Capacity expansion interface and circuit board

Abstract

The utility model discloses a first capacity expansion interface. The first capacity expansion interface is arranged on the storage circuit board and used for enabling the storage circuit board to have a capacity expansion function in advance. The first capacity expansion interface comprises a plurality of first connection contacts which are arranged into a first contact array, and each first connection contact is arranged on a path where a corresponding first connection line between the master control and the storage module on the storage circuit board is located; wherein the first contact array comprises a first contact subarray and a second contact subarray, each contact subarray comprises a first area and a second area, the first area is used for placing data type signal contacts, and the second area is used for placing other types of non-data type signal contacts; the center of the first capacity expansion interface is located between the first contact subarray and the second contact subarray, and the distance from the second area to the center of the first capacity expansion interface is smaller than the distance from the first area to the center of the first capacity expansion interface. In this way, the storage capacity of the circuit board can be improved.

Description

Technical Field

[0001] The present application relates to the field of storage, and in particular to a capacity expansion interface and a circuit board. Background Art

[0002] In the field of storage, with the continuous development of technology, users' demand for computing and storage is also increasing. In the production process of electronic devices, the storage capacity is usually designed to meet the current storage needs of the device. However, as time goes by, the computing and storage tasks of the electronic device may become larger and more complex, so it may need more storage capacity to meet the growing storage needs. Utility Model Content

[0003] The main purpose of this application is to provide an expansion interface and a circuit board, which can increase the storage capacity of the circuit board.

[0004] In order to solve the above technical problems, the first technical solution adopted by the present application is: to provide a first expansion interface. The first expansion interface is arranged on the storage circuit board, and is used to preset the storage circuit board with an expansion function. The first expansion interface includes a plurality of first connection contacts, which are arranged into a first contact array, and each first connection contact is respectively arranged on the path where a corresponding first connection line between the main control and the storage module on the storage circuit board is located; wherein the first contact array includes a first contact sub-array and a second contact sub-array, and each contact sub-array includes a first area and a second area respectively, the first area is used to place data type signal contacts, and the second area is used to place non-data type other types of signal contacts, the center of the first expansion interface is located between the first contact sub-array and the second contact sub-array, and the distance from the second area to the center of the first expansion interface is less than the distance from the first area to the center of the first expansion interface.

[0005] In order to solve the above technical problems, the second technical solution adopted by the present application is: to provide a second expansion interface. The second expansion interface is arranged on the expansion circuit board, and is used to enable the expansion circuit board to be preset with an expansion function. The second expansion interface includes a plurality of second connection contacts arranged in a second contact array, and each second connection contact is respectively arranged on the path where a corresponding second connection line connected to the storage module on the expansion circuit board is located; wherein the second expansion interface matches the first expansion interface in the first technical solution, so that the storage circuit board can be expanded through the connection between the first expansion interface and the second expansion interface.

[0006] To solve the above technical problems, the third technical solution adopted by the present application is: to provide a circuit board, which includes a storage module and an expansion interface as described in the first technical solution or the second technical solution.

[0007] The beneficial effect of the present application is: in this embodiment, the first expansion interface provided on the storage circuit board includes a plurality of first connection contacts. These first connection contacts are arranged into a first contact array, and each first connection contact is respectively provided on the path where a corresponding first connection line between the main control and the storage module on the storage circuit board is located. By providing the expansion interface between the main control and the storage module, the expansion interface becomes an expanded application of the original internal signal between the main control and the storage module in the storage circuit board itself, so that other circuit boards matched by the expansion interface are directly used as the capacity expansion of the storage circuit board itself, thereby increasing the storage capacity of the storage circuit board. Further, the connection contacts of the expansion interface are divided into data signal contacts and non-data signal contacts, and the contacts of the expansion interface are also divided into two contact sub-arrays, and the center of the first expansion interface is located between the two contact sub-arrays. Each sub-array includes a first area and a second area, respectively, and the second area is closer to the center of the expansion interface than the first area. Since the data signal contacts are placed in the first area and the non-data contacts are placed in the second area, the non-data contacts are concentrated and closer to the center of the expansion interface, thereby reducing the impact of the transmission of non-data signals on the transmission of data signals. In addition, when the data signal contacts are placed on the outside of the interface, the wiring space for the data contacts is increased compared to placing them on the inside, optimizing the wiring layout of the data signals, thereby further improving the transmission efficiency of the data signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 It is a structural diagram of the first embodiment of the first expansion interface of the present application;

[0010] Figure 2 It is a structural diagram of the first embodiment of the first expansion interface of the present application;

[0011] Figure 3 It is a structural diagram of a specific embodiment of the first expansion interface of the present application. DETAILED DESCRIPTION

[0012] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0013] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0014] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0015] Before introducing the technical solution of the present application, a brief introduction to the related prior art is first given.

[0016] In order to increase the storage capacity of an electronic device, it is generally possible to increase the connection interfaces of the electronic device to connect more storage devices to increase the storage capacity, or to increase the capacity of a single storage device to increase the overall storage capacity without changing the number of connection interfaces of the electronic device.

[0017] Regarding the method of adding connection interfaces to electronic devices, since the electronic devices are usually already manufactured, it is not easy to disassemble and adjust the electronic devices to add connection interfaces. In addition, the electronic devices are easily interfered with during the adjustment process, which may affect their subsequent use. The added connection interfaces also require further debugging and verification.

[0018] Therefore, it is easier to increase the storage capacity by increasing the capacity of the storage device when the electronic device has already been manufactured.

[0019] Increasing the capacity of storage devices can be achieved by increasing the capacity of a single storage particle on a circuit board. However, expanding the capacity of storage particles is a very challenging technical problem, which involves multiple levels of complexity and technical requirements. First of all, the structure and properties of the storage particles themselves are extremely delicate, and their internal circuit design and material selection have been rigorously scientifically calculated and experimentally verified. Therefore, when expanding the capacity, it is necessary to ensure that the new storage unit is perfectly integrated with the original structure without any conflict or interference. Secondly, various physical and chemical parameters such as temperature, pressure, and electric field need to be precisely controlled during the expansion process to ensure that the newly added storage unit can work stably. Slight changes in these parameters may have a significant impact on the performance of the storage particles, so technicians are required to have extremely high operating precision and rich experience. Moreover, capacity expansion research is not achieved overnight and requires long-term efforts.

[0020] In summary, the research on storage particle expansion requires not only technical personnel to have profound professional knowledge and a deep understanding of storage technology, but also the ability to master and apply these professional knowledge, rich practical experience, and unremitting innovative spirit, and the ability to continuously innovate and try in the long-term research process. Only by overcoming these problems can we find a suitable expansion plan in the process of experiment and realize the improvement of storage particle capacity.

[0021] Considering the difficulty and cycle of implementing the above expansion scheme, in order to realize the expansion of the storage device more quickly and easily, the present application chooses to increase the circuit board space to realize the expansion of the storage device. Adding a circuit board has higher flexibility and scalability. As one of the core components of the storage device, the circuit board can be customized and expanded according to demand. When the storage capacity needs to be increased, the expansion is achieved by adding additional circuit boards or extending the circuit board. Compared with the complex expansion operation of the storage particles themselves, it is simpler, more convenient and easier to implement. Secondly, compared with the expansion of storage particles, adding a circuit board can provide better performance and stability. Because the expansion of storage particles may involve more physical and chemical parameter control, the change of these parameters may have unexpected effects. As part of the overall system, the circuit board can work better with other components to provide a more reliable data storage and access experience. In addition, adding a circuit board also means better compatibility and standardization. Circuit boards usually use standardized interfaces and protocols, which makes it easier to integrate and connect the added circuit boards when expanding capacity, reducing the trouble caused by compatibility issues.

[0022] In order to establish connections between circuit boards and achieve capacity expansion, the present application proposes the following embodiments.

[0023] Reference Figure 1 and Figure 2 , Figure 1 and Figure 2 This is a structural diagram of the first embodiment of the first expansion interface of the present application.

[0024] like Figure 1 As shown, the first expansion interface 140 is arranged on the circuit board plate 110 of the storage circuit board 10, and is used to preset the expansion function of the storage circuit board 10. The storage circuit board 10 also includes a main control 120 and a storage module 130, and a plurality of first connection lines 150 are arranged between the main control 120 and the storage module 130 to realize the control of the storage module 130 by the main control 120. The first expansion interface 140 includes a plurality of first connection contacts 160, which are arranged in a first contact array, and each first connection contact 160 is respectively arranged on a corresponding first connection line 150.

[0025] Furthermore, if Figure 2 As shown, the first contact array 210 includes a first contact sub-array 220 and a second contact sub-array 230. Each contact sub-array includes a first area 240 and a second area 250. The first area 240 is used to place data type signal contacts, and the second area 250 is used to place non-data type other type signal contacts, and the first expansion interface center A is located between the first contact sub-array and the second contact sub-array, and the distance from the second area 250 to the center of the first expansion interface is less than the distance from the first area 240 to the center of the first expansion interface. The first expansion interface center A can be the center point of the first contact array 210, or it can be the central axis of the first contact array 210.

[0026] In this embodiment, the first area 240 of the first contact subarray and the first area 240 of the second contact subarray are symmetrically distributed along the central axis of the first expansion interface, and the second area 250 of the first contact subarray and the second area 250 of the second contact subarray are symmetrically distributed along the central axis of the first expansion interface.

[0027] In this embodiment, the first expansion interface provided on the storage circuit board includes a plurality of first connection contacts arranged in a first contact array, each of which is provided on a path where a corresponding first connection line between the main control and the storage module on the storage circuit board is located.

[0028] By setting up an expansion interface between the main control and the storage module, the expansion interface becomes an expanded application of the original internal signal between the main control and the storage module in the storage circuit board itself, so that other circuit boards matched by the expansion interface can be directly used as the capacity expansion of the storage circuit board itself, thereby increasing the storage capacity of the storage circuit board.

[0029] Furthermore, the connection contacts of the expansion interface are divided into data signal contacts and non-data signal contacts, and the contacts of the expansion interface are also divided into two contact sub-arrays, and the center of the first expansion interface is located between the two contact sub-arrays. Each sub-array includes a first area and a second area, respectively, and the second area is closer to the center of the expansion interface than the first area. Since the data signal contacts are placed in the first area and the non-data contacts are placed in the second area, the non-data contacts are concentrated and closer to the center of the expansion interface, thereby reducing the impact of the transmission of non-data signals on the transmission of data signals. And when the data signal contacts are placed on the outside of the interface, the wiring space available for the data contacts is increased compared to placing them on the inside, and the wiring layout of the data signals is optimized, thereby further improving the transmission efficiency of the data signals.

[0030] In one embodiment, the first contact sub-array and the second contact sub-array respectively include a plurality of position units arranged in an array, and a first connection contact is provided on several position units among the plurality of position units, wherein the position unit provided with the first connection contact is defined as a contact position; the contact position of the first contact sub-array and the contact position of the second contact sub-array are axially symmetrically distributed along the central axis of the first expansion interface.

[0031] Reference Figure 3 , Figure 3 This is a structural diagram of a specific embodiment of the first expansion interface of this application. Figure 3 As shown, the first expansion interface includes a first contact subarray (7*23 left array) and a second contact subarray (7*23 right array). Each contact subarray is divided into 7*23 position units, and the first contact subarray and the second contact subarray are arranged side by side to form a first contact array with 7*46 position units. Among these position units, a number of position units are selected to set the first connection contact, and the position unit with the first connection contact is defined as the contact position. The gray area in the array in the figure is the contact position. Specifically, in the first contact subarray, in the area of ​​the first row, the third row and the fifth row, the position unit of the odd column is the contact position, in the area of ​​the second row and the fourth row, the position unit of the first column and the even column is the contact position, and in the area of ​​the sixth row and the seventh row, the position unit of the even column and the first column, the twenty-first column, and the twenty-third column is the contact position; the contact position in the second contact subarray is axially symmetrical with the contact position in the first contact subarray along the central axis of the first expansion interface.

[0032] In one embodiment, the first connection contacts include a high-speed transmission signal contact, a low-speed transmission signal contact, a power contact, and a ground contact.

[0033] The high-speed transmission signal contacts in the first connection contacts are distributed in the first area and / or the second area of ​​the first contact sub-array and the second contact sub-array, the low-speed transmission signal contacts in the first connection contacts are distributed in the second area of ​​the first contact sub-array and the second contact sub-array, the power contacts in the first connection contacts are distributed in the second area of ​​the first contact sub-array and the second contact sub-array, and the ground contacts in the first connection contacts are distributed in the first area and / or the second area of ​​the first contact sub-array and the second contact sub-array.

[0034] like Figure 3 As shown, taking the specific embodiment of the contact position as an example, the first expansion interface includes a first contact sub-array (7*23 left array) and a second contact sub-array (7*23 right array). Each contact sub-array is divided into 7*23 position units, and the first contact sub-array and the second contact sub-array are arranged side by side to form a first contact array with 7*46 position units.

[0035] Among them, in the first contact sub-array, the first area includes position units from the first row to the fifth row and the first column to the sixteenth column and position units from the sixth row to the seventh row and the first column to the eighteenth column, and the second area includes position units from the first row to the fifth row and the seventeenth column to the twenty-third column and position units from the sixth row to the seventh row and the nineteenth column to the twenty-third column; the first area and the second area in the second contact sub-array are axially symmetrically distributed with the first area and the second area in the first contact sub-array along the central axis of the first expansion interface.

[0036] In one embodiment, the data signal contact is a high-speed transmission signal contact, and the data signal contact further includes a data signal contact and a data reference clock contact.

[0037] The first area in the first contact sub-array and the second contact sub-array includes a data signal contact sub-area and a data reference clock signal contact sub-area, the data signal contacts are distributed in the data signal contact sub-area in the first area, and the data reference clock signal contacts are distributed in the data reference clock signal contact sub-area in the first area; the contact positions of the data signal contacts and the data reference clock signal contacts of the first contact sub-array are respectively axially symmetrically distributed with the contact positions of the data signal contacts and the data reference clock signal contacts of the second contact sub-array along the central axis of the first expansion interface.

[0038] like Figure 3As shown, taking a specific embodiment of the contact position as an example, the data signal contact sub-area includes position units from the first row to the fifth row and the first column to the sixteenth column, and the data reference clock contact sub-area includes position units from the sixth row to the seventh row and the first column to the eighteenth column; in the second contact sub-array, the data signal contact sub-area includes position units from the first row to the fifth row and the thirty-first column to the forty-sixth column, and the data reference clock contact sub-area includes position units from the sixth row to the seventh row and the twenty-ninth column to the forty-sixth column.

[0039] Furthermore, the clock signal in the present application includes a differential clock signal. In the data reference clock contact sub-region, two contact positions in the same column are respectively used as the first differential clock signal contact and the second differential clock signal contact, and the two cooperate to transmit a set of data reference differential clock signals; in the data reference clock contact sub-region, multiple contact positions in the same row are respectively the first differential clock signal contact or the second differential clock signal contact of multiple sets of data reference differential clock signals.

[0040] by Figure 3 Taking the specific structure as an example, in the data reference clock contact sub-area, the two contact positions in the first column of the sixth row and the first column of the seventh row are respectively a first differential clock signal contact and a second differential clock signal contact, which cooperate with each other to transmit a set of data reference clock signals.

[0041] Specifically, in the data reference clock contact sub-area of ​​the first contact sub-array, the two contact positions in the first column are the sixth group of data reference differential clock signal contacts, the two contact positions in the second column are the first group of data reference differential clock signal contacts, the two contact positions in the fourth column are the seventh group of data reference differential clock signal contacts, the two contact positions in the sixth column are the second group of data reference differential clock signal contacts, the two contact positions in the eighth column are the eighth group of data reference differential clock signal contacts, the two contact positions in the tenth column are the third group of data reference differential clock signal contacts, the two contact positions in the twelfth column are the ninth group of data reference differential clock signal contacts, the two contact positions in the fourteenth column are the fourth group of data reference differential clock signal contacts, the two contact positions in the sixteenth column are the tenth group of data reference differential clock signal contacts, and the two contact positions in the eighteenth column are the fifth group of data reference differential clock signal contacts; the ten groups of data reference differential clock signal contacts of the first contact sub-array are used to assist data transmission of the data signal contacts in the first contact sub-array;

[0042] In the data reference clock contact sub-area of ​​the second contact sub-array, the two contact positions of the twenty-ninth column are the tenth group of data reference differential clock signal contacts, the two contact positions of the thirty-first column are the fifth group of data reference differential clock signal contacts, the two contact positions of the thirty-third column are the first group of data reference differential clock signal contacts, the two contact positions of the thirty-fifth column are the sixth group of data reference differential clock signal contacts, the two contact positions of the thirty-seventh column are the second group of data reference differential clock signal contacts, the two contact positions of the thirty-ninth column are the seventh group of data reference differential clock signal contacts, the two contact positions of the forty-first column are the third group of data reference differential clock signal contacts, the two contact positions of the forty-third column are the eighth group of data reference differential clock signal contacts, the two contact positions of the forty-fifth column are the fourth group of data reference differential clock signal contacts, and the two contact positions of the forty-sixth column are the ninth group of data reference differential clock signal contacts; the ten groups of data reference differential clock signal contacts of the second contact sub-array are used to assist data transmission of the data signal contacts in the second contact sub-array.

[0043] As shown in the following table, the following table shows a setting position of the data reference clock contact. Among them, the pin number represents the contact position, where A is the first row, B is the second row, C is the third row, D is the fourth row, E is the fifth row, F is the sixth row, and G is the seventh row. DQS0 is the first group of data reference differential clock signals, DQS1 is the second group of data reference differential clock signals, DQS2 is the third group of data reference differential clock signals, and so on. AR represents the corresponding first contact sub-array, and BR represents the corresponding second contact sub-array. T represents the first differential clock signal, and C represents the second differential clock signal.

[0044]

[0045] In one embodiment, the data signal contacts further include a first type of data signal contacts and a second type of data signal contacts, and the distance from the area where the first type of data signal contacts are distributed to the center of the first expansion interface is greater than the distance from the area where the second type of data signal contacts are distributed to the center of the first expansion interface; the contact positions of the data signal contacts distributed in the first contact sub-array and the contact positions of the data signal contacts distributed in the second contact sub-array are axially symmetrically distributed along the central axis of the first expansion interface.

[0046] The first type of data signal contact is used to transmit ordinary data and can be marked as DQ. The second type of data signal contact is used to transmit check data, which is used to perform error check on the transmitted ordinary data and can be marked as CB. The check data bits are further separated from the transmitted ordinary data and placed in different areas for transmission. The check bit data transmission contact is placed closer to the center of the first expansion interface, which further optimizes the routing layout of the high-speed transmission signal contact and is conducive to improving the transmission efficiency of high-speed transmission signals.

[0047] like Figure 3 As shown, taking a specific embodiment of the contact position as an example, in the data signal contact sub-area of ​​the first contact sub-array, the contact positions of the second type of data signal contacts are the thirteenth and fifteenth columns of the first row, the fourteenth and sixteenth columns of the second row, the fifteenth column of the third row, the fourteenth and sixteenth columns of the fourth row, and the fifteenth column of the fifth row; in the data signal contact sub-area of ​​the second contact sub-array, the contact positions of the second type of data signal contacts are the thirty-second column of the first row, the thirty-first and thirty-third columns of the second row, the thirty-second column of the third row, the thirty-first and thirty-third columns of the fourth row, and the thirty-second and thirty-fourth columns of the fifth row.

[0048] As shown in the following table, a setting position of the second type data signal contact is shown, wherein CB0 is the first second type data signal, CB1 is the second second type data signal, CB2 is the third second type data signal, and so on.

[0049] Pin No. signal name Signal Type Description type A13 CB5_AR High-speed signal transmission data A15 CB0_AR High-speed signal transmission data B14 CB6_AR High-speed signal transmission data B16 CB2_AR High-speed signal transmission data C15 CB1_AR High-speed signal transmission data D14 CB4_AR High-speed signal transmission data D16 CB3_AR High-speed signal transmission data E15 CB7_AR High-speed signal transmission data A32 CB4_BR High-speed signal transmission data B31 CB6_BR High-speed signal transmission data B33 CB1_BR High-speed signal transmission data C32 CB5_BR High-speed signal transmission data D31 CB7_BR High-speed signal transmission data D33 CB2_BR High-speed signal transmission data E32 CB3_BR High-speed signal transmission data E34 CB0_BR High-speed signal transmission data

[0050] In this embodiment, the signals transmitted by the second-type data signal contacts belonging to the same contact sub-array can be exchanged with each other. For example, in the data signal contact sub-area of ​​the first contact sub-array, the second-type data signal contact in the thirteenth column of the first row is used to transmit the second-type data signal CB5, and the second-type data signal contact in the fifteenth column of the first row is used to transmit the second-type data signal CB0, then they can be exchanged, and the second-type data signal contact in the thirteenth column of the first row is used to transmit the second-type data signal CB0, and the second-type data signal contact in the fifteenth column of the first row is used to transmit the second-type data signal CB5. The exchange can be in the same row, in the same column, or in different rows and columns.

[0051] Further, in the data signal contact sub-area of ​​the first contact sub-array, the contact positions of the second row and the first column and the fourth row and the first column are ground contacts, and the remaining contact positions are first-type data signal contacts; in the data signal contact sub-area of ​​the second contact sub-array, the contact positions of the second row and the forty-sixth column and the fourth row and the forty-sixth column are ground contacts, and the remaining contact positions are first-type data signal contacts.

[0052] As shown in the following table, one setting position of the first type data signal contact is shown.

[0053]

[0054]

[0055] In the data signal contact sub-area, the contact positions of the second row and first column, the fourth row and first column, the second row and forty-sixth column, and the fourth row and forty-sixth column are set as ground contacts, which reduces the routing pressure of the ground contacts in the middle area and makes the overall routing of the expansion interface more uniform, avoiding mutual interference caused by excessively concentrated routing, thereby improving the transmission efficiency of the data contacts.

[0056] In this embodiment, the signals transmitted by the first-class data signal contacts belonging to the same contact sub-array can be exchanged with each other. For example, in the data signal contact sub-area of ​​the first contact sub-array, the first-class data signal transmission contacts in the third row and third column are used to transmit the first-class data signal DQ0, and the first-class data signal transmission contacts in the fourth row and second column are used to transmit the first-class data signal DQ1. Then, they can be exchanged, and the first-class data signal transmission contacts in the third row and third column are used to transmit the first-class data signal DQ1, and the first-class data signal transmission contacts in the fourth row and second column are used to transmit the first-class data signal DQ0. The exchange can be in the same row, in the same column, or in different rows and columns.

[0057] In one embodiment, the high-speed transmission signal contacts also include multiple address command signal contacts, multiple chip select signal contacts and multiple system clock signal contacts, and the address command signal contacts, chip select signal contacts and system clock signal contacts are all distributed in the second area; the contact positions of the address command signal contacts, chip select signal contacts, system clock signal contacts, power contacts and ground contacts in the first contact sub-array are respectively non-axisymmetrically distributed with the contact positions of the address command signal contacts, chip select signal contacts, system clock signal contacts, power contacts and ground contacts in the second contact sub-array.

[0058] like Figure 3 As shown, taking a specific implementation example of the contact position, in one implementation, in the second area of ​​the first contact sub-array, the contact positions of the seventeenth column of the first row and the seventeenth column of the third row are chip select signal contacts; in the second area of ​​the second contact sub-array, the contact positions of the seventeenth column of the first row and the seventeenth column of the third row are chip select signal contacts.

[0059] like Figure 3As shown, taking a specific embodiment of the contact position as an example, in one embodiment, in the second area of ​​the first contact sub-array, the contact positions of the nineteenth and twenty-first columns of the first row, the eighteenth column of the second row, the twenty-first column of the third row, the eighteenth column of the fourth row, and the nineteenth and twenty-first columns of the fifth row are address command signal contacts; in the second area of ​​the second contact sub-array, the contact positions of the twenty-fourth, twenty-sixth and twenty-eighth columns of the first row, the twenty-fifth and twenty-seventh columns of the second row, the twenty-sixth column of the third row, the twenty-fifth column of the fourth row, and the twenty-eighth column of the fifth row are address command signal contacts.

[0060] like Figure 3 As shown, taking a specific implementation example of the contact position, in one implementation, in the second area of ​​the first contact sub-array, the contact position of the sixth row and the twentieth column and the seventh row and the twentieth column is a system clock signal contact; in the second area of ​​the second contact sub-array, there is no system clock signal contact.

[0061] In the second area, after the high-speed transmission signal contacts are set, the remaining contact positions can be set as power contacts, low-speed signal contacts and ground contacts.

[0062] like Figure 3 As shown, taking a specific embodiment of the contact position as an example, in one embodiment, in the second area of ​​the first contact sub-array, the contact positions of the fifth row and the twenty-third column, the sixth row and the twenty-second column and the twenty-third column, and the seventh row and the twenty-second column and the twenty-third column are power contacts; in the second area of ​​the second contact sub-array, the contact positions of the fifth row and the twenty-fourth column, the sixth row and the twenty-fourth column, and the seventh row and the twenty-fourth column are power contacts.

[0063] In one embodiment, the low-speed transmission signal contact includes at least one of the following: a power status indication signal contact, an I3C interface address setting signal contact, an alarm signal contact, an I3C interface clock signal contact, an I3C interface data signal contact, a reset signal contact, a loopback data signal contact, and a loopback data reference clock signal contact.

[0064] like Figure 3 As shown, taking the specific embodiment of the contact position as an example, in the second area of ​​the first contact subarray, the contact positions of the 17th column of the first row and the 17th column of the third row are chip selection signal contacts, the contact positions of the 19th column and the 21st column of the first row, the 18th column of the second row, the 21st column of the third row, the 18th column of the fourth row, the 19th column and the 21st column of the fifth row are address command signal contacts, the contact positions of the 20th column of the sixth row and the 20th column of the seventh row are system clock signal contacts, and the remaining contact positions are low-speed transmission signal contacts, power contacts and ground contacts;

[0065] In the second area of ​​the second contact subarray, the contact positions of the seventeenth column of the first row and the seventeenth column of the third row are chip select signal contacts, the contact positions of the twenty-fourth column, the twenty-sixth column and the twenty-eighth column of the first row, the twenty-fifth column and the twenty-seventh column of the second row, the twenty-sixth column of the third row, the twenty-fifth column of the fourth row, and the twenty-eighth column of the fifth row are address command signals, and the remaining contact positions are low-speed transmission signal contacts, power contacts and ground contacts.

[0066] Therefore, it can be imagined that after the high-speed transmission signal contact is set, any remaining contact can be used as a low-speed transmission signal contact.

[0067] Further, in one embodiment, in the second area of ​​the first contact sub-array, the contact positions of the twenty-third column of the first row, the twenty-second column of the second row, and the twenty-second column of the fourth row are low-speed transmission signal contacts; in the second area of ​​the second contact sub-array, the contact positions of the thirtieth column of the first row, the twenty-ninth column of the second row, the twenty-eighth column of the third row, the twenty-ninth column of the fourth row, and the thirtieth column of the fifth row are low-speed transmission signal contacts.

[0068] The eight contact positions are used as power status indication signal contact, I3C interface address setting signal contact, alarm signal contact, I3C interface clock signal contact, I3C interface data signal contact, reset signal contact, loopback data signal contact and loopback data reference clock signal contact. The signals transmitted jointly control the data transmission of the first contact sub-area and the second contact sub-area. Different types of low-speed transmission signals can be exchanged between these eight contact positions.

[0069] As shown in the following table, one setting position of the low-speed transmission signal contact is shown.

[0070] The present application also proposes a second expansion interface, which is arranged on the expansion circuit board and is used to preset the expansion circuit board with an expansion function. The second expansion interface includes a plurality of second connection contacts arranged in a second contact array, each second connection contact being arranged on the expansion circuit board on a path where a corresponding second connection line connected to the storage module is located; wherein the second expansion interface matches the first expansion interface in the first technical solution, so that the storage circuit board can be expanded through the connection between the first expansion interface and the second expansion interface.

[0071] Since the second expansion interface matches the first expansion interface, the relevant settings of the second expansion interface can refer to the relevant description of the first expansion interface, which will not be repeated here.

[0072] The present application also provides a circuit board, which includes a storage module and the first expansion interface or the second expansion interface mentioned above in the present application.

[0073] In summary, the first expansion interface provided on the storage circuit board of the present application includes a plurality of first connection contacts arranged into a first contact array, each of which is provided on a path where a corresponding first connection line between the main control and the storage module on the storage circuit board is located.

[0074] By setting up an expansion interface between the main control and the storage module, the expansion interface becomes an expanded application of the original internal signal between the main control and the storage module in the storage circuit board itself, so that other circuit boards matched by the expansion interface can directly serve as the capacity expansion of the storage circuit board itself, thereby increasing the storage capacity of the storage circuit board.

[0075] Furthermore, the connection contacts of the expansion interface are divided into data signal contacts and non-data signal contacts, and the contacts of the expansion interface are also divided into two contact sub-arrays, and the center of the first expansion interface is located between the two contact sub-arrays. Each sub-array includes a first area and a second area, respectively, and the second area is closer to the center of the expansion interface than the first area. Since the data signal contacts are placed in the first area and the non-data contacts are placed in the second area, the non-data contacts are concentrated and closer to the center of the expansion interface, thereby reducing the impact of the transmission of non-data signals on the transmission of data signals. And when the data signal contacts are placed on the outside of the interface, the wiring space available for the data contacts is increased compared to placing them on the inside, and the wiring layout of the data signals is optimized, thereby further improving the transmission efficiency of the data signals.

[0076] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only illustrative, for example, the division of the modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0077] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0078] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0079] If the integrated units in the above other embodiments are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, RandomAccess Memory), disk or optical disk and other media that can store program codes.

[0080] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A first expansion interface, provided on a storage circuit board, for enabling the storage circuit board to be preset with an expansion function, characterized in that: The first expansion interface includes: A plurality of first connection contacts are arranged into a first contact array, each of the first connection contacts is respectively arranged on a path where a corresponding first connection line between the main control and the storage module on the storage circuit board is located; Among them, the first contact array includes a first contact sub-array and a second contact sub-array, each contact sub-array includes a first area and a second area respectively, the first area is used to place data type signal contacts, and the second area is used to place other types of non-data type signal contacts, the center of the first expansion interface is located between the first contact sub-array and the second contact sub-array, and the distance from the second area to the center of the first expansion interface is smaller than the distance from the first area to the center of the first expansion interface.

2. The first expansion interface according to claim 1, characterized in that: The first contact sub-array and the second contact sub-array respectively include a plurality of position units arranged in an array, and the first connection contacts are arranged on several position units among the plurality of position units, wherein the position units provided with the first connection contacts are defined as contact positions; and the contact positions of the first contact sub-array and the contact positions of the second contact sub-array are axially symmetrically distributed along the central axis of the first expansion interface.

3. The first expansion interface according to claim 2, characterized in that: The first connection contacts include a high-speed transmission signal contact, a low-speed transmission signal contact, a power contact and a ground contact; The high-speed transmission signal contacts in the first connection contacts are distributed in the first area and / or the second area of ​​the first contact sub-array and the second contact sub-array, the low-speed transmission signal contacts in the first connection contacts are distributed in the second area of ​​the first contact sub-array and the second contact sub-array, the power contacts in the first connection contacts are distributed in the second area of ​​the first contact sub-array and the second contact sub-array, and the ground contacts in the first connection contacts are distributed in the first area and / or the second area of ​​the first contact sub-array and the second contact sub-array.

4. The first expansion interface according to claim 3, characterized in that: The data signal contact is the high-speed transmission signal contact, and the data signal contact includes a data signal contact and a data reference clock contact; The first area in the first contact sub-array and the second contact sub-array includes a data signal contact sub-area and a data reference clock signal contact sub-area, the data signal contacts are distributed in the data signal contact sub-area in the first area, and the data reference clock signal contacts are distributed in the data reference clock signal contact sub-area in the first area; the contact positions of the data signal contacts and the data reference clock signal contacts of the first contact sub-array are respectively axially symmetrically distributed with the contact positions of the data signal contacts and the data reference clock signal contacts of the second contact sub-array along the central axis of the first expansion interface.

5. The first expansion interface according to claim 4, characterized in that: The data signal contacts include first-type data signal contacts and second-type data signal contacts, and the distance from the area where the first-type data signal contacts are distributed to the center of the first capacity expansion interface is greater than the distance from the area where the second-type data signal contacts are distributed to the center of the first capacity expansion interface; The contact positions of the data signal contact distribution of the first contact sub-array and the contact positions of the data signal contact distribution of the second contact sub-array are axially symmetrically distributed along the central axis of the first expansion interface.

6. The first expansion interface according to claim 5, characterized in that: The high-speed transmission signal contacts further include a plurality of address command signal contacts, a plurality of chip select signal contacts and a plurality of system clock signal contacts, and the address command signal contacts, the chip select signal contacts and the system clock signal contacts are all distributed in the second area; The contact positions of the address command signal contacts, the chip select signal contacts, the system clock signal contacts, the power contacts and the ground contacts in the first contact sub-array are respectively non-axisymmetrically distributed along the central axis of the first expansion interface with the contact positions of the address command signal contacts, the chip select signal contacts, the system clock signal contacts, the power contacts and the ground contacts in the second contact sub-array.

7. The first expansion interface according to claim 3, characterized in that: The low-speed transmission signal contact includes at least one of the following: a power status indication signal contact, an I3C interface address setting signal contact, an alarm signal contact, an I3C interface clock signal contact, an I3C interface data signal contact, a reset signal contact, a loopback data signal contact, and a loopback data reference clock signal contact.

8. The first expansion interface according to claim 6, characterized in that: Each of the contact sub-arrays is divided into 7*23 position units, and the first contact sub-array and the second contact sub-array are arranged side by side to form the first contact array having 7*46 position units; In the first contact sub-array, the first region includes the position units in the first to fifth rows and the first to sixteenth columns and the position units in the sixth to seventh rows and the first to eighteenth columns, and the second region includes the position units in the first to fifth rows and the seventeenth to twenty-third columns and the position units in the sixth to seventh rows and the nineteenth to twenty-third columns; the first region and the second region in the second contact sub-array are axially symmetrically distributed with the first region and the second region in the first contact sub-array along the central axis of the first expansion interface; In the first contact sub-array, in the areas of the first row, the third row and the fifth row, the position units of the odd columns are the contact positions, in the areas of the second row and the fourth row, the position units of the first column and the even columns are the contact positions, and in the areas of the sixth row and the seventh row, the position units of the even columns and the first column, the twenty-first column and the twenty-third column are the contact positions; the contact positions in the second contact sub-array and the contact positions in the first contact sub-array are axially symmetrically distributed along the central axis of the first expansion interface.

9. The first expansion interface according to claim 8, characterized in that: In the first contact sub-array, the data signal contact sub-region includes the position units of the first row to the fifth row and the first column to the sixteenth column, and the data reference clock contact sub-region includes the position units of the sixth row to the seventh row and the first column to the eighteenth column; In the second contact sub-array, the data signal contact sub-region includes the position units of the first to fifth rows and the thirty-first to forty-sixth columns, and the data reference clock contact sub-region includes the position units of the sixth to seventh rows and the twenty-ninth to forty-sixth columns.

10. The first expansion interface according to claim 9, characterized in that: The clock signal includes a differential clock signal; In the data reference clock contact sub-area, two contact positions in the same column are respectively used as the first A differential clock signal contact and a second differential clock signal contact, the two cooperate to transmit a set of data According to the reference differential clock signal; In the data reference clock contact sub-area, the plurality of contact positions in the same row are respectively A first differential clock signal contact or a second differential clock signal contact of a plurality of groups of data reference differential clock signals Differential clock signal contacts.

11. The first expansion interface according to claim 10, characterized in that: In the data reference clock contact sub-area of ​​the first contact sub-array, the two contact positions in the first column are the sixth group of data reference differential clock signal contacts, and the two contact positions in the second column are the sixth group of data reference differential clock signal contacts. The contact positions are the first group of data reference differential clock signal contacts, and the two contacts in the fourth column are The contact position is the seventh group of data reference differential clock signal contacts, and the two contacts in the sixth column are The point position is the second set of data reference differential clock signal contacts, and the two contacts in the eighth column are located at The second contact position is the eighth group of data reference differential clock signal contacts, the second contact position is the third group of data reference differential clock signal contacts, and the second contact position is the twelfth group of data reference differential clock signal contacts. Nine sets of data reference differential clock signal contacts, the two contacts in the fourteenth column are located at the fourth The two contact positions in the sixteenth column are the tenth group of data reference differential clock signal contacts. Data reference differential clock signal contacts, the two contacts in the eighteenth column are located in the fifth group of data The ten groups of data reference differential clock signal contacts of the first contact subarray are The clock signal contact is used to assist the data signal contact of the data signal contact in the first contact sub-array. transmission; In the data reference clock contact sub-region of the second contact sub-array, the twentieth The two contact positions of the ninth column are the tenth group of data reference differential clock signal contacts, and the thirty-third The two contact positions in one column are the fifth group of data reference differential clock signal contacts, and the thirty The two contact positions in the third column are the first group of data reference differential clock signal contacts, and the third column is the first group of data reference differential clock signal contacts. The two contact positions of the fifth column are the sixth group of data reference differential clock signal contacts, and the thirty The two contact positions in the seventh column are the second group of data reference differential clock signal contacts, the two contact positions in the thirty-ninth column are the seventh group of data reference differential clock signal contacts, the two contact positions in the forty-first column are the third group of data reference differential clock signal contacts, the two contact positions in the forty-third column are the eighth group of data reference differential clock signal contacts, the two contact positions in the forty-fifth column are the fourth group of data reference differential clock signal contacts, and the two contact positions in the forty-sixth column are the ninth group of data reference differential clock signal contacts; the ten groups of data reference differential clock signal contacts of the second contact sub-array are used to assist data transmission of the data signal contacts in the second contact sub-array.

12. The first expansion interface according to claim 9, characterized in that: In the data signal contact sub-area of ​​the first contact sub-array, the contact positions of the second type of data signal contacts are the thirteenth and fifteenth columns of the first row, the fourteenth and sixteenth columns of the second row, the fifteenth column of the third row, the fourteenth and sixteenth columns of the fourth row, and the fifteenth column of the fifth row; In the data signal contact sub-area of ​​the second contact sub-array, the contact positions of the second type of data signal contacts are the thirty-second column of the first row, the thirty-first column and the thirty-third column of the second row, the thirty-second column of the third row, the thirty-first column and the thirty-third column of the fourth row, and the thirty-second column and the thirty-fourth column of the fifth row.

13. The first expansion interface according to claim 12, characterized in that: In the data signal contact sub-area of ​​the first contact sub-array, the contact positions in the second row and first column and the fourth row and first column are the ground contacts, and the remaining contact positions are the first type of data signal contacts; In the data signal contact sub-region of the second contact sub-array, the contact positions in the forty-sixth column of the second row and the forty-sixth column of the fourth row are the ground contacts, and the remaining contact positions are the first type of data signal contacts.

14. The first expansion interface according to claim 8, characterized in that: In the second area of ​​the first contact subarray, the contact positions in the first row and seventeenth column and the third row and seventeenth column are the chip selection signal contacts; In the second area of ​​the second contact sub-array, the contact positions in the first row and seventeenth column and the third row and seventeenth column are the chip selection signal contacts.

15. The first expansion interface according to claim 8, characterized in that: In the second area of ​​the first contact subarray, the contact positions in the 19th and 21st columns of the first row, the 18th column of the second row, the 21st column of the third row, the 18th column of the fourth row, the 20th column of the fifth row, the 19th column of the fifth row and the 21st column are the address command signal contacts; In the second area of ​​the second contact sub-array, the contact positions of the contacts in the 24th, 26th and 28th columns of the first row, the 25th and 27th columns of the second row, the 26th column of the third row, the 25th column of the fourth row and the 28th column of the fifth row are the address command signals.

16. The first expansion interface according to claim 8, characterized in that: In the second area of ​​the first contact sub-array, the contact position in the sixth row and the twentieth column and the seventh row and the twentieth column is the system clock signal contact; In the second region of the second contact sub-array, the system clock signal contact does not exist.

17. The first expansion interface according to claim 8, characterized in that: In the second area of ​​the first contact sub-array, the contact positions in the fifth row and the twenty-third column, the sixth row and the twenty-second column and the twenty-third column, and the seventh row and the twenty-second column and the twenty-third column are the power contacts; In the second area of ​​the second contact sub-array, the contact positions in the fifth row and the twenty-fourth column, the sixth row and the twenty-fourth column, and the seventh row and the twenty-fourth column are the power contacts.

18. The first expansion interface according to claim 8, characterized in that: In the second area of ​​the first contact subarray, the contact positions of the 17th column of the first row and the 17th column of the third row are the chip selection signal contacts, the contact positions of the 19th column and the 21st column of the first row, the 18th column of the second row, the 21st column of the third row, the 18th column of the fourth row, the 20th column of the fifth row, the 19th column of the fifth row and the 21st column are the address command signal contacts, the contact positions of the 20th column of the sixth row and the 20th column of the seventh row are the system clock signal contacts, and the remaining contact positions are the low-speed transmission signal contacts, the power contacts and the ground contacts; In the second area of ​​the second contact sub-array, the contact positions of the seventeenth column of the first row and the seventeenth column of the third row are the chip select signal contacts, the contact positions of the twenty-fourth column, the twenty-sixth column and the twenty-eighth column of the first row, the twenty-fifth column and the twenty-seventh column of the second row, the twenty-sixth column of the third row, the twenty-fifth column of the fourth row, and the twenty-eighth column of the fifth row are the address command signals, and the remaining contact positions are the low-speed transmission signal contacts, the power contacts and the ground contacts.

19. The first expansion interface according to claim 18, characterized in that: In the second area of ​​the first contact subarray, the contact positions in the 23rd column of the first row, the 22nd column of the second row, and the 22nd column of the fourth row are the low-speed transmission signal contacts; In the second area of ​​the second contact subarray, the contact positions in the 30th column of the first row, the 29th column of the second row, the 28th column of the third row, the 29th column of the fourth row, and the 30th column of the fifth row are the low-speed transmission signal contacts.

20. A second expansion interface, provided on an expansion circuit board, for enabling the expansion circuit board to be preset with an expansion function, characterized in that: The second expansion interface includes: A plurality of second connection contacts are arranged into a second contact array, each of the second connection contacts is respectively arranged on a path where a corresponding second connection line connected to the storage module on the expansion circuit board is located; The second expansion interface matches the first expansion interface according to any one of claims 1 to 19, so that the storage circuit board can be expanded through the connection between the first expansion interface and the second expansion interface.

21. A circuit board, characterized in that: It comprises a storage module and an expansion interface as described in any one of claims 1-20.

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