Liquid crystal panel and electronic equipment

Abstract

The utility model relates to a liquid crystal panel and electronic equipment. The liquid crystal panel comprises a first substrate and a second substrate which are oppositely arranged in a spaced mode, a transparent conductive film is arranged on the side, close to the first substrate, of the second substrate, the first substrate and the second substrate are each provided with a corresponding edge area, and the first substrate is provided with a conductive unit in a target area of the edge areas; the conductive frame glue is arranged on the edge area of the side, close to the second substrate, of the first substrate and attached to the transparent conductive thin film, so that the first substrate, the transparent conductive thin film and the conductive frame glue form a cavity supporting and containing liquid crystals. The electronic device includes a liquid crystal panel.

Description

Technical Field

[0001] The present application relates to the technical field of liquid crystal panels, and in particular to a liquid crystal panel and an electronic device. Background Art

[0002] With the rapid development of the electronics industry and the rapid iteration of image display needs, liquid crystal panels came into being and have been widely used in all aspects of daily life due to their convenience.

[0003] Among liquid crystal panels, LCoS (Liquid Crystal on Silicon) panels have the advantages of high light utilization efficiency and small size, thus having excellent color performance. However, the manufacturing process of LCoS liquid crystal panels is not yet mature, and the production efficiency is low due to its lengthy production process, which makes it difficult for LCoS liquid crystal panels to be widely used. Utility Model Content

[0004] Based on this, it is necessary to provide a liquid crystal panel and electronic equipment with good conductive performance and high production efficiency.

[0005] In a first aspect, the present application provides a liquid crystal panel, the liquid crystal panel comprising:

[0006] A first substrate and a second substrate are arranged opposite to each other and spaced apart, a transparent conductive film is provided on a side of the second substrate close to the first substrate, the first substrate and the second substrate respectively have corresponding edge regions, and a conductive unit is provided in a target region of the edge region of the first substrate;

[0007] The conductive frame glue is arranged at the edge area of ​​the first substrate close to the second substrate and is attached to the transparent conductive film, so that the first substrate, the transparent conductive film and the conductive frame glue form a cavity supporting and accommodating liquid crystal.

[0008] In one embodiment, the conductive frame glue includes a first conductive layer and a second conductive layer which are sequentially stacked on an edge region of the first substrate, and the conductive property of the first conductive layer is better than that of the second conductive layer.

[0009] In one embodiment, the number of the first conductive layer and the number of the second conductive layer are respectively plural, and the first conductive layer and the second conductive layer are cross-stacked in sequence along the direction from the first substrate to the second substrate.

[0010] In one embodiment, the target area is four vertex areas of the edge area.

[0011] In one embodiment, an LCoS chip is disposed on the first substrate, and pins of the LCoS chip are electrically connected to the conductive unit.

[0012] In one embodiment, the conductive unit is in a shape of a dot, a line, and a rectangle, and the length of the conductive unit is 10-1000 μm.

[0013] In one embodiment, the first conductive layer is made of any one of gold balls, silver balls, silver paste, nanosilver and conductive carbon paste.

[0014] In one embodiment, the thickness of the second conductive layer satisfies a first preset thickness condition so that the box thickness of the liquid crystal panel satisfies a second preset thickness condition, the value range of the first preset thickness condition is less than or equal to the value range of the second preset thickness condition, and the second conductive layer is composed of any one of silicon and spacer materials.

[0015] In one embodiment, the first substrate is a silicon substrate, and the second substrate is an ITO glass substrate.

[0016] In a second aspect, the present application provides an electronic device, comprising a liquid crystal panel according to any one of the first aspect of the embodiments of the present application.

[0017] In the above-mentioned liquid crystal panel and electronic device, since the liquid crystal panel includes a first substrate and a second substrate that are arranged oppositely and spaced apart, a transparent conductive film is provided on a side of the second substrate close to the first substrate, the first substrate and the second substrate respectively have corresponding edge regions, and the first substrate is provided with a conductive unit in a target region of the edge region, the liquid crystal panel also includes a conductive frame glue, and the conductive frame glue is provided in an edge region of the first substrate close to the second substrate, and is bonded with the transparent conductive film, so that the first substrate, the transparent conductive film and the conductive frame glue form a cavity that supports and accommodates liquid crystals. With the liquid crystal panel disclosed in the present application, since the first substrate is provided with a conductive unit in the target region of the edge region, and at the same time, the first substrate and the second substrate are bonded by the conductive frame glue having conductive properties, in the process of manufacturing the liquid crystal panel, a conductive path can be formed between the first substrate and the second substrate while bonding the first substrate and the second substrate, thereby eliminating the subsequent process of enhancing the conductive performance of the liquid crystal panel, while ensuring the conductive performance of the liquid crystal panel, the production efficiency of the liquid crystal panel is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] FIG1 is a schematic diagram of the structure of a liquid crystal panel provided in an embodiment of the present application;

[0020] FIG2 is a schematic diagram of the structure of a conductive sealant provided in an embodiment of the present application;

[0021] FIG3 is a schematic diagram of the structure of another conductive sealant provided in an embodiment of the present application;

[0022] FIG. 4 is a schematic diagram of the position between a conductive frame glue and a conductive unit provided in an embodiment of the present application.

[0023] Reference numerals

[0024] A first substrate 100 ; a second substrate 200 ; a conductive sealant 300 ; a conductive unit 1001 ; a conductive film 2001 ; a first conductive layer 3001 ; and a second conductive layer 3002 . DETAILED DESCRIPTION

[0025] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0027] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0028] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0029] It can be understood that “at least one” means one or more, “plurality” means two or more, and “at least a portion of an element” means a part or all of an element.

[0030] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0031] Based on this, as shown in FIG1 , an embodiment of the present application provides a liquid crystal panel, which includes:

[0032] The first substrate 100 and the second substrate 200 are arranged opposite to each other and spaced apart. A transparent conductive film 2001 is provided on the side of the second substrate 200 close to the first substrate 100. The first substrate 100 and the second substrate 200 have corresponding edge areas respectively. The first substrate 100 is provided with a conductive unit 1001 in a target area of ​​the edge area.

[0033] The conductive sealant 300 is disposed at an edge region of the first substrate 100 close to the second substrate 200 and is attached to the transparent conductive film 2001 , so that the first substrate 100 , the transparent conductive film 2001 and the conductive sealant 300 form a cavity for supporting and accommodating liquid crystals.

[0034] Optionally, the first substrate 100 and the second substrate 200 may be different types of substrates, and the conductive property of the first substrate 100 may be better than that of the second substrate 200 .

[0035] Specifically, the conductivity of the transparent conductive film 2001 is higher than the preset conductivity; the transparent conductive film 2001 is arranged on the side of the second substrate 200 close to the first substrate 100 in order to enhance the conductivity of the first substrate 100 and the second substrate 200, thereby ensuring that the liquid crystal has a higher response ability.

[0036] The preset conductivity is the conductivity of the first substrate 100. The selection of the conductivity of the first substrate 100 is related to the material used for the first substrate. For example, the material used for the first substrate is silicon, and the conductivity of silicon is 1.0×10^ 4 S / m, the transparent conductive film 2001 can be selected to have a conductivity greater than 1.0×10^ 4 Material of S / m.

[0037] Optionally, the conductive unit 1001 may be a metal pad disposed in a target area of ​​an edge region of the first substrate 100 .

[0038] Specifically, the conductive unit 1001 is disposed on an edge region of the first substrate 100 on a side close to the second substrate 200 by coating.

[0039] In this embodiment, the liquid crystal panel has a first substrate and a second substrate that are arranged oppositely and spaced apart, a transparent conductive film is provided on a side of the second substrate close to the first substrate, the first substrate and the second substrate respectively have corresponding edge regions, the first substrate is provided with a conductive unit in a target region of the edge region, the liquid crystal panel also includes a conductive frame glue, and the conductive frame glue is provided in the edge region of the first substrate close to the second substrate, and is bonded with the transparent conductive film, so that the first substrate, the transparent conductive film and the conductive frame glue form a cavity that supports and accommodates liquid crystals. With the liquid crystal panel disclosed in the present application, since the first substrate is provided with a conductive unit in the target region of the edge region, and at the same time, the first substrate and the second substrate are bonded by the conductive frame glue with conductive properties, during the production process of the liquid crystal panel, a conductive path can be formed between the first substrate and the second substrate while bonding the first substrate and the second substrate, thereby eliminating the subsequent process of enhancing the conductive performance of the liquid crystal panel, while ensuring the conductive performance of the liquid crystal panel, the production efficiency of the liquid crystal panel is also improved.

[0040] In one embodiment, the conductive sealant 300 includes a first conductive layer 3001 and a second conductive layer 3002 sequentially stacked on the edge region of the first substrate 100 , and the conductive property of the first conductive layer 3001 is better than that of the second conductive layer 3002 .

[0041] Optionally, the first conductive layer 3001 is composed of a high-conductivity material. Optionally, the high-conductivity material may include gold balls, silver powder, nanosilver or other materials. Exemplarily, the first conductive layer 3001 is composed of a mixture of gold balls, silver powder, nanosilver and conductive carbon paste. By selecting and adjusting the material of the first conductive layer 3001, the conductive performance requirements of the first conductive layer and the consideration of the manufacturing cost can be taken into account.

[0042] Specifically, the first conductive layer 3001 and the second conductive layer 3002 are both frame-shaped; the size and shape of the first conductive layer 3001 can be respectively the same as the size and shape of the second conductive layer 3002, which is beneficial for making the bonding positions of the first conductive layer 3001 and the second conductive layer 3002 completely correspond to each other when the first conductive layer 3001 and the second conductive layer 3002 are aligned and bonded, ensuring the flatness of the edge portion of the conductive frame glue 300.

[0043] In this embodiment, the first conductive layer and the second conductive layer are sequentially stacked on the edge area of ​​the first substrate to form a conductive frame glue, and the conductive performance of the first conductive layer is better than that of the second conductive layer. Therefore, the conductive frame glue has higher conductive performance, thereby ensuring that the liquid crystal panel has higher conductive performance.

[0044] In one embodiment, the first conductive layer 3001 and the second conductive layer 3002 are respectively multiple in number, and the first conductive layer 3001 and the second conductive layer 3002 are sequentially cross-stacked along the direction from the first substrate 100 to the second substrate 200 .

[0045] Optionally, the number of layers of the first conductive layer 3001 and the number of layers of the second conductive layer 3002 can be determined according to the thickness of the first conductive layer 3001 and the thickness of the second conductive layer 3002; for example: when the box thickness is set to 2.0um, the thickness of the conductive layer should be greater than 2.0um and less than 2.3um; if the conductive layer is stacked in two layers, the first conductive layer should be less than 0.3um, and the second conductive layer should be less than 2.0um. It should be noted that the predetermined box thickness referred to in this application refers to the spacing distance between the first substrate and the second substrate. Since the box thickness is set to 2.0um, in actual operation, it is necessary to consider the compression rate of the material used for the conductive layer during the box pressing process to prevent the actual box thickness after box pressing from being too small to meet the set box thickness requirement. Therefore, the thickness of the conductive layer before box pressing should be greater than the set box thickness so that the box thickness after box pressing is equal to the set box thickness.

[0046] Furthermore, the thickness of the first conductive layer 3001 and the thickness of the second conductive layer 3002, as well as the number of the first conductive layer 3001 and the number of the second conductive layer 3002, should satisfy the condition that the box thickness of the final liquid crystal panel is equal to the target thickness.

[0047] Exemplarily, as shown in FIG2 , a conductive frame glue 300 is shown, in which the number of layers of the first conductive layer 3001 and the second conductive layer 3002 are respectively 2, and the direction of the arrow shown in FIG2 is the direction from the first substrate 100 to the second substrate 200, that is, the first conductive layer 3001 and the second conductive layer 3002 are cross-stacked in sequence along the direction from the first substrate 100 to the second substrate 200.

[0048] In this embodiment, the number of first conductive layers and second conductive layers are multiple, and the first conductive layers and second conductive layers are cross-stacked in sequence from the first substrate to the second substrate, thereby ensuring that the conductive frame glue can further improve the conductive performance of the liquid crystal panel.

[0049] It should be noted that in a specific implementation, the second conductive layer 3002 and the first conductive layer 3001 may be cross-stacked in sequence along the direction from the first substrate 100 to the second substrate 200, and the cross-stacking order of the first conductive layer 3001 and the second conductive layer 3002 is not limited herein.

[0050] In one embodiment, the conductive frame glue 300 includes a first conductive layer 3001 and a second conductive layer 3002 arranged side by side on the edge area of ​​the first substrate 100, the conductivity of the first conductive layer 3001 is better than that of the second conductive layer 3002, and the first conductive layer 3001 is arranged outside the edge area of ​​the second conductive layer 3002.

[0051] Specifically, since the first conductive layer 3001 is arranged outside the edge area of ​​the second conductive layer 3002, the first conductive layer 3001 and the second conductive layer 3002 have the same shape, but the size of the first conductive layer 3001 is larger than the size of the second conductive layer 3002, so that the conductive frame glue 300 can have a smaller thickness and better conductive performance.

[0052] Exemplarily, in the conductive sealant 300 shown in FIG. 3 , the first conductive layer 3001 and the second conductive layer 3002 are arranged side by side on the edge region of the first substrate 100 , and the first conductive layer 3001 is arranged outside the edge region of the second conductive layer 3002 .

[0053] It should be noted that, in a specific implementation, the second conductive layer 3002 may be disposed outside the edge region of the first conductive layer 3001 , and the internal and external arrangement relationship between the first conductive layer 3001 and the second conductive layer 3002 is not limited herein.

[0054] In one embodiment, the target area is four vertex areas of the edge area.

[0055] In this embodiment, since the conductive units of the first substrate are disposed at the four vertex areas of the edge area, less material is used for the conductive units and the conductive frame glue can be ensured to form a conductive path between the conductive units and the first substrate.

[0056] Optionally, the target area may also be four vertex areas of the edge area, and midpoint areas of each side length of the edge area; further, the target area may also be the edge area.

[0057] In one embodiment, an LCoS chip is disposed on the first substrate 100 , and pins of the LCoS chip are electrically connected to the conductive unit 1001 .

[0058] In this embodiment, since an LCoS chip is disposed on the first substrate and the pins of the LCoS chip are electrically connected to the conductive unit, an LCoS liquid crystal panel with good conductive performance can be obtained.

[0059] In one embodiment, the shape of the conductive unit 1001 is one of a dot shape, a line shape, and a rectangle shape, and the length of the conductive unit 1001 is 10-1000 μm.

[0060] Optionally, the length of the conductive unit 1001 may also be less than or equal to 500 μm.

[0061] Exemplarily, as shown in FIG. 2 , the target area of ​​the edge region of the first substrate 100 provided with the conductive unit 1001 is the four vertex regions of the edge region, and the conductive unit 1001 is in a point shape, so that the four vertex regions of the conductive frame glue 300 cover the conductive unit 1001 in the four vertex regions of the edge region of the first substrate 100, that is, cover the side of the conductive unit 1001 away from the first substrate.

[0062] In one embodiment, the area of ​​the conductive unit 1001 meets a preset area condition.

[0063] Optionally, the preset area condition may be that the area of ​​the conductive unit 1001 is within an area range between the first area and the second area.

[0064] In one embodiment, the first conductive layer 3001 is made of any one of gold balls, silver balls, silver paste, nanosilver and conductive carbon paste.

[0065] Optionally, the first conductive layer 3001 may also be composed of at least one material selected from the group consisting of gold balls, silver balls, silver paste, nanosilver and conductive carbon paste. The first conductive layer 3001 may also include other materials with high conductivity.

[0066] In this embodiment, the first conductive layer is composed of any one of gold balls, silver balls, silver paste, nanosilver and conductive carbon paste, so that the first conductive layer has good conductive properties, thereby ensuring that the obtained liquid crystal panel also has good conductive properties.

[0067] In one embodiment, the thickness of the second conductive layer 3002 satisfies a first preset thickness condition, the box thickness of the liquid crystal panel satisfies a second preset thickness condition, the value range of the first preset thickness condition is less than or equal to the value range of the second preset thickness condition, and the second conductive layer 3002 is composed of any one of silicon and spacer materials.

[0068] Optionally, the first preset thickness condition may be that the thickness of the second conductive layer 3002 is within a range between a first thickness and a second thickness. For example, the first thickness is 2 μm, and the second thickness is 2.3 μm.

[0069] Optionally, the second preset thickness condition may be that the box thickness of the liquid crystal panel is within a thickness range between the third thickness and the fourth thickness, wherein the values ​​of the third thickness to the fourth thickness may be understood as the upper or lower limit of the box thickness after the liquid crystal panel is formed into a box. Generally, this parameter is adjusted and set according to design requirements and is not limited here.

[0070] Optionally, the second conductive layer 3002 may also be composed of at least one material selected from silicon and a liner material.

[0071] In this embodiment, the thickness of the second conductive layer satisfies the first preset thickness condition, so that the box thickness of the liquid crystal panel satisfies the second preset thickness condition, and the second conductive layer is composed of any one of silicon and spacers, so that the overall thickness of the conductive frame glue is small through the second conductive layer whose thickness satisfies the first preset thickness condition, thereby ensuring that the box thickness of the final liquid crystal panel is also small, making the liquid crystal panel thinner in structure. The spacers may include a material composed of at least one of plastic balls, silicon balls, gold balls, silver balls, silver paste, nanosilver and conductive carbon paste.

[0072] In one embodiment, the first substrate 100 is a silicon substrate, and the second substrate 200 is an ITO glass substrate.

[0073] Specifically, when the second substrate 200 is an ITO glass substrate, the transparent conductive film 2001 disposed on the second substrate 200 is an ITO conductive film.

[0074] In one embodiment, an electronic device is provided. The electronic device includes a liquid crystal panel as described in the embodiments of the present application.

[0075] Optionally, the electronic device may be a touch-screen industrial computer, a liquid crystal display, a liquid crystal television, a video game device, or other electronic device with a liquid crystal display screen.

[0076] It is understandable that the above-mentioned liquid crystal panel may also adopt other forms, not limited to the forms mentioned in the above-mentioned embodiments, as long as it can ensure the conductive performance of the liquid crystal panel while improving the production efficiency of the liquid crystal panel.

[0077] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0078] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A liquid crystal panel, characterized in that: The liquid crystal panel comprises: A first substrate and a second substrate are arranged opposite to each other and spaced apart, a transparent conductive film is arranged on a side of the second substrate close to the first substrate, the first substrate and the second substrate respectively have corresponding edge regions, and a conductive unit is arranged in a target region of the edge region of the first substrate; The conductive frame glue is disposed in the edge area of ​​the first substrate on one side close to the second substrate and is attached to the transparent conductive film, so that the first substrate, the transparent conductive film and the conductive frame glue form a cavity supporting and accommodating liquid crystal.

2. The liquid crystal panel according to claim 1, characterized in that: The conductive frame glue includes a first conductive layer and a second conductive layer which are sequentially stacked on the edge region of the first substrate, and the conductive property of the first conductive layer is better than that of the second conductive layer.

3. The liquid crystal panel according to claim 2, characterized in that: The first conductive layer and the second conductive layer each have a plurality of layers, and the first conductive layer and the second conductive layer are sequentially cross-stacked along a direction from the first substrate to the second substrate.

4. The liquid crystal panel according to claim 1, characterized in that: The target area is the four vertex areas of the edge area.

5. The liquid crystal panel according to claim 1, characterized in that: An LCoS chip is disposed on the first substrate, and pins of the LCoS chip are electrically connected to the conductive unit.

6. The liquid crystal panel according to claim 1, characterized in that: The conductive unit has a shape of one of a dot, a line and a rectangle, and a length of the conductive unit is 10-1000 μm.

7. The liquid crystal panel according to claim 2 or 3, characterized in that: The first conductive layer is composed of any one of gold balls, silver balls, silver paste, nano silver and conductive carbon paste.

8. The liquid crystal panel according to claim 2 or 3, characterized in that: The thickness of the second conductive layer satisfies a first preset thickness condition, the box thickness of the liquid crystal panel satisfies a second preset thickness condition, the value range of the first preset thickness condition is less than or equal to the value range of the second preset thickness condition, and the second conductive layer is composed of any one of silicon and spacer materials.

9. The liquid crystal panel according to claim 1, characterized in that: The first substrate is a silicon substrate, and the second substrate is an ITO glass substrate.

10. An electronic device, characterized in that: The electronic device comprises the liquid crystal panel as described in any one of claims 1 to 9.

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