the limiting portion 31 can form a three-sided contact with the insertion portion 22.

[0069] In addition, the pin 41 forms a guide slope with an opening facing upward and gradually increasing through the two guide portions 23. When the pin 41 moves into the insertion portion 22, that is, when it is plugged into the insertion portion 22 from above, the width of the guide slope gradually decreases. The pin 41 squeezes the insertion portion 22 to open outward, thereby allowing the pin 41 to enter the insertion portion 22 and form an electrical connection with the insertion portion 22. And because the pin 41 forms a pressure contact with the insertion portion 22 (it can also be understood that the insertion portion 22 clamps the pin 41), the conductive stability of the pin 41 and the insertion portion 22 can be guaranteed during the test of the semiconductor module 4.

[0070] In one example, if the cross-sectional shape of all the inserting portions 22 in the vertical direction can be a trapezoidal shape that is narrow at the top and wide at the bottom, the width of the top of the corresponding inserting portion 22 is smaller than the width of the pin 41, so that the inserting portion 22 at this location clamps the pin 41.

[0071] An optional utility model embodiment, referring to Figure 6 As shown, the middle area of ​​the needle portion 32 is a hollow structure.

[0072] In the embodiment of the utility model, the middle area of ​​the needle portion 32 is a hollow structure, which can improve the deformation performance of the needle portion 32, thereby preventing the needle portion 32 from breaking when being bent repeatedly. On the other hand, it can also save the material usage of the needle portion 32, thereby reducing the production cost of the testing device.

[0073] In some embodiments, the end of the needle portion 32 away from the limiting portion 31 is provided with a chamfer, so that the needle portion 32 is more easily inserted into the conductive clip 2 and facilitates the electrical connection between the needle portion 32 and the device testing equipment.

[0074] In an optional embodiment of the utility model, the needle portion 32 and the limiting portion 31 may be fixed by welding; in another optional embodiment of the utility model, the needle portion 32 and the limiting portion 31 may be an integrated structure, in which case the needle portion 32 and the limiting portion 31 are an integrated structure, the assembly process of the needle portion 32 and the limiting portion 31 may be reduced, and the production cost of the plug pin 3 may be reduced. Those skilled in the art may determine the connection method between the needle portion 32 and the limiting portion 31 according to actual design requirements, and no excessive limitation is made here.

[0075] During the assembly process of the test device, the pin 3 can be inserted into the mounting hole 21 in advance to connect the pin 3 to the conductive clip 2. Then the conductive clip 2 is installed in the accommodating cavity 11 of the barrel 1, and the pin 3 is inserted into the mounting hole 21 of the barrel 1, so that a part of the pin 3 is exposed outside the barrel 1, and the assembly of the test device is completed. In the case where the semiconductor module 4 needs to be tested, the pin 41 of the semiconductor module 4 is inserted into the conductive clip 2, so that the conductive clip 2 clamps the pin 41. As a result, the pin 41 of the semiconductor module 4 is electrically connected to the plug-in portion, the plug-in portion is electrically connected to the limit portion 31, the limit portion 31 is electrically connected to the needle portion 32, and the needle portion 32 is electrically connected to the device testing equipment, so that the device test can be performed by bending the pin 3, and the pin 41 of the device can be prevented from being broken during the test, thereby reducing the number of defective devices and saving product costs.

[0076] In summary, the embodiment of the utility model discloses a testing device, which may include a cylinder 1, a conductive clip 2 and a pin 3. A receiving cavity 11 is provided in the cylinder 1, and a receiving hole 12 is also provided on the cylinder 1. The conductive clip 2 is provided in the receiving cavity 11, and a mounting hole 21 is provided on the conductive clip 2. The pin 3 passes through the mounting hole 21 and the receiving hole 12, and when the pin 41 of the semiconductor module 4 is inserted into the conductive clip 2, it forms an electrical connection with the pin 41. Therefore, when testing multiple chips of the semiconductor module 4 separately, the pins 41 of the device can be respectively inserted into the conductive clip 2, so that the device test can be performed by bending the pin 3, and the pin 41 of the device can be prevented from being broken during the test, thereby reducing the number of defective devices and saving product costs.

[0077] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0078] It is easy for a person skilled in the art to think that any combination of the above embodiments is feasible, so any combination of the above embodiments is an implementation scheme of the present utility model. However, due to space limitations, this specification will not describe them in detail here.

[0079] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0080] Similarly, it should be understood that in order to simplify the present invention and help understand one or more of the various aspects of the present invention, in the above description of exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof.

[0081] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

Claims

1. A testing device, characterized in that: The device comprises: A cylinder (1), wherein a receiving cavity (11) is arranged inside the cylinder (1), and a receiving hole (12) is also arranged on the cylinder (1); A conductive clip (2), the conductive clip (2) being arranged in the accommodating cavity (11), and a mounting hole (21) being provided on the conductive clip (2); A plug pin (3) is provided, wherein the plug pin (3) penetrates the mounting hole (21) and the receiving hole (12), and forms an electrical connection with the pin (41) when the pin (41) of the semiconductor module (4) is inserted into the conductive clip (2).

2. The testing device according to claim 1, characterized in that: The conductive clip (2) forms a pressure contact with the cylinder (1).

3. The testing device according to claim 2, characterized in that: The conductive clip (2) comprises an inserting portion (22), the mounting hole (21) is opened at the bottom of the inserting portion (22), and the width of at least a portion of the inserting portion (22) gradually narrows from a direction close to the mounting hole (21) to a direction close to the pin (41).

4. The testing device according to claim 3, characterized in that: The conductive clip (2) further comprises two guide portions (23), the two guide portions (23) being arranged on the end of the insertion portion (22) close to the pin (41), wherein the distance between the two guide portions (23) gradually increases from a direction away from the insertion pin (3) to a direction close to the pin (41).

5. The testing device according to claim 4, characterized in that: The two guide parts (23) are respectively in pressure contact with the cylinder (1).

6. The testing device according to claim 4, characterized in that: The conductive clip (2) further comprises two connecting parts (24), wherein the two connecting parts (24) are arranged on the end of the guide part (23) away from the insertion part (22), wherein the two connecting parts (24) respectively form a pressure contact with the cylinder (1).

7. The testing device according to claim 1, characterized in that: The cylinder (1) is made of insulating material.

8. The testing device according to claim 1, characterized in that: The plug pin (3) comprises a limiting portion (31) and a needle portion (32); the limiting portion (31) is snap-fitted into the conductive clip (2); and the needle portion (32) is arranged to penetrate the mounting hole (21) and the accommodating hole (12).

9. The testing device according to claim 8, characterized in that: The limiting portion (31) is a spherical limiting portion (31).

10. The testing device according to claim 8, characterized in that: The middle area of ​​the needle part (32) is a hollow structure.

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